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TWI781096B - Heat treatment device - Google Patents

Heat treatment device Download PDF

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TWI781096B
TWI781096B TW106109550A TW106109550A TWI781096B TW I781096 B TWI781096 B TW I781096B TW 106109550 A TW106109550 A TW 106109550A TW 106109550 A TW106109550 A TW 106109550A TW I781096 B TWI781096 B TW I781096B
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sub
damper
container
chamber
medium
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TW201738963A (en
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和田賴彥
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日商捷太格特熱處理股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Furnace Details (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

本發明提供一種熱處理裝置,即使在溫度控制條件發生了變化的情況下,也能夠使被處理物更均等地進行溫度變化,並且能夠自動地進行用於使被處理物更均等地進行溫度變化的調整作業。熱處理裝置1具有:用於收納被處理物100的腔室4;包含有用於將冷卻空氣供給至腔室4的基準阻尼器32和副阻尼器31、33的介質供給部7;以及以基準阻尼器32供給冷卻空氣的供給形態為基準來控制副阻尼器31、33供給冷卻空氣的供給形態的控制部18。 The present invention provides a heat treatment device capable of making the temperature change of the object to be processed more uniform even when the temperature control conditions are changed, and automatically performing a process for making the temperature change of the object more uniform. Adjust assignments. The heat treatment device 1 has: a chamber 4 for accommodating the object to be processed 100; a medium supply part 7 including a reference damper 32 and auxiliary dampers 31, 33 for supplying cooling air to the chamber 4; The control unit 18 controls the supply form of the cooling air supplied to the sub dampers 31 and 33 based on the supply form of the cooling air supplied from the damper 32 .

Description

熱處理裝置 Heat treatment device

本發明關於一種熱處理裝置。 The present invention relates to a heat treatment device.

已知用於對半導體基板等被處理物進行熱處理的熱處理裝置(例如,參照下述的文獻1)。作為熱處理裝置的一例,文獻1所記載的熱處理裝置具有:被隔熱件包圍的加熱器;及被加熱器包圍的石英管。另外,連接有貫通隔熱件的管,在該管上連接有送風機。 There is known a heat treatment apparatus for heat-treating an object to be processed such as a semiconductor substrate (see, for example, Document 1 below). As an example of a heat treatment apparatus, the heat treatment apparatus described in Document 1 includes: a heater surrounded by a heat insulator; and a quartz tube surrounded by the heater. Moreover, the pipe which penetrates a heat insulating material is connected, and the air blower is connected to this pipe.

在藉由加熱器的加熱對石英管內的被處理物進行熱處理後,使送風機運作,從而將冷卻空氣導入石英管。藉此,石英管和被處理物被冷卻。此時,控制送風機的控制部對加熱器的輸出和送風機的風量進行控制,以使石英管的實際溫度與目標溫度的偏差為零。如此,已知在石英管的強制冷卻中使用送風機的結構。 After the object to be processed in the quartz tube is heat-treated by heating with the heater, the blower is operated to introduce cooling air into the quartz tube. Thereby, the quartz tube and the object to be processed are cooled. At this time, the controller for controlling the blower controls the output of the heater and the air volume of the blower so that the deviation between the actual temperature of the quartz tube and the target temperature becomes zero. Thus, a structure using a blower for forced cooling of quartz tubes is known.

[專利文獻1]日本專利特開平1-282619號公報 [Patent Document 1] Japanese Patent Laid-Open No. 1-282619

另外,在使用送風機對石英管等容器進行強制冷卻的結構中,可以考慮使用複數個阻尼器的結構。例如,在該結構中,與送風機連接的配管具有分支成複數個的分支管。並且,在各分支 管上連接有阻尼器。複數個阻尼器將來自送風機的冷卻空氣供給至例如沿著容器的長度方向的複數個部位。各阻尼器例如藉由作業員的手動操作來調整開度。並且,冷卻空氣從送風機穿過對應的阻尼器後,與容器接觸,從而對該容器進行冷卻。為了使容器的冷卻速度在該容器的各部盡可能地均等,作業員係手動調整各阻尼器的開度。 Also, in a structure in which a container such as a quartz tube is forcibly cooled using an air blower, a structure using a plurality of dampers is conceivable. For example, in this structure, the piping connected to the blower has branch pipes branched into plural. And, in each branch A damper is attached to the tube. The plurality of dampers supplies the cooling air from the blower to, for example, a plurality of locations along the longitudinal direction of the container. The opening of each damper is adjusted, for example, by manual operation of an operator. In addition, the cooling air passes through the corresponding damper from the blower and contacts the container, thereby cooling the container. In order to make the cooling rate of the container as uniform as possible in each part of the container, the operator manually adjusted the opening of each damper.

另一方面,在容器內進行熱處理的被處理物的內容和數量不一定每次都相同。即,容器內的被處理物的合計的熱容量不一定每次都相同。另外,容器(被處理物)的目標冷卻溫度和冷卻區域也不一定每次都相同。另外,驅動送風機的送風機馬達的頻率(例如,送風機馬達的轉速)也存在根據電源的條件而不同的情況。如此,在產生了冷卻條件的差異的情況下,如果不調整各阻尼器的開度,則容器的各部的冷卻速度會產生偏差。 On the other hand, the content and quantity of the object to be heat-treated in the container are not necessarily the same every time. That is, the total heat capacity of the objects to be processed in the container is not always the same. In addition, the target cooling temperature and cooling area of the container (object to be processed) are not necessarily the same every time. In addition, the frequency of the blower motor that drives the blower (for example, the number of revolutions of the blower motor) may vary depending on the conditions of the power supply. In this way, when a difference in cooling conditions occurs, the cooling rate of each part of the container will vary unless the opening of each damper is adjusted.

另一方面,從進行均勻的熱處理的觀點出發,較佳為,與冷卻條件的差異無關地使容器和複數個被處理物的整體盡可能均等地冷卻。因此,作業員對應於冷卻條件藉由手動作業來調整各阻尼器的開度。藉此,從各阻尼器與容器接觸的冷卻空氣的流量被調整,實現了容器和被處理物的更均等的冷卻。 On the other hand, from the viewpoint of performing uniform heat treatment, it is preferable to cool the container and the plurality of objects as a whole as evenly as possible regardless of differences in cooling conditions. Therefore, the worker manually adjusts the opening degrees of the respective dampers according to the cooling conditions. Thereby, the flow rate of the cooling air which contacts a container from each damper is adjusted, and more uniform cooling of a container and an object to be processed is realized.

如此,對於藉由手動作業來進行各阻尼器的開度調整作業的結構來說,較佳為實現自動的調整作業。 In this way, it is preferable to realize the automatic adjustment operation in the structure in which the adjustment operation of the opening degree of each damper is performed manually.

本發明鑒於上述情況,目的在於提供如下的熱處理裝置:即使在溫度控制條件發生了變化的情況下,也能夠使被處理物更均等地進行溫度變化,並且,能夠自動地進行用於使被處理物更均等地進行溫度變化的調整作業。 In view of the above circumstances, the present invention aims to provide a heat treatment apparatus that can change the temperature of the object to be processed more evenly even when the temperature control conditions change, and can automatically perform the process for making the object to be processed The adjustment operation of the temperature change is performed more evenly.

(1)為了解決上述課題,本發明的一個方面的熱處理裝置具備:容器,其在被處理物的熱處理時收納上述被處理物;介質供給部,其包括用於將溫度調整用的介質供給至上述容器的基準閥和副閥;以及控制部,其以上述基準閥供給上述介質的供給形態為基準,控制上述副閥供給上述介質的供給形態。 (1) In order to solve the above-mentioned problems, a heat treatment apparatus according to an aspect of the present invention includes: a container for accommodating the object to be processed during heat treatment of the object; a medium supply unit for supplying a medium for temperature adjustment to the A reference valve and a sub-valve of the container; and a control unit for controlling a supply form of the medium from the sub-valve based on a supply form of the medium from the reference valve.

根據該結構,利用控制部來控制副閥供給介質的供給形態。藉此,能夠在被處理物的溫度控制條件發生了變化的情況下變更副閥供給介質的供給形態。其結果是,即使在被處理物的溫度控制條件發生了變化的情況下,也能夠使被處理物更均等地冷卻。另外,以基準閥供給介質的供給形態為基準來控制副閥供給介質的供給形態的結果是,能夠更加可靠地抑制副閥的控制運算發散。從而,實現了對被處理物的更正確的溫度控制。另外,由於副閥被控制部控制,因此不需要人力對副閥的調整作業。根據以上的情況,根據本發明,能夠實現如下的熱處理裝置:即使在溫度控制條件發生了變化的情況下,也能夠使被處理物更均等地進行溫度變化,並且能夠自動地進行用於使被處理物更均等地發生溫度變化的調整作業。 According to this configuration, the supply form of the auxiliary valve supply medium is controlled by the control unit. Thereby, when the temperature control condition of the object to be processed changes, the supply form of the auxiliary valve supply medium can be changed. As a result, even when the temperature control conditions of the object to be processed are changed, the object to be processed can be cooled more uniformly. In addition, as a result of controlling the supply form of the sub-valve supply medium based on the supply form of the reference valve supply medium, it is possible to more reliably suppress the divergence of the control calculation of the sub-valve. Thus, more accurate temperature control of the object to be processed is realized. In addition, since the sub-valve is controlled by the controller, manpower is not required to adjust the sub-valve. In view of the above, according to the present invention, it is possible to realize a heat treatment apparatus that can change the temperature of the object to be processed more evenly even when the temperature control conditions change, and can automatically perform the process for making the object to be processed. It is an adjustment operation to make the temperature change more evenly in the processed object.

(2)存在這樣的情況:上述控制部以上述基準閥的開度固定的狀態為基準,來控制上述副閥的開度。 (2) There may be a case where the control unit controls the opening degree of the sub valve based on a state where the opening degree of the reference valve is fixed.

根據該結構,控制部在副閥的開度控制中無需變更基準閥的開度,結果是,能夠使副閥的控制所需要的運算更加簡化。另外,在副閥的開度控制中,能夠更加可靠地抑制產生振盪。 According to this configuration, the control unit does not need to change the opening degree of the reference valve in controlling the opening degree of the sub valve, and as a result, calculations required for controlling the sub valve can be further simplified. In addition, in the opening degree control of the sub valve, occurrence of hunting can be suppressed more reliably.

(3)存在這樣的情況:上述控制部構成為:以上述容器 中被從上述基準閥供給上述介質的部位處的溫度為基準,控制從上述副閥向上述容器供給的上述介質的流量。 (3) There is a case where the above-mentioned control unit is configured to use the above-mentioned container The flow rate of the medium supplied from the sub-valve to the container is controlled based on the temperature at a portion where the medium is supplied from the reference valve.

根據該結構,能夠使因從副閥供給至容器的介質而引起的容器的溫度變化程度與因從基準閥供給至容器的介質而引起的容器的溫度變化程度更加均等。 According to this configuration, the degree of temperature change of the container due to the medium supplied to the container from the sub valve and the degree of temperature change of the container due to the medium supplied to the container from the reference valve can be made more equal.

(4)存在這樣的情況:上述控制部控制上述副閥的開度,以使上述容器中被從上述基準閥供給上述介質的部位處的溫度、和上述容器中的被從上述副閥供給上述介質的部位處的溫度之偏差減小。 (4) There is a case where the control unit controls the opening degree of the sub-valve so that the temperature of the part of the container to which the medium is supplied from the reference valve is the same as the temperature of the part of the container to which the medium is supplied from the sub-valve. The temperature deviation at the point of the medium is reduced.

根據該結構,控制部能夠控制副閥,以使容器中被從基準閥供給上述介質的部位處的溫度和容器中被從副閥供給介質的部位處的溫度更加均等。 According to this configuration, the control unit can control the sub-valve so that the temperature of the part of the container supplied with the medium from the reference valve and the temperature of the part of the container supplied with the medium from the sub-valve become more equal.

(5)存在這樣的情況:上述副閥設置有複數個,上述控制部控制各上述副閥,以使一個上述副閥和其他上述副閥進行不同的動作。 (5) There may be a case where a plurality of the sub-valves are provided, and the control unit controls each of the sub-valves so that one of the sub-valves operates differently from the other sub-valves.

根據該結構,藉由複數個副閥的動作,能夠使容器的更廣的區域均等地發生溫度變化。另外,能夠對容器的各區域更加細微地進行溫度控制。 According to this configuration, the temperature can be uniformly changed in a wider area of the container by the operation of the plurality of sub-valves. In addition, it is possible to more finely control the temperature of each region of the container.

