CN204442899U - Electronic device and liquid cooling heat dissipation structure thereof - Google Patents

Abstract

An electronic device and a liquid-cooled heat dissipation structure thereof, the liquid-cooled heat dissipation structure includes: a heat-conducting substrate, a flow-dividing plate and a water supply assembly. The heat conducting substrate is provided with a heat conducting body contacting with the heating source and a plurality of heat radiating fins arranged on the heat conducting body. The flow distribution plate is disposed on the plurality of heat dissipation fins. The guide plate is arranged on the flow distribution plate. The water supply assembly comprises an outer cover body detachably arranged on the heat conduction body and at least two pumps detachably arranged on the outer cover body in parallel, wherein the plurality of heat dissipation fins, the flow distribution plate and the flow guide plate are accommodated in the outer cover body. The outer cover body is provided with at least one liquid input port and at least one liquid output port, and cooling liquid is driven by one or all of the at least two pumps to be input into the inner part of the outer cover body from the at least one liquid input port and output to the outer part of the outer cover body from the at least one liquid output port.

Description

Electronic device and liquid cooling heat dissipation structure thereof

technical field

The utility model relates to an electronic device and its liquid-cooled heat dissipation structure, in particular to an electronic device and its liquid-cooled heat dissipation structure for improving the overall heat dissipation performance.

Background technique

With the improvement of the processing speed and performance of the central processing unit (CPU), the heat output of the current CPU increases, and the higher operating frequency also relatively increases the wattage during work, and the high temperature generated by it will reduce the CPU temperature. Life, especially when too much heat is not effectively removed, it is easy to cause system instability. In order to solve the problem of overheating of the CPU, a combination of a radiator and a fan is generally used to remove the heat by means of forced cooling, so as to achieve the effect of maintaining the normal operation of the CPU. However, the disturbing noise and high power consumption produced by the existing fan at high speed are often difficult problems for manufacturers to overcome.

In order to solve the above-mentioned existing troubles, a heat dissipation structure of a water-cooled head is developed accordingly. The existing heat dissipation structure of the water cooling head includes a base body and a cover body arranged on the base body, wherein the base body has a plurality of cooling fins, the bottom of the base body directly contacts a heat source, and the cover body has a water inlet hole and a drainage. In this way, through the contact between the bottom of the seat and the heat source, the heat generated by the heat source can be conducted to a plurality of heat sinks, and then the cooling liquid circulates between the water inlet hole and the water outlet hole to dissipate the heat. The heat absorbed by the multiple heat sinks is quickly dissipated to achieve the purpose of rapid heat dissipation. However, the heat dissipation efficiency of the existing water cooling head heat dissipation structure still needs to be improved.

Utility model content

The technical problem to be solved by the utility model is to provide an electronic device and its liquid-cooled heat dissipation structure, which can be used to improve the overall heat dissipation performance.

One embodiment of the present invention provides a liquid-cooled heat dissipation structure, which includes: a heat-conducting substrate, a splitter plate, a deflector plate, and a water supply component. The heat conduction substrate has a heat conduction body contacting the heat source and a plurality of heat dissipation fins arranged on the heat conduction body; the splitter plate is arranged on the plurality of heat dissipation fins; the deflector is arranged on the Diverter plate; the water supply assembly includes an outer cover detachably arranged on the heat conduction body and at least two pumps detachably arranged on the outer cover in parallel, wherein a plurality of the heat dissipation fins, Both the diverter plate and the deflector are housed in the outer cover; wherein the deflector has at least two first deflector openings corresponding to at least two pumps and a through A first accommodating space communicates with at least two second baffle openings of the first baffle openings, and the splitter plate has a second accommodating space for communicating with the second baffle openings. The first diverter plate opening of the diverter plate opening and a second diverter plate opening through a third accommodating space to communicate with the first diverter plate opening; wherein, the outer cover has at least one through a fourth accommodating space space to communicate with the liquid input port of the opening of the first deflector plate and at least one liquid output port through a fifth accommodating space to communicate with the opening of the second diverter plate, and the cooling liquid is driven by the pump , so as to input the liquid from at least one input port to the inside of the outer cover, and output the liquid from at least one output port to the outside of the outer cover.

