TWI871001B - OLED display structure - Google Patents

Abstract

The OLED display structure of the present invention includes a substrate and a back cover, which has an inner side surface and an outer side surface. The inner side surface is covered on the substrate, and a groove is provided on the inner side surface of the back cover, corresponding to the position of the OLED on the substrate. The back cover is provided with an outer groove at the periphery of the groove, and the outer groove is surrounded on three sides of the groove.

Description

OLED display structure

The present invention relates to a display device, in particular to an OLED display structure.

Because OLED organic materials are very sensitive to substances such as moisture and oxygen, OLED display devices currently on the market will use glue to seal the OLED to extend its service life. As shown in Figures 1 to 3, the commonly used OLED device packaging structure includes a substrate 1, on which an OLED 2 is arranged, and one side of the substrate 1 will leave a position 3 and a circuit for setting a control IC. A back cover 4 is arranged on the substrate 1, and a groove 5 is arranged on the back cover 4 corresponding to the position of the OLED 2. A moisture-absorbing material such as a desiccant can be arranged in the groove 5, and a sealing glue 6 such as UV glue is arranged between the substrate 1 and the back cover 4 to connect the substrate 1 and the back cover 4. The sealing glue 6 is arranged around the OLED 2 and is located on the periphery of the groove 5.

After the OLED is packaged, the control IC 3 is filled with glue to package the control IC. However, since there is a gap between the substrate 1 and the back cover 4, the glue used to package the control IC will easily penetrate from the control IC end to the OLED end along the gap, thereby reducing the yield of the product.

Another example is a method for improving glue overflow disclosed in the Chinese patent case CN201749877, as shown in FIG. 4 , in which a second groove 7 is provided on the periphery of the groove 5 of the back cover to surround the groove, and the sealant 6 is accommodated by the provision of the second groove 7 .

The main purpose of the present invention is to provide an OLED display structure that can reduce the leakage of the glue used to package the control IC toward the OLED and improve the yield of the product.

In order to achieve the above main purpose, the OLED display structure of the present invention includes: a substrate having an inner side surface and an outer side surface, an OLED is arranged on the inner side surface and a control IC is arranged on one side of the inner side surface, the area of the inner side surface of the substrate where the OLED is arranged is the first packaging area, and the area where the control IC is to be arranged is the second packaging area, and a sealant is arranged around the OLED in the first packaging area. A back cover has an inner surface and an outer surface. The back cover is arranged on the substrate with the inner surface facing the inner surface of the substrate. The inner surface of the back cover is provided with a groove toward the outer surface. The position of the groove corresponds to the position of the OLED on the substrate. The position of the back cover corresponding to the first packaging area of the substrate is defined as an active area. The back cover is provided with an outer groove at the periphery of the groove. The outer groove is arranged around three sides of the groove. The outer groove is not provided at the position of the back cover corresponding to between the first packaging area and the second packaging area of the substrate.

With the above structure, the OLED display structure of the present invention can reduce the problem of glue overflow by reducing the gap between the first packaging area and the second packaging area.

The applicant first explains that throughout the entire specification, including the embodiments described below and the claims of the patent application, the terms related to direction are based on the directions in the drawings for auxiliary explanation and are not limited thereto. Secondly, in the embodiments and drawings to be introduced below, the same component numbers represent the same or similar components or their structural features.

Please refer to FIG. 5, FIG. 6 and FIG. 7 which are schematic diagrams of the first embodiment of the OLED display structure of the present invention, including:

A substrate 10 is provided, which is rectangular and has an inner surface 11 and an outer surface 12. An OLED 13 is provided on the inner surface 11 and a control IC setting position 14 is provided on one side of the inner surface. For the convenience of explanation, the area of the inner surface of the substrate where the OLED is provided is defined as a first packaging area 15, and the area where the control IC will be provided is defined as a second packaging area 16. The first packaging area 15 is provided with a sealing glue 17 surrounding the OLED 13, such as UV glue.

A back cover 20 is also rectangular in shape corresponding to the substrate 10. The back cover has an inner side surface 21 and an outer side surface 22. The back cover is covered on the substrate 10 with the inner side surface 21 facing the inner side surface 11 of the substrate. A groove 23 is formed on the inner side surface 21 of the back cover 20 toward the outer side surface 22. The position of the groove 23 corresponds to the position of the OLED 13 on the substrate. The position of the back cover 20 corresponding to the first packaging area 15 of the substrate is defined as an active area 24. The back cover is provided with an outer peripheral groove 25 on the periphery of the groove 23. The outer peripheral groove 25 is arranged around three sides of the groove 23. The outer peripheral groove is not provided at the position of the back cover corresponding to between the first packaging area 15 and the second packaging area 16 of the substrate. In order to further explain the arrangement of the peripheral groove 25 of the present invention, the end of the groove 23 facing the second packaging area 16 is defined as the front side, the opposite end is defined as the rear side, and the left and right sides of the groove are defined as the sides. The peripheral groove is set at the rear side and the left and right sides of the groove.

Thus, when the back cover 20 is covered on the substrate 10, the peripheral groove 25 can be used to accommodate the sealing glue 17 on the substrate to reduce the occurrence of glue overflow. In addition, because the peripheral groove is not set at the position corresponding to the first packaging area 15 and the second packaging area 16 of the substrate on the back cover 20, when the back cover 20 is covered on the substrate, the distance between the back cover and the substrate in this area will be smaller, so when the second packaging area is filled with glue, the glue overflow to the first packaging area can be reduced, thereby improving this problem and improving the yield of the product.