(6)存在這樣的情況:上述控制部構成為採用比例控制來控制各上述副閥,上述控制部將一個上述副閥的控制增益和其他上述副閥的控制增益設定為不同的值。 (6) There may be a case where the control unit is configured to control each of the sub valves using proportional control, and the control unit may set a control gain of one of the sub valves to a different value from a control gain of the other sub valves.

根據該結構,一個上述副閥能夠進一步提高用於實現目標的介質供給形態的回應速度。另一方面,其他上述副閥能夠進一步降低用於實現目標的介質供給形態的回應速度。如此,藉由將 針對目標的回應速度不同的副閥組合在一起,能夠使容易發生熱的偏差的容器發生更均等的溫度變化。 According to this configuration, the one sub-valve described above can further increase the response speed for achieving the target medium supply form. On the other hand, the other above-mentioned auxiliary valves can further reduce the response speed for achieving the target medium supply form. Thus, by adding The combination of sub valves with different response speeds to the target can make the temperature change more evenly in the container that is prone to thermal deviation.

(7)存在這樣的情況:上述介質是用於冷卻上述容器的冷卻介質,從一個上述副閥向上述容器供給上述冷卻介質的位置,係被設定成比從其他上述副閥向上述容器供給上述冷卻介質的位置高,上述控制部將針對一個上述副閥的上述控制增益設定成比針對其他上述副閥的上述控制增益大。 (7) There is such a case: the above-mentioned medium is a cooling medium for cooling the above-mentioned container, and the position where the above-mentioned cooling medium is supplied to the above-mentioned container from one of the above-mentioned auxiliary valves is set to be higher than the position where the above-mentioned cooling medium is supplied to the above-mentioned container from the other above-mentioned auxiliary valves. The position of the cooling medium is high, and the control unit sets the control gain for one of the sub valves to be larger than the control gains for the other sub valves.

根據該結構,由於容器的熱朝向上方,因此存在這樣的傾向:容器的上部的熱量比容器的下部的熱量大。因此,藉由使對容器的上部側進行冷卻的一個副閥的控制增益更大,能夠朝向容器的上部側更迅速地供給更多的介質。藉此,能夠更加可靠地冷卻容易積存熱量的容器的上部側。另一方面,藉由使對容器的下部側進行冷卻的其他副閥的控制增益更小,能夠抑制朝向容器的下部側急劇地供給過度的介質。藉此,能夠抑制熱比較容易逃逸的容器的下部側比容器的其它部分先被冷卻。其結果是,容器的各部被更均等地冷卻。 According to this configuration, since the heat of the container is directed upward, there is a tendency that the heat of the upper portion of the container is larger than the heat of the lower portion of the container. Therefore, by increasing the control gain of the one sub-valve cooling the upper side of the container, it is possible to more quickly supply a larger amount of medium toward the upper side of the container. Thereby, the upper part side of a container which tends to accumulate heat can be cooled more reliably. On the other hand, by making the control gain of the other sub-valve that cools the lower side of the container smaller, excessive supply of the medium toward the lower side of the container can be suppressed rapidly. Thereby, it can suppress that the lower part side of the container from which heat escapes comparatively is cooled earlier than the other part of a container. As a result, all parts of the container are cooled more evenly.

(8)存在這樣的情況:上述容器包括:向上述容器的外部敞開的開口部、及相對於上述容器的外部被封閉的形狀的裡部,上述介質是用於冷卻上述容器的冷卻介質,從一個上述副閥向上述容器供給上述冷卻介質的位置被設定成靠上述開口部和上述裡部中的上述裡部,並且,從其他上述副閥向上述容器供給上述冷卻介質的位置被設定成靠上述開口部和上述裡部中的上述開口部,上述控制部將針對一個上述副閥的上述控制增益設定成比針對其他上述副閥的上述控制增益大。 (8) There is a case where the container includes: an opening open to the outside of the container, and an inner portion of a shape closed to the outside of the container, and the medium is a cooling medium for cooling the container. A position where one of the auxiliary valves supplies the cooling medium to the container is set close to the inner portion of the opening and the inner portion, and a position where the cooling medium is supplied from the other auxiliary valve to the container is set close to the opening. In the opening part and the opening part of the back part, the control part sets the control gain for one of the sub-valves to be larger than the control gain for the other sub-valves.

根據該結構,容器的熱容易積存在裡部,因此存在容器的裡部的熱量比容器的開口部的熱量大的傾向。因此,藉由使對容器的裡部側進行冷卻的一個副閥的控制增益更大,而能夠朝向容器的裡部側更迅速地供給更多的介質。藉此,能夠更加可靠地冷卻容易積存熱量的容器的裡部側。另一方面,藉由使對容器的開口部側進行冷卻的其他副閥的控制增益更小,而能夠抑制朝向容器的開口部側急劇地供給過度的介質。藉此,能夠抑制熱比較容易逃逸的容器的開口部側比容器的其它部分先被冷卻之情形。其結果是,容器的各部被更均等地冷卻。 According to this structure, heat of the container tends to accumulate in the inside, so the heat of the inside of the container tends to be larger than the heat of the opening of the container. Therefore, by increasing the control gain of one sub-valve cooling the inner side of the container, it is possible to more quickly supply a larger amount of medium toward the inner side of the container. Thereby, it is possible to more reliably cool the inner side of the container, which tends to accumulate heat. On the other hand, by making the control gain of the other sub-valve that cools the opening of the container smaller, it is possible to suppress excessive supply of the medium toward the opening of the container. Thereby, it can suppress that the opening part side of the container from which heat escapes comparatively is cooled earlier than other parts of a container. As a result, all parts of the container are cooled more evenly.

(9)存在這樣的情況:上述副閥設置有複數個,來自上述基準閥的上述介質的出口位置被設定於來自各上述副閥的上述介質的出口位置之間。 (9) There may be a case where a plurality of the sub-valves are provided, and the outlet position of the medium from the reference valve is set between the outlet positions of the medium from the sub-valves.

根據該結構,能夠藉由複數個閥並利用介質使容器的更廣的區域更均等地進行溫度變化。另外,對於容器中的被供給來自基準閥的介質的部位以外的區域,能夠進一步增大其配置在被供給來自基準閥的介質的部位附近的比例。其結果是,對於容器的更廣的區域,能夠減小與被供給來自基準閥的介質的部位之間的溫度差。 According to this configuration, it is possible to more uniformly change the temperature of a wider area of the container by using a medium through a plurality of valves. In addition, the proportion of the area in the container other than the portion supplied with the medium from the reference valve can be further increased in the vicinity of the portion supplied with the medium from the reference valve. As a result, for a wider area of the container, the temperature difference with the site supplied with the medium from the reference valve can be reduced.

根據本發明,能夠實現如下的熱處理裝置:即使在溫度控制條件發生了變化的情況下,也能夠使被處理物更均等地進行溫度變化,並且能夠自動地進行用於使被處理物更均等地發生溫度變化的調整作業。 According to the present invention, it is possible to realize a heat treatment apparatus that can change the temperature of the object to be processed more evenly even when the temperature control conditions are changed, and can automatically perform the process for making the object to be processed more uniform. Adjustment work where temperature changes occur.

1‧‧‧熱處理裝置 1‧‧‧Heat treatment device

2‧‧‧基座板 2‧‧‧base plate

2a‧‧‧貫通孔 2a‧‧‧through hole

3‧‧‧加熱器 3‧‧‧Heater

3a‧‧‧側壁 3a‧‧‧Side wall

3b‧‧‧頂壁 3b‧‧‧top wall

4‧‧‧腔室(容器) 4‧‧‧Chamber (container)

4a‧‧‧上部 4a‧‧‧upper part

4b‧‧‧中間部 4b‧‧‧middle part

4c‧‧‧下部 4c‧‧‧bottom

4d‧‧‧開口部 4d‧‧‧opening

4e‧‧‧裡部 4e‧‧‧Libu

5‧‧‧晶舟 5‧‧‧Crystal boat

6‧‧‧升降機構 6‧‧‧Elevating mechanism

7‧‧‧介質供給部 7‧‧‧Media supply department

8‧‧‧凸緣 8‧‧‧flange

10‧‧‧空間 10‧‧‧space

11‧‧‧送風機單元 11‧‧‧Blower unit

12‧‧‧供給管 12‧‧‧Supply pipe

13‧‧‧歧管 13‧‧‧Manifold

14‧‧‧阻尼器單元 14‧‧‧Damper unit

15‧‧‧排氣管 15‧‧‧exhaust pipe

16‧‧‧排氣冷卻器 16‧‧‧Exhaust cooler

17‧‧‧感測器單元 17‧‧‧Sensor unit

18‧‧‧控制部 18‧‧‧Control Department

21‧‧‧送風機 21‧‧‧Blower

22‧‧‧送風機馬達 22‧‧‧Blower motor

30‧‧‧阻尼器 30‧‧‧damper

31‧‧‧第1副阻尼器(副閥;一個副閥) 31‧‧‧The first auxiliary damper (auxiliary valve; one auxiliary valve)

32‧‧‧基準阻尼器(基準閥) 32‧‧‧Reference damper (reference valve)

33‧‧‧第2副阻尼器(副閥;其他副閥) 33‧‧‧Second auxiliary damper (auxiliary valve; other auxiliary valves)

41‧‧‧入口管 41‧‧‧Inlet pipe

42‧‧‧閥箱 42‧‧‧Valve box

43‧‧‧支承軸 43‧‧‧Support shaft

44‧‧‧閥體 44‧‧‧Valve body

45‧‧‧阻尼器馬達 45‧‧‧Motor with damper

46、47‧‧‧出口管 46, 47‧‧‧Exit pipe

48‧‧‧馬達殼 48‧‧‧Motor shell

49‧‧‧輸出軸 49‧‧‧Output shaft

51~53‧‧‧溫度感測器 51~53‧‧‧temperature sensor

100‧‧‧被處理物 100‧‧‧processed objects

A1‧‧‧(冷卻空氣的)氣流 A1‧‧‧(cooling air) air flow

kp1、kp2‧‧‧控制增益 kp1, kp2‧‧‧control gain

P1‧‧‧全閉位置 P1‧‧‧Fully closed position

P2‧‧‧全開位置 P2‧‧‧full open position

T1‧‧‧腔室上部溫度(容器中的被從副閥供給介質的部位處 的溫度) T1‧‧‧Temperature at the upper part of the chamber (at the part of the container where the medium is supplied from the auxiliary valve temperature)

T2‧‧‧腔室中間部溫度(容器中的被從基準閥供給介質的部位處的溫度) T2‧‧‧temperature in the middle of the chamber (the temperature at the part of the container where the medium is supplied from the reference valve)

T3‧‧‧腔室下部溫度(容器中的被從副閥供給介質的部位處的溫度) T3‧‧‧Chamber lower temperature (the temperature at the part of the container where the medium is supplied from the auxiliary valve)

T1t、T3t、Tft‧‧‧目標溫度 T1t, T3t, Tft‧‧‧target temperature

圖1是以截面顯示本發明的一個實施形態的熱處理裝置的一部分的示意圖,顯示從側方觀察熱處理裝置的狀態。 FIG. 1 is a schematic diagram showing a part of a heat treatment apparatus according to an embodiment of the present invention in cross section, and shows a state in which the heat treatment apparatus is viewed from the side.

圖2是將圖1的熱處理裝置的主要部分放大顯示的圖。 FIG. 2 is an enlarged view showing a main part of the heat treatment apparatus of FIG. 1 .

圖3是在熱處理裝置的冷媒供給部中設置的阻尼器的剖視圖,顯示從側方觀察阻尼器的狀態。 3 is a cross-sectional view of a damper provided in a refrigerant supply unit of the heat treatment device, showing a state of the damper viewed from a side.

圖4是用於說明熱處理裝置中的冷卻動作的一例的流程圖。 FIG. 4 is a flow chart illustrating an example of cooling operation in the heat treatment apparatus.

以下參照附圖對用於實施本發明的形態進行說明。並且,本發明能夠作為用於對被處理物進行熱處理的熱處理裝置來廣泛應用。 Embodiments for implementing the present invention will be described below with reference to the drawings. In addition, the present invention can be widely applied as a heat treatment device for heat-treating an object to be processed.

圖1是以截面顯示本發明的一個實施形態的熱處理裝置1的一部分的示意圖,顯示從側方觀察熱處理裝置1的狀態。圖2是將圖1的熱處理裝置1的主要部分放大後顯示的圖。圖3是在熱處理裝置1的介質供給部7中設置的阻尼器30的剖視圖,顯示從側方觀察阻尼器30的狀態。 FIG. 1 is a schematic diagram showing a part of a heat treatment apparatus 1 according to an embodiment of the present invention in cross section, and shows a state in which the heat treatment apparatus 1 is viewed from the side. FIG. 2 is an enlarged view showing a main part of the heat treatment apparatus 1 of FIG. 1 . 3 is a cross-sectional view of the damper 30 provided in the medium supply unit 7 of the heat treatment apparatus 1, showing a state in which the damper 30 is viewed from the side.

參照圖1,熱處理裝置1構成為能夠對被處理物100實施熱處理。更具體來說,熱處理裝置1構成為能夠藉由朝向被處理物100供給被加熱的氣體來對被處理物100的表面實施熱處理。另外,熱處理裝置1構成為,能夠使用為介質的空氣作為冷卻空氣,來對被處理物100強制冷卻。 Referring to FIG. 1 , a heat treatment apparatus 1 is configured to perform heat treatment on an object 100 to be processed. More specifically, the heat treatment apparatus 1 is configured to be able to perform heat treatment on the surface of the object 100 to be processed by supplying heated gas toward the object 100 to be processed. In addition, the heat treatment apparatus 1 is configured to be able to forcibly cool the object 100 to be processed using air as a medium as cooling air.

被處理物100例如是玻璃基板或半導體基板等。 The object to be processed 100 is, for example, a glass substrate, a semiconductor substrate, or the like.

熱處理裝置1具有基座板2、加熱器3、作為容器的腔室4、晶舟(boat)5、升降機構6以及介質供給部7。 The heat treatment apparatus 1 has a susceptor plate 2 , a heater 3 , a chamber 4 as a container, a boat 5 , an elevating mechanism 6 , and a medium supply unit 7 .

基座板2被設置為支撐加熱器3和腔室4的構件。在基座板2的中央形成有貫通孔2a。以從上方堵塞該貫通孔2a的方式配置有加熱器3。 The base plate 2 is provided as a member supporting the heater 3 and the chamber 4 . A through hole 2 a is formed in the center of the base plate 2 . The heater 3 is arranged so as to close the through-hole 2 a from above.

加熱器3例如是電熱加熱器,構成為能夠將氣體加熱至例如大約600℃。加熱器3整體上形成為箱狀。加熱器3具有:在上下方向(鉛直方向)上延伸的圓筒狀的側壁3a;和將側壁3a的上端堵住的頂壁3b。在側壁3a的下端部,形成有向下敞開的開口部。加熱器3的側壁3a的下端部被基座板2承接。在被加熱器3包圍的空間中,配置有腔室4。 The heater 3 is, for example, an electrothermal heater, and is configured to be able to heat the gas to, for example, approximately 600°C. The heater 3 is formed in a box shape as a whole. The heater 3 has a cylindrical side wall 3 a extending in the vertical direction (vertical direction), and a ceiling wall 3 b closing the upper end of the side wall 3 a. An opening that opens downward is formed at the lower end of the side wall 3a. The lower end portion of the side wall 3 a of the heater 3 is received by the base plate 2 . In the space surrounded by the heater 3, a chamber 4 is disposed.

腔室4構成為在被處理物100的熱處理時收納被處理物100的容器。腔室4整體上形成為圓筒狀。腔室4的上端部被堵塞。另外,腔室4向下敞開。腔室4的下端部被基座板2承接。腔室4內的空間通過基座板2的貫通孔2a向基座板2的下方的空間敞開。如此,腔室4包括:向腔室4的外部敞開的開口部4d;相對於腔室4的外部被閉合的形狀的裡部4e。 The chamber 4 is configured as a container for accommodating the object to be processed 100 during heat treatment of the object to be processed 100 . The chamber 4 is formed in a cylindrical shape as a whole. The upper end of the chamber 4 is blocked. In addition, the chamber 4 is open downwards. The lower end of the chamber 4 is received by the base plate 2 . The space in the chamber 4 is opened to the space below the base plate 2 through the through hole 2 a of the base plate 2 . Thus, the chamber 4 includes an opening 4 d opened to the outside of the chamber 4 , and an inner portion 4 e of a shape closed to the outside of the chamber 4 .

在熱處理裝置1執行熱處理動作時,在腔室4內的空間中配置有被處理物100。被處理物100例如以水平配置的狀態支撐於晶舟5。 When the heat treatment apparatus 1 performs a heat treatment operation, the object 100 to be processed is arranged in the space in the chamber 4 . The object to be processed 100 is supported by the wafer boat 5 in a horizontally arranged state, for example.

晶舟5是為了將被處理物100配置在腔室4內而設置的。晶舟5例如具有上下並排的複數個狹槽,複數個被處理物100被保持於該等狹槽。晶舟5被升降機構6支撐,且能夠藉由升降機構6的動作與被處理物100一起在上下方向上移位。藉由該升降機構6的動作,被處理物100和晶舟5進出腔室4。 The wafer boat 5 is provided for arranging the object 100 to be processed in the chamber 4 . The wafer boat 5 has, for example, a plurality of slots arranged vertically, and a plurality of objects to be processed 100 are held in the slots. The wafer boat 5 is supported by the elevating mechanism 6 and can be displaced in the vertical direction together with the object 100 by the operation of the elevating mechanism 6 . The object to be processed 100 and the wafer boat 5 move in and out of the chamber 4 by the operation of the lifting mechanism 6 .

在晶舟5和被處理物100被配置於腔室4內的狀態 下,腔室4的下端部和基座板2的貫通孔2a被與晶舟5連結的凸緣8封閉。藉此,被處理物100和晶舟5被密閉在腔室4內。在該狀態下,基於加熱器3的加熱對被處理物100加熱。然後,在加熱器3對被處理物100的加熱結束後,被處理物100、晶舟5和腔室4被從介質供給部7供給的冷卻空氣強制冷卻。 In the state where the wafer boat 5 and the object to be processed 100 are arranged in the chamber 4 Next, the lower end portion of the chamber 4 and the through-hole 2 a of the susceptor plate 2 are closed by the flange 8 connected to the wafer boat 5 . Thereby, the object 100 and the wafer boat 5 are hermetically sealed in the chamber 4 . In this state, the object to be processed 100 is heated by heating by the heater 3 . Then, after the heater 3 finishes heating the object 100 to be processed, the object 100 , the boat 5 , and the chamber 4 are forcibly cooled by the cooling air supplied from the medium supply unit 7 .

介質供給部7構成為,藉由向形成在加熱器3與腔室4之間的空間10強制地供給作為溫度調整用的冷卻介質的冷卻空氣,來冷卻腔室4和被處理物100。空間10是形成在基座板2、和配置於該基座板2上的腔室4及加熱器3之間的空間。該空間10整周地包圍腔室4的外周部。另外,該空間10是從上方覆蓋腔室4的上端部的空間。並且,在圖1中,以箭頭A1示意性地表示冷卻空氣的氣流。在本實施形態中,介質供給部7構成為藉由電子控制來控制冷卻空氣朝向空間10供給的供給形態。 The medium supply unit 7 is configured to cool the chamber 4 and the processed object 100 by forcibly supplying cooling air as a cooling medium for temperature adjustment to the space 10 formed between the heater 3 and the chamber 4 . The space 10 is a space formed between the base plate 2 and the chamber 4 and the heater 3 arranged on the base plate 2 . This space 10 surrounds the outer periphery of the chamber 4 over its entire circumference. In addition, this space 10 is a space covering the upper end portion of the chamber 4 from above. In addition, in FIG. 1 , the flow of cooling air is schematically indicated by arrow A1 . In the present embodiment, the medium supply unit 7 is configured as a supply form in which the supply of cooling air to the space 10 is controlled by electronic control.

介質供給部7具有送風機單元11、供給管12、歧管13、阻尼器單元14、排氣管15、排氣冷卻器16、感測器單元17以及控制部18。 The medium supply unit 7 has a blower unit 11 , a supply pipe 12 , a manifold 13 , a damper unit 14 , an exhaust pipe 15 , an exhaust cooler 16 , a sensor unit 17 , and a control unit 18 .

送風機單元11是為了將存在於加熱器3的外部的空氣取入並將該空氣作為冷卻空氣供給至供給管12而設置的。 The blower unit 11 is provided to take in air existing outside the heater 3 and supply the air to the supply pipe 12 as cooling air.

送風機單元11具有送風機21和用於驅動該送風機21的送風機馬達22。 The blower unit 11 has a blower 21 and a blower motor 22 for driving the blower 21 .

送風機21例如是離心送風機,並且構成為:將存在於加熱器3的外部的空氣吸入,並對該空氣加壓,將其作為冷卻空氣以加壓狀態輸出。該送風機21具有葉輪(未圖示)。該葉輪與送風機馬達22的輸出軸連結,借助該送風機馬達22的驅動而運作。送 風機馬達22在本實施形態中為電動馬達。該送風機馬達22產生與所提供的的電力的頻率相對應的輸出。 The blower 21 is, for example, a centrifugal blower, and is configured to take in air existing outside the heater 3 , pressurize the air, and output it as cooling air in a pressurized state. This blower 21 has an impeller (not shown). The impeller is connected to the output shaft of the blower motor 22 and operated by the drive of the blower motor 22 . deliver The fan motor 22 is an electric motor in this embodiment. The blower motor 22 generates an output corresponding to the frequency of the supplied electric power.

並且,被吸入送風機21中的空氣可以是常溫,也可以預先被冷卻器(未圖示)冷卻。供給管12的一端與送風機21的排出口連接。 In addition, the air sucked into the air blower 21 may be at normal temperature, or may be cooled by a cooler (not shown) in advance. One end of the supply pipe 12 is connected to the discharge port of the blower 21 .

供給管12是大致筆直地延伸的配管。供給管12可以是剛體狀的金屬管,也可以是能夠彈性變形的可撓管。供給管12的另一端與歧管13連接。 The supply pipe 12 is a pipe extending substantially straight. The supply pipe 12 may be a rigid metal pipe or an elastically deformable flexible pipe. The other end of the supply pipe 12 is connected to a manifold 13 .

歧管13是為了將冷卻空氣分別分配至阻尼器單元14的後述的複數個阻尼器30而設置的。歧管13例如是使用具有規定的直徑的圓筒狀的金屬管而形成的。在本實施形態中,歧管13的兩端部被堵塞。另外,在本實施形態中,歧管13在與供給管12延伸的方向大致垂直的方向上延伸。 The manifold 13 is provided to distribute cooling air to a plurality of dampers 30 described later of the damper unit 14 . The manifold 13 is formed using, for example, a cylindrical metal pipe having a predetermined diameter. In this embodiment, both ends of the manifold 13 are blocked. In addition, in the present embodiment, the manifold 13 extends in a direction substantially perpendicular to the direction in which the supply pipe 12 extends.

更具體來說,在本實施形態中,歧管13在上下方向上延伸,且沿著與腔室4的長度方向平行的方向配置。歧管13被配置在加熱器3的側方(換言之,是腔室4的側方)。 More specifically, in the present embodiment, the manifold 13 extends in the vertical direction and is arranged in a direction parallel to the longitudinal direction of the chamber 4 . The manifold 13 is arranged on the side of the heater 3 (in other words, on the side of the chamber 4 ).

在本實施形態中,供給管12連接在歧管13的上端部的外周部。根據上述的結構,通過供給管12的冷卻空氣在進入歧管13後在歧管13內向下方行進。然後,該冷卻空氣被送入阻尼器單元14的阻尼器30。 In this embodiment, the supply pipe 12 is connected to the outer peripheral portion of the upper end portion of the manifold 13 . According to the above configuration, the cooling air passing through the supply pipe 12 travels downward in the manifold 13 after entering the manifold 13 . This cooling air is then fed into the damper 30 of the damper unit 14 .

阻尼器單元14是為了將送入歧管13中的冷卻空氣分別向腔室4的上部4a、中間部4b以及下部4c供給而設置的。阻尼器單元14在本實施形態中被配置於歧管13與加熱器3之間。 The damper unit 14 is provided to supply the cooling air sent into the manifold 13 to the upper part 4a, the middle part 4b, and the lower part 4c of the chamber 4, respectively. The damper unit 14 is arranged between the manifold 13 and the heater 3 in this embodiment.

