[go: up one dir, main page]

US20050059759A1 - Method of gluing hydrophobic and oleophobic substrates which are intended for packaging - Google Patents

Method of gluing hydrophobic and oleophobic substrates which are intended for packaging Download PDF

Info

Publication number
US20050059759A1
US20050059759A1 US10/815,914 US81591404A US2005059759A1 US 20050059759 A1 US20050059759 A1 US 20050059759A1 US 81591404 A US81591404 A US 81591404A US 2005059759 A1 US2005059759 A1 US 2005059759A1
Authority
US
United States
Prior art keywords
styrene
adhesive
phase
compatible
encompassed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/815,914
Other languages
English (en)
Inventor
Nicolas Sajot
Benoit Pollacchi
Saida Sellak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bostik SA
Original Assignee
Bostik Findley SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bostik Findley SA filed Critical Bostik Findley SA
Publication of US20050059759A1 publication Critical patent/US20050059759A1/en
Assigned to BOSTIK S.A. reassignment BOSTIK S.A. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SELLAK, SAIDA, POLLACCHI, BENOIT, SAJOT, NICOLAS
Priority to US12/124,036 priority Critical patent/US20080221247A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof

Definitions

  • This invention has as its object a process for gluing together substrates that are made oleophobic and hydrophobic, using an adhesive based on styrene block copolymers. It also has as its object adhesives that make possible the gluing of so-called difficult substrates such as those made oleophobic and hydrophobic.
  • HMA Hot Melt Adhesives
  • the polymer that is used in the HMA consists of, for example, the ethylene-type copolymers, such as vinyl ethylene-acetate (EVA), amorphous poly-alpha-olefins (APAO), polyolefins that are synthesized by metallocene catalysis, polyethylenes of low molecular weight or else amorphous polypropylenes.
  • EVA vinyl ethylene-acetate
  • APAO amorphous poly-alpha-olefins
  • polyolefins that are synthesized by metallocene catalysis
  • polyethylenes of low molecular weight or else amorphous polypropylenes ethylenes of low molecular weight or else amorphous polypropylenes.
  • styrene block copolymers where the latter is combined with a co-monomer such as isoprene or butadiene, hydrogenated forms of these components.
  • the selection will naturally be made on a criterion of structural
  • the preparation of food products for example, as well as their preservation or the conditions in which they are stored, require that the packaging be resistant and continue to ensure its function under extreme temperatures.
  • the gluing should be effective during all of the packaging operations or the life cycle of the packaging.
  • fluorinated compounds such as the fluorinated polyacrylates in the treatment of substrates that are intended for packaging so as to impart to them oleophobic and hydrophobic barrier properties, namely both at a high level of resistance to water and a high level of resistance to oils and fatty substances.
  • fluorinated compounds of various types are used in an aqueous phase and are therefore hydrodilutable. They are either small fluorinated molecules, for example fluorinated phosphate salts, or fluorinated sulfate salts, or fluorinated acrylic copolymers, i.e., copolymers of which at least one monomer comprises a perfluorinated group, whereby the other non-fluorinated monomers are acrylic or vinyl.
  • fluorinated lattices i.e., dispersions of copolymers in water in the presence of surfactant, either hydrosoluble or hydrodispersible copolymers, in general copolymers of cationic type.
  • fluorinated compounds are used either in the body of the substrate, for example, paper, or as a coating for said substrate.
  • the adhesive should be able to meet a whole series of sometimes contradictory stresses that are linked to both conditions of use of the packaging and to the nature of the various substrates that are used, identical or different or composite materials, most of the time based on paper or cardboard, but also metal (aluminum) or plastics (polyethylene, polypropylene, terephthalate polyethylene, polystyrene . . . ) of which at least one is a substrate that is made difficult by a treatment based on fluorinated compounds such as fluorinated polyacrylates. It is also necessary to add that the operating conditions for glue application play an important role.
  • the adhesive should be able to be used for any assembly of which at least one of the substrates has undergone a hydrophobic and oleophobic treatment.
