TWM379164U - Sealing ring for the wafer-plating jig - Google Patents
Sealing ring for the wafer-plating jig Download PDFInfo
- Publication number
- TWM379164U TWM379164U TW98224009U TW98224009U TWM379164U TW M379164 U TWM379164 U TW M379164U TW 98224009 U TW98224009 U TW 98224009U TW 98224009 U TW98224009 U TW 98224009U TW M379164 U TWM379164 U TW M379164U
- Authority
- TW
- Taiwan
- Prior art keywords
- sealing ring
- wafer
- ring
- sealing
- fixture
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims description 31
- 238000007747 plating Methods 0.000 title claims description 8
- 238000005452 bending Methods 0.000 claims description 3
- 229920006351 engineering plastic Polymers 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims 3
- 239000002033 PVDF binder Substances 0.000 claims 2
- 229920012287 polyphenylene sulfone Polymers 0.000 claims 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims 2
- 230000004888 barrier function Effects 0.000 claims 1
- 239000004927 clay Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 210000003127 knee Anatomy 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 229920001021 polysulfide Polymers 0.000 claims 1
- 239000005077 polysulfide Substances 0.000 claims 1
- 150000008117 polysulfides Polymers 0.000 claims 1
- 239000000565 sealant Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920000491 Polyphenylsulfone Polymers 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Gasket Seals (AREA)
Description
M379164 五、新型說明: 【新型所屬之技術領域】 種晶圓電趟治具用 本創作係關於-種密封環,尤其 的密封環。 【先前技術】 傳統上,於半導體製造過程中, (sputtering)作業,其係屬於—種物理沉 又_進行濺鍍 係屬於後段封裝新製程,其係利用化焱理、進現=的新製程 止電鍍液滲透到不期望進行電鍍的區:程並且防 圓電鍍治具的密封環。 — 亟而種可用於晶 【新型内容】 為滿足上述需求,本創作裎ψ — a 環,其包含:-密封環主體,其下端用的密封 有一個以上的彎折部,於i中 基邛而其上端則具 之中心而向内延伸;以及二防ϊ部件以設該密封環 中心的該彎折部之底面上。使: 在μ近該密封環之 二晶圓電輪期間防止電鑛液i透到不;電 【實施方式】 1的f體1視_之—魏例之麵治之穷_ 二:圖2顯示圖1之密封環1的側㈣ 圖1之山封環1的俯視圖。 及圖3顯7Γ Ζ顯將說日ί本創作之密封環1的詳細構造。 .頭不沿者圖3之Α-Α線戶斤银夕玄封卢 M379164 封環主體3的下端具有基部31,而在密封環主^ 朝密封環1之中心(如圖3所干彳% :封衣主體3的上端則具有 第二彎折部=延,第:,折部32以及 最靠近密封環1的中心。防滲部件5\的最内側,即, 面上。 係。又置在第二幫折部33的底 冨進行日日圓電鑛程序時,密封環1可套一 a 一 此晶圓的外周緣以及側表面可被密 j(未^不)上, 而防止電缠液的設置, 覆蓋的晶_分)。當這些胃折部3^ =1所 贫/I電鑛之曰曰圓的大小而設計成相對應的尺寸。 :封,主體3可由工程塑膠所製成 ί ?i:y:ce TV ^W(PEEK'poIyether ^ : )l 本石風(PPSU,p0lyphenylene sulf〇ne) (PAI ^ polyamide-ixnide) ^ ?^#(PP , polypr〇pyle; e)、,驗亞胺卿’p〇iyettoi福e),或i可t盆他 月匕夠承叉日日f電鍍製程的高分子材料加以製成。 八 干,圖4之密封環1之部分B的局部放大圖。如圖5所 件,設置在第二彎折部33的底面,以防止電1液渗 電鍍的區域内。防滲部件5可由氟素橡膠所ί成: 巧有優異的耐化學腐健以及耐触 二衣, J中:密封環主體3僅顯示第一彎折部32以; 猎封裱主體3可視使用情況而增減彎折部的數量。 一 ί,ϋ 1密封環尚可具有其他形狀的外觀。舉例而 :圖、所:;、、不=产創作之另一實施例之密封環1〇0的俯視圖。 之叫面έ士二U100的外觀係呈現一矩形。由於密封環1〇0 之一面結構係類似於密封環!,以及密封環腦之材質係相同於密 M379164 封環1,故在此將不再加以贅述。 本創作之隨附圖式僅作為說明之用途,並非# 專利範圍内 範圍。此外,為了便於說明本創作之實施_内=^創作的 附圖式的尺寸並非倾實際尺树製。熟之隨 不離開本創作之範_情況下,#可對本創作的瞭解在 各種修改與變化’而這些修改與變化應落入本創 【圖式簡單說明】 • 圖1顯示依照本創作之一盘竑乜丨夕田^ .環的立體視®; ,、施例之用於㈣電麟具之密封 ^2示^之密封環的側視圖; =示圖4之密封局T二見㈡環的橫剖面圖; 圖6顯示依照本創 刃二風人回,及 另—貫施例之密封環的俯視圖。 【主要元件符號說明】 1 密封環 3 雄'封環主體 5 防滲部件 31 基部 32 第一彎折部 33 第二彎折部 100 密封環M379164 V. New description: [New technical field] The use of wafer curing tools This series is about a kind of sealing ring, especially the sealing ring. [Prior Art] Traditionally, in the semiconductor manufacturing process, sputtering operations belong to a kind of physical sinking and _sputtering is a new process of post-packaging, which is a new process of utilizing chemical processing and cashing. The plating solution penetrates into the area where the plating is not desired to be performed: and the sealing ring of the anti-circular plating fixture. — 亟 种 可 可 可 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 And the upper end has a center and extends inward; and the second anti-smashing member is disposed on the bottom surface of the bent portion at the center of the sealing ring. To prevent the electro-mineral liquid from passing through during the two wafer electric wheels of the sealing ring; [Embodiment] 1 f body 1 view _ —— —— —— —— —— —— —— —— —— —— 2: Figure 2 shows Side view of the seal ring 1 of Fig. 1 (four) Top view of the mountain seal ring 1 of Fig. 1. And Fig. 3 shows the details of the seal ring 1 of the creation of the Japanese. The head does not follow the figure of Figure 3 - Α line 斤 银 夕 夕 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M The upper end of the sealing main body 3 has a second bent portion = extension, the first: the folded portion 32 and the center closest to the sealing ring 1. The innermost side of the anti-seepage member 5\, that is, the surface. When the bottom circle of the second folding portion 33 is subjected to the Japanese yen electric ore program, the sealing ring 1 can be sleeved, and the outer circumference and the side surface of the wafer can be densely sealed (not to be), thereby preventing electrical winding. The setting of the liquid, covering the crystal_minutes). When these stomach folds 3^ = 1 lean / I electric mine, the size of the circle is designed to correspond to the corresponding size. : Seal, body 3 can be made of engineering plastics ί ?i:y:ce TV ^W(PEEK'poIyether ^ : )l This stone (PPSU, p0lyphenylene sulf〇ne) (PAI ^ polyamide-ixnide) ^ ?^ #(PP , polypr〇pyle; e),,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Eight, a partial enlarged view of a portion B of the seal ring 1 of Fig. 4. As shown in Fig. 5, it is provided on the bottom surface of the second bent portion 33 to prevent the liquid from being electrolyzed in the region of plating. The anti-seepage member 5 can be made of fluoroelastomer: it has excellent chemical resistance and resistance to touch clothes, J: the seal ring main body 3 only shows the first bent portion 32; the hunting seal body 3 can be used visually Increase or decrease the number of bends in the case. A ί, ϋ 1 seal ring can still have the appearance of other shapes. For example: a plan view of a sealing ring 1〇0 of another embodiment of the drawing. The appearance of the Gentleman II U100 is a rectangle. Since the sealing ring 1〇0 has a surface structure similar to the sealing ring! And the material of the sealed ring brain is the same as the dense M379164 ring 1 and will not be described here. The accompanying drawings of this creation are for illustrative purposes only and are not within the scope of the patent. In addition, in order to facilitate the description of the implementation of the present invention, the size of the drawing is not a practical rule. If you are not familiar with the scope of this creation _ _, you can understand the changes in this creation in various modifications and changes' and these modifications and changes should fall into this creation [simple description of the schema] • Figure 1 shows one of the creations盘竑乜丨夕田^. The stereoscopic view of the ring;, the side view of the seal ring used for the seal of the electric device (2), and the seal ring of the seal of the figure 2; Sectional view; Figure 6 shows a top view of the seal ring in accordance with the present blade and the other embodiment. [Main component symbol description] 1 Sealing ring 3 Male 'sealing ring body 5 Impervious part 31 Base part 32 First bending part 33 Second bending part 100 Sealing ring
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98224009U TWM379164U (en) | 2009-12-22 | 2009-12-22 | Sealing ring for the wafer-plating jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98224009U TWM379164U (en) | 2009-12-22 | 2009-12-22 | Sealing ring for the wafer-plating jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM379164U true TWM379164U (en) | 2010-04-21 |
Family
ID=50596300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98224009U TWM379164U (en) | 2009-12-22 | 2009-12-22 | Sealing ring for the wafer-plating jig |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM379164U (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD193205S (en) | 2017-09-27 | 2018-10-01 | 日商荏原製作所股份有限公司 | One part of the seal ring |
| USD871561S1 (en) | 2017-11-17 | 2019-12-31 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| TWD202039S (en) | 2018-10-12 | 2020-01-11 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| TWD202040S (en) | 2018-10-12 | 2020-01-11 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| TWD202041S (en) | 2018-10-12 | 2020-01-11 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| TWD202042S (en) | 2018-10-12 | 2020-01-11 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| USD885443S1 (en) | 2017-12-19 | 2020-05-26 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| TWD206218S (en) | 2017-11-17 | 2020-08-01 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| USD897504S1 (en) | 2017-11-17 | 2020-09-29 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD898170S1 (en) | 2017-12-01 | 2020-10-06 | Valqua, Ltd. | Composite seal member for semiconductor production apparatus |
| USD898171S1 (en) | 2017-12-19 | 2020-10-06 | Valqua, Ltd. | Seal members for use in semiconductor production apparatuses |
| TWD208041S (en) | 2018-09-11 | 2020-11-01 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| USD901648S1 (en) | 2018-07-10 | 2020-11-10 | Valqua, Ltd. | Seal |
| USD909322S1 (en) | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
-
2009
- 2009-12-22 TW TW98224009U patent/TWM379164U/en not_active IP Right Cessation
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD193205S (en) | 2017-09-27 | 2018-10-01 | 日商荏原製作所股份有限公司 | One part of the seal ring |
| USD922545S1 (en) | 2017-11-17 | 2021-06-15 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD871561S1 (en) | 2017-11-17 | 2019-12-31 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD923158S1 (en) | 2017-11-17 | 2021-06-22 | Valqua, Ltd. | Seal members for use in semiconductor production apparatus |
| USD923159S1 (en) | 2017-11-17 | 2021-06-22 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| TWD206218S (en) | 2017-11-17 | 2020-08-01 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| USD897504S1 (en) | 2017-11-17 | 2020-09-29 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD922546S1 (en) | 2017-12-01 | 2021-06-15 | Valqua, Ltd. | Composite seal member for semiconductor production apparatus |
| USD922027S1 (en) | 2017-12-01 | 2021-06-15 | Valqua, Ltd. | Composite seal member for semiconductor production apparatus |
| USD898170S1 (en) | 2017-12-01 | 2020-10-06 | Valqua, Ltd. | Composite seal member for semiconductor production apparatus |
| USD885443S1 (en) | 2017-12-19 | 2020-05-26 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD898171S1 (en) | 2017-12-19 | 2020-10-06 | Valqua, Ltd. | Seal members for use in semiconductor production apparatuses |
| USD922547S1 (en) | 2017-12-19 | 2021-06-15 | Valqua, Ltd. | Seal members for use in semiconductor production apparatuses |
| USD901648S1 (en) | 2018-07-10 | 2020-11-10 | Valqua, Ltd. | Seal |
| USD917028S1 (en) | 2018-07-10 | 2021-04-20 | Valqua, Ltd. | Seal |
| TWD208041S (en) | 2018-09-11 | 2020-11-01 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| USD927656S1 (en) | 2018-09-11 | 2021-08-10 | Valqua, Ltd. | Seal for vacuum gate valve |
| TWD202042S (en) | 2018-10-12 | 2020-01-11 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| TWD202041S (en) | 2018-10-12 | 2020-01-11 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| TWD202040S (en) | 2018-10-12 | 2020-01-11 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| TWD202039S (en) | 2018-10-12 | 2020-01-11 | 日商華爾卡股份有限公司 | Seal member for use in semiconductor production apparatus |
| USD909322S1 (en) | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD933031S1 (en) | 2018-10-12 | 2021-10-12 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
| USD933032S1 (en) | 2018-10-12 | 2021-10-12 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |