M369018 、五、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱構造，尤指一種可抑制電磁輻 射之散熱構造。 【先前技術】 由於半導體產業的高度發展，半導體製程技術不斷往 0 小的元件尺寸及更小的線寬前進，可於單位面積中整合越 來越多的電子元件。 數量魔大的電子元件在工作裝態中所產生的熱量相 當可觀，當這些電子元件被整合在一體積窄小的積體電路 元件中時，其單位面積所產出之熱量更是驚人。故在電子 裝置的設計中，積體電路元件的散熱效率即為其考量的重 點之一。 習用技術的積體電路元件散熱方式係如第1圖所 • 示，其主要係於一電路板12上設有複數個接點銅箔121， 可供一積體電路元件14之引腳141以銲錫18銲接。於積 體電路元件14之上表面塗佈散熱膏161後，將一散熱片 16貼附於散熱膏161上，可藉由散熱膏161將積體電路 元件14所產生之熱量傳導至散熱片16上，再經由散熱片 * 16之鰭片163散逸到空氣中。 然而，一般散熱片16係以金屬（例如I呂、銅等金屬） 製作，在傳導熱量的同時也容易因環境中的電磁雜訊而產 M369018 生感電流’更嚴重者甚至形成生天線效應，進而韓射更夕 的電磁雜sfl。而5哀境中的電磁雜訊將會對積體電路」 的運作造成干擾。 ^件14 【新型内容】 本創作之主要目的，在於提供一種散熱構造，尤指— 種可抑制電磁輻射之散熱構造。 曰 本創作之次要目的，在於提供一種可抑制電磁輻射之 散熱構造’其主要係利用錫球令散熱片連接地鋼$ : 地的方式形成電磁輻射之屏蔽者。 $ 本創作之又一目的，在於提供一種可抑制電磁輕 散熱構造’可於電路板上設置複數個裸露的散熱鋼^ 口 利於與錫球接合者。 可抑制電磁輻射之 藉以連接電路板另 本創作之又一目的，在於提供一種 散熱構造’可於散熱銅箔處設置貫孔， 一面之地銅箱。 本劍作之又-目的，在於提供-種可抑制電磁輕射之 散熱構造，可於貫孔中植入銲錫，可利於與錫球接人 本劍作之又-目的，在於提供一種可抑制電磁:射 散熱構邊，可於散熱片底面之週緣設置—逆 佳之遮蔽絲。 _ 可提供更 為達成上述目的 散熱構造’包含有： 地銅箱，各散熱鋼箔 ’本創作提供-種可抑制電磁輻射之 二電路板，設有複數__仏_ 刀別連接至地銅箔；— 政熱片；及複 M369018 •數個錫球，分別連接於各散熱銅箱與該散熱片之間。 本創作尚提供-種可抑制電磁轄射之散熱構造，包含 有：一電路板，設有複數個散熱鋼箔及一地銅箔，各散熱 銅箱分別以-貫孔連接至地㈣—散熱片；及複數個揚 球，分別連接於各散熱銅羯與該散熱片之間。 【實施方式】 藝百先，請參閱第2圖，係本創作一較佳實施例之構造 剖面不意圖。如圖所示，本創作可抑制電磁韓射之散熱構 造主=包含有〜電路板22及一散熱片％。 、/、中電略板22上佈設有所需求之電路，並設置有 複數個接點銅22卜以供鲜接各式電子元件。一般的電 路板22曰以大面積鋪銅的地銅箱225做為系統的接地 處，並連接至電源的接地電位。 本ij作之敷熱構造主要係於電路板Μ上設置複數個 •散,’、、銅4 223 I令各散熱銅箱分別連接地銅箱225。 田外積體電路元件24將引腳241以鲜錫281鲜接至接點 銅名221 H彳於積體電路元件24之上表面塗佈或設置 t、導熱層261唆’將散熱片26安置於該導熱層261上， 並利用複數個轉球283將散熱片26與散熱銅箱m口以 ，連接。 利用本創作之散熱構造，積體電路元件24所產生的 熱里不僅可經由散熱片26之籍片263散逸到空氣中，尚 可經由錫球283傳遞到電路板22之地銅羯225上，而藉 M369018 由大面積的地銅f| 225 |高整體的散熱效率。 ㈣ί攸由於散熱片26與地銅225導通，亦即成為系 2 的—部分’相對積體電路元件24形成—導體屏 不僅不會耦合電磁雜訊，且可將電磁雜訊屏蔽於外 圍，防止積體電路元件24受到電磁雜訊的干擾。 其中，散熱鋼箔223係以圍繞接點銅箔221的方式設 置’亦即m繞於該積體電路元件24之週圍設置，可結: 散熱片26及地銅箱225形成較佳的屏蔽效果。積體；： 兀件24上表面導熱層261可以塗佈—層散熱膏 層導熱膠的方式實施。 請參閱第3目，係本創作另一實施例之構造剖面示意 圖。如圖所示，該電路板32上設有複數個接點銅箔， 以供銲接各式電子元件。其大_鋪銅的地銅们25係設 置於電路板32之背面，可提供較電路板32之正面更大的 地銅箱325面積。 在本實施例中，散熱銅箔323仍以圍繞接點銅箔321 的方式設置為較佳，各散熱鋼箔323分別以一貫孔327連 接至電路板32背面之地銅謂325。 當一積體電路元件34將其引腳341以銲錫381銲接 至接點銅箔321後，可於積體電路元件34之上表面塗佈 一層散熱膏或設置一層導熱膠，形成一導熱層361。將散 熱片36安置於該導熱層361上後，再利用複數個錫球383 連接散熱片36與各散熱銅箔323,即可完成散熱構造之設 置。 M369018 在本實施例中’散熱片36與地銅箔325可形成嚴密 的導體屏蔽，亦可提供較佳的散熱效果。此外，尚可於各 貫孔327中植入銲錫385，可提供錫球383較佳的接合效 果。 請參閱第4圖，係本創作又一實施例之構造剖面示意 圖。如圖所示，本實施例之可抑制電磁輻射之散熱構造與 第3圖所示之實施例大致相同，惟，本實施例主要係應用 於積體電路元件44具有較大厚度之場合。 ，本實施例之散熱片46於底部之週緣設有一凸緣463。 當厚度較大之積體電路元件44將其引腳441以鲜錫381 銲接於接點銅H 321後，可同樣於積體電⑽44之上表 ^置-導熱層46卜再將散熱片#安置於該導熱層461 哔恐積媸电峪兀件44目七私ι_ - ,如 叶44具有較大的厚度，然j 細叙㈣463 __ : 接，形成-包含接地迴路之導體屏蔽。 本實施例尚可利用散熱片46 熱片46與電路板32之間的間隙，夢:二二減少彳 果。 精以扣供更佳的遮蔽3 以上所述者，僅為本M369018, V. New description: [New technical field] This creation is about a heat dissipation structure, especially a heat dissipation structure that can suppress electromagnetic radiation. [Prior Art] Due to the high development of the semiconductor industry, semiconductor process technology continues to advance toward a small component size and a smaller line width, and more and more electronic components can be integrated in a unit area. The amount of heat generated by the large number of electronic components in the working state is considerable. When these electronic components are integrated into a small integrated circuit component, the heat generated per unit area is even more amazing. Therefore, in the design of an electronic device, the heat dissipation efficiency