[go: up one dir, main page]

TWI774439B - 耐彎折性優異之金屬配線及導電薄片以及為形成該金屬配線之金屬糊 - Google Patents

耐彎折性優異之金屬配線及導電薄片以及為形成該金屬配線之金屬糊 Download PDF

Info

Publication number
TWI774439B
TWI774439B TW110123067A TW110123067A TWI774439B TW I774439 B TWI774439 B TW I774439B TW 110123067 A TW110123067 A TW 110123067A TW 110123067 A TW110123067 A TW 110123067A TW I774439 B TWI774439 B TW I774439B
Authority
TW
Taiwan
Prior art keywords
metal wiring
metal
silver particles
less
metal paste
Prior art date
Application number
TW110123067A
Other languages
English (en)
Chinese (zh)
Other versions
TW202208557A (zh
Inventor
佐藤弘規
大嶋優輔
大武成行
Original Assignee
日商田中貴金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商田中貴金屬工業股份有限公司 filed Critical 日商田中貴金屬工業股份有限公司
Publication of TW202208557A publication Critical patent/TW202208557A/zh
Application granted granted Critical
Publication of TWI774439B publication Critical patent/TWI774439B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/12—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of wires
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F2003/1042—Sintering only with support for articles to be sintered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/05—Submicron size particles
    • B22F2304/056—Particle size above 100 nm up to 300 nm

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Chemical Kinetics & Catalysis (AREA)
TW110123067A 2020-07-03 2021-06-24 耐彎折性優異之金屬配線及導電薄片以及為形成該金屬配線之金屬糊 TWI774439B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020115366 2020-07-03
JP2020-115366 2020-07-03

Publications (2)

Publication Number Publication Date
TW202208557A TW202208557A (zh) 2022-03-01
TWI774439B true TWI774439B (zh) 2022-08-11

Family

ID=79315362

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110123067A TWI774439B (zh) 2020-07-03 2021-06-24 耐彎折性優異之金屬配線及導電薄片以及為形成該金屬配線之金屬糊

Country Status (6)

Country Link
US (1) US11967441B2 (fr)
JP (1) JP7467632B2 (fr)
KR (1) KR102729467B1 (fr)
CN (1) CN115735416A (fr)
TW (1) TWI774439B (fr)
WO (1) WO2022004629A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201623459A (zh) * 2014-10-24 2016-07-01 納美仕有限公司 導電性組成物及使用該導電性組成物的電子組件
TW201807083A (zh) * 2016-04-04 2018-03-01 大賽璐股份有限公司 網版印刷用印墨

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795096U (fr) 1980-12-01 1982-06-11
JPS5916159U (ja) 1982-07-23 1984-01-31 株式会社日立製作所 相補型半導体装置
JP2010248617A (ja) * 2009-03-26 2010-11-04 Nippon Handa Kk 多孔質銀製シート、金属製部材接合体の製造方法、金属製部材接合体、電気回路接続用バンプの製造方法および電気回路接続用バンプ
CN202082871U (zh) * 2011-01-10 2011-12-21 深圳市鑫富艺实业有限公司 背光源fpc排线厚度的改良
US10369667B2 (en) * 2012-03-05 2019-08-06 Namics Corporation Sintered body made from silver fine particles
JP5840096B2 (ja) * 2012-05-28 2016-01-06 富士フイルム株式会社 導電フィルムおよびタッチパネル
JP5975911B2 (ja) * 2013-03-15 2016-08-23 ルネサスエレクトロニクス株式会社 半導体装置
MY176474A (en) * 2013-05-24 2020-08-11 Tanaka Precious Metal Ind Method for manufacturing silver particles
JP5795096B2 (ja) 2014-02-25 2015-10-14 田中貴金属工業株式会社 低温焼結性に優れる銀ペースト及び該銀ペーストの製造方法
JP5916159B2 (ja) 2014-08-27 2016-05-11 田中貴金属工業株式会社 金属パターンの形成方法及び導電体
WO2017033911A1 (fr) 2015-08-25 2017-03-02 田中貴金属工業株式会社 Pâte métallique présentant une excellente aptitude au frittage à basse température et procédé de production de la pâte métallique
JP6496775B2 (ja) 2017-05-18 2019-04-03 田中貴金属工業株式会社 金属配線を備える導電基板、及び、該導電基板の製造方法
JP6496784B2 (ja) 2017-08-08 2019-04-03 田中貴金属工業株式会社 導電シート及び該導電シートの製造方法
WO2019093069A1 (fr) 2017-11-07 2019-05-16 大日本印刷株式会社 Substrat de circuit étirable et article

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201623459A (zh) * 2014-10-24 2016-07-01 納美仕有限公司 導電性組成物及使用該導電性組成物的電子組件
TW201807083A (zh) * 2016-04-04 2018-03-01 大賽璐股份有限公司 網版印刷用印墨

Also Published As

Publication number Publication date
CN115735416A (zh) 2023-03-03
TW202208557A (zh) 2022-03-01
KR20230010706A (ko) 2023-01-19
WO2022004629A1 (fr) 2022-01-06
US11967441B2 (en) 2024-04-23
US20230197311A1 (en) 2023-06-22
JP7467632B2 (ja) 2024-04-15
KR102729467B1 (ko) 2024-11-14
JPWO2022004629A1 (fr) 2022-01-06

Similar Documents

Publication Publication Date Title
US10940534B2 (en) Metal paste having excellent low-temperature sinterability and method for producing the metal paste
TWI675078B (zh) 導電性組成物
KR101151366B1 (ko) 도전성 입자 및 이의 제조방법
JP2009070677A (ja) 熱硬化型導電性ペースト
CN107949607A (zh) 导电层形成用涂布液以及导电层的制造方法
CN101693817A (zh) 超导电性铜箔胶带
TWI774439B (zh) 耐彎折性優異之金屬配線及導電薄片以及為形成該金屬配線之金屬糊
KR101960983B1 (ko) 도전성 조성물 및 그것을 사용한 외부 전극
KR101796452B1 (ko) 연성인쇄회로기판 및 그 제조 방법
JPWO2019069936A1 (ja) 銀微粒子分散液
JP6263146B2 (ja) 導電膜付基板、その製造方法、およびポリイミド基板用導電性ペースト
EP3246115A1 (fr) Poudre d'argent
JP2015018674A (ja) 導電膜形成用組成物、導電膜の製造方法、および、導電膜
US20190225827A1 (en) Ink Composition, Method For Forming A Conductive Member, And Conductive Device
JP2018170227A (ja) 導体形成用組成物、導体及びその製造方法、積層体並びに装置
TWI836748B (zh) 導電性層合體及其製造方法
KR20140049632A (ko) 도금층을 구비한 도전성 페이스트 인쇄회로기판 및 이의 제조방법
JP7193605B1 (ja) 金属ペースト
JP2017197658A (ja) 導体形成組成物、導体の製造方法、めっき層の製造方法、導体、積層体及び装置
KR101177084B1 (ko) 다층 피씨비 빌드업 범프 형성용 도전성 잉크 조성물
JP2017204371A (ja) 導体形成組成物、導体の製造方法、めっき層の製造方法、導体、積層体及び装置
JP2009224201A (ja) 低温焼成多層基板用導電性ペースト
JP2013137891A (ja) 銀導電膜およびその製造方法