Another embodiment of the utility model provides an electronic device, the electronic device has at least one heat source, and the electronic device uses a liquid-cooled heat dissipation structure arranged on the at least one heat source, and is characterized in that , the liquid-cooled heat dissipation structure includes: a heat-conducting substrate, a splitter plate, a deflector plate, and a water supply component. The heat conduction substrate has a heat conduction body contacting at least one heat source and a plurality of heat dissipation fins arranged on the heat conduction body; the splitter plate is arranged on a plurality of the heat dissipation fins; the deflector set on the diverter plate; the water supply assembly includes an outer cover detachably arranged on the heat conduction body and at least two pumps detachably arranged on the outer cover in parallel, wherein a plurality of the The heat dissipation fins, the splitter plate, and the deflector are all accommodated in the outer cover; wherein the deflector has at least two first deflectors respectively corresponding to at least two pumps The opening and a second deflector opening communicated with at least two of the first deflector openings through a first accommodation space, and the splitter plate has a second accommodation space through which it communicates with all The first splitter opening of the second deflector opening and a second splitter opening that passes through a third accommodating space to communicate with the first splitter opening; wherein, the outer cover has at least one through a The fourth accommodating space communicates with the liquid input port of the first deflector opening and at least one liquid output port through a fifth accommodating space and communicates with the second diverter plate opening, and the cooling liquid passes through the Driven by the pump, the liquid is input from at least one of the liquid input ports to the inside of the outer cover, and output from at least one of the liquid output ports to the outside of the outer cover.

Another embodiment of the present invention provides a liquid-cooled heat dissipation structure, which includes: a heat-conducting substrate, a splitter plate, a deflector plate, and a water supply assembly. The heat conduction substrate has a heat conduction body contacting the heat source and a plurality of heat dissipation fins arranged on the heat conduction body; the splitter plate is arranged on the plurality of heat dissipation fins; the deflector is arranged on the Diverter plate; the water supply assembly includes an outer cover detachably arranged on the heat conduction body and at least two pumps detachably arranged on the outer cover in parallel, wherein a plurality of the heat dissipation fins, Both the splitter plate and the deflector are accommodated in the outer cover; wherein, the outer cover has at least one liquid input port and at least one liquid output port, and the cooling liquid passes through at least two of the pumps One or all of them are driven to be input from at least one of the liquid input ports to the inside of the outer cover, and to be output from at least one of the liquid output ports to the outside of the outer cover.

The beneficial effect of the utility model may lie in that the electronic device and its liquid-cooled heat dissipation structure provided by the embodiment of the utility model can be realized by "the water supply assembly includes an outer cover detachably arranged on the heat conduction body And at least two detachable pumps that are arranged in parallel on the outer cover to improve the overall heat dissipation performance. It is worth mentioning that the liquid-cooled heat dissipation structure of the present invention can selectively activate the first rotating member or the second rotating member, or simultaneously activate the first rotating member and the second rotating member according to different heat dissipation requirements. Describe the second rotating member.

In order to enable a further understanding of the features and technical content of the utility model, please refer to the following detailed description and drawings of the utility model, but the attached drawings are only for reference and illustration, and are not used to limit the utility model .

Description of drawings

Fig. 1 is a three-dimensional exploded schematic diagram of one viewing angle of the liquid cooling heat dissipation structure of the present invention;

Fig. 2 is a three-dimensional exploded schematic view of another viewing angle of the liquid-cooled heat dissipation structure of the present invention;

Fig. 3 is a three-dimensional combination schematic diagram of the liquid cooling heat dissipation structure of the present invention;

Fig. 4 is the three-dimensional sectional schematic diagram of the A-A section line of Fig. 3;

Fig. 5 is a schematic side view sectional view of the A-A section line of Fig. 3;

