US1779457A - Electrodeposition of platinum metals - Google Patents
Electrodeposition of platinum metals Download PDFInfo
- Publication number
- US1779457A US1779457A US224764A US22476427A US1779457A US 1779457 A US1779457 A US 1779457A US 224764 A US224764 A US 224764A US 22476427 A US22476427 A US 22476427A US 1779457 A US1779457 A US 1779457A
- Authority
- US
- United States
- Prior art keywords
- platinum
- metal
- nitrite
- electrodeposition
- electrolyte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title description 46
- 229910052697 platinum Inorganic materials 0.000 title description 24
- 229910052751 metal Inorganic materials 0.000 title description 21
- 239000002184 metal Substances 0.000 title description 21
- 238000004070 electrodeposition Methods 0.000 title description 11
- -1 platinum metals Chemical class 0.000 title description 7
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 16
- 239000000243 solution Substances 0.000 description 13
- 239000003792 electrolyte Substances 0.000 description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- 229910052703 rhodium Inorganic materials 0.000 description 8
- 239000010948 rhodium Substances 0.000 description 8
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 8
- 235000010288 sodium nitrite Nutrition 0.000 description 8
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 239000000908 ammonium hydroxide Substances 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 150000002739 metals Chemical group 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- 229910021604 Rhodium(III) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- CAMXVZOXBADHNJ-UHFFFAOYSA-N ammonium nitrite Chemical compound [NH4+].[O-]N=O CAMXVZOXBADHNJ-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002826 nitrites Chemical class 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910000923 precious metal alloy Inorganic materials 0.000 description 1
- SONJTKJMTWTJCT-UHFFFAOYSA-K rhodium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Rh+3] SONJTKJMTWTJCT-UHFFFAOYSA-K 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000010938 white gold Substances 0.000 description 1
- 229910000832 white gold Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
Definitions
- This invention relates to the electro-deposition of platinum metals and especially to the electro-deposition of metals of the group compalladous chloride (PdCl 2H O) or rhodium trichloride RhCl are preferable; to this solution I add an excess of sodium nitrite and heat until the color change indicates a reaction after which I make the hot solution ammoniacal with ammonium hydroxide.
- the sodium nitrite reacts with the metal chloride and forms a double nitrite of sodium and the metal, and upon the subsequent addition of ammonium hydroxide, as stated, an ammino nitrite of the metal is formed in solution in the ammoniacal bath and from such a bath the metal can be electrodeposited.
- the electro-deposition is done from the hot solution with a potential of 4 to 10 volts and a current of 0.05 to 0.20 amperes per square inch.
- An insoluble anode such as platinum or other precious metal, graphite, etc. may be used.
- alloys of the metals platinum, palladium and rhodium can be electrodeposited from my bath if it be prepared from ammino nitrites of the metals to be deposited.
- the preparation and use of such an alloy plating bath is analogous to the preparation and use of a single metal bath, as is more fully set forth hereinafter.
- Example I 2 grams of chloroplatinic acid were dissolved in 140 c. c. distilled water and 3 grams of sodium nitrite added. This 4 Application flied October 7, 1927. Serial Io. 224,704.
- the object to be plated was made the cathode and an anode of platinum was provided. I have found that the best results were obtained at 7 volts with a current density of 0.05 to 0.08 amperes per square inch of cathode surface while the bath is maintained at 7 5-95 C. A bright adherent plate of platinum was obtained.
- ammino nitrite solutions are especially adapted for plating the precious metals on copper, nickel, gold or alloys such as brass or white gold, and other precious metal alloys used in ewelry or scientific instruments.
- An electrolyte for the electro-deposition of a metal of the group comprising platinum, palladium and rhodium comprising the heat treated aqueous solution of a chloride of said metal and an excess of sodium nitrite containing an excess of ammonia.
- An electrolyte for the electrode -osition of a metal of the group, platinum, pa ladium and rhodium comprising an ammoniacal aqueous solution of the reaction product of a chloride of the metal with an alkali metal nitrite.
- An electrolyte for the electrodeposition of platinum comprising an ammoniacal aqueous solution of the reaction product of a chloride of platinum with an alkali metal nitrite.
- An electrolyte for the electrodeposition of platinum comprising an ammoniacal aqueous solution of the reaction product of a chloride of platinum with sodium nitrite.
- Method of preparing an electrolyte for the electrodeposition of metals of the group comprising platinum, palladium and rhodium which comprises treating an aqueous solution of a chloride of the metal to be deposited with an excess of an alkali metal nitrite until a reaction has taken place and then adding an excess of ammonia.
- Method for the preparation of an electrolyte for the electro-deposition of a. metal or alloy of the group comprising platinum, palladium and rhodium which comprises treating an aqueous solution of a chloride of said metal with an excess of sodium nitrite until a reaction has taken place and then adding an excess of ammonia.