of the integrated circuit component is one of the considerations. The heat dissipation method of the integrated circuit component of the conventional technology is as shown in Fig. 1, which is mainly provided on a circuit board 12 with a plurality of contact copper foils 121 for the pins 141 of an integrated circuit component 14 Solder 18 is soldered. After the thermal grease 161 is applied to the upper surface of the integrated circuit component 14, a heat sink 16 is attached to the thermal grease 161, and the heat generated by the integrated circuit component 14 can be conducted to the heat sink 16 by the thermal grease 161. Then, it is dissipated into the air via the fins 163 of the heat sink*16. However, in general, the heat sink 16 is made of metal (for example, metal such as Ilu, copper, etc.), and it is easy to generate M369018 raw current due to electromagnetic noise in the environment while conducting heat. In addition, the Korean ray is more electromagnetic sfl. The electromagnetic noise in the 5 grief will interfere with the operation of the integrated circuit. ^件14 [New content] The main purpose of this creation is to provide a heat dissipation structure, especially a heat dissipation structure that can suppress electromagnetic radiation.次 The second objective of this creation is to provide a heat-dissipating structure that suppresses electromagnetic radiation. The main purpose is to use a solder ball to connect the heat sink to the ground steel to form a shield of electromagnetic radiation. Another object of the present invention is to provide an electromagnetic light-reducing structure that can be placed on a circuit board to provide a plurality of bare heat-dissipating steel ports for bonding with solder balls. Another object of the invention is to provide a heat dissipating structure, a copper box which can be provided with a through hole at one side of the heat dissipating copper foil. The purpose of this sword is to provide a heat-dissipating structure that can suppress electromagnetic light radiation. The solder can be implanted in the through-hole, which can be beneficial to the connection with the solder ball. The purpose is to provide an electromagnetic suppression: The heat-dissipating edge can be set on the periphery of the bottom surface of the heat sink - the reverse shielding wire. _ Provides a heat-dissipating structure that achieves the above objectives. 'Includes: copper box, heat-dissipating steel foil'. This notebook provides two kinds of circuit boards that can suppress electromagnetic radiation, with multiple __仏_ knives connected to the ground copper. Foil; — political hot film; and complex M369018 • Several solder balls are connected between each heat-dissipating copper box and the heat sink. The creation also provides a heat-dissipating structure capable of suppressing electromagnetic radiation, including: a circuit board having a plurality of heat-dissipating steel foils and a copper foil, and each of the heat-dissipating copper tanks is connected to the ground by a through-hole (four) - heat dissipation And a plurality of lifting balls are respectively connected between the heat dissipation copper cymbals and the heat sink. [Embodiment] Fig. 2 is a schematic cross-sectional view of a preferred