阻尼器單元14具有複數個阻尼器30。在本實施形態 中,作為複數個阻尼器30,具有基準阻尼器32和作為複數個副阻尼器的第1副阻尼器31及第2副阻尼器33。並且,在對阻尼器31、32、33統稱的情況下,稱為阻尼器30。 The damper unit 14 has a plurality of dampers 30 . In this embodiment Among them, as a plurality of dampers 30 , there are a reference damper 32 and a first sub damper 31 and a second sub damper 33 as a plurality of sub dampers. In addition, when the dampers 31 , 32 , and 33 are collectively referred to as the damper 30 .

基準阻尼器32被設置為用於向腔室4供給冷卻空氣的基準閥。另外,副阻尼器31、33被設置為用於向腔室4供給冷卻空氣的副閥。第1副阻尼器31是本發明的「一個副閥」的一例。第2副阻尼器33是本發明的「其他副閥」的一例。各阻尼器30構成為能夠調整開度。即,構成為能夠調整通過各阻尼器30的冷卻空氣的流量。 The reference damper 32 is provided as a reference valve for supplying cooling air to the chamber 4 . In addition, sub dampers 31 , 33 are provided as sub valves for supplying cooling air to chamber 4 . The first sub-damper 31 is an example of "one sub-valve" in the present invention. The second sub-damper 33 is an example of the "other sub-valve" of the present invention. Each damper 30 is configured such that an opening degree can be adjusted. That is, it is configured to be able to adjust the flow rate of cooling air passing through each damper 30 .

第1副阻尼器31構成為朝向腔室4的上部4a供給冷卻空氣。基準阻尼器32構成為朝向腔室4的中間部4b供給冷卻空氣。第2副阻尼器33構成為朝向腔室4的下部4c供給冷卻空氣。 The first sub damper 31 is configured to supply cooling air toward the upper portion 4 a of the chamber 4 . The reference damper 32 is configured to supply cooling air toward the middle portion 4 b of the chamber 4 . The second sub-damper 33 is configured to supply cooling air toward the lower portion 4 c of the chamber 4 .

第1副阻尼器31、基準阻尼器32以及第2副阻尼器33按照該順序沿著腔室4的長度方向即上下方向排列。即,基準阻尼器32被配置在第1副阻尼器31的下方。另外,第2副阻尼器33被配置在基準阻尼器32的下方。 The first sub damper 31 , the reference damper 32 , and the second sub damper 33 are arranged in this order along the longitudinal direction of the chamber 4 , that is, the vertical direction. That is, the reference damper 32 is arranged below the first sub damper 31 . In addition, the second sub damper 33 is arranged below the reference damper 32 .

參照圖1~圖3,阻尼器30(即,基準阻尼器32、副阻尼器31、33各者)具有入口管41、閥箱42、支承軸43、閥體44、阻尼器馬達45以及出口管46、47。 Referring to FIGS. 1 to 3 , the damper 30 (that is, each of the reference damper 32 and the auxiliary dampers 31 and 33) has an inlet pipe 41, a valve box 42, a support shaft 43, a valve body 44, a damper motor 45, and an outlet. Tubes 46, 47.

並且,在本實施形態中,以基準阻尼器32為包含有阻尼器馬達45的電動式的阻尼器的形態為例進行說明,但不限於此。例如,基準阻尼器32可以是未設置阻尼器馬達45的基於人力的手動開度調整式的、且能夠使閥體44的開度固定的阻尼器。 In addition, in the present embodiment, an example in which the reference damper 32 is an electric damper including the damper motor 45 is described, but it is not limited thereto. For example, the reference damper 32 may be a manual opening adjustment type damper without the damper motor 45 and capable of fixing the opening of the valve body 44 .

入口管41與歧管13和閥箱42連接,且構成為將來 自歧管13的冷卻空氣導入閥箱42內。入口管41的內徑被設定得比歧管13的內徑小。入口管41的一端與歧管13的外周部連接。 The inlet pipe 41 is connected with the manifold 13 and the valve box 42, and is configured as a future The cooling air from the manifold 13 is introduced into the valve box 42 . The inner diameter of the inlet pipe 41 is set smaller than that of the manifold 13 . One end of the inlet pipe 41 is connected to the outer peripheral portion of the manifold 13 .

第1副阻尼器31的入口管41與歧管13的上部連接。基準阻尼器32的入口管41與歧管13的中間部連接。第2副阻尼器33的入口管41與歧管13的下部連接。入口管41從歧管13朝向對應的閥箱42水平地延伸。 The inlet pipe 41 of the first sub-damper 31 is connected to the upper portion of the manifold 13 . The inlet pipe 41 of the reference damper 32 is connected to the middle portion of the manifold 13 . The inlet pipe 41 of the second sub-damper 33 is connected to the lower portion of the manifold 13 . The inlet pipe 41 extends horizontally from the manifold 13 towards the corresponding valve box 42 .

閥箱42例如形成為中空的四角柱狀。入口管41的另一端與閥箱42的一側壁連接。通過入口管41的冷卻空氣被導入閥箱42內。閥箱42收納支承軸43和閥體44。 The valve box 42 is formed, for example, in the shape of a hollow square column. The other end of the inlet pipe 41 is connected to a side wall of the valve box 42 . The cooling air passing through the inlet pipe 41 is introduced into the valve box 42 . The valve box 42 accommodates the support shaft 43 and the valve body 44 .

支承軸43被支撐於閥箱42,並且可繞該支承軸43擺動地支撐閥體44。在本實施形態中,支承軸43與閥體44以能夠一體旋轉的方式連結。支承軸43例如在水平方向上延伸,且配置成與入口管41鄰接。支承軸43的一部分貫通閥箱42,並與阻尼器馬達45的輸出軸49連結。 The support shaft 43 is supported by the valve case 42 and supports the valve body 44 so as to be swingable about the support shaft 43 . In the present embodiment, the support shaft 43 and the valve body 44 are connected so as to be integrally rotatable. The support shaft 43 extends, for example, in the horizontal direction, and is disposed adjacent to the inlet pipe 41 . A part of the support shaft 43 penetrates the valve box 42 and is connected to the output shaft 49 of the damper motor 45 .

阻尼器馬達45是為了藉由使閥體44繞支承軸43擺動來設定阻尼器30的閥開度而設置的。 The damper motor 45 is provided to set the valve opening degree of the damper 30 by swinging the valve body 44 around the support shaft 43 .

阻尼器馬達45具有馬達殼48和被該馬達殼48支撐的輸出軸49。 The damper motor 45 has a motor case 48 and an output shaft 49 supported by the motor case 48 .

阻尼器馬達45是伺服馬達等構成為能夠進行旋轉位置控制的電動馬達。阻尼器馬達45構成為,接收來自控制部18的控制信號,從而能夠變更該阻尼器馬達45的輸出軸49的旋轉位置。 The damper motor 45 is an electric motor configured to be capable of controlling the rotational position, such as a servo motor. The damper motor 45 is configured to be able to change the rotational position of the output shaft 49 of the damper motor 45 by receiving a control signal from the control unit 18 .

馬達殼48例如固定於閥箱42。阻尼器馬達45的輸出軸49以能夠聯動地旋轉的方式與支承軸43連結。該輸出軸49可以與支承軸43連結成能夠一體地旋轉,也可以經由未圖示的減 速機構與支承軸43可聯動旋轉地連結。根據上述的結構,藉由阻尼器馬達45的驅動來設定輸出軸49的旋轉位置,與此相伴,閥體44的繞支承軸43的旋轉位置(即,阻尼器30的開度)被設定。 The motor case 48 is fixed to the valve box 42, for example. An output shaft 49 of the damper motor 45 is coupled to the support shaft 43 so as to be rotatable in conjunction with it. The output shaft 49 may be connected to the support shaft 43 so as to be integrally rotatable, or it may be connected to the support shaft 43 via a detent not shown. The speed mechanism is coupled to the support shaft 43 so as to be rotatable. According to the above configuration, the rotational position of the output shaft 49 is set by driving the damper motor 45, and accordingly, the rotational position of the valve body 44 around the support shaft 43 (that is, the opening degree of the damper 30) is set.

閥體44構成為對入口管41的另一端進行開閉。閥體44例如是使用矩形的平板狀構件而形成的。閥體44的一個緣部與支承軸43連結。閥體44例如被配置成在垂直地立起的姿勢下堵塞入口管41。 The valve body 44 is configured to open and close the other end of the inlet pipe 41 . The valve body 44 is formed using, for example, a rectangular flat member. One edge of the valve body 44 is connected to the support shaft 43 . The valve body 44 is arranged, for example, to block the inlet pipe 41 in a vertically erect posture.

閥體44從垂直地立起的姿勢起繞支承軸43旋轉例如數十度,藉此被配置在全開位置P2。即,當閥體44處於垂直位置即全閉位置P1時,阻尼器30的開度為零。另外,當閥體44處於從垂直位置旋轉了數十度的規定的全開位置P2時,阻尼器30的開度為100%。 The valve body 44 is arranged at the fully open position P2 by rotating, for example, several tens of degrees around the support shaft 43 from the vertically erected posture. That is, when the valve body 44 is in the vertical position, that is, the fully closed position P1, the opening of the damper 30 is zero. In addition, when the valve body 44 is at the predetermined fully open position P2 rotated by several tens of degrees from the vertical position, the opening degree of the damper 30 is 100%.

並且,閥體44的旋轉位置與阻尼器30的開度之間的關係根據阻尼器30的結構來決定。因此,關於閥體44的旋轉位置與阻尼器30的開度之間的關係,存在有為線形的情況、和為非線形的情況。在本實施形態中,閥體44的旋轉位置與阻尼器30的旋轉位置之間的關係被預先儲存於控制部18。 Furthermore, the relationship between the rotational position of the valve body 44 and the opening degree of the damper 30 is determined according to the structure of the damper 30 . Therefore, the relationship between the rotational position of the valve body 44 and the opening degree of the damper 30 may be linear or nonlinear. In the present embodiment, the relationship between the rotational position of the valve body 44 and the rotational position of the damper 30 is stored in the control unit 18 in advance.

當閥體44將入口管41的另一端打開時,來自入口管41的冷卻空氣被導入閥體44內,進而被向出口管46、47引導。 When the valve body 44 opens the other end of the inlet pipe 41 , the cooling air from the inlet pipe 41 is introduced into the valve body 44 and then guided to the outlet pipes 46 and 47 .

在本實施形態中,在各阻尼器31、32、33設有2個出口管(即,出口管46、47)。各出口管46、47是為了將對應的閥箱42內的空間和形成於加熱器3內的空間10連接起來而設置的。各出口管46、47的一端與對應的閥箱42的一個側壁連接。 In this embodiment, two outlet pipes (that is, outlet pipes 46 and 47 ) are provided in each of the dampers 31 , 32 , and 33 . Each outlet pipe 46 , 47 is provided to connect the space in the corresponding valve box 42 with the space 10 formed in the heater 3 . One end of each outlet pipe 46 , 47 is connected to one side wall of the corresponding valve box 42 .

另外,各出口管46、47的另一端貫通加熱器3的側 壁3a而面對空間10。在各阻尼器31、32、33中,出口管46的另一端和出口管47的另一端在加熱器3的側壁3a的圓周方向上等間隔地(在本實施方式中,以180度的間隔)配置。 In addition, the other end of each outlet pipe 46, 47 penetrates the side of the heater 3 The wall 3 a faces the space 10 . In each damper 31, 32, 33, the other end of the outlet pipe 46 and the other end of the outlet pipe 47 are equally spaced (in this embodiment, at intervals of 180 degrees) in the circumferential direction of the side wall 3a of the heater 3. ) configuration.

第1副阻尼器31的出口管46、47的另一端被配置成水平地面對腔室4的上部4a。基準阻尼器32的出口管46、47的另一端被配置成水平地面對腔室4的中間部4b。第2副阻尼器33的出口管46、47的另一端被配置成水平地面對腔室4的下部4c。 The other ends of the outlet pipes 46 and 47 of the first sub-damper 31 are disposed so as to face the upper portion 4 a of the chamber 4 horizontally. The other ends of the outlet pipes 46 , 47 of the reference damper 32 are arranged to face the middle portion 4 b of the chamber 4 horizontally. The other ends of the outlet pipes 46 and 47 of the second sub-damper 33 are disposed so as to face the lower portion 4c of the chamber 4 horizontally.