In addition, as shown in the second embodiment of the present invention and FIG. 8 , the back cover can further be provided with UV glue at the ends of the two side peripheral grooves and at the positions 18 adjacent to the second packaging area to further enhance the effect of preventing glue overflow from the second packaging area.

The position of the back cover 20 corresponding to the second packaging area 16 of the substrate is defined as a cut-out area 26. The cut-out area 26 will eventually be cut off during the manufacturing process of the product. However, since the original thickness of the back cover is easy to scratch the wiring provided on the substrate for connecting the control IC during cutting, the third embodiment of the present invention provides a notch 27 in the cut-out area 26 of the back cover to reduce the original thickness of the back cover 20, for example: reducing the thickness by one third to make the thickness of the back cover in the cut-out area thinner, as shown in Figure 9. In this way, the problem of the cut-out area scratching the control IC wiring during cutting can be reduced.

In addition, the back cover 20 is not manufactured one by one due to the need for mass production, but a plurality of back cover units 30 are arranged in a matrix on a plate-shaped raw material, such as a glass plate, and are molded and manufactured in large quantities at one time, as shown in the fourth embodiment of the present invention and FIG. 10, and then each molded back cover unit 30 is divided into a back cover 20. In view of the aforementioned method of reducing the thickness of the cut-off area, when the glass plate is cut along the cutting line, it is easy to cause chipping. Therefore, in the present invention, a plurality of thicker bumps 31 are arranged between the two adjacent back cover units 30 in each row. If the raw material is a glass plate, for example, the bumps 31 are unetched areas to retain their thickness. The arrangement of the bumps 31 can prevent the occurrence of chipping during slicing.

1: Substrate 2: OLED 3: Control IC position 4: Back cover 5: Groove 6: Sealant 7: Second groove 10: Substrate 11: Inner surface 12: Outer surface 13: OLED 14: Control IC position 15: First packaging area 16: Second packaging area 17: Sealant 20: Back cover 21: Inner surface 22: Outer surface 23: Groove 24: Actuation area 25: Peripheral groove 26: Cut-off area 27: Incision 30: Back cover unit 31: Bump

Figure 1 is a schematic diagram of the decomposition of the packaging structure of the previous OLED device. Figure 2 is a three-dimensional schematic diagram of the packaging of the previous OLED device. Figure 3 is a schematic diagram of the cross-section along the 3-3 section line in Figure 2. Figure 4 is a schematic diagram of the back cover structure of the previous OLED device. Figure 5 is a three-dimensional decomposition schematic diagram of the first embodiment of the present invention. Figure 6 is a schematic diagram of the top of the first embodiment of the present invention. Figure 7 is a schematic diagram of the cross-section of the first embodiment of the present invention. Figure 8 is a schematic diagram of the top of the second embodiment of the present invention. Figure 9 is a schematic diagram of the cross-section of the third embodiment of the present invention. Figure 10 is a schematic diagram of the top of the fourth embodiment of the present invention.

10: Substrate

13:OLED

14: Control IC location

15: First packaging area

16: Second packaging area

17: Sealant

20: Back cover

21: Inner side

23: Groove

24: Action area

25: Outer groove

Claims (7)

An OLED display structure includes: a substrate having an inner surface and an outer surface, an OLED is arranged on the inner surface and a control IC is reserved on one side of the inner surface, the area of the inner surface of the substrate where the OLED is arranged is a first packaging area, and the area where the control IC is to be arranged is a second packaging area, and a sealant is arranged around the OLED in the first packaging area; a back cover having an inner surface and an outer surface, the back cover is arranged on the substrate with the inner surface facing the inner surface of the substrate, the inner surface of the back cover is concavely provided with a groove toward the outer surface, the position of the groove corresponds to the position of the OLED on the substrate, and the position of the back cover corresponding to the first packaging area of the substrate is defined as an active area, The back cover is provided with an outer peripheral groove at the periphery of the groove, and the outer peripheral groove is arranged around three sides of the groove, while the back cover is not provided with the outer peripheral groove at the position between the first packaging area and the second packaging area corresponding to the substrate. An OLED display structure as described in claim 1, wherein the end of the groove facing the second packaging area is defined as the front side, the opposite end is defined as the rear side, the left and right sides of the groove are defined as sides, and the peripheral groove is arranged on the rear side and the left and right sides of the groove. The OLED display structure as described in claim 2, wherein the back cover is further provided with a sealant at the ends of the outer peripheral groove edges on both sides adjacent to the second packaging area. An OLED display structure as described in claim 1, wherein the position of the back cover corresponding to the second packaging area of the substrate is defined as a cut-away area, and the cut-away area is provided with a notch to reduce the thickness of the back cover in the cut-away area. An OLED display structure as described in claim 3, wherein the position of the back cover corresponding to the second packaging area of the substrate is defined as a cut-out area, and the cut-out area is provided with a notch to reduce the thickness of the back cover in the cut-out area. An OLED display structure as described in claim 1, wherein a plurality of back cover units are arranged in a matrix on a plate-shaped raw material, each formed back cover unit is divided into a back cover, and a plurality of thicker bumps are arranged between each row of two adjacent back cover units. An OLED display structure as described in claim 3, wherein a plurality of back cover units are arranged in a matrix on a plate-shaped raw material, each formed back cover unit is divided into a back cover, and a plurality of thicker bumps are arranged between two adjacent back cover units in each row.

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