embodiment of the present invention. As shown in the figure, this creation can suppress the heat dissipation structure of the electromagnetic Han radiation master = including the circuit board 22 and a heat sink %. , /, the power supply board 22 is equipped with the required circuit, and is provided with a plurality of contacts copper 22 for the fresh connection of various electronic components. A typical circuit board 22 is a ground copper copper 225 with a large area of copper and is connected to the ground potential of the power supply. The heat-applying structure of this ij is mainly based on the circuit board, and a plurality of holes, ', and copper 4 223 I are arranged to connect the heat-dissipating copper boxes to the copper box 225. The field integrated circuit component 24 has the pin 241 freshly soldered to the contact copper name 221 H彳 on the upper surface of the integrated circuit component 24 to be coated or disposed t, the heat conductive layer 261 唆 'to place the heat sink 26 on The heat conducting layer 261 is connected to the heat dissipating copper box m by a plurality of balls 283. With the heat dissipation structure of the present invention, the heat generated by the integrated circuit component 24 can be dissipated into the air not only through the sheet 263 of the heat sink 26, but also through the solder ball 283 to the copper 225 of the circuit board 22. And by borrowing M369018 from a large area of ground copper f| 225 | high overall heat dissipation efficiency. (4) Since the heat sink 26 and the ground copper 225 are turned on, that is, the portion of the system 2 is formed by the relative integrated circuit component 24, the conductor screen not only does not couple electromagnetic noise, but also shields the electromagnetic noise from the periphery to prevent The integrated circuit component 24 is disturbed by electromagnetic noise. The heat-dissipating steel foil 223 is disposed around the contact copper foil 221, that is, m is disposed around the integrated circuit component 24, and the heat sink 26 and the ground copper box 225 form a better shielding effect. . The integrated body;: The upper surface heat conductive layer 261 of the element 24 can be applied by applying a layer of thermal grease layer thermal conductive adhesive. Please refer to the third item, which is a schematic sectional view of another embodiment of the present creation. As shown, the circuit board 32 is provided with a plurality of contact copper foils for soldering various electronic components. The large copper copper 25 is placed on the back of the circuit board 32 to provide a larger copper box 325 area than the front side of the circuit board 32. In the present embodiment, the heat-dissipating copper foil 323 is preferably disposed so as to surround the contact copper foil 321, and the heat-dissipating steel foils 323 are respectively connected to the copper 325 of the back surface of the circuit board 32 by the constant holes 327. After an integrated circuit component 34 solders its lead 341 to the contact copper foil 321 by solder 381, a thermal grease or a thermal paste may be applied on the upper surface of the integrated circuit component 34 to form a heat conductive layer 361. . After the heat dissipating sheet 36 is placed