根據上述的結構,冷卻空氣被從第1副阻尼器31供給至腔室4的位置(即,第1副阻尼器31的出口管46、47的另一端的位置)被設定得比冷卻空氣被從第2副阻尼器33供給至腔室4的位置(即,第2副阻尼器33的出口管46、47的另一端的位置)高。 According to the above structure, the position where the cooling air is supplied from the first sub-damper 31 to the chamber 4 (that is, the position at the other end of the outlet pipes 46, 47 of the first sub-damper 31) is set to be larger than the position where the cooling air is supplied. The position from the second sub-damper 33 to the chamber 4 (that is, the position of the other end of the outlet pipes 46 and 47 of the second sub-damper 33 ) is high.

另外,冷卻空氣被從第1副阻尼器31供給至腔室4的位置被設定得靠近開口部4d和裡部4e中的裡部4e。另外,冷卻空氣被從第2副阻尼器33供給至腔室4的位置被設定得靠近開口部4d和裡部4e中的開口部4d。 In addition, the position where the cooling air is supplied from the first sub damper 31 to the chamber 4 is set close to the inner portion 4e of the opening portion 4d and the inner portion 4e. In addition, the position where the cooling air is supplied from the second sub damper 33 to the chamber 4 is set close to the opening 4d and the opening 4d in the back portion 4e.

另外,來自基準阻尼器32的冷卻空氣的出口即出口管46、47的另一端的位置被設定在來自第1副阻尼器31的冷卻空氣的出口即出口管46、47的另一端位置與來自第2副阻尼器33的冷卻空氣的出口即出口管46、47的另一端位置之間。 In addition, the positions of the other ends of the outlet pipes 46 and 47, which are the outlets of the cooling air from the reference damper 32, are set at the same position as the other ends of the outlet pipes 46 and 47, which are the outlets of the cooling air from the first sub-damper 31. Between the other end positions of the outlet pipes 46 and 47 , which is the outlet of the cooling air of the second sub-damper 33 .

另外,在本實施形態中,各阻尼器31、32、33的出口管46的另一端在腔室4的圓周方向上的位置被對齊。同樣,各阻尼器31、32、33的出口管47的另一端在腔室4的圓周方向上的位置被對齊。 In addition, in the present embodiment, the positions of the other ends of the outlet pipes 46 of the respective dampers 31 , 32 , and 33 in the circumferential direction of the chamber 4 are aligned. Also, the positions of the other ends of the outlet pipes 47 of the respective dampers 31 , 32 , 33 in the circumferential direction of the chamber 4 are aligned.

根據上述的結構,通過第1副阻尼器31的冷卻空氣 以朝向腔室4的上部4a的方式被供給至空間10中。另外,通過基準阻尼器32的冷卻空氣以朝向腔室4的中間部4b的方式被供給至空間10中。而且,通過第2副阻尼器33的冷卻空氣以朝向腔室4的下部4c的方式被供給至空間10中。被供給至空間10中的冷卻空氣一邊吸收來自腔室4的熱一邊朝向排氣管15流動。 According to the above structure, the cooling air passing through the first sub damper 31 It is fed into the space 10 towards the upper part 4 a of the chamber 4 . In addition, cooling air passing through the reference damper 32 is supplied into the space 10 toward the middle portion 4 b of the chamber 4 . Furthermore, the cooling air passing through the second sub damper 33 is supplied into the space 10 toward the lower portion 4 c of the chamber 4 . The cooling air supplied into the space 10 flows toward the exhaust duct 15 while absorbing heat from the chamber 4 .

排氣管15貫通加熱器3的頂壁3b。排氣管15的一端面對空間10。排氣管15將到達空間10的上端的冷卻空氣向排氣管15的另一端側引導。排氣管15在加熱器3的外側的空間中與排氣冷卻器16連接。排氣冷卻器16對吸收了來自腔室4的熱的冷卻空氣進行冷卻。藉由通過排氣冷卻器16而被冷卻的冷卻空氣向熱處理裝置1的外部空間排出。 The exhaust pipe 15 penetrates through the ceiling wall 3 b of the heater 3 . One end of the exhaust pipe 15 faces the space 10 . The exhaust duct 15 guides the cooling air that has reached the upper end of the space 10 to the other end side of the exhaust duct 15 . The exhaust pipe 15 is connected to an exhaust cooler 16 in a space outside the heater 3 . The exhaust cooler 16 cools the cooling air that has absorbed heat from the chamber 4 . The cooling air cooled by passing through the exhaust cooler 16 is exhausted to the external space of the heat treatment apparatus 1 .

根據上述的結構,冷卻空氣從送風機21通過供給管12和歧管13後通過對應的阻尼器31、32、33,從而到達空間10,進而通過排氣管15和排氣冷卻器16被排出至熱處理裝置1的外部。利用感測器單元17檢測與各阻尼器31、32、33的出口管46、47的另一端相鄰的位置處的腔室4的溫度。 According to the above-mentioned structure, the cooling air passes through the supply pipe 12 and the manifold 13 from the blower 21 and then passes through the corresponding dampers 31, 32, 33 to reach the space 10, and then is discharged to the exhaust pipe 15 and the exhaust cooler 16. The exterior of the heat treatment device 1. The temperature of the chamber 4 at a position adjacent to the other end of the outlet pipe 46 , 47 of each damper 31 , 32 , 33 is detected by the sensor unit 17 .

更具體來說,感測器單元17分別檢測與第1副阻尼器31的出口管46的另一端面對的位置處的腔室4的溫度、與基準阻尼器32的出口管46的另一端面對的位置處的腔室4的溫度、以及與第2副阻尼器33的出口管46的另一端面對的位置處的腔室4的溫度。 More specifically, the sensor unit 17 detects the temperature of the chamber 4 at the position facing the other end of the outlet pipe 46 of the first sub-damper 31 and the temperature of the other end of the outlet pipe 46 of the reference damper 32. The temperature of the chamber 4 at the facing position and the temperature of the chamber 4 at the position facing the other end of the outlet pipe 46 of the second sub-damper 33 .

感測器單元17具有溫度感測器51~53。 The sensor unit 17 has temperature sensors 51 to 53 .

溫度感測器51~53例如是熱電偶等電氣式溫度感測器,構成為輸出指定檢測溫度的電信號。溫度感測器51~53例如 在與腔室4相鄰的位置處被加熱器3支撐。 The temperature sensors 51 to 53 are, for example, electrical temperature sensors such as thermocouples, and are configured to output electrical signals specifying detected temperatures. Temperature sensors 51~53 such as It is supported by the heater 3 at a position adjacent to the chamber 4 .

溫度感測器51與腔室4的上部4a的外周面相鄰地配置,並且與第1副阻尼器31的出口管46的另一端相鄰。溫度感測器51檢測出與第1副阻尼器31的出口管46水平地對置的腔室4之上部4a的溫度,作為腔室上部溫度T1。 The temperature sensor 51 is arranged adjacent to the outer peripheral surface of the upper portion 4 a of the chamber 4 and adjacent to the other end of the outlet pipe 46 of the first sub-damper 31 . The temperature sensor 51 detects the temperature of the upper part 4a of the chamber 4 horizontally facing the outlet pipe 46 of the first sub-damper 31 as the chamber upper part temperature T1.

溫度感測器52與腔室4的中間部4b的外周面相鄰地配置,並且與基準阻尼器32的出口管46的另一端相鄰。溫度感測器52檢測出與基準阻尼器32的出口管46水平地對置的腔室4之中間部4b的溫度,作為腔室中間部溫度T2。 The temperature sensor 52 is arranged adjacent to the outer peripheral surface of the intermediate portion 4 b of the chamber 4 and adjacent to the other end of the outlet pipe 46 of the reference damper 32 . The temperature sensor 52 detects the temperature of the middle part 4b of the chamber 4 horizontally opposed to the outlet pipe 46 of the reference damper 32 as the chamber middle part temperature T2.

溫度感測器53與腔室4的下部4c的外周面相鄰地配置,並且與第2副阻尼器33的出口管46的另一端相鄰。溫度感測器53檢測出與第2副阻尼器33的出口管46水平地對置的腔室4之下部4c的溫度,作為腔室下部溫度T3。各溫度感測器51~53的溫度檢測結果被提供給控制部18。 The temperature sensor 53 is arranged adjacent to the outer peripheral surface of the lower portion 4 c of the chamber 4 and adjacent to the other end of the outlet pipe 46 of the second sub-damper 33 . The temperature sensor 53 detects the temperature of the lower portion 4c of the chamber 4 horizontally opposed to the outlet pipe 46 of the second sub-damper 33 as the chamber lower portion temperature T3. The temperature detection results of the respective temperature sensors 51 to 53 are supplied to the control unit 18 .

控制部18構成為以基準阻尼器32供給冷卻空氣的供給形態為基準來控制副阻尼器31、33供給冷卻空氣的供給形態。控制部18是使用PLC(Programmable Logic Controller:可程式設計邏輯控制器)等來形成的。並且,控制部18可以使用包括有CPU(Central Processing Unit:中央處理單元)、ROM(Read Only Memory:唯讀記憶體)以及RAM(Random Access Memory:隨機存取記憶體)的電腦來形成,也可以使用時序電路等來形成。 The control unit 18 is configured to control the supply form of the cooling air supplied by the sub dampers 31 and 33 based on the supply form of the cooling air supplied by the reference damper 32 . The control unit 18 is formed using a PLC (Programmable Logic Controller: Programmable Logic Controller) or the like. Moreover, the control unit 18 can be formed using a computer including a CPU (Central Processing Unit: Central Processing Unit), a ROM (Read Only Memory: Read Only Memory), and a RAM (Random Access Memory: Random Access Memory). It can be formed using a sequential circuit or the like.

控制部18與各溫度感測器51~53連接,接收指定該等溫度感測器51~53的溫度檢測結果即腔室溫度T1~T3的電信號。另外,控制部18與送風機馬達22連接,藉由控制送風機馬達 22的驅動,藉此控制從送風機21供給的冷卻空氣的流量。 The control unit 18 is connected to each of the temperature sensors 51-53, and receives electrical signals specifying the temperature detection results of the temperature sensors 51-53, that is, the chamber temperatures T1-T3. In addition, the control unit 18 is connected to the blower motor 22, and by controlling the blower motor 22, thereby controlling the flow rate of the cooling air supplied from the blower 21.

另外,控制部18與第1副阻尼器31的阻尼器馬達45、基準阻尼器32的阻尼器馬達45以及第2副阻尼器33的阻尼器馬達45連接,分別控制該等馬達45的動作。 In addition, the control unit 18 is connected to the damper motor 45 of the first sub-damper 31 , the damper motor 45 of the reference damper 32 , and the damper motor 45 of the second sub-damper 33 , and controls the operation of the motors 45 respectively.

在本實施形態中,控制部18以基準阻尼器32的開度固定的狀態為基準,來控制第1副阻尼器31和第2副阻尼器33各自的開度。更具體來說,在介質供給部7冷卻腔室4和被處理物100的動作開始時,控制部18首先設定基準阻尼器32的開度。 In the present embodiment, the control unit 18 controls the respective opening degrees of the first sub-damper 31 and the second sub-damper 33 based on the state where the opening degree of the reference damper 32 is fixed. More specifically, when the medium supply unit 7 starts to cool the chamber 4 and the object 100 to be processed, the control unit 18 first sets the opening degree of the reference damper 32 .

此時的基準阻尼器32的開度例如被設定為50%。這樣,控制部18驅動基準阻尼器32的阻尼器馬達45,以使基準阻尼器32的開度為50%,例如使閥體44配置在全閉位置P1與全開位置P2之間的一半的位置處。這樣,藉由將基準阻尼器32的開度設定為0%與100%的中間的50%,藉此能夠使來自各副阻尼器31、33的冷卻空氣流量相對於來自基準阻尼器32的冷卻空氣流量的調整幅度更大。 The opening degree of the reference damper 32 at this time is set to 50%, for example. In this way, the control unit 18 drives the damper motor 45 of the reference damper 32 so that the opening degree of the reference damper 32 is 50%, for example, the valve body 44 is arranged at a position halfway between the fully closed position P1 and the fully open position P2. place. In this way, by setting the opening degree of the reference damper 32 to 50% of the middle of 0% and 100%, the cooling air flow rate from each sub-damper 31, 33 can be adjusted relative to the cooling air flow rate from the reference damper 32. The adjustment of air flow is more extensive.

並且,對於基準阻尼器32的開度,可以對應於被處理物100的熱容量(具體來說,是被處理物100的片數、材質、體積)、被處理物100的目標冷卻溫度、送風機馬達22的運作頻率等,由控制部18適當地設定。 In addition, the opening degree of the reference damper 32 may correspond to the heat capacity of the object to be processed 100 (specifically, the number, material, and volume of the object to be processed 100), the target cooling temperature of the object to be processed 100, and the blower motor. 22 operating frequency, etc., are appropriately set by the control unit 18.

另外,控制部18構成為:以腔室4中的被從基準阻尼器32供給冷卻空氣的中間部4b處的腔室中間部溫度T2為基準,來控制從各副阻尼器31、33的出口管46、47向腔室4供給的冷卻空氣的流量。更具體來說,控制部18對各副阻尼器31、33的開度進行回饋控制,以減小腔室4中的被從基準阻尼器32供給冷 卻空氣的部位處的溫度(腔室中間部溫度T2)、和腔室4中的被從各副阻尼器31、33供給冷卻空氣的上部4a和下部4c處的溫度(腔室上部溫度T1、腔室下部溫度T3)的偏差。 In addition, the control unit 18 is configured to control the outlets from the sub-dampers 31 and 33 based on the temperature T2 of the middle portion of the chamber 4 at the middle portion 4b of the chamber 4 that is supplied with cooling air from the reference damper 32 . The flow rate of the cooling air supplied to the chamber 4 by the pipes 46 , 47 . More specifically, the control unit 18 feedback-controls the openings of the secondary dampers 31 and 33 to reduce the amount of cold supplied from the reference damper 32 in the chamber 4 . The temperature at the position where the cooling air is cooled (chamber middle part temperature T2), and the temperatures at the upper part 4a and lower part 4c of the chamber 4 that are supplied with cooling air from the respective sub dampers 31, 33 (chamber upper part temperature T1, Deviation of temperature T3) in the lower part of the chamber.

控制部18構成為採用比例控制來分別控制各阻尼器31、32、33。在本實施形態中,控制部18藉由PID控制(Proportional Integral Differential Control,比例積分微分控制)分別控制各阻尼器31、32、33的阻尼器馬達45,藉此控制各阻尼器31、32、33的開度。並且,控制部18也可以藉由PI控制(Proportional Integral Control,比例積分控制)等其它控制方法來控制各阻尼器31、32、33。 The control unit 18 is configured to individually control the respective dampers 31 , 32 , and 33 using proportional control. In this embodiment, the control part 18 controls the damper motor 45 of each damper 31, 32, 33 respectively by PID control (Proportional Integral Differential Control, proportional integral differential control), thereby controlling each damper 31, 32, 33 degrees of opening. Furthermore, the control unit 18 may also control the respective dampers 31 , 32 , and 33 by other control methods such as PI control (Proportional Integral Control, proportional integral control).

控制部18控制各副阻尼器31、33,以使第1副阻尼器31和第2副阻尼器33執行不同的動作。具體來說,控制部18將第1副阻尼器31的控制增益kp1和第2副阻尼器33的控制增益kp2設定為不同的值。在本實施形態中,控制部18將對腔室4的上部4a供給冷卻空氣的第1副阻尼器31的控制增益kp1設定得比對腔室4的下部4c供給冷卻空氣的第2副阻尼器33的控制增益kp2大(kp1>kp2)。 The control unit 18 controls the sub-dampers 31 and 33 so that the first sub-damper 31 and the second sub-damper 33 perform different operations. Specifically, the control unit 18 sets the control gain kp1 of the first sub-damper 31 and the control gain kp2 of the second sub-damper 33 to different values. In this embodiment, the control unit 18 sets the control gain kp1 of the first sub-damper 31 that supplies cooling air to the upper portion 4a of the chamber 4 to be higher than that of the second sub-damper that supplies cooling air to the lower portion 4c of the chamber 4. The control gain kp2 of 33 is large (kp1>kp2).

接下來,對熱處理裝置1中的冷卻動作的一例進行說明。並且,例如在加熱器3的加熱動作停止後執行熱處理裝置1中的冷卻動作。圖4是用於說明熱處理裝置1中的冷卻動作的一例的流程圖。並且,在參照流程圖進行說明的情況下,也適當地參照流程圖以外的圖進行說明。 Next, an example of the cooling operation in the heat treatment apparatus 1 will be described. And, for example, the cooling operation in the thermal processing apparatus 1 is performed after the heating operation of the heater 3 is stopped. FIG. 4 is a flowchart illustrating an example of the cooling operation in the heat treatment apparatus 1 . In addition, when the description is made with reference to the flowchart, the description is also made with reference to figures other than the flowchart as appropriate.

參照圖4,在冷卻動作開始時,控制部18首先使送風機馬達22運作,藉此將冷卻空氣導入介質供給部7(步驟S1)。 Referring to FIG. 4 , when the cooling operation starts, the control unit 18 first operates the blower motor 22 to introduce cooling air into the medium supply unit 7 (step S1 ).

接下來,控制部18控制基準阻尼器32的開度(步驟S2)。即,控制部18設定基準阻尼器32的目標開度,進而藉由驅動基準阻尼器32的阻尼器馬達45來將基準阻尼器32的開度設定為與該目標開度相當的值。 Next, the control unit 18 controls the opening degree of the reference damper 32 (step S2). That is, the control unit 18 sets the target opening degree of the reference damper 32 , and further sets the opening degree of the reference damper 32 to a value corresponding to the target opening degree by driving the damper motor 45 of the reference damper 32 .

接下來,控制部18參照腔室中間部溫度T2,藉此來測量腔室中間部溫度T2(步驟S3)。 Next, the control part 18 measures the chamber middle part temperature T2 by referring to the chamber middle part temperature T2 (step S3).

接下來,控制部18控制第1副阻尼器31的開度(步驟S4)。即,控制部18設定第1副阻尼器31的目標開度,進而藉由驅動第1副阻尼器31的阻尼器馬達45來將第1副阻尼器31的開度設定為與該目標開度相當的值。此時,控制部18根據檢測出的腔室中間部溫度T2運算目標溫度T1t。然後,控制部18控制第1副阻尼器31的開度,以使目標溫度T1t與腔室上部溫度T1的偏差(T1t-T1)減小。 Next, the control unit 18 controls the opening degree of the first sub damper 31 (step S4). That is, the control unit 18 sets the target opening degree of the first sub-damper 31 , and further sets the opening degree of the first sub-damper 31 to match the target opening degree by driving the damper motor 45 of the first sub-damper 31 . considerable value. At this time, the control unit 18 calculates the target temperature T1t based on the detected chamber intermediate temperature T2. Then, the controller 18 controls the opening degree of the first sub-damper 31 so that the deviation (T1t-T1) between the target temperature T1t and the chamber upper temperature T1 is reduced.

另外,控制部18控制第2副阻尼器33的開度(步驟S5)。即,控制部18設定第2副阻尼器33的目標開度,進而藉由驅動第2副阻尼器33的阻尼器馬達45來將第2副阻尼器33的開度設定為與該目標開度相當的值。此時,控制部18根據檢測出的腔室中間部溫度T2運算目標溫度T3t。然後,控制部18控制第2副阻尼器33的開度,以使目標溫度T3t與腔室下部溫度T3的偏差(T3t-T3)減小。 In addition, the control unit 18 controls the opening degree of the second sub damper 33 (step S5). That is, the control unit 18 sets the target opening degree of the second sub-damper 33, and further sets the opening degree of the second sub-damper 33 to the target opening degree by driving the damper motor 45 of the second sub-damper 33. considerable value. At this time, the control unit 18 calculates the target temperature T3t based on the detected chamber middle portion temperature T2. Then, the control unit 18 controls the opening degree of the second sub-damper 33 so that the deviation (T3t-T3) between the target temperature T3t and the chamber lower temperature T3 is reduced.

並且,可以更換第1副阻尼器31的開度控制(步驟S4)和第2副阻尼器33的開度控制(步驟S5)的順序,也可以並行地執行該等步驟S4、S5。 Furthermore, the order of the opening degree control of the first sub-damper 31 (step S4) and the opening degree control of the second sub-damper 33 (step S5) may be changed, or these steps S4 and S5 may be executed in parallel.

接下來,控制部18檢測腔室上部溫度T1、腔室中間 部溫度T2以及腔室下部溫度T3(步驟S6)。然後,控制部18判定該等溫度T1~T3是否達到了冷卻動作結束的目標溫度Tft(步驟S7)。 Next, the control unit 18 detects the temperature T1 of the upper part of the chamber, the temperature in the middle of the chamber internal temperature T2 and chamber lower temperature T3 (step S6). Then, the control unit 18 determines whether or not the temperatures T1 to T3 have reached the target temperature Tft at which the cooling operation ends (step S7 ).

在溫度T1~T3達到了目標溫度Tft的情況下(在步驟S8中為YES),控制部18使送風機馬達22的動作停止(步驟S8),結束腔室4和被處理物100的冷卻動作。 When the temperatures T1-T3 have reached the target temperature Tft (YES in step S8), the control unit 18 stops the operation of the blower motor 22 (step S8), and ends the cooling operation of the chamber 4 and the processed object 100.

另一方面,在溫度T1~T3未達到冷卻動作結束的目標溫度Tft的情況下(在步驟S8中為NO),控制部18再次執行步驟S3之後的控制。 On the other hand, when the temperatures T1 to T3 have not reached the target temperature Tft at which the cooling operation ends (NO in step S8), the control unit 18 executes the control after step S3 again.

如以上所說明的,根據本實施形態,控制部18以基準阻尼器32供給冷卻空氣的供給形態為基準來控制副阻尼器31、33供給冷卻空氣的供給形態。根據該結構,副阻尼器31、33供給冷卻空氣的供給形態由控制部18控制。藉此,能夠在被處理物100的片數等被處理物100的溫度控制條件發生了變化的情況下變更副阻尼器31、33供給冷卻空氣的供給形態。其結果是,即使在被處理物100的溫度控制條件發生了變化的情況下,也能夠使被處理物100更均等地冷卻。另外,以基準阻尼器32供給冷卻空氣的供給形態為基準來控制副阻尼器31、33供給冷卻空氣的供給形態的結果是,能夠更加可靠地抑制副阻尼器31、33的控制運算發散。從而,實現了對被處理物100的更正確的溫度控制。另外,由於副阻尼器31、33被控制部18控制,因此不需要人力對副阻尼器31、33的調整作業。根據以上的情況,能夠實現如下的熱處理裝置1:即使在溫度控制條件發生了變化的情況下,也能夠使被處理物100更均等地進行溫度變化,並且能夠自動地進行用於使被處理物100更均等 地發生溫度變化的調整作業。 As described above, according to the present embodiment, the control unit 18 controls the supply form of the cooling air supplied to the sub dampers 31 and 33 based on the supply form of the cooling air supplied from the reference damper 32 . According to this configuration, the supply form of the cooling air supplied to the sub dampers 31 and 33 is controlled by the control unit 18 . Thereby, when the temperature control conditions of the processed object 100 such as the number of processed objects 100 change, the supply form of the cooling air supplied by the sub dampers 31 and 33 can be changed. As a result, even when the temperature control conditions of the object 100 are changed, the object 100 can be cooled more uniformly. In addition, controlling the supply form of cooling air to the sub dampers 31 and 33 based on the supply form of the cooling air supplied from the reference damper 32 can more reliably suppress the divergence of the control calculations of the sub dampers 31 and 33 . Thus, more accurate temperature control of the object 100 to be processed is realized. In addition, since the sub-dampers 31 and 33 are controlled by the control unit 18, manual adjustment of the sub-dampers 31 and 33 is unnecessary. Based on the above, it is possible to realize a heat treatment apparatus 1 that can change the temperature of the object 100 to be processed more evenly even when the temperature control conditions change, and can automatically perform the process for making the object 100 more uniform. 100 more equal Adjustment operations where temperature changes occur.

另外,根據本實施形態,控制部18以基準阻尼器32的開度固定的狀態為基準,來控制副阻尼器31、33的開度。根據該結構,控制部18在阻尼器30的開度控制中無需變更基準阻尼器32的開度,結果是,能夠使副阻尼器31、33的控制所需要的運算更加簡化。另外,在副阻尼器31、33的開度控制中,能夠更加可靠地抑制產生振盪。 In addition, according to the present embodiment, the control unit 18 controls the opening degrees of the sub dampers 31 and 33 based on the state where the opening degree of the reference damper 32 is fixed. According to this configuration, the control unit 18 does not need to change the opening degree of the reference damper 32 in controlling the opening degree of the damper 30 , and as a result, calculations required for controlling the sub dampers 31 and 33 can be further simplified. In addition, in the opening degree control of the sub dampers 31 and 33 , it is possible to more reliably suppress the occurrence of oscillation.