  • the adhesive should therefore have very specific and sometimes contradictory characteristics, short setting time, good wetting power, very good thermal behavior of the adhesion after temperature cycles located between ⁇ 10° C. and +60° C., and even between ⁇ 40° C. and +80° C., as well as a low viscosity because of the fluorinated treatment.
  • the process according to the invention is used in the sense of resolving this problem, in particular by a selection of the polymer and its structure.
  • the invention has as its object a process for gluing together so-called difficult substrates that are intended for the manufacture of packages, which consists in applying on at least one of the substrates an adhesive that comprises:
  • the adhesive of the process of the invention optionally can comprise various additives such as antioxidants. . . .
  • Component a) according to the process of the invention has a diblock, triblock or multiblock, linear, radial or star-shaped structure, whereby the intermediate block consists of at least one of the comonomers listed above and can undergo a hydrogenation phase.
  • Component a) is preferably a styrene-ethylene butylene-styrene block copolymer (designated SEBS) or any other close structure. It is possible to mix this
  • component a) with other polymers such as the copolymers of ethylene, polyolefins, polymers that are obtained by a metallocene catalysis path.
  • the content of the adhesive in component a) in general between 5 and 50% by mass is preferably between 15 and 30%.
  • component b) is selected from among the resins that are conventionally used in the thermofusible adhesives, such as:
  • Component c) consists of resin or a mixture of resins that are conventionally used, such as the polymers that are obtained from aromatic fractions or else poly-alpha-methylstyrene. It is preferably selected from among the resins that are obtained from the polymerization of alpha-methylstyrene, for example having a softening point that is measured according to the EN 1238 standard encompassed between 80 and 160° C.
  • the content of component c) is between 0 and 20% by mass and preferably between 5 and 15%.
  • Component d) is selected for the most part from among the so-called microcrystalline waxes that are conventionally used in the thermofusible adhesives, having a melting point (ASTM D127 method) of between 70 and 100° C., preferably between 80 and 95° C.
  • component d) can contain synthesis waxes such as polyolefins with short chains that are rather linear, obtained by polymerization according to standard processes (Ziegler Natta; Fischer Tropsch), whose melting point that is measured according to the standard (ASTM D127 method) is high, generally between 80 and 150° C. and preferably between 90 and 120° C.
  • the content of component d) is between 5 and 25%, and preferably between 10 and 17% by mass.
  • Polymers of another nature can be present in a minority way in the adhesive, for example the ethylene-vinyl acetate copolymers (EVA), the polyolefins of the processes or of various natures, and the other styrene block copolymers.
  • EVA ethylene-vinyl acetate copolymers
  • polyolefins of the processes or of various natures for example the ethylene-vinyl acetate copolymers (EVA), the polyolefins of the processes or of various natures, and the other styrene block copolymers.
  • the various additives will be, for example, the antioxidants that are conventionally used in the thermofusible adhesives or in the industry for transformation of thermoplastic compounds, such as hindered phenolic derivatives, phosphites or mixtures thereof.
  • the viscosity of the thermofusible adhesive of the process of the invention will be between 400 and 3000 mPa.s at 170° C. and preferably between 700 and 1400. Its softening point that is measured according to the so-called ball-ring method that is known to one skilled in the art will be encompassed between 75 and 120° C.
  • the adhesive according to the process of the invention is obtained by mixing a), b), c), d) and e) as well as the possible additives, by any suitable means, for example by a simple mixing at a temperature of between 150 and 170° C.
  • the adhesive can be easily characterized by chemical analysis according to the standard processes for deformulation and identification of different fractions, in particular by infra-red spectrometry, nuclear magnetic resonance 1H and 13C, elementary micro-analysis, gel permeation chromatography or high-performance chromatography or else by differential calorimetry (DSC or Differential Scanning Calorimetry).