on the heat conducting layer 361, the heat sink 36 and the heat dissipating copper foil 323 are connected by a plurality of solder balls 383 to complete the heat dissipating structure. M369018 In this embodiment, the heat sink 36 and the ground copper foil 325 can form a strict conductor shield, and can also provide a better heat dissipation effect. In addition, solder 385 can be implanted in each of the vias 327 to provide better bonding of the solder balls 383. Referring to Figure 4, there is shown a schematic cross-sectional view of a further embodiment of the present invention. As shown in the figure, the heat dissipating structure for suppressing electromagnetic radiation of the present embodiment is substantially the same as that of the embodiment shown in Fig. 3. However, the present embodiment is mainly applied to the case where the integrated circuit element 44 has a large thickness. The heat sink 46 of this embodiment is provided with a flange 463 at the periphery of the bottom. When the integrated circuit component 44 having a large thickness solders the lead 441 to the contact copper H 321 with the fresh tin 381, it can be placed on the integrated body (10) 44 - the heat conductive layer 46 and then the heat sink # Placed in the heat conducting layer 461 哔 媸 媸 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 In this embodiment, the gap between the heat sink 46 and the circuit board 32 can be utilized, and the dream is reduced. Better to buckle better for the above 3, only this
定本創作實施之範圍，即凡依本並非用來I :培、構造、特徵及精神所為之均等圍所述: 括於本創作之申請專利範圍内。 …飾’均應1 M369018 【圖式簡單說明】 第1圖：係習用散熱片設置之剖面示意圖。 第2圖：係本創作一較佳實施例之構造剖面示意圖 第3圖：係本創作另一實施例之構造剖面示意圖。 第4圖：係本創作又一實施例之構造剖面示意圖。 【主要元件符號說明】 12 電路板 121 接點銅箔 14 積體電路元件 141 引腳 16 散熱片 161 散熱膏 163 鰭片 18 鲜錫 22 電路板 221 接點銅箔 223 散熱銅箔 225 地銅箱 24 積體電路元件 241 引腳 26 散熱片 261 導熱層 263 縛片 281 録錫 283 鲜球 32 電路板 321 接點銅箔 323 散熱銅箔 325 地銅猪 327 貫孔 34 積體電路元件 341 引腳 36 散熱片 361 導熱層 381 銲錫 383 錫球 385 銲錫 44 積體電路元件 441 引腳 M369018 導熱層 • 46 散熱片 461 463 凸緣The scope of the creation of this book, that is, the equivalent of this is not used for I: training, structure, character and spirit: It is included in the scope of the patent application of this creation. ...decoration should be 1 M369018 [Simple description of the diagram] Figure 1: Schematic diagram of the conventional heat sink setting. 2 is a schematic cross-sectional view showing a structure of a preferred embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing another embodiment of the present creation. Fig. 4 is a cross-sectional view showing the structure of still another embodiment of the present invention. [Main component symbol description] 12 Circuit board 121 Contact copper foil 14 Integrated circuit component 141 Pin 16 Heat sink 161 Thermal paste 163 Fin 18 Fresh tin 22 Circuit board 221 Contact copper foil 223 Heat-dissipating copper foil 225 Ground copper box 24 Integral circuit component 241 Pin 26 Heat sink 261 Thermal layer 263 Binder 281 Recording tin 283 Fresh ball 32 Circuit board 321 Contact copper foil 323 Heat sink copper foil 325 Ground copper pig 327 Through hole 34 Integrated circuit component 341 Pin 36 Heat sink 361 Thermal layer 381 Solder 383 Tin ball 385 Solder 44 Integrated circuit component 441 Pin M369018 Thermal layer • 46 Heat sink 461 463 Flange