Fig. 6 is the three-dimensional sectional schematic diagram of the B-B section line of Fig. 3;

Fig. 7 is the three-dimensional sectional schematic diagram of the C-C section line of Fig. 3;

Fig. 8 is a three-dimensional sectional schematic diagram of the D-D section line of Fig. 3

9 is a schematic top view of one of the electronic devices using a liquid-cooled heat dissipation structure in the present invention;

Fig. 10 is a schematic diagram of the cooling liquid of the liquid cooling heat dissipation structure of the present invention being transported only through the first rotating member;

Fig. 11 is a schematic diagram showing that the cooling liquid of the liquid cooling heat dissipation structure of the present invention is transported only through the second rotating member;

Fig. 12 is a schematic diagram of the cooling liquid being conveyed through the first rotating member and the second rotating member at the same time in the liquid cooling heat dissipation structure of the present invention.

Explanation of reference signs: electronic device D; liquid cooling heat dissipation structure Z; heat conduction substrate 1; heat conduction body 10; heat dissipation fins 11; splitter plate 2; 2012; second splitter opening 202; deflector 3; first deflector opening 301; second deflector opening 302; support part 31; retaining wall part 32; protruding part 33; water supply assembly M; outer cover 4; liquid input port 41; liquid output port 42; pump 5; first pump 5A; first rotating part 51A; first fixing part 52A; first pump 5B; second rotating part 51B; The moving element 6; the first accommodation space R1; the first space portion R11; the second space portion R12; the common space portion R13; the first communication opening P1; The fourth accommodating space R4; the fifth accommodating space R5; the heat source H; the cooling liquid W; the screw S.

Detailed ways

The following is a specific example to illustrate the implementation of the "electronic device and its liquid cooling heat dissipation structure" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. The utility model can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the utility model. In addition, the accompanying drawings of the present utility model are only for simple illustration, and are not drawn according to the actual size, and shall be described in advance. The following embodiments will further describe the relevant technical contents of the present utility model in detail, but the disclosed content is not intended to limit the technical scope of the present utility model.

Please refer to Fig. 1 to Fig. 9, wherein Fig. 4 is a schematic three-dimensional sectional view of the A-A section line of Fig. 3, Fig. 5 is a side view sectional view of the A-A section line of Fig. 3, and Fig. 6 is a schematic diagram of the B-B section of Fig. 3 7 is a schematic three-dimensional cross-sectional view of the C-C secant line in FIG. 3 , and FIG. 8 is a schematic three-dimensional cross-sectional view of the D-D secant line in FIG. 3 . As can be seen from the above figures, the present invention provides a liquid-cooled heat dissipation structure Z, which includes: a heat-conducting substrate 1 , a splitter plate 2 , a deflector plate 3 and a water supply assembly M.

First, as shown in FIG. 1 (or FIG. 2 ) and FIG. 4 (or FIG. 5 ), the thermally conductive substrate 1 has a thermally conductive body 10 that contacts the heat source H (such as a CPU or any chip that generates heat) and a plurality of The heat dissipation fins 11 on the heat conduction body 10 . In addition, the splitter plate 2 is disposed on the plurality of heat dissipation fins 11 , and the deflector plate 3 is disposed on the splitter plate 2 . In addition, the water supply assembly M includes an outer cover body 4 detachably arranged on the heat conduction body 10 and at least two pumps 5 detachably arranged on the outer cover body 4 in parallel, and a plurality of cooling fins 11, a distribution plate 2, And deflector 3 are accommodated in the outer cover body 4.