另外,根據本實施形態,控制部18構成為:以腔室4中的被從基準阻尼器32供給冷卻空氣的中間部4b處的溫度(腔室中間部溫度T2)為基準,來控制從副阻尼器31、33向腔室4供給的冷卻空氣的流量。根據該結構,能夠使因從副阻尼器31、33供給至腔室4的冷卻空氣而引起的腔室4的上部4a和下部4c的溫度變化程度與因從基準阻尼器32供給至腔室4的中間部4b的冷卻空氣而引起的腔室4的中間部4b的溫度變化程度更加均等。 In addition, according to the present embodiment, the control unit 18 is configured to control the secondary temperature T2 based on the temperature at the middle part 4b of the chamber 4 to which the cooling air is supplied from the reference damper 32 (chamber middle part temperature T2). The flow rate of the cooling air supplied by the dampers 31 , 33 to the chamber 4 . According to this structure, the temperature change degree of the upper part 4a and the lower part 4c of the chamber 4 caused by the cooling air supplied from the sub dampers 31, 33 to the chamber 4 can be made different from that due to the cooling air supplied from the reference damper 32 to the chamber 4. The degree of temperature change in the middle part 4b of the chamber 4 caused by the cooling air in the middle part 4b of the chamber 4 is more uniform.

另外,根據本實施形態,控制部18控制副阻尼器31、33的開度,以使腔室中間部溫度T2與腔室上部溫度T1的偏差(T2-T1)、和腔室中間部溫度T2與腔室下部溫度T3的偏差(T2-T3)分別減小。根據該結構,控制部18能夠控制副阻尼器31、33,以使腔室4中的被從基準阻尼器32供給冷卻空氣的腔室4的中間部4b處的溫度(腔室中間部溫度T2)、和腔室4中的被從副阻尼器31、33供給冷卻空氣的腔室4的上部4a及下部4c處的溫度(腔室上部溫度T1及腔室下部溫度T3)更加均等。 In addition, according to the present embodiment, the control unit 18 controls the opening degrees of the auxiliary dampers 31 and 33 so that the deviation (T2-T1) between the temperature T2 of the middle part of the chamber and the temperature T1 of the upper part of the chamber and the temperature T2 of the middle part of the chamber The deviation (T2-T3) from the temperature T3 of the lower part of the chamber decreases respectively. According to this configuration, the control unit 18 can control the sub dampers 31, 33 so that the temperature at the middle portion 4b of the chamber 4 to which the cooling air is supplied from the reference damper 32 in the chamber 4 (chamber middle portion temperature T2 ), and the temperature at the upper part 4a and lower part 4c of the chamber 4 supplied with cooling air from the auxiliary dampers 31, 33 in the chamber 4 (chamber upper temperature T1 and chamber lower temperature T3) are more equal.

另外,根據本實施形態,控制部18控制各副阻尼器31、33,以使第1副阻尼器31和第2副阻尼器33執行不同的動作。 根據該結構,藉由複數個副阻尼器31、33的動作,能夠使腔室4的更廣的區域均等地發生溫度變化。另外,能夠對腔室4的各區域更加細微地進行溫度控制。 In addition, according to the present embodiment, the control unit 18 controls the respective sub-dampers 31 and 33 so that the first sub-damper 31 and the second sub-damper 33 perform different operations. According to this structure, by the operation of the plurality of sub-dampers 31 and 33 , it is possible to uniformly change the temperature in a wider area of the chamber 4 . In addition, it is possible to more finely control the temperature of each region of the chamber 4 .

另外,根據本實施形態,控制部18構成為採用比例積分微分控制來控制各副阻尼器31、33,從而將第1副阻尼器31的控制增益kp1和第2副阻尼器33的控制增益kp2設定為不同的值。根據該結構,第1副阻尼器31能夠進一步提高用於實現目標的冷卻空氣供給形態(即,開度)的回應速度。另一方面,第2副阻尼器33能夠進一步降低用於實現目標的冷卻空氣供給形態(即,開度)的回應速度。如此,藉由將針對目標開度的回應速度不同的副阻尼器31、33組合在一起,能夠使容易發生熱的偏差的腔室4發生更均等的溫度變化。 In addition, according to the present embodiment, the control unit 18 is configured to control the respective sub-dampers 31, 33 using proportional integral-derivative control so that the control gain kp1 of the first sub-damper 31 and the control gain kp2 of the second sub-damper 33 set to a different value. According to this configuration, the first sub-damper 31 can further increase the response speed for realizing the target cooling air supply form (that is, the opening degree). On the other hand, the second sub-damper 33 can further reduce the response speed for realizing the target cooling air supply form (that is, the opening degree). In this way, by combining the sub-dampers 31 and 33 having different response speeds to the target opening degree, it is possible to cause more uniform temperature changes in the chamber 4, which is prone to thermal variation.

更詳細來說,冷卻空氣被從第1副阻尼器31供給至腔室4的位置被設定得比冷卻空氣被從第2副阻尼器33供給至腔室4的位置高。並且,控制部18將針對第1副阻尼器31的控制增益kp1設定得比針對第2副阻尼器33的控制增益kp2大。根據該結構,由於腔室4的熱朝向上方,因此存在這樣的傾向:腔室4的上部4a的熱量比腔室4的下部4b的熱量大。因此,藉由使對腔室4的上部4a側進行冷卻的第1副阻尼器31的控制增益kp1更大,能夠朝向腔室4的上部4a側更迅速地供給更多的冷卻空氣。藉此,能夠更加可靠地冷卻容易積存熱量的腔室4的上部4a側。另一方面,藉由使對腔室4的下部4c側進行冷卻的第2副阻尼器33的控制增益kp2更小,能夠抑制朝向腔室4的下部4c側急劇地供給過度的冷卻空氣。藉此,能夠抑制熱比較容易逃逸的腔室4的下部4c 側比腔室4的其它部分先被冷卻之情形。其結果是,腔室4的各部被更均等地冷卻。 More specifically, the position where the cooling air is supplied from the first sub-damper 31 to the chamber 4 is set higher than the position where the cooling air is supplied from the second sub-damper 33 to the chamber 4 . Furthermore, the control unit 18 sets the control gain kp1 for the first sub-damper 31 to be larger than the control gain kp2 for the second sub-damper 33 . According to this configuration, since the heat of the chamber 4 is directed upward, there is a tendency that the heat of the upper part 4 a of the chamber 4 is larger than the heat of the lower part 4 b of the chamber 4 . Therefore, by increasing the control gain kp1 of the first sub-damper 31 for cooling the upper portion 4 a side of the chamber 4 , more cooling air can be quickly supplied toward the upper portion 4 a side of the chamber 4 . Thereby, the upper part 4a side of the chamber 4 which tends to accumulate heat can be cooled more reliably. On the other hand, by making the control gain kp2 of the second sub-damper 33 for cooling the lower portion 4c of the chamber 4 smaller, excessive supply of cooling air toward the lower portion 4c of the chamber 4 can be suppressed from being suddenly supplied. Thereby, the lower part 4c of the chamber 4 where heat escapes relatively easily can be suppressed. The case where the side is cooled before the rest of the chamber 4. As a result, each part of the chamber 4 is cooled more evenly.

另外,冷卻空氣被從第1副阻尼器31供給至腔室4的位置被設定得靠近開口部4d和裡部4e中的裡部4e。另外,冷卻空氣被從第2副阻尼器33供給至腔室4的位置被設定得靠近開口部4d和裡部4e中的開口部4d。並且,控制部18將針對第1副阻尼器31的控制增益kp1設定得比針對第2副阻尼器33的控制增益kp2大。根據該結構,腔室4的熱容易積存在裡部4e,因此存在裡部4e的熱量比開口部4d的熱量大的傾向。因此,藉由使針對對裡部4e側進行冷卻的第1副阻尼器31的控制增益kp1更大,能夠朝向腔室4的裡部4e側更迅速地供給更多的冷卻空氣。藉此,能夠更加可靠地冷卻容易積存熱量的腔室4的裡部4e側。另一方面,藉由使針對對腔室4的開口部4d側進行冷卻的第2副阻尼器33的控制增益kp2更小,能夠抑制朝向腔室4的開口部4d側急劇地供給過度的冷卻空氣。藉此,能夠抑制熱比較容易逃逸的腔室4的開口部4d側比腔室4的其它部分先被冷卻之情形。其結果是,腔室4的各部被更均等地冷卻。 In addition, the position where the cooling air is supplied from the first sub damper 31 to the chamber 4 is set close to the inner portion 4e of the opening portion 4d and the inner portion 4e. In addition, the position where the cooling air is supplied from the second sub damper 33 to the chamber 4 is set close to the opening 4d and the opening 4d in the back portion 4e. Furthermore, the control unit 18 sets the control gain kp1 for the first sub-damper 31 to be larger than the control gain kp2 for the second sub-damper 33 . According to this structure, the heat of the chamber 4 tends to accumulate in the inner part 4e, so the heat of the inner part 4e tends to be larger than the heat of the opening 4d. Therefore, by increasing the control gain kp1 for the first sub-damper 31 for cooling the inner portion 4e side, more cooling air can be supplied more quickly toward the inner portion 4e side of the chamber 4 . Thereby, the back part 4e side of the chamber 4 which tends to accumulate heat can be cooled more reliably. On the other hand, by making the control gain kp2 for the second sub-damper 33 for cooling the opening 4d side of the chamber 4 smaller, excessive cooling can be suppressed from being rapidly supplied to the opening 4d side of the chamber 4. Air. Thereby, it can suppress that the opening part 4d side of the chamber 4 from which heat escapes comparatively is cooled earlier than the other part of the chamber 4. As shown in FIG. As a result, each part of the chamber 4 is cooled more evenly.

另外,基準阻尼器32的出口管46、47的另一端位置被設定在第1副阻尼器31的出口管46、47的另一端位置與第2副阻尼器33的出口管46、47的另一端位置之間。根據該結構,能夠藉由複數個阻尼器31、32、33並利用冷卻空氣使腔室4的更廣的區域更均等地發生溫度變化。另外,對於腔室4中的被供給來自基準阻尼器32的冷卻空氣的部位(中間部4b)以外的區域,能夠進一步增大其配置在被供給來自基準阻尼器32的冷卻空氣的部位附近 的比例。其結果是,對於腔室4的更廣的區域,能夠減小與被供給來自基準阻尼器32的冷卻空氣的中間部4b之間的溫度差。 In addition, the position of the other end of the outlet pipes 46, 47 of the reference damper 32 is set at the position of the other end of the outlet pipes 46, 47 of the first sub-damper 31 and the position of the other end of the outlet pipes 46, 47 of the second sub-damper 33. between one end position. According to this configuration, it is possible to more uniformly change the temperature of a wider area of the chamber 4 by the plurality of dampers 31 , 32 , and 33 using the cooling air. In addition, for the area of the chamber 4 other than the portion (intermediate portion 4 b ) to which the cooling air is supplied from the reference damper 32 , it is possible to further enlarge the area near the portion to which the cooling air is supplied from the reference damper 32 . proportion. As a result, for a wider area of the chamber 4, the temperature difference with the intermediate portion 4b supplied with cooling air from the reference damper 32 can be reduced.

以上,對本發明的實施形態進行了說明,但本發明不限於上述的實施形態。只要記載於申請專利範圍中,本發明就能夠進行各種變更。 The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments. The present invention can be modified in various ways as long as it is described in the claims.

(1)在上述的實施形態中,以下述形態為例進行了說明:在進行各副阻尼器31、33的開度控制的期間,基準阻尼器32的開度固定。可是,也可以不是這樣。例如,也可以是,在進行各副阻尼器31、33的開度控制的期間,基準阻尼器32的開度藉由控制部18或人力定期地變更。 (1) In the above-mentioned embodiment, an example has been described in which the opening degree of the reference damper 32 is fixed while the opening degrees of the sub dampers 31 and 33 are controlled. However, it may not be the case. For example, the opening degree of the reference damper 32 may be periodically changed by the control unit 18 or human power while the opening degree control of each sub damper 31 and 33 is being performed.

(2)另外,在上述的實施形態中,以使送風機21的風量固定的形態為例進行了說明。可是,也可以不是這樣。例如,也可以是,送風機21的風量對應於腔室4的各部的溫度T1、T2、T3等被控制部18變更。 (2) In addition, in the said embodiment, the form which made the air volume of the air blower 21 constant was demonstrated as an example. However, it may not be the case. For example, the air volume of the air blower 21 may be changed by the control unit 18 in accordance with the temperatures T1, T2, T3, etc. of each part of the chamber 4 .

(3)另外,在上述的實施形態中,以下述形態為例進行了說明:在加熱器3的加熱動作結束後,介質供給部7開始進行腔室4和被處理物100的冷卻處理。可是,也可以不是這樣。例如,可以是,藉由使介質供給部7與加熱器3協調工作,藉此在加熱器3停止動作的途中從介質供給部7朝向腔室4供給冷卻空氣。 (3) In addition, in the above-mentioned embodiment, the mode in which the medium supply unit 7 starts cooling the chamber 4 and the processed object 100 after the heating operation of the heater 3 is completed has been described as an example. However, it may not be the case. For example, the cooling air may be supplied from the medium supply unit 7 toward the chamber 4 while the heater 3 is stopped by cooperating with the medium supply unit 7 and the heater 3 .

(4)另外,在上述的實施形態中,以設置有2個副阻尼器的形態為例進行了說明。可是,也可以不是這樣。例如,副阻尼器可以是1個,也可以是3個以上。 (4) In addition, in the above-mentioned embodiment, the embodiment in which two sub-dampers are provided has been described as an example. However, it may not be the case. For example, the number of sub dampers may be one, or three or more.

(5)另外,在上述的實施形態中,以控制部18控制各阻尼器31、32、33的開度的形態為例進行了說明。可是,也可以 不是這樣。例如,也可以是,控制部18以通過各阻尼器31、32、33的冷卻空氣的壓力等其它要素作為控制對象。 (5) In addition, in the above-mentioned embodiment, the mode in which the control unit 18 controls the opening degrees of the respective dampers 31 , 32 , and 33 has been described as an example. However, it is also possible It's not like this. For example, the control unit 18 may control other elements such as the pressure of the cooling air passing through the dampers 31 , 32 , and 33 .

(6)另外,在上述的實施形態中,作為控制冷卻空氣的閥構件,以阻尼器為例進行了說明。可是,也可以不是這樣。例如,作為控制冷卻空氣的閥構件,也可以使用電磁閥等具有能夠調整閥體的開度的結構的其它閥構件。 (6) In addition, in the above-mentioned embodiments, the damper has been described as an example of the valve member for controlling the cooling air. However, it may not be the case. For example, as the valve means for controlling the cooling air, other valve means having a structure capable of adjusting the opening degree of the valve body, such as a solenoid valve, may be used.

(7)另外,在上述的實施形態中,以將本發明應用於在加熱蒸鍍等中使用的爐的情況為例進行了說明。可是,也可以不是這樣。例如,也可以將本發明應用於具有熱風循環爐等其它爐的熱處理裝置中。 (7) In addition, in the above-mentioned embodiment, the case where this invention is applied to the furnace used for thermal vapor deposition etc. was demonstrated as an example. However, it may not be the case. For example, the present invention can also be applied to a heat treatment apparatus having other furnaces such as a hot air circulation furnace.

(8)另外,在上述的實施形態中,以使用空氣作為熱處理用介質的形態為例進行了說明。可是,也可以不是這樣。例如,作為熱處理用介質,也可以使用空氣以外的氣體,也可以使用水等液體。在使用液體作為熱處理用介質的情況下,用泵來代替送風機。 (8) In addition, in the above-mentioned embodiment, the embodiment in which air is used as the medium for heat treatment has been described as an example. However, it may not be the case. For example, a gas other than air or a liquid such as water may be used as the heat treatment medium. In the case of using a liquid as a medium for heat treatment, a pump is used instead of a blower.

(9)另外,在上述的實施形態中,以介質供給部7對腔室4和被處理物100進行冷卻的形態為例進行了說明。可是,也可以不是這樣。例如,也可以是,在對腔室4等容器和被處理物100加熱時應用本發明的結構。這種情況下,各阻尼器31、32、33將被加熱的空氣等熱處理用介質朝向腔室4供給。 (9) In addition, in the above-mentioned embodiment, the mode in which the medium supply unit 7 cools the chamber 4 and the object 100 to be processed has been described as an example. However, it may not be the case. For example, it is also possible to apply the structure of the present invention to heating containers such as the chamber 4 and the object 100 to be processed. In this case, each damper 31 , 32 , 33 supplies a heat treatment medium such as heated air toward the chamber 4 .

(10)另外,在上述的實施形態中,以腔室4為縱型爐的形態為例進行了說明。可是,也可以不是這樣。例如,也可以將本發明應用於具有橫向配置的腔室的熱處理裝置中。 (10) In addition, in the above-mentioned embodiment, the embodiment in which the chamber 4 is a vertical furnace has been described as an example. However, it may not be the case. For example, the present invention can also be applied to a heat treatment apparatus having chambers arranged laterally.

(產業上之可利用性) (industrial availability)

本發明能夠作為熱處理裝置被廣泛地應用。 The present invention can be widely applied as a heat treatment device.

1‧‧‧熱處理裝置 1‧‧‧Heat treatment device

2‧‧‧基座板 2‧‧‧base plate

2a‧‧‧貫通孔 2a‧‧‧through hole

3‧‧‧加熱器 3‧‧‧Heater

3a‧‧‧側壁 3a‧‧‧Side wall

3b‧‧‧頂壁 3b‧‧‧top wall

4‧‧‧腔室(容器) 4‧‧‧Chamber (container)

4a‧‧‧上部 4a‧‧‧upper part

4b‧‧‧中間部 4b‧‧‧middle part

4c‧‧‧下部 4c‧‧‧bottom

4d‧‧‧開口部 4d‧‧‧opening

4e‧‧‧裡部 4e‧‧‧Libu

5‧‧‧晶舟 5‧‧‧Crystal boat

6‧‧‧升降機構 6‧‧‧Elevating mechanism

7‧‧‧介質供給部 7‧‧‧Media supply department

8‧‧‧凸緣 8‧‧‧flange

10‧‧‧空間 10‧‧‧space

11‧‧‧送風機單元 11‧‧‧Blower unit

12‧‧‧供給管 12‧‧‧Supply pipe

13‧‧‧歧管 13‧‧‧Manifold

14‧‧‧阻尼器單元 14‧‧‧Damper unit

15‧‧‧排氣管 15‧‧‧exhaust pipe

16‧‧‧排氣冷卻器 16‧‧‧Exhaust cooler

17‧‧‧感測器單元 17‧‧‧Sensor unit

18‧‧‧控制部 18‧‧‧Control Department

21‧‧‧送風機 21‧‧‧Blower

22‧‧‧送風機馬達 22‧‧‧Blower motor

30‧‧‧阻尼器 30‧‧‧damper

31‧‧‧第1副阻尼器(副閥;一個副閥) 31‧‧‧The first auxiliary damper (auxiliary valve; one auxiliary valve)

32‧‧‧基準阻尼器(基準閥) 32‧‧‧Reference damper (reference valve)

33‧‧‧第2副阻尼器(副閥;其他副閥) 33‧‧‧Second auxiliary damper (auxiliary valve; other auxiliary valves)

44‧‧‧閥體 44‧‧‧Valve body

45‧‧‧阻尼器馬達 45‧‧‧Motor with damper

46、47‧‧‧出口管 46, 47‧‧‧Exit pipe

51~53‧‧‧溫度感測器 51~53‧‧‧temperature sensor

100‧‧‧被處理物 100‧‧‧processed objects

A1‧‧‧(冷卻空氣的)氣流 A1‧‧‧(cooling air) air flow

Claims (8)

一種熱處理裝置,其特徵在於,其具備:容器,其在被處理物的熱處理時收納上述被處理物;介質供給部,其包括用於將溫度調整用的介質供給至上述容器的基準閥和副閥;以及控制部,其以上述基準閥供給上述介質的供給形態為基準,控制上述副閥供給上述介質的供給形態;上述控制部以上述基準閥的開度固定的狀態為基準,來控制上述副閥的開度。 A heat treatment device characterized by comprising: a container for storing the object to be processed during the heat treatment of the object; a medium supply unit including a reference valve and a sub valve; and a control unit that controls the supply form of the medium by the sub-valve based on the supply form of the medium by the reference valve; the control unit controls the above-mentioned The opening of the auxiliary valve. 如請求項1之熱處理裝置,其中,上述控制部構成為:以上述容器中被從上述基準閥供給上述介質的部位處的溫度為基準,控制從上述副閥向上述容器供給的上述介質的流量。 The heat treatment device according to claim 1, wherein the control unit is configured to control the flow rate of the medium supplied from the sub-valve to the container based on the temperature of a portion of the container where the medium is supplied from the reference valve. . 如請求項2之熱處理裝置,其中,上述控制部控制上述副閥的開度,以使上述容器中被從上述基準閥供給上述介質的部位處的溫度、和上述容器中被從上述副閥供給上述介質的部位處的溫度之偏差減小之方式為之。 The heat treatment device according to claim 2, wherein the control unit controls the opening degree of the sub-valve so that the temperature of the part of the container where the medium is supplied from the reference valve is the same as the temperature in the container where the medium is supplied from the sub-valve. This is the way in which the temperature deviations at the locations of the above-mentioned medium are reduced. 如請求項1之熱處理裝置,其中,上述副閥設置有複數個,上述控制部控制各上述副閥,以使一個上述副閥和其他上述副閥進行不同的動作。 The heat treatment device according to claim 1, wherein a plurality of the sub-valves are provided, and the control unit controls each of the sub-valves so that one of the sub-valves operates differently from the other sub-valves. 如請求項4之熱處理裝置,其中,上述控制部構成為採用比例控制來控制各上述副閥,上述控制部將一個上述副閥的控制增益和其他上述副閥的控制增益設定為不同的值。 The heat treatment device according to claim 4, wherein the control unit is configured to control each of the sub-valves using proportional control, and the control unit sets a control gain of one of the sub-valves and a control gain of the other sub-valves to different values. 如請求項5之熱處理裝置,其中,上述介質是用於冷卻上述容器的冷卻介質, 從一個上述副閥向上述容器供給上述冷卻介質的位置,係被設定成比從其他上述副閥向上述容器供給上述冷卻介質的位置高,上述控制部將針對一個上述副閥的上述控制增益設定成比針對其他上述副閥的上述控制增益大。 The heat treatment device according to claim 5, wherein the above-mentioned medium is a cooling medium for cooling the above-mentioned container, The position where the cooling medium is supplied from one of the sub valves to the container is set higher than the position where the cooling medium is supplied from the other sub valves to the container, and the control unit sets the control gain for one of the sub valves. It is proportionally larger than the above-mentioned control gain for the other above-mentioned sub valves. 如請求項5之熱處理裝置,其中,上述容器包含:向上述容器的外部敞開的開口部、及相對於上述容器的外部被封閉的形狀的裡部,上述介質是用於冷卻上述容器的冷卻介質,從一個上述副閥向上述容器供給上述冷卻介質的位置被設定成靠上述開口部和上述裡部中的上述裡部,並且,從其他上述副閥向上述容器供給上述冷卻介質的位置被設定成靠上述開口部和上述裡部中的上述開口部,上述控制部將針對一個上述副閥的上述控制增益設定成比針對其他上述副閥的上述控制增益大。 The heat treatment device according to claim 5, wherein the container includes: an opening open to the outside of the container, and an inner portion of a shape closed to the outside of the container, and the medium is a cooling medium for cooling the container A position where the cooling medium is supplied from one of the sub-valves to the container is set close to the inner portion of the opening and the inner portion, and a position where the cooling medium is supplied from the other sub-valve to the container is set. The control unit may set the control gain for one of the sub-valves to be greater than the control gains for the other sub-valves depending on the opening and the opening in the back portion. 如請求項1之熱處理裝置,其中,上述副閥設置有複數個,來自上述基準閥的上述介質的出口位置被設定於來自各上述副閥的上述介質的出口位置之間。 The heat treatment device according to claim 1, wherein a plurality of the auxiliary valves are provided, and the outlet position of the medium from the reference valve is set between the outlet positions of the medium from each of the auxiliary valves.
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