  • the adhesives of the process of the invention are applied according to the standard methods that are used in the area of thermofusible adhesives, on the packaging chain or else on the edge of the latter.
  • Starting from a boiler tank via heated and heat-insulated pipes, by extrusion nozzles: controlled deposition of one or more beads on a first substrate and mating with the second substrate, with optional pressing of the adhesive joint thus produced.
  • the low-viscosity HMA can be applied by any other possible means such as, for example, a lipped nozzle, multi-line nozzles, disk, imprint or else by the Sift Proof process developed by the Nordson Company.
  • the temperature of the adhesive at the time of application is conventionally between 150 and 180° C.
  • the machine open time is the time that passes between the application of the adhesive on the first substrate and mating with the second substrate.
  • the machine pressing time is the time immediately after gluing during which the two glued substrates are kept in contact with a force that is at least equal to the force of reopening the packaging without adhesive.
  • the adhesive is applied on thin substrates, i.e., of a thickness that is generally encompassed between 0.05 and about 2 mm, whereby these substrates can be part of a thicker complex structure.
  • This substrate often can be based on paper or cardboard, such as virgin or recycled kraft paper, having a low density or on the contrary a compact thin substrate, optionally treated by fluorinated compounds or on the surface by acrylic varnish or UV-reticulated varnish, or of specific coatings, optionally with non-coated zones, reserves, to make possible the deposition and the hooking of the adhesive on the substrate.
  • the nature of the various substrates used is selected from among identical or different or composite materials, most of the time based on paper or cardboard, metal, for example, aluminum, or plastics, such as polyethylene, polypropylene, terephthalate polyethylene, polystyrene,. . . .
  • the substrates that are used for our tests are FORAPERLED® 325 treated papers or cardboards with a concentration of about 3%.
  • the raw materials that are used in the examples are as follows: Kraton ® G1652 Copolymer of ethylene-butylene and styrene, Melt Index 10, % styrene 30 and no diblock, marketed by Kraton Polymers Kraton ® G1726 Copolymer of ethylene-butylene and styrene, Melt Index 65, % styrene 30 and 70% diblock, marketed by Kraton Polymers Kraton ® G1657 Copolymer of ethylene-butylene and styrene, Melt Index 8, % styrene 13 and 30% diblock, marketed by Kraton Polymers Evatane ® 18-500 EVA Melt Index 500, vinyl acetate 18%, marketed by Atofina Evatane ® 28-420 EVA Melt Index 420, vinyl acetate 28%, marketed by Atofina Evatane ® 33-400 EVA Melt Index 400, vinyl acetate
  • testM E 28 marketed by Hercules Norsolène ® Resin that is obtained from the polymerization of pure monomers W110 of ⁇ methyl-styrene, softening point 105-115° C. (ISO 4625), marketed by Cray Valley Foral ® AX-E Resin that is obtained from the hydrogenated rosin, softening point 81° C. (ASTM E 28), marketed by Hercules Foral ® 85-E Resin that is obtained from the hydrogenated and glycerol- esterified rosin, softening point 85° C.
  • ASTM E 28 marketed by Hercules Dertophène ® T Phenolic terpene resin that is obtained from the condensation of terebenthine gasolines with phenol, softening point 95° C.
  • ASTM E28 marketed by DRT Dertoline ® DEG 2 Resin that is obtained from the hydrogenated and diethylene glycol-esterified rosin, softening point 35° C.
  • DRT Sylvarley ® 540 Resin that is obtained by copolymerization of styrene with ⁇ methyl-styrene or vinyl-toluene, softening point 75° C., marketed by Arizona Chemical Besquare ® 185 So-called microcrystalline wax, consisting of saturated hydrocarbons with branched and cyclized chains, softening point about 90° C.
  • Examples 1 and 2 target first-generation adhesives of the prior art based on EVA (Example 1) and APAO (Example 2);
  • Examples 3 and 4 are comparison examples that use SEBS bases described in the prior art and Examples 5 and 6 of the examples based on SEBS according to the process of the invention.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Wrappers (AREA)
US10/815,914 2001-10-02 2004-04-02 Method of gluing hydrophobic and oleophobic substrates which are intended for packaging Abandoned US20050059759A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/124,036 US20080221247A1 (en) 2001-10-02 2008-05-20 Method of gluing hydrophobic and oleophobic substrates which are intended for packaging