For example, as shown in FIG. 1 (or FIG. 2 ) and FIG. 4 (or FIG. 5 ), the outer cover 4 can be detachably disposed on the heat-conducting substrate 1 through a plurality of screws S. As shown in FIG. In addition, the first splitter plate opening 201 of the splitter plate 2 has an elongated opening 2011 and a buffer opening 2012 connected to the elongated opening 2011 . In addition, one of the pumps (such as the first pump 5A) has a first rotating member 51A (that is, the rotor) arranged between the outer cover body 4 and the deflector 3 and a first rotating member 51A (ie, the rotor) arranged on the outer cover body 4 and corresponding to the first The first fixed part 52A (that is, the stator) of the rotating part 51A, and another pump (such as the first pump 5B) has a second fixed part arranged between the outer cover body 4 and the deflector 3 and adjacent to the first rotating part 51A. The rotating part 51B (ie, the rotor) and a second fixing part 52B (ie, the stator) disposed on the outer cover 4 and corresponding to the second rotating part 51B. However, the present invention is not limited to the examples mentioned above.

Furthermore, as shown in FIG. 1 (or FIG. 2 ), FIG. 4 (or FIG. 5 ) and FIG. 7 , the deflector 3 has at least two first deflector openings corresponding to at least two pumps 5 respectively. 301 and a second deflector opening 302 communicating with at least two first deflector openings 301 through a first accommodating space R1 . In addition, as shown in FIG. 1 (or FIG. 2), FIG. 4 (or FIG. 5), FIG. 6 and FIG. A first distribution plate opening 201 and a second distribution plate opening 202 communicating with the first distribution plate opening 201 pass through a third accommodating space R3. In other words, after the cooling liquid W enters from the two first deflector openings 301, it will sequentially pass through the first accommodating space R1, the second accommodating space R2, and the third accommodating space R3, and finally gathers in the second accommodating space. Divider plate opening 202 (as shown in FIG. 9 ).

Furthermore, as shown in FIG. 1 (or FIG. 2), FIG. 4 (or FIG. 5), FIG. 6 and FIG. The liquid input port 41 of the flow plate opening 301 and at least one liquid output port 42 connected to the second flow plate opening 202 through a fifth accommodating space R5, and the cooling liquid W is driven by one or all of the pumps 5 , so that at least one liquid input port 41 is input to the inside of the outer cover body 4 , and at least one liquid output port 42 is output to the outside of the outer cover body 4 .

For example, as shown in FIG. 1 (or FIG. 2 ) and FIG. 4 (or FIG. 5 ), the bottom end of the deflector 3 has a plurality of support portions 31 directly contacting the diverter plate 2 and a plurality of directly contacting the diverter plate 2 The retaining wall portion 32, and the top end of the deflector 3 has a protruding portion 33 disposed between the first accommodating space R1 and the second accommodating space R2. In addition, the first accommodating space R1 is formed between the outer cover 4 and the deflector 3, the second accommodating space R2 and the fourth accommodating space R4 are both formed between the deflector 3 and the diverter plate 2, and the third accommodating space R2 is formed between the deflector 3 and the diverter plate 2. The accommodating space R3 is formed between the distribution plate 2 and the heat conducting body 10 , and the second accommodating space R2 and the fourth accommodating space R4 are separated by the retaining wall portion 32 . However, the present invention is not limited to the examples mentioned above.

Please refer to FIG. 9 , the present invention additionally provides an electronic device D (such as a computer host), wherein the electronic device D has at least one heat source H. As shown in FIG. It is worth noting that the electronic device D uses a liquid-cooled heat dissipation structure Z disposed on at least one heat source H to provide the heat source H for water cooling and heat dissipation. Of course, the electronic device D can also be replaced with any heat dissipation bearing plate. For example, the heat dissipation bearing plate can be a heat dissipation plate, and the liquid cooling heat dissipation structure Z can be placed on the heat dissipation plate to improve the overall heat dissipation performance of the heat dissipation plate.

Please refer to FIG. 10 to FIG. 12 , the first accommodating space R1 has a first space part R11 for accommodating the first rotating member 51A and communicating with one of the first deflector openings 301 , and a space for accommodating The second rotating part 51B is placed and communicated with the second space part R12 of the first deflector opening 301, and a second space part R11 corresponding to the first space part R11 and the second space part R12 is communicated with the second deflector opening 302. The shared space part R13. In addition, the common space portion R13 can communicate with the first space portion R11 through a first communication opening P1, and the common space portion R13 can communicate with the second space portion R12 through a second communication opening P2. Furthermore, the liquid cooling heat dissipation structure Z further includes: a movable element 6 (such as a flexible switching element), wherein the movable element 6 is arranged in the first space part R11, the second space part R12, And between the shared space part R13.

