以下,對本發明之實施形態之一例進行說明。但本發明並不受下述實施形態所限制。 [本黏著片材積層體] 本發明之實施形態之一例的黏著片材積層體(稱為「本黏著片材積層體」)如圖1所示,係具備黏著材層、以可剝離之方式積層於該黏著材層之正面及背面之一側而成之被覆部I、及以可剝離之方式積層於該黏著材層之正面及背面之另一側而成之被覆部II的黏著片材積層體。此處,被覆部II為任意,亦可採用不積層被覆部II之構成。 <黏著材層> 本黏著片材積層體之黏著材層只要為若將被覆部I及被覆部II剝離則可作為雙面黏著片材而發揮功能,且具有若加熱則會柔軟化或熔融之熱熔性者即可。 黏著材層較佳為於100℃下之損耗正切tanδ(SA)為1.0以上。又,較佳為於30℃下之損耗正切tanδ(SB)未達1.0。 此處,損耗正切tanδ意指損耗彈性模數G''與儲存彈性模數G'之比(G''/G')。 由於將本黏著片材積層體進行加熱成型時之溫度通常為70~120℃,故而若於100℃下之損耗正切tanδ(SA)為1.0以上,則變得容易於黏著材層表面成型凹凸形狀。 又,若黏著材層於30℃下之損耗正切tanδ(SB)未達1.0,則於常態下可保持形狀,因此可保持於黏著材層表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀之狀態。 通常高分子材料兼具黏性性質與彈性性質,損耗正切tanδ為1.0以上,進而其值越大,黏性性質越強。另一方面,損耗正切tanδ未達1.0,進而其值越小,彈性性質越強。因此,藉由控制黏著材層於不同溫度下之損耗正切tanδ,可兼具成形性與形狀保持性。 就該觀點而言,黏著材層於100℃下之損耗正切tanδ(SA)較佳為1.0以上,其中較佳為1.5以上或30以下,其中較佳為3.0以上或20以下。 另一方面,黏著材層於30℃下之損耗正切tanδ(SB)較佳為未達1.0,其中較佳為0.01以上或0.9以下,其中較佳為0.1以上或0.8以下。 此處,黏著材層於100℃下之損耗正切tanδ(SA)及於30℃下之損耗正切tanδ(SB)可藉由調整構成黏著材層之組合物之成分或凝膠分率、重量平均分子量等而調整為上述範圍。 進而,黏著材層於100℃下之儲存彈性模數G'(SA)較佳為未達1.0×104
Pa。又,上述黏著材層於30℃下之儲存彈性模數G'(SB)較佳為1.0×104
Pa以上。 若黏著材層於100℃下之儲存彈性模數G'(SA)未達1.0×104
Pa,則可獲得充分之成形性,故而較佳,另一方面,若黏著材層於30℃下之儲存彈性模數G'(SB)為1.0×104
Pa以上,則就成形後之形狀穩定性之觀點而言較佳。 就該觀點而言,黏著材層於100℃下之儲存彈性模數G'(SA)較佳為未達1.0×104
Pa,其中進而較佳為5.0×101
Pa以上或5.0×103
Pa以下,其中進而較佳為1.0×102
Pa以上或1.0×103
Pa以下。 據此,黏著材層於100℃下之儲存彈性模數G'(SA)更佳為5.0×101
Pa以上且未達1.0×104
Pa,或為5.0×101
Pa以上且5.0×103
Pa以下,其中進而較佳為1.0×102
Pa以上且未達1.0×104
Pa,或為1.0×102
Pa以上且5.0×103
Pa以下,最佳為1.0×102
Pa以上且1.0×103
Pa以下。 又,就該觀點而言,黏著材層於30℃下之儲存彈性模數G'(SB)較佳為1.0×104
Pa以上,其中進而較佳為2.0×104
Pa以上或1.0×107
Pa以下,其中進而較佳為5.0×104
Pa以上或1.0×106
Pa以下。 又,據此,黏著材層於30℃下之儲存彈性模數G'(SB)更佳為1.0×104
Pa以上且1.0×107
Pa以下,或為1.0×104
Pa以上且1.0×106
Pa以下,其中更佳為2.0×104
Pa以上且1.0×107
Pa以下,或為2.0×104
Pa以上且1.0×106
Pa以下,最佳為5.0×104
Pa以上且1.0×106