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0112654A FR2830257B1 (fr) 2001-10-02 2001-10-02 Procede d'assemblage par collage de substrats hydrophobes et oleophobes destines au marche de l'emballage
FR01/12654 2001-10-02
PCT/FR2002/003335 WO2003029379A1 (fr) 2001-10-02 2002-10-01 Procede d'assemblage par collage de substrats hydrophobes et oleophobes destines au marche de l'emballage

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2002/003335 Continuation WO2003029379A1 (fr) 2001-10-02 2002-10-01 Procede d'assemblage par collage de substrats hydrophobes et oleophobes destines au marche de l'emballage

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/124,036 Continuation US20080221247A1 (en) 2001-10-02 2008-05-20 Method of gluing hydrophobic and oleophobic substrates which are intended for packaging

Publications (1)

Publication Number Publication Date
US20050059759A1 true US20050059759A1 (en) 2005-03-17

Family

ID=8867836

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/815,914 Abandoned US20050059759A1 (en) 2001-10-02 2004-04-02 Method of gluing hydrophobic and oleophobic substrates which are intended for packaging
US12/124,036 Abandoned US20080221247A1 (en) 2001-10-02 2008-05-20 Method of gluing hydrophobic and oleophobic substrates which are intended for packaging

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/124,036 Abandoned US20080221247A1 (en) 2001-10-02 2008-05-20 Method of gluing hydrophobic and oleophobic substrates which are intended for packaging

Country Status (6)

Country Link
US (2) US20050059759A1 (fr)
EP (1) EP1434829A1 (fr)
JP (1) JP2005504164A (fr)
AU (1) AU2002350812B2 (fr)
FR (1) FR2830257B1 (fr)
WO (1) WO2003029379A1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060229411A1 (en) * 2005-04-06 2006-10-12 Stephen Hatfield Hot melt pressure sensitive adhesives based on blends of styrene/butadiene copolymers
WO2008028716A1 (fr) * 2006-09-05 2008-03-13 Henkel Ag & Co. Kgaa Étiquettes redécollables
US20110020634A1 (en) * 2008-04-28 2011-01-27 Sika Technology Ag Hotmelt adhesives having an extended open time
US20140199908A1 (en) * 2011-09-16 2014-07-17 Henkel Ag & Co. Kgaa Hot melt adhesive
US20140329074A1 (en) * 2011-12-19 2014-11-06 Sika Technology Ag Reactive polyolefin hot-melt adhesive having low viscosity and use thereof for textile laminations
US9695340B2 (en) 2011-09-16 2017-07-04 Henkel Ag & Co. Kgaa Low temperature hot melt adhesive for high-speed coating and spiral coating
US9758704B2 (en) 2012-08-28 2017-09-12 Henkel Ag & Co. Kgaa Hot melt adhesive
US9816014B2 (en) 2011-09-16 2017-11-14 Henkel Ag & Co. Kgaa Hot melt adhesive for disposable products
CN115806789A (zh) * 2022-09-26 2023-03-17 嘉好(太仓)新材料股份有限公司 一种用于口罩耳带粘接热熔胶及其制备方法
DE102023126363A1 (de) 2023-09-27 2025-03-27 Tesa Se Haftklebemasse und wiederablösbare Selbstklebeprodukte umfassend die Haftklebemasse
EP4621025A1 (fr) * 2024-03-21 2025-09-24 Colquimica-Indústria Nacional de Colas, S.A. Adhésif thermofusible en granulés ou en perles pour coller les bouchons aux capsules et son procédé de fabrication