As an example, as shown in FIG. 10 , when the cooling liquid W is delivered only through the first rotating member 51A, the cooling liquid W pushes the movable element 6 to the second space portion R12 to close the second communication opening P2 , so that the cooling liquid W can only pass through the first communication opening P1 to be delivered to the common space portion R13.

As another example, as shown in FIG. 11 , when the cooling liquid W is delivered only through the second rotating member 51B, the cooling liquid W pushes the movable element 6 to the first space portion R11 to close the first communication opening P1 , so that the cooling liquid W can only pass through the second communication opening P2 to be transmitted to the common space portion R13.

As another example, as shown in FIG. 12, when the cooling liquid W is conveyed through the first rotating member 51A and the second rotating member 51B at the same time, the cooling liquid W pushes the movable element 6 to the first space R11 The first communication opening P1 and the second communication opening P2 are simultaneously opened between the second space portion R12, so that the cooling liquid W can pass through the first communication opening P1 and the second communication opening P2 at the same time to be transmitted to the common space portion R13.

Therefore, the liquid cooling heat dissipation structure Z of the present invention can selectively activate the first rotating member 51A and the second rotating member 51B according to different heat dissipation requirements. When the heat dissipation demand is low, only the first rotating member 51A or the second rotating member 51B may be activated. When the demand for heat dissipation is high, the first rotating member 51A and the second rotating member 51B can be started at the same time.

To sum up, the beneficial effect of the utility model can be that the electronic device D and its liquid-cooled heat dissipation structure Z provided by the embodiment of the utility model can be detachably arranged on the heat conduction body through the "water supply assembly M". 10 and at least two pumps 5" detachably arranged in parallel on the outer cover 4 to improve the overall heat dissipation performance. It is worth mentioning that the liquid cooling heat dissipation structure Z of the present invention can selectively activate the first rotating part 51A or the second rotating part 51B, or simultaneously activate the first rotating part 51A and the second rotating part according to different heat dissipation requirements. Item 51B.

The above descriptions are only preferred feasible embodiments of the present utility model, and are not intended to limit the patent scope of the present utility model. Therefore, all equivalent technical changes made by using the description of the utility model and the contents of the accompanying drawings are included in the utility model. within the scope of protection.

Claims (17)

1. a liquid-cooling type radiator structure, is characterized in that, comprising:

One heat-conducting substrate, described heat-conducting substrate has the heat-conductive body in a contact heating source and multiple radiating fin be arranged on described heat-conductive body;

One flow distribution plate, described flow distribution plate is arranged on multiple described radiating fin;

One baffler, described baffler is arranged on described flow distribution plate; And

One for water assembly, describedly comprise one for water assembly and be removably disposed in outer outlet body on described heat-conductive body and at least two pumps be removably arranged in parallel on described outer outlet body, wherein multiple described radiating fin, described flow distribution plate and described baffler are all contained in described outer outlet body;

Wherein, described baffler has at least two the first baffler openings and corresponding respectively at least two described pumps by one first accommodation space to be communicated in the second baffler opening of at least two described first baffler openings, and described flow distribution plate have one by one second accommodation space with the first flow distribution plate opening and being communicated in described second baffler opening by one the 3rd accommodation space to be communicated in the second flow distribution plate opening of described first flow distribution plate opening;

Wherein, described outer outlet body have at least one by one the 4th accommodation space be communicated in described first baffler opening liquid inlet and at least one by one the 5th accommodation space to be communicated in the liquid outlet of described second flow distribution plate opening, and cooling liquid is by the drive of described pump, to input to the inside of described outer outlet body from least one described liquid inlet, and export the outside of described outer outlet body to from least one described liquid outlet.