- An electrolyte for the electrodeposition of platinum containing in solution an ammino nitrite of platinum, the electrolyte being ammoniacal.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Description
Patented Oct. 28, 1930 UNITED STATES PATENT OFFICE HERBERT mun ZSCHIEGNEB, OI WOODBRIDGE, NEW JERSEY, ASSIGNOB, BY will! ASSIGNMENTS, TO BAKER & 00., INC., 0]? NEWARK, NEW JERSEY, A. CORPORATION 0! NEW JERSEY ELEC'IBODEPOSITION OF PLATINUM. mus
Io Drawing.
This invention relates to the electro-deposition of platinum metals and especially to the electro-deposition of metals of the group compalladous chloride (PdCl 2H O) or rhodium trichloride RhCl are preferable; to this solution I add an excess of sodium nitrite and heat until the color change indicates a reaction after which I make the hot solution ammoniacal with ammonium hydroxide. In the first part of this reaction, the sodium nitrite reacts with the metal chloride and forms a double nitrite of sodium and the metal, and upon the subsequent addition of ammonium hydroxide, as stated, an ammino nitrite of the metal is formed in solution in the ammoniacal bath and from such a bath the metal can be electrodeposited.
The electro-deposition is done from the hot solution with a potential of 4 to 10 volts and a current of 0.05 to 0.20 amperes per square inch. An insoluble anode such as platinum or other precious metal, graphite, etc. may be used.
I have also found that alloys of the metals platinum, palladium and rhodium can be electrodeposited from my bath if it be prepared from ammino nitrites of the metals to be deposited. The preparation and use of such an alloy plating bath is analogous to the preparation and use of a single metal bath, as is more fully set forth hereinafter.
Further details of my bath'and procedure are given in the following examples which show the preparation and use of a platinum plating bath and a platinum-rhodium alloy bath.
Example I.2 grams of chloroplatinic acid were dissolved in 140 c. c. distilled water and 3 grams of sodium nitrite added. This 4 Application flied October 7, 1927. Serial Io. 224,704.
solution was now heated at 85 to 90 C. until the orange color of the original solution was changed to colorless or a very pale yellow. This color change probably indicates a reduction from tetravalent to divalent platinum to form the complex salt sodium platinum nitrite. 5 c. c. of ammonium hydroxide (sp. gr. 0.90) was now added forming a platinum ammino nitrite after which the solution was ready for use.
The object to be plated was made the cathode and an anode of platinum was provided. I have found that the best results were obtained at 7 volts with a current density of 0.05 to 0.08 amperes per square inch of cathode surface while the bath is maintained at 7 5-95 C. A bright adherent plate of platinum was obtained.
Emample Il.+1.8 ams platinum chloride and 0.2 grams rho ium chloride were dissolved in 140 c. c. distilled water and 3 grams sodium nitrite added. This solution was now heated at 8590 C. until a change of color to a very pale yellow took place. 5 c. c. of ammonium hydroxide solution was now added. This solution when used as the electrolyte as described above with a platinum anode gave an adherent cathode deposit of approximately 90% platinum and 10% rhodium.
The ammino nitrite solutions are especially adapted for plating the precious metals on copper, nickel, gold or alloys such as brass or white gold, and other precious metal alloys used in ewelry or scientific instruments.
I have found that the concentration of my plating bath can be considerably varied and still good plating results will be obtained, and I do not wish to be limited to the exact quantities given. I have increased the platinic chloride concentration up to 3 times that given; the amount of nitrite and ammonia added is not critical and the proportions have been doubled and tripled without harmful efi'ects. Potassium or ammonium nitrite may be used.
Claims:
1. An electrolyte for the electro-deposition of a metal of the group comprising platinum, palladium and rhodium, comprising the heat treated aqueous solution of a chloride of said metal and an excess of sodium nitrite containing an excess of ammonia.
2. An electrolyte for the electrode -osition of a metal of the group, platinum, pa ladium and rhodium, comprising an ammoniacal aqueous solution of the reaction product of a chloride of the metal with an alkali metal nitrite.
3. An electrolyte for the electrode osition of a metal of the group, platinum, pa ladium and rhodium, com rising an ammoniacal aqueous solution 0 the reaction product of the chloride of the metal with sodium nitrite'.
4. An electrolyte for the electrodeposition of platinum comprising an ammoniacal aqueous solution of the reaction product of a chloride of platinum with an alkali metal nitrite.
5. An electrolyte for the electrodeposition of platinum comprising an ammoniacal aqueous solution of the reaction product of a chloride of platinum with sodium nitrite.
6. Method of preparing an electrolyte for the electrodeposition of metals of the group comprising platinum, palladium and rhodium which comprises treating an aqueous solution of a chloride of the metal to be deposited with an excess of an alkali metal nitrite until a reaction has taken place and then adding an excess of ammonia.
'7. Method for the preparation of an electrolyte for the electro-deposition of a. metal or alloy of the group comprising platinum, palladium and rhodium which comprises treating an aqueous solution of a chloride of said metal with an excess of sodium nitrite until a reaction has taken place and then adding an excess of ammonia.
8. An electrolyte for the electrodeposition of a metal or alloy of the group platinum, palladium and rhodium, containing in solution an ammino nitrite of the metal to be deposited, the electrolyte being ammoniacal.
9. An electrolyte for the electrodeposition of platinum containing in solution an ammino nitrite of platinum, the electrolyte being ammoniacal.
Signed at Perth Amboy in the county of Middlesex and State of New Jersey this 3rd day of October, A. D. 1927.
HERBERT EMIL ZSGHIIEIGNER.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US224764A US1779457A (en) | 1927-10-07 | 1927-10-07 | Electrodeposition of platinum metals |
| DER75932D DE549775C (en) | 1927-10-07 | 1928-10-05 | Process for generating electrolytic deposits of metals of the platinum group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US224764A US1779457A (en) | 1927-10-07 | 1927-10-07 | Electrodeposition of platinum metals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US1779457A true US1779457A (en) | 1930-10-28 |
Family
ID=22842094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US224764A Expired - Lifetime US1779457A (en) | 1927-10-07 | 1927-10-07 | Electrodeposition of platinum metals |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US1779457A (en) |
| DE (1) | DE549775C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3013956A (en) * | 1957-04-05 | 1961-12-19 | Baldwin Piano Co | Methods of etching metals in the platinum group and producing printed circuits therefrom |
| US3296102A (en) * | 1961-08-01 | 1967-01-03 | Exxon Research Engineering Co | Catalysts and electrodes for electrochemical cells |
| US3356538A (en) * | 1964-09-29 | 1967-12-05 | Gen Electric | Electrodeposited ion exchange membrane and method of forming |
| US3444003A (en) * | 1965-09-30 | 1969-05-13 | Leesona Corp | Multilayer catalytic electrode having a layer of noble metal and lead and a surface layer free of lead and method of constructing same |
| US4285784A (en) * | 1980-07-10 | 1981-08-25 | The United States Of America As Represented By The Secretary Of The Interior | Process of electroplating a platinum-rhodium alloy coating |
| US6306277B1 (en) | 2000-01-14 | 2001-10-23 | Honeywell International Inc. | Platinum electrolyte for use in electrolytic plating |
| WO2010037495A1 (en) * | 2008-10-04 | 2010-04-08 | Umicore Galvanotechnik Gmbh | Process for the deposition of platinum-rhodium layers having improved whiteness |
| KR20230050238A (en) | 2021-10-07 | 2023-04-14 | 이이쟈 가부시키가이샤 | PtRu ALLOY PLATING SOLUTION AND METHOD FOR PLATING PtRu ALLOY FILM |
-
1927
- 1927-10-07 US US224764A patent/US1779457A/en not_active Expired - Lifetime
-
1928
- 1928-10-05 DE DER75932D patent/DE549775C/en not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3013956A (en) * | 1957-04-05 | 1961-12-19 | Baldwin Piano Co | Methods of etching metals in the platinum group and producing printed circuits therefrom |
| US3296102A (en) * | 1961-08-01 | 1967-01-03 | Exxon Research Engineering Co | Catalysts and electrodes for electrochemical cells |
| US3356538A (en) * | 1964-09-29 | 1967-12-05 | Gen Electric | Electrodeposited ion exchange membrane and method of forming |
| US3444003A (en) * | 1965-09-30 | 1969-05-13 | Leesona Corp | Multilayer catalytic electrode having a layer of noble metal and lead and a surface layer free of lead and method of constructing same |
| US4285784A (en) * | 1980-07-10 | 1981-08-25 | The United States Of America As Represented By The Secretary Of The Interior | Process of electroplating a platinum-rhodium alloy coating |
| US6306277B1 (en) | 2000-01-14 | 2001-10-23 | Honeywell International Inc. | Platinum electrolyte for use in electrolytic plating |
| US6521113B2 (en) | 2000-01-14 | 2003-02-18 | Honeywell International Inc. | Method of improving the oxidation resistance of a platinum modified aluminide diffusion coating |
| WO2010037495A1 (en) * | 2008-10-04 | 2010-04-08 | Umicore Galvanotechnik Gmbh | Process for the deposition of platinum-rhodium layers having improved whiteness |
| KR20230050238A (en) | 2021-10-07 | 2023-04-14 | 이이쟈 가부시키가이샤 | PtRu ALLOY PLATING SOLUTION AND METHOD FOR PLATING PtRu ALLOY FILM |
Also Published As
| Publication number | Publication date |
|---|---|
| DE549775C (en) | 1932-05-02 |
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