Pa以下。 此處,黏著材層於100℃下之儲存彈性模數G'(SA)及黏著材層於30℃下之儲存彈性模數G'(SB)可藉由調整構成黏著材層之組合物之成分或凝膠分率、重量平均分子量等而調整為上述範圍。 黏著材層之損耗正切tanδ成為1.0之溫度較佳為50~150℃,其中進而較佳為60℃以上或130℃以下,其中進而較佳為70℃以上或110℃以下。 若黏著材層之損耗正切tanδ成為1.0之溫度為50~150℃,則可藉由預先將本黏著片材積層體加熱為50~150℃而進行模具成形。 黏著材層之基礎樹脂之玻璃轉移溫度(Tg)較佳為-50~40℃,其中進而較佳為-30℃以上或25℃以下,其中進而較佳為-10℃以上或20℃以下。此處,玻璃轉移溫度之測定係指使用示差掃描熱量計(DSC)而以3℃/分鐘之速度升溫時的基線移動之反曲點間之中點。 若黏著材層之基礎樹脂之玻璃轉移溫度(Tg)為上述範圍,則可對黏著材層賦予黏著性,進而,可將黏著材層之損耗正切tanδ成為1.0之溫度調整為50~150℃。 作為黏著材層之材料,只要為可製備為特定黏彈性行為之材料,則可使用先前公知之黏著片材。 例如可列舉:1)使用(甲基)丙烯酸酯系聚合物(為包括共聚物在內之含義,以下稱為「丙烯酸酯系(共)聚合物」)作為基礎樹脂,於其中調配交聯單體、視需要調配交聯起始劑或反應觸媒等,使其等進行交聯反應所形成之黏著片材;或 2)使用丁二烯或異戊二烯系共聚物作為基礎樹脂,於其中調配交聯單體、視需要調配交聯起始劑或反應觸媒等,使其等進行交聯反應所形成之黏著片材;或 3)使用聚矽氧系聚合物作為基礎樹脂,於其中調配交聯單體、視需要調配交聯起始劑或反應觸媒等,使其等進行交聯反應所形成之黏著片材;或 4)使用聚胺基甲酸酯系聚合物作為基礎樹脂之聚胺基甲酸酯系黏著片材等。 黏著材層本身之物性中除了上述之黏彈性性質或熱性質以外,於本發明中並非本質上之問題。但就黏著性、透明性、及耐候性等觀點而言,較佳為以上述1)之丙烯酸酯系(共)聚合物作為基礎樹脂者。 於要求電氣特性、低折射率等性能之情形時,較佳為以上述2)之丁二烯或異戊二烯系共聚物作為基礎樹脂者。 於要求耐熱性、較廣之溫度範圍中之橡膠彈性等性能之情形時,較佳為以上述3)之聚矽氧系共聚物作為基礎樹脂者。 於要求再剝離性等性能之情形時,較佳為以上述4)之聚胺基甲酸酯系聚合物作為基礎樹脂者。 作為上述黏著材層之一例,可例示由含有作為基礎樹脂之(甲基)丙烯酸系共聚物(a)、交聯劑(b)、及光聚合起始劑(c)之樹脂組合物所形成之黏著片材。 於該情形時,必須於未交聯狀態、即形成立體地交聯之網狀結構前之狀態下滿足上述黏彈性特性。就該觀點而言,黏著材層之凝膠分率較佳為40%以下。 若黏著材層之凝膠分率為40%以下,則可將構成黏著材層之分子鏈彼此之鍵結抑制於適當之範圍,故而於成形為賦形黏著片材積層體時可具備適度之流動性。 就該觀點而言,黏著材層之凝膠分率較佳為40%以下,其中尤佳為20%以下,其中尤佳為10%以下。再者,黏著材層之凝膠分率之下限並無限定,亦可為0%。 再者,上述黏著材層之凝膠分率並不限於使用含有作為基礎樹脂之(甲基)丙烯酸系共聚物(a)、交聯劑(b)、及光聚合起始劑(c)之樹脂組合物之情形,使用其他樹脂組合物作為黏著材層之情形時亦相同。 ((甲基)丙烯酸系共聚物(a)) (甲基)丙烯酸系共聚物(a)可根據用於使其聚合之丙烯酸系單體或甲基丙烯酸系單體之種類、組成比率、進而聚合條件等而適當調整玻璃轉移溫度(Tg)等特性。 作為用於使丙烯酸酯聚合物聚合之丙烯酸系單體或甲基丙烯酸系單體,例如可列舉:丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸正丁酯、丙烯酸乙酯、甲基丙烯酸甲酯等。亦可使用使該等與親水基或有機官能基等共聚合而成之乙酸乙烯酯、丙烯酸羥基乙酯、丙烯酸、丙烯酸縮水甘油酯、丙烯醯胺、丙烯腈、甲基丙烯腈、氟丙烯酸酯、聚矽氧丙烯酸酯等。 丙烯酸酯聚合物中尤佳為(甲基)丙烯酸烷基酯系共聚物。 作為用於形成(甲基)丙烯酸烷基酯系共聚物之(甲基)丙烯酸酯、即丙烯酸烷基酯或甲基丙烯酸烷基酯成分,較佳為烷基為正辛基、異辛基、2-乙基己基、正丁基、異丁基、甲基、乙基、異丙基中之任一者之丙烯酸烷基酯或甲基丙烯酸烷基酯之1種或者選自該等之2種以上之混合物。 作為其他成分,亦可使具有羧基、羥基、縮水甘油基等有機官能基之丙烯酸酯或甲基丙烯酸酯進行共聚合。具體而言,可以適當地選擇性地組合上述(甲基)丙烯酸烷基酯成分與具有有機官能基之(甲基)丙烯酸酯成分而成之單體成分作為起始原料進行加熱聚合,而獲得(甲基)丙烯酸酯系共聚物聚合物。 其中,較佳可列舉丙烯酸異辛酯、丙烯酸正辛酯、丙烯酸正丁酯、丙烯酸2-乙基己酯等丙烯酸烷基酯之1種或選自該等之2種以上之混合物,或者可列舉使丙烯酸異辛酯、丙烯酸正辛酯、丙烯酸正丁酯、丙烯酸2-乙基己酯等中之至少1種以上與丙烯酸進行共聚合而成者。 作為使用該等單體之聚合處理,可採用溶液聚合、乳化聚合、塊狀聚合、懸浮聚合等公知之聚合方法,此時根據聚合方法而使用熱聚合起始劑或光聚合起始劑等聚合起始劑,藉此可獲得丙烯酸酯共聚物。 (丙烯酸系共聚物(A1)) 作為黏著材層之較佳之基礎聚合物之一例,可列舉包含具有巨單體作為支鏈成分之接枝共聚物之(甲基)丙烯酸系共聚物(A1)。 若以上述丙烯酸系共聚物(A