2. liquid-cooling type radiator structure as claimed in claim 1, it is characterized in that, the bottom of described baffler has the support portion of the described flow distribution plate of multiple direct contacts and the barricade portion of the described flow distribution plate of multiple direct contacts, and the top of described baffler has one is arranged on protuberance between described first accommodation space and described second accommodation space, the described first flow distribution plate opening of wherein said flow distribution plate has the buffering peristome that a strip peristome and is communicated in described strip peristome.

3. liquid-cooling type radiator structure as claimed in claim 2, it is characterized in that, described first accommodation space is formed between described outer outlet body and described baffler, described second accommodation space and described 4th accommodation space are all formed between described baffler and described flow distribution plate, described 3rd accommodation space is formed between described flow distribution plate and described heat-conductive body, and described second accommodation space and described 4th accommodation space separate by described barricade portion.

4. liquid-cooling type radiator structure as claimed in claim 1, it is characterized in that, pump described in one of them has one to be arranged on the first rotating part between described outer outlet body and described baffler, and pump described in another one has one to be arranged between described outer outlet body and described baffler and the second rotating part of contiguous described first rotating part, wherein said first accommodation space has one for accommodating described first rotating part and is communicated in the first spatial portion of the first baffler opening described in one of them, one is communicated in the second space portion of the first baffler opening described in another one for accommodating described second rotating part, and one corresponds to described first spatial portion and described second space portion and is communicated in the sharing space portion of described second baffler opening, wherein said sharing space portion by one first open communication to be communicated in described first spatial portion, and described sharing space portion by one second open communication to be communicated in described second space portion.

5. liquid-cooling type radiator structure as claimed in claim 4, it is characterized in that, further comprise: a displaceable element, described displaceable element is arranged between described first spatial portion, described second space portion and described sharing space portion.

6. liquid-cooling type radiator structure as claimed in claim 5, it is characterized in that, when described cooling liquid is only carried by described first rotating part, described displaceable element is pushed to described second space portion to close described second open communication by described cooling liquid, make described cooling liquid can only by described first open communication, to be sent to described sharing space portion.

7. liquid-cooling type radiator structure as claimed in claim 5, it is characterized in that, when described cooling liquid is only carried by described second rotating part, described displaceable element is pushed to described first spatial portion to close described first open communication by described cooling liquid, make described cooling liquid can only by described second open communication, to be sent to described sharing space portion.

8. liquid-cooling type radiator structure as claimed in claim 5, it is characterized in that, when described cooling liquid is carried by described first rotating part and described second rotating part simultaneously, described displaceable element is pushed between described first spatial portion and described second space portion to open described first open communication and described second open communication simultaneously by described cooling liquid, make described cooling liquid simultaneously by described first open communication and described second open communication, to be sent to described sharing space portion.

9. an electronic installation, is characterized in that, described electronic installation has at least one pyrotoxin, and described electronic installation use one is arranged on the liquid-cooling type radiator structure at least one described pyrotoxin, and it is characterized in that, described liquid-cooling type radiator structure comprises:

One heat-conducting substrate, described heat-conducting substrate has the heat-conductive body of at least one described pyrotoxin of a contact and multiple radiating fin be arranged on described heat-conductive body;

One flow distribution plate, described flow distribution plate is arranged on multiple described radiating fin;

One baffler, described baffler is arranged on described flow distribution plate; And

One for water assembly, describedly comprise one for water assembly and be removably disposed in outer outlet body on described heat-conductive body and at least two pumps be removably arranged in parallel on described outer outlet body, wherein multiple described radiating fin, described flow distribution plate and described baffler are all contained in described outer outlet body;

Wherein, described baffler has at least two the first baffler openings and corresponding respectively at least two described pumps by one first accommodation space to be communicated in the second baffler opening of at least two described first baffler openings, and described flow distribution plate have one by one second accommodation space with the first flow distribution plate opening and being communicated in described second baffler opening by one the 3rd accommodation space to be communicated in the second flow distribution plate opening of described first flow distribution plate opening;

Wherein, described outer outlet body have at least one by one the 4th accommodation space be communicated in described first baffler opening liquid inlet and at least one by one the 5th accommodation space to be communicated in the liquid outlet of described second flow distribution plate opening, and cooling liquid is by the drive of described pump, to input to the inside of described outer outlet body from least one described liquid inlet, and export the outside of described outer outlet body to from least one described liquid outlet.