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7622523B2 (en) 2002-08-12 2009-11-24 Exxonmobil Chemical Patents Inc. Plasticized polyolefin compositions
JP2005535748A (ja) 2002-08-12 2005-11-24 エクソンモービル・ケミカル・パテンツ・インク 可塑性ポリオレフィン組成物
US7531594B2 (en) 2002-08-12 2009-05-12 Exxonmobil Chemical Patents Inc. Articles from plasticized polyolefin compositions
US7271209B2 (en) 2002-08-12 2007-09-18 Exxonmobil Chemical Patents Inc. Fibers and nonwovens from plasticized polyolefin compositions
FR2867160B1 (fr) * 2004-03-05 2006-07-14 Oreal Emballage revetu d'un vernis de protection vis-a-vis de la lumiere
FR2882681B1 (fr) * 2005-03-03 2009-11-20 Coriolis Composites Tete d'application de fibres et machine correspondante
US8163192B2 (en) * 2009-06-26 2012-04-24 Vincelli Sr Fred Hydroseed substrate and method of making such
US8163194B2 (en) 2009-06-26 2012-04-24 Vincelli Sr Fred Hydroseed substrate and method of making such
CN104715830A (zh) * 2015-03-11 2015-06-17 上海军信船舶科技有限公司 一种电缆用水密封热熔胶及其应用
CN112513215B (zh) * 2018-07-24 2023-04-18 汉高股份有限及两合公司 具有较低熔体粘度的热熔粘合剂组合物
JP7694147B2 (ja) * 2021-05-24 2025-06-18 ａｒｔｉｅｎｃｅ株式会社 樹脂組成物及び該樹脂組成物を用いた積層体

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3917607A (en) * 1971-09-22 1975-11-04 Shell Oil Co Block copolymer adhesive compositions
US4394915A (en) * 1982-04-12 1983-07-26 Findley Adhesives Inc. Hot melt adhesive compositions and bottle assemblies using said compositions
US5095059A (en) * 1990-03-28 1992-03-10 Mitsui Toatsu Chemicals, Inc. Oiled-face adherable, hot-melt adhesive composition and a non-slip processing method of metal scaffolding board
US5120585A (en) * 1990-10-12 1992-06-09 Gelman Sciences Technology, Inc. Package for preservative agent
US5120781A (en) * 1991-05-07 1992-06-09 Union Camp Corporation Acid-modified polyhydric alcohol rosin ester tackifiers and hot melt adhesive compositions containing those tackifiers
US5266400A (en) * 1990-04-20 1993-11-30 Minnesota Mining And Manufacturing Company Low voltage electron beam radiation cured elastomer-based pressure sensitive adhesive tape
US5496628A (en) * 1992-11-25 1996-03-05 Textiles Coated Incorporated Single membrane insulation material
US5863977A (en) * 1993-10-12 1999-01-26 H. B. Fuller Licensing & Financing, Inc. High molecular weight S-EB-S hot melt adhesive
US5910527A (en) * 1994-04-28 1999-06-08 Ato Findley, Inc. Hot melt adhesive having a high acid number for disposable soft goods
US5939483A (en) * 1996-07-12 1999-08-17 H.B. Fuller Licensing & Financing, Inc. Low application temperature hot melt with excellent heat and cold resistance
US6121354A (en) * 1998-11-19 2000-09-19 Bostik, Inc. High performance single-component sealant
US6232391B1 (en) * 1998-12-23 2001-05-15 National Starch And Chemical Investment Holding Corporation Multipurpose hot melt adhesive
US6291571B1 (en) * 2000-03-21 2001-09-18 Adco Products, Inc. Lap edge roofing sealant
US6448303B1 (en) * 2000-12-29 2002-09-10 National Starch And Chemical Investment Holding Corporation Hot melt adhesives for dermal application
US6582829B1 (en) * 1996-03-14 2003-06-24 H.B. Fuller Licensing & Financing Inc. Hot melt adhesive composition comprising homogeneous ethylene interpolymer and block copolymer
US6926959B2 (en) * 2000-01-31 2005-08-09 H. B. Fuller Licensing & Financing, Inc. Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149741A (en) * 1989-07-21 1992-09-22 Findley Adhesives, Inc. Hot melt construction adhesives for disposable soft goods
KR930017965A (ko) * 1992-02-28 1993-09-21 핀들리 어드히시브, 인코포레이티드 냉유동 접착제 조성물을 포장하기 위한 필름
EP0781824B1 (fr) * 1995-12-27 2001-07-25 Central Glass Company, Limited Adhésif pour lier une résine de fluorure de vinylidène à un substrat
JP4034478B2 (ja) * 1999-07-02 2008-01-16 スリーエム イノベイティブ プロパティズ カンパニー 感圧接着シート及びその製造方法

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3917607A (en) * 1971-09-22 1975-11-04 Shell Oil Co Block copolymer adhesive compositions
US4394915A (en) * 1982-04-12 1983-07-26 Findley Adhesives Inc. Hot melt adhesive compositions and bottle assemblies using said compositions
US5095059A (en) * 1990-03-28 1992-03-10 Mitsui Toatsu Chemicals, Inc. Oiled-face adherable, hot-melt adhesive composition and a non-slip processing method of metal scaffolding board
US5266400A (en) * 1990-04-20 1993-11-30 Minnesota Mining And Manufacturing Company Low voltage electron beam radiation cured elastomer-based pressure sensitive adhesive tape
US5120585A (en) * 1990-10-12 1992-06-09 Gelman Sciences Technology, Inc. Package for preservative agent
US5120781A (en) * 1991-05-07 1992-06-09 Union Camp Corporation Acid-modified polyhydric alcohol rosin ester tackifiers and hot melt adhesive compositions containing those tackifiers
US5496628A (en) * 1992-11-25 1996-03-05 Textiles Coated Incorporated Single membrane insulation material
US5863977A (en) * 1993-10-12 1999-01-26 H. B. Fuller Licensing & Financing, Inc. High molecular weight S-EB-S hot melt adhesive
US5910527A (en) * 1994-04-28 1999-06-08 Ato Findley, Inc. Hot melt adhesive having a high acid number for disposable soft goods
US6582829B1 (en) * 1996-03-14 2003-06-24 H.B. Fuller Licensing & Financing Inc. Hot melt adhesive composition comprising homogeneous ethylene interpolymer and block copolymer
US5939483A (en) * 1996-07-12 1999-08-17 H.B. Fuller Licensing & Financing, Inc. Low application temperature hot melt with excellent heat and cold resistance
US6121354A (en) * 1998-11-19 2000-09-19 Bostik, Inc. High performance single-component sealant
US6232391B1 (en) * 1998-12-23 2001-05-15 National Starch And Chemical Investment Holding Corporation Multipurpose hot melt adhesive
US6926959B2 (en) * 2000-01-31 2005-08-09 H. B. Fuller Licensing & Financing, Inc. Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks
US6291571B1 (en) * 2000-03-21 2001-09-18 Adco Products, Inc. Lap edge roofing sealant
US6448303B1 (en) * 2000-12-29 2002-09-10 National Starch And Chemical Investment Holding Corporation Hot melt adhesives for dermal application

