TWM508885U - Electronic device and liquid cooling heat dissipation structure thereof - Google Patents

Description

Electronic device and liquid cooling heat dissipation structure thereof

The present invention relates to an electronic device and a liquid-cooled heat dissipation structure thereof, and more particularly to an electronic device for improving the overall heat dissipation performance and a liquid-cooled heat dissipation structure thereof.

With the increase in processing speed and performance of the central processing unit (CPU), the current heat generation of the CPU is increased, and the higher operating frequency also increases the wattage during operation, and the high temperature generated by the CPU reduces the CPU. Lifespan, especially when too much heat is not effectively removed, can easily cause system instability. In order to solve the problem of CPU overheating, a combination of a heat sink and a fan is generally used to remove heat by forced cooling, thereby achieving the effect of maintaining the normal operation of the CPU. However, the disturbing noise and high power consumption of conventional fans at high speeds are often difficult for manufacturers to overcome.

In order to solve the above-mentioned conventional problems, a water-cooling head heat dissipation structure is born. The conventional water-cooling head heat dissipating structure comprises a body and a cover body disposed on the seat body, wherein the seat body has a plurality of heat sinks, the bottom of the seat body directly contacts a heat source, and the cover body has a water inlet hole and a drainage. Thereby, the bottom of the base body is in contact with the heat source, so that the heat generated by the heat source can be conducted to the plurality of heat sinks, and then the cooling liquid flows through the circulation between the water inlet hole and the water outlet hole to The heat absorbed by the multiple heat sinks is quickly guided away to achieve rapid heat dissipation. However, the heat dissipation performance of the conventional water-cooling head heat dissipation structure still needs to be improved.

The technical problem to be solved by this creation is that it provides for the shortcomings of the prior art. An electronic device and a liquid-cooled heat dissipation structure thereof can be used to improve overall heat dissipation performance.

A liquid-cooled heat dissipation structure provided by one embodiment of the present invention includes: a heat-conducting substrate, a shunt plate, a baffle, and a water supply module. The heat conducting substrate has a heat conducting body contacting the heat source and a plurality of heat dissipating fins disposed on the heat conducting body; the shunt plate is disposed on the plurality of the heat dissipating fins; the baffle is disposed on the a water distribution module comprising: an outer cover body detachably disposed on the heat conductive body; and at least two pumps detachably disposed in parallel on the outer cover body, wherein the plurality of heat dissipation fins The sheet, the splitter plate, and the baffle are all housed in the outer casing; wherein the baffle has at least two first baffle openings respectively corresponding to at least two of the pumps And a second baffle opening that communicates with at least two of the first baffle openings through a first accommodating space, and the shunt plate has a second accommodating space to communicate with the a first splitter opening of the second deflector opening and a second splitter opening that communicates with the first splitter opening through a third receiving space; wherein the outer cover has at least one pass Four accommodating spaces to communicate with the first baffle a liquid input port of the port and at least one liquid output port passing through a fifth accommodating space to communicate with the opening of the second splitter plate, and the cooling liquid is driven by the pump to pass from at least one of the liquid input ports It is input to the inside of the outer cover body and is output from at least one of the liquid outlets to the outside of the outer cover body.

An electronic device provided by another embodiment of the present invention, the electronic device having at least one heat source, wherein the electronic device uses a liquid-cooled heat dissipation structure disposed on at least one of the heat sources, wherein The liquid cooling heat dissipating structure comprises: a heat conducting substrate, a shunt plate, a baffle, and a water supply module. The heat-conducting substrate has a heat-conducting body contacting at least one of the heat-generating sources and a plurality of heat-dissipating fins disposed on the heat-conducting body; the heat-distributing plate is disposed on a plurality of the heat-dissipating fins; the deflector Provided on the shunt plate; the water supply module includes an outer cover body detachably disposed on the heat conductive body and at least two detachably a pump disposed in parallel on the outer cover body, wherein a plurality of the heat dissipation fins, the flow dividing plate, and the baffle are housed in the outer cover; wherein the baffle has at least Two first baffle openings respectively corresponding to at least two of the pumps and a second baffle opening through a first accommodating space to communicate with at least two of the first baffle openings, The splitter plate has a first splitter opening that communicates with the second baffle opening through a second receiving space and a third accommodating space to communicate with the first splitter opening. The second shunt plate opening; wherein the outer cover body has at least one liquid input port that communicates with the first baffle opening through a fourth receiving space and at least one through a fifth receiving space to communicate a liquid outlet opening of the second splitter opening, and the cooling liquid is driven by the pump to be input from at least one of the liquid input ports to the inside of the outer cover body and output from at least one of the liquids The port is output to the outside of the outer cover.

A liquid-cooled heat dissipation structure according to another embodiment of the present invention includes: a heat-conducting substrate, a shunt plate, a baffle, and a water supply module. The heat conducting substrate has a heat conducting body contacting the heat source and a plurality of heat dissipating fins disposed on the heat conducting body; the shunt plate is disposed on the plurality of the heat dissipating fins; the baffle is disposed on the a water distribution module comprising: an outer cover body detachably disposed on the heat conductive body; and at least two pumps detachably disposed in parallel on the outer cover body, wherein the plurality of heat dissipation fins The sheet, the flow dividing plate, and the baffle are all housed in the outer casing; wherein the outer casing has at least one liquid inlet and at least one liquid outlet, and the cooling liquid passes through at least two of the One or all of the pumps are driven to be input from at least one of the liquid inlets to the inside of the outer casing, and are output from at least one of the liquid outlets to the outside of the outer casing.

The electronic device of the present invention and the liquid-cooling heat dissipation structure thereof can be provided by the water supply module including a cover body detachably disposed on the heat conductive body and At least two pumps are detachably disposed in parallel on the outer casing to enhance the overall heat dissipation performance. It is worth mentioning that the liquid cooling heat dissipation structure of the present invention can selectively activate the first rotating member or the second rotating member or simultaneously activate the first rotating member and the according to different heat dissipation requirements. The second rotating member.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

D‧‧‧Electronic device

Z‧‧‧Liquid cooled heat dissipation structure

1‧‧‧thermal substrate

10‧‧‧thermal body

11‧‧‧ Heat sink fins

2‧‧‧Splitter

201‧‧‧First splitter opening

2011‧‧‧Long strip opening

2012‧‧‧buffer opening

202‧‧‧Second splitter opening

3‧‧‧Baffle

301‧‧‧First deflector opening

302‧‧‧Second deflector opening

31‧‧‧Support

32‧‧‧Retaining wall

33‧‧‧Protruding

M‧‧‧Water supply module

4‧‧‧Outer cover

41‧‧‧Liquid input

42‧‧‧Liquid outlet

5‧‧‧ pump

5A‧‧‧First pump

51A‧‧‧First rotating part

52‧‧‧First fixture

5B‧‧‧First pump

51B‧‧‧Second rotating parts

52B‧‧‧Second fixture

6‧‧‧Removable components

R1‧‧‧First accommodation space

R11‧‧‧First Space Department

R12‧‧‧Second Space Department

R13‧‧‧Shared Space Department

P1‧‧‧ first connected opening

P2‧‧‧second communication opening

R2‧‧‧Second space

R3‧‧‧ third accommodating space

R4‧‧‧ fourth accommodation space

R5‧‧‧ fifth accommodation space

H‧‧‧heat source

W‧‧‧Cooling liquid

S‧‧‧ screws

FIG. 1 is a perspective exploded view of one of the viewing angles of the liquid cooling heat dissipation structure of the present invention.

2 is a perspective exploded view of another viewing angle of the liquid cooling heat dissipation structure of the present invention.

FIG. 3 is a perspective assembled view of the liquid cooling heat dissipation structure of the present invention.

4 is a schematic perspective cross-sectional view of the A-A cut line of FIG. 3.

Figure 5 is a side cross-sectional view of the A-A cut line of Figure 3;

Fig. 6 is a schematic perspective cross-sectional view showing the B-B cut line of Fig. 3;

Fig. 7 is a schematic perspective cross-sectional view showing the C-C cut line of Fig. 3;

Figure 8 is a schematic perspective cross-sectional view of the D-D cut line of Figure 3.

FIG. 9 is a top plan view of one of the electronic devices using the liquid cooling heat dissipation structure.

FIG. 10 is a schematic view showing that the cooling liquid of the liquid cooling type heat dissipating structure is conveyed only by the first rotating member.

Figure 11 is a schematic view showing the cooling liquid of the liquid cooling type heat dissipating structure of the present invention being conveyed only by the second rotating member.

FIG. 12 is a schematic view showing the cooling liquid of the liquid cooling heat dissipating structure of the present invention being simultaneously conveyed by the first rotating member and the second rotating member.

The following is a specific example to illustrate the implementation of the "electronic device and its liquid cooling heat dissipation structure" disclosed in the present application, and those skilled in the art may The advantages and effects of this creation are understood from the content disclosed in this specification. The present invention can be implemented or applied in various other specific embodiments. The details of the present specification can also be modified and changed without departing from the spirit and scope of the present invention. In addition, the drawings of this creation are only for a brief illustration, and are not described in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosed content is not intended to limit the technical scope of the present creation.

Please refer to FIG. 1 to FIG. 9 , wherein FIG. 4 is a schematic cross-sectional view of the AA cut line of FIG. 3 , FIG. 5 is a side cross-sectional view of the AA cut line of FIG. 3 , and FIG. 6 is a BB cut of FIG. 3 . FIG. 7 is a perspective cross-sectional view of the CC cut line of FIG. 3, and FIG. 8 is a perspective cross-sectional view of the DD cut line of FIG. As can be seen from the above figures, the present invention provides a liquid-cooled heat dissipation structure Z comprising: a heat-conducting substrate 1, a shunt plate 2, a baffle 3, and a water supply module M.

First, as shown in FIG. 1 (or FIG. 2) and FIG. 4 (or FIG. 5), the heat-conductive substrate 1 has a heat-conducting body 10 that contacts a heat source H (for example, a CPU or any heat-generating wafer) and a plurality of The heat dissipation fins 11 on the heat conducting body 10. In addition, the splitter plate 2 is disposed on the plurality of heat radiating fins 11, and the deflector 3 is disposed on the splitter plate 2. In addition, the water supply module M includes an outer cover body 4 detachably disposed on the heat conductive body 10 and at least two pumps 5 detachably disposed in parallel on the outer cover body 4, and a plurality of heat dissipation fins 11 and a manifold 2. The deflector 3 is housed in the outer cover 4.

For example, as shown in FIG. 1 (or FIG. 2) and FIG. 4 (or FIG. 5), the outer cover 4 can be detachably disposed on the thermally conductive substrate 1 by a plurality of screws S. Further, the first manifold opening 201 of the splitter plate 2 has a long opening portion 2011 and a buffer opening portion 2012 that communicates with the elongated opening portion 2011. In addition, one of the pumps (for example, the first pump 5A) has a first rotating member 51A (ie, a rotor) disposed between the outer cover 4 and the deflector 3, and a first cover member 4 is disposed on the outer cover 4 and corresponds to The first fixing member 52A of the first rotating member 51A (that is, the stator), and another pump (for example, the first pump) 5B) having a second rotating member 51B (ie, a rotor) disposed between the outer cover 4 and the deflector 3 adjacent to the first rotating member 51A and one disposed on the outer cover 4 and corresponding to the second rotating member 51B The second fixing member 52B (that is, the stator). However, this creation is not limited to the examples given above.

Furthermore, in conjunction with FIG. 1 (or FIG. 2), FIG. 4 (or FIG. 5) and FIG. 7, the deflector 3 has at least two first baffles respectively corresponding to at least two pumps 5. The opening 301 and a second baffle opening 302 passing through the first accommodating space R1 to communicate with the at least two first baffle openings 301. In addition, as shown in FIG. 1 (or FIG. 2 ), FIG. 4 (or FIG. 5 ), FIG. 6 and FIG. 9 , the splitter plate 2 has a second receiving space R2 for communicating with the second deflector opening 302 . The first shunt opening 201 and a second shunt opening 202 that communicates with the first shunt opening 201 through a third receiving space R3. In other words, after the cooling liquid W enters from the two first baffle openings 301, it passes through the first accommodating space R1, the second accommodating space R2, and the third accommodating space R3, and finally collects into the second. The manifold opening 202 (shown in Figure 9).

Furthermore, with reference to FIG. 1 (or FIG. 2), FIG. 4 (or FIG. 5), FIG. 6 and FIG. 9, the outer cover body 4 has at least one through a fourth accommodating space R4 to communicate with the first guide. a liquid input port 41 of the flow plate opening 301 and at least one liquid output port 42 passing through a fifth accommodating space R5 to communicate with the second splitter plate opening 202, and the cooling liquid W passes through one or all of the pump 5 The drive is input from the at least one liquid input port 41 to the inside of the outer cover body 4, and is output from the at least one liquid output port 42 to the outside of the outer cover body 4.

For example, as shown in FIG. 1 (or FIG. 2 ) and FIG. 4 (or FIG. 5 ), the bottom end of the baffle 3 has a plurality of support portions 31 directly contacting the splitter plate 2 and a plurality of direct contact split plates 2 . The retaining wall portion 32 has a protruding portion 33 disposed between the first receiving space R1 and the second receiving space R2. In addition, the first accommodating space R1 is formed between the outer cover body 4 and the deflector 3, and the second accommodating space R2 and the fourth accommodating space R4 are both formed between the deflector 3 and the diverter plate 2, and the third The accommodating space R3 is formed between the splitter plate 2 and the heat conductive body 10, and the second accommodating space R2 and the The four accommodation spaces R4 are separated by the retaining wall portion 32. However, this creation is not limited to the examples given above.

Referring to FIG. 9 , the present invention further provides an electronic device D (for example, a computer main body), wherein the electronic device D has at least one heat source H. It should be noted that the electronic device D uses a liquid-cooled heat dissipation structure Z disposed on at least one heat source H to provide a heat source H for water cooling. Of course, the electronic device D can also be replaced with any heat dissipation carrier. For example, the heat dissipation carrier plate may be a heat dissipation plate, and the liquid cooling heat dissipation structure Z may be placed on the heat dissipation plate to improve the overall heat dissipation performance of the heat dissipation plate.

Referring to FIG. 10 to FIG. 12, the first accommodating space R1 has a first space portion R11 for accommodating the first rotating member 51A and communicating with one of the first baffle openings 301. a second rotating portion 51B and a second space portion R12 communicating with the other first deflector opening 301, and a corresponding to the first space portion R11 and the second space portion R12 and communicating with the second deflector opening 302 Shared space section R13. Further, the shared space portion R13 may pass through the first communication opening P1 to communicate with the first space portion R11, and the common space portion R13 may pass through the second communication opening P2 to communicate with the second space portion R12. Furthermore, the liquid-cooling heat dissipation structure Z further comprises: a movable element 6 (for example, a flexible switching element), wherein the movable element 6 is disposed in the first space portion R11, the second space portion R12, And between the shared space portion R13.

As an example, as shown in FIG. 10, when the cooling liquid W is conveyed only by the first rotating member 51A, the cooling liquid W pushes the movable member 6 toward the second space portion R12 to close the second communication opening P2. The cooling liquid W can only pass through the first communication opening P1 to be transferred to the common space portion R13.

As another example, as shown in FIG. 11, when the cooling liquid W is conveyed only by the second rotating member 51B, the cooling liquid W pushes the movable member 6 toward the first space portion R11 to close the first communication opening. P1, so that the cooling liquid W can pass only through the second communication opening P2 to be transferred to the common space portion R13.

As another example, as shown in FIG. 12, when the cooling liquid W is simultaneously conveyed by the first rotating member 51A and the second rotating member 51B, the cooling liquid W pushes the movable member 6 to the first space portion R11. Opening the first communication opening P1 and the second communication opening P2 simultaneously between the second space portion R12, so that the cooling liquid W can pass through the first communication opening P1 and the second communication opening P2 simultaneously to be transmitted to the shared space portion. R13.

Thereby, the liquid cooling heat dissipation structure Z of the present invention can selectively activate the first rotating member 51A and the second rotating member 51B according to different heat dissipation requirements. When the heat dissipation demand is low, only the first rotating member 51A or the second rotating member 51B can be activated. When the heat dissipation demand is high, the first rotating member 51A and the second rotating member 51B can be simultaneously activated.

[Possible effects of the examples]

In summary, the benefit of the present invention may be that the electronic device D and the liquid-cooling heat dissipation structure Z thereof provided by the present embodiment may be provided by the water supply module M including a detachably disposed heat-dissipating body 10 The upper cover body 4 and at least two pumps 5" detachably disposed in parallel on the outer cover body 4 are designed to improve the overall heat dissipation performance. It is worth mentioning that the liquid cooling heat dissipation structure Z of the present invention can selectively activate the first rotating member 51A or the second rotating member 51B or simultaneously activate the first rotating member 51A and the second rotating member according to different heat dissipation requirements. 51B.

The above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the schema are included in the scope of protection of the present creation. .

Z‧‧‧Liquid cooled heat dissipation structure

1‧‧‧thermal substrate

10‧‧‧thermal body

11‧‧‧ Heat sink fins

2‧‧‧Splitter

201‧‧‧First splitter opening

2011‧‧‧Long strip opening

2012‧‧‧buffer opening

202‧‧‧Second splitter opening

3‧‧‧Baffle

301‧‧‧First deflector opening

302‧‧‧Second deflector opening

31‧‧‧Support

32‧‧‧Retaining wall

33‧‧‧Protruding

M‧‧‧Water supply module

4‧‧‧Outer cover

41‧‧‧Liquid input

42‧‧‧Liquid outlet

5‧‧‧ pump

5A‧‧‧First pump

51A‧‧‧First rotating part

52‧‧‧First fixture

5B‧‧‧First pump

51B‧‧‧Second rotating parts

52B‧‧‧Second fixture

S‧‧‧ screws

Claims (17)

A liquid-cooling heat dissipation structure includes: a heat-conducting substrate having a heat-conducting body contacting a heat source and a plurality of heat-dissipating fins disposed on the heat-conducting body; a shunt plate, the shunt plate is disposed a plurality of the fins; a baffle, the baffle is disposed on the shunt; and a water supply module, the water supply module includes a detachably disposed on the heat conducting body a cover body and at least two pumps detachably disposed in parallel on the outer cover body, wherein a plurality of the heat dissipation fins, the flow dividing plate, and the baffle are housed in the outer cover body Wherein the baffle has at least two first baffle openings respectively corresponding to at least two of the pumps and one through a first accommodating space to communicate with at least two of the first diversions a second baffle opening of the plate opening, and the diverter plate has a first shunt plate opening through a second accommodating space to communicate with the second baffle opening and a third accommodating space In order to communicate with the opening of the first manifold a partition opening; wherein the outer cover has at least one liquid input port that communicates with the opening of the first baffle through a fourth receiving space and at least one through a fifth receiving space to communicate with the a liquid outlet of the second splitter opening, and the cooling liquid is driven by the pump to be input from at least one of the liquid input ports to the inside of the outer cover body, and is outputted from at least one of the liquid output ports to The exterior of the outer cover. The liquid-cooling heat dissipation structure according to claim 1, wherein the bottom end of the deflector has a plurality of support portions directly contacting the splitter plate and a plurality of retaining wall portions directly contacting the splitter plate, and The top end of the deflector has a protrusion disposed between the first accommodating space and the second accommodating space, wherein the first shunt opening of the shunt plate has a long strip shape Opening and one connected to the office The buffer opening portion of the elongated opening portion is described. The liquid-cooling heat dissipation structure according to claim 2, wherein the first accommodating space is formed between the outer cover and the deflector, the second accommodating space and the fourth accommodating a space is formed between the baffle and the diverter plate, the third accommodating space is formed between the diverter plate and the heat conducting body, and the second accommodating space and the first The four accommodating spaces are separated by the retaining wall portion. The liquid-cooling heat dissipation structure according to claim 1, wherein one of the pumps has a first rotating member disposed between the outer cover and the deflector, and another one of the pumps Having a second rotating member disposed between the outer cover body and the deflector and adjacent to the first rotating member, wherein the first accommodating space has a first rotating member for accommodating the first rotating member And a first space portion connected to one of the first baffle openings, a second space portion for accommodating the second rotating member and communicating with another one of the first baffle openings, and a shared space portion corresponding to the first space portion and the second space portion and communicating with the second baffle opening, wherein the shared space portion communicates with the first communication opening a first space portion, and the shared space portion communicates with the second space portion through a second communication opening. The liquid cooling heat dissipation structure according to claim 4, further comprising: a movable element disposed in the first space portion, the second space portion, and the shared space portion between. The liquid-cooling heat dissipation structure according to claim 5, wherein the cooling liquid pushes the movable member toward the second space portion when the cooling liquid is conveyed only by the first rotating member The second communication opening is closed such that the cooling liquid can only pass through the first communication opening to be transferred to the common space portion. The liquid-cooling heat dissipation structure according to claim 5, wherein the cooling liquid pushes the movable member toward the first space portion when the cooling liquid is conveyed only by the second rotating member Closing the first communication opening such that The cooling liquid can only pass through the second communication opening to be transferred to the common space portion. The liquid-cooling heat dissipation structure according to claim 5, wherein the cooling liquid pushes the movable member to when the cooling liquid is simultaneously conveyed by the first rotating member and the second rotating member Opening the first communication opening and the second communication opening simultaneously between the first space portion and the second space portion, so that the cooling liquid passes through the first communication opening and the The second communication opening is transmitted to the shared space portion. An electronic device having at least one heat generating source, the electronic device using a liquid cooling heat dissipating structure disposed on at least one of the heat generating sources, wherein the liquid cooling heat dissipating structure comprises: a heat-conducting substrate having a heat-conducting body contacting at least one of the heat-generating sources and a plurality of heat-dissipating fins disposed on the heat-conducting body; a shunt plate disposed on the plurality of heat-dissipating fins a baffle; a baffle disposed on the shunt; and a water supply module, the water supply module including a cover body detachably disposed on the heat transfer body and at least two a pump detachably disposed in parallel on the outer cover body, wherein a plurality of the heat dissipation fins, the flow dividing plate, and the baffle are housed in the outer casing; wherein the diversion The plate has at least two first baffle openings respectively corresponding to at least two of the pumps and a second diversion flow passing through a first accommodating space to communicate with at least two of the first baffle openings Board opening, and The splitter plate has a first splitter plate opening through a second receiving space to communicate with the second deflector opening and a second through a third receiving space to communicate with the first splitter opening a partition opening; wherein the outer cover has at least one liquid input port that communicates with the opening of the first baffle through a fourth receiving space and at least one through a fifth receiving space to communicate with the a liquid outlet of the second splitter opening, and a coolant The body is driven by the pump to be input from at least one of the liquid inlets to the inside of the outer casing, and is output from at least one of the liquid outlets to the outside of the outer casing. The electronic device of claim 9, wherein the bottom end of the baffle has a plurality of support portions directly contacting the shunt plate and a plurality of retaining wall portions directly contacting the shunt plate, and the diversion The top end of the plate has a protrusion disposed between the first accommodating space and the second accommodating space, wherein the first shunt plate opening of the shunt plate has a long opening portion and A buffer opening that communicates with the elongated opening. The electronic device of claim 10, wherein the first accommodating space is formed between the outer cover body and the baffle, and the second accommodating space and the fourth accommodating space are both formed. The third accommodating space is formed between the flow dividing plate and the heat conducting body, and the second accommodating space and the fourth accommodating space are disposed between the deflector and the flow dividing plate. The space is separated by the retaining wall portion. The electronic device of claim 9, wherein one of the pumps has a first rotating member disposed between the outer cover and the deflector, and another one of the pumps has a setting a second rotating member between the outer cover body and the deflector and adjacent to the first rotating member, wherein the first receiving space has a first rotating member for receiving and communicating with a first space portion of the first baffle opening, a second space portion for accommodating the second rotating member and communicating with another one of the first baffle openings, and a corresponding to The first space portion and the second space portion communicate with the common space portion of the second baffle opening, wherein the common space portion communicates with the first space through a first communication opening And the shared space portion communicates with the second space portion through a second communication opening. The electronic device of claim 12, wherein the liquid-cooling heat dissipation structure further comprises: a movable element disposed in the first space portion, the second space portion, and Between the shared space parts. The electronic device of claim 13, wherein the cooling liquid pushes the movable member toward the second space portion to close the cooling liquid when the cooling liquid is conveyed only by the first rotating member The second communication opening allows the cooling liquid to pass only through the first communication opening to be transferred to the common space portion. The electronic device of claim 13, wherein the cooling liquid pushes the movable member toward the first space portion to close the cooling liquid when the cooling liquid is conveyed only by the second rotating member The first communication opening allows the cooling liquid to pass only through the second communication opening to be transferred to the common space portion. The electronic device of claim 13, wherein the cooling liquid pushes the movable member to the first portion when the cooling liquid is simultaneously conveyed by the first rotating member and the second rotating member Opening the first communication opening and the second communication opening simultaneously between a space portion and the second space portion, so that the cooling liquid passes through the first communication opening and the second communication simultaneously An opening is transmitted to the shared space portion. A liquid-cooling heat dissipation structure includes: a heat-conducting substrate having a heat-conducting body contacting a heat source and a plurality of heat-dissipating fins disposed on the heat-conducting body; a shunt plate, the shunt plate is disposed a plurality of the fins; a baffle, the baffle is disposed on the shunt; and a water supply module, the water supply module includes a detachably disposed on the heat conducting body a cover body and at least two pumps detachably disposed in parallel on the outer cover body, wherein a plurality of the heat dissipation fins, the flow dividing plate, and the baffle are housed in the outer cover body Wherein the outer cover body has at least one liquid input port and at least one liquid output port, and the cooling liquid is driven by one or all of the at least two of the pumps to be input from at least one of the liquid input ports To the inside of the outer cover body and outputted from at least one of the liquid outlets to the outside of the outer cover body.