10. electronic installation as claimed in claim 9, it is characterized in that, the bottom of described baffler has the support portion of the described flow distribution plate of multiple direct contacts and the barricade portion of the described flow distribution plate of multiple direct contacts, and the top of described baffler has one is arranged on protuberance between described first accommodation space and described second accommodation space, the described first flow distribution plate opening of wherein said flow distribution plate has the buffering peristome that a strip peristome and is communicated in described strip peristome.

11. electronic installations as claimed in claim 10, it is characterized in that, described first accommodation space is formed between described outer outlet body and described baffler, described second accommodation space and described 4th accommodation space are all formed between described baffler and described flow distribution plate, described 3rd accommodation space is formed between described flow distribution plate and described heat-conductive body, and described second accommodation space and described 4th accommodation space separate by described barricade portion.

12. electronic installations as claimed in claim 9, it is characterized in that, pump described in one of them has one to be arranged on the first rotating part between described outer outlet body and described baffler, and pump described in another one has one to be arranged between described outer outlet body and described baffler and the second rotating part of contiguous described first rotating part, wherein said first accommodation space has one for accommodating described first rotating part and is communicated in the first spatial portion of the first baffler opening described in one of them, one is communicated in the second space portion of the first baffler opening described in another one for accommodating described second rotating part, and one corresponds to described first spatial portion and described second space portion and is communicated in the sharing space portion of described second baffler opening, wherein said sharing space portion by one first open communication to be communicated in described first spatial portion, and described sharing space portion by one second open communication to be communicated in described second space portion.

13. electronic installations as claimed in claim 12, it is characterized in that, described liquid-cooling type radiator structure further comprises: a displaceable element, and described displaceable element is arranged between described first spatial portion, described second space portion and described sharing space portion.

14. electronic installations as claimed in claim 13, it is characterized in that, when described cooling liquid is only carried by described first rotating part, described displaceable element is pushed to described second space portion to close described second open communication by described cooling liquid, make described cooling liquid can only by described first open communication, to be sent to described sharing space portion.

15. electronic installations as claimed in claim 13, it is characterized in that, when described cooling liquid is only carried by described second rotating part, described displaceable element is pushed to described first spatial portion to close described first open communication by described cooling liquid, make described cooling liquid can only by described second open communication, to be sent to described sharing space portion.

16. electronic installations as claimed in claim 13, it is characterized in that, when described cooling liquid is carried by described first rotating part and described second rotating part simultaneously, described displaceable element is pushed between described first spatial portion and described second space portion to open described first open communication and described second open communication simultaneously by described cooling liquid, make described cooling liquid simultaneously by described first open communication and described second open communication, to be sent to described sharing space portion.

17. 1 kinds of liquid-cooling type radiator structures, is characterized in that, comprising:

One heat-conducting substrate, described heat-conducting substrate has the heat-conductive body in a contact heating source and multiple radiating fin be arranged on described heat-conductive body;

One flow distribution plate, described flow distribution plate is arranged on multiple described radiating fin;

One baffler, described baffler is arranged on described flow distribution plate; And

One for water assembly, describedly comprise one for water assembly and be removably disposed in outer outlet body on described heat-conductive body and at least two pumps be removably arranged in parallel on described outer outlet body, wherein multiple described radiating fin, described flow distribution plate and described baffler are all contained in described outer outlet body;

Wherein, described outer outlet body has at least one liquid inlet and at least one liquid outlet, and cooling liquid is by one of them or whole drives of at least two described pumps, to input to the inside of described outer outlet body from least one described liquid inlet, and export the outside of described outer outlet body to from least one described liquid outlet.