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060229411A1 (en) * 2005-04-06 2006-10-12 Stephen Hatfield Hot melt pressure sensitive adhesives based on blends of styrene/butadiene copolymers
WO2008028716A1 (fr) * 2006-09-05 2008-03-13 Henkel Ag & Co. Kgaa Étiquettes redécollables
US9375895B2 (en) * 2008-04-28 2016-06-28 Sika Technology Ag Hotmelt adhesives having an extended open time
US20110020634A1 (en) * 2008-04-28 2011-01-27 Sika Technology Ag Hotmelt adhesives having an extended open time
US9695340B2 (en) 2011-09-16 2017-07-04 Henkel Ag & Co. Kgaa Low temperature hot melt adhesive for high-speed coating and spiral coating
US20140199908A1 (en) * 2011-09-16 2014-07-17 Henkel Ag & Co. Kgaa Hot melt adhesive
US9816014B2 (en) 2011-09-16 2017-11-14 Henkel Ag & Co. Kgaa Hot melt adhesive for disposable products
US9822283B2 (en) * 2011-09-16 2017-11-21 Henkel Ag & Co. Kgaa Hot melt adhesive
US10370567B2 (en) 2011-09-16 2019-08-06 Henkel Ag & Co. Kgaa Hot melt adhesive
US20140329074A1 (en) * 2011-12-19 2014-11-06 Sika Technology Ag Reactive polyolefin hot-melt adhesive having low viscosity and use thereof for textile laminations
US9758704B2 (en) 2012-08-28 2017-09-12 Henkel Ag & Co. Kgaa Hot melt adhesive
CN115806789A (zh) * 2022-09-26 2023-03-17 嘉好(太仓)新材料股份有限公司 一种用于口罩耳带粘接热熔胶及其制备方法
DE102023126363A1 (de) 2023-09-27 2025-03-27 Tesa Se Haftklebemasse und wiederablösbare Selbstklebeprodukte umfassend die Haftklebemasse
EP4621025A1 (fr) * 2024-03-21 2025-09-24 Colquimica-Indústria Nacional de Colas, S.A. Adhésif thermofusible en granulés ou en perles pour coller les bouchons aux capsules et son procédé de fabrication

Also Published As

Publication number Publication date
JP2005504164A (ja) 2005-02-10
WO2003029379A8 (fr) 2004-04-22
US20080221247A1 (en) 2008-09-11
WO2003029379A1 (fr) 2003-04-10
FR2830257B1 (fr) 2006-12-01
FR2830257A1 (fr) 2003-04-04
AU2002350812B2 (en) 2007-11-15
EP1434829A1 (fr) 2004-07-07

Similar Documents

Publication Publication Date Title
US20080221247A1 (en) Method of gluing hydrophobic and oleophobic substrates which are intended for packaging
US9982171B2 (en) Hot melt adhesive with functionalized metallocene catalyzed polyolefins
AU757501B2 (en) Hot melt adhesive composition comprising homogeneous ethylene interpolymer and block copolymer
KR101507211B1 (ko) 저온 적용 핫멜트 접착제
US20120165455A1 (en) OBC Based Packaging Adhesive
US10081212B2 (en) Cohesively failing, non-staining hot melt adhesives
US10227509B2 (en) Hot melt adhesive composition for bookbinding
CA2704960C (fr) Composition d'adhesif thermofusible pour application a basse temperature et articles comprenant celle-ci
EP3541887B1 (fr) Composition adhésive thermofusible pour application à basse température et procédé comprenant une telle composition
WO2015017704A1 (fr) Composition adhésive thermofusible pour relier des paquets de récipients
US20030091760A1 (en) Adhesive for difficult to bond substrates
JPH083526A (ja) ホットメルト組成物
EP4332195B1 (fr) Compositions adhésives thermofusibles à base de polypropylène
US3661826A (en) Wax compositions comprising petroleum waxes with certain hydrogenated two-block copolymers
HK1150058B (en) Low application temperature hot melt adhesive composition and articles including the same

Legal Events

Date Code Title Description
AS Assignment

Owner name: BOSTIK S.A., FRANCE

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SAJOT, NICOLAS;POLLACCHI, BENOIT;SELLAK, SAIDA;REEL/FRAME:017212/0847;SIGNING DATES FROM 20051017 TO 20051109

STCB Information on status: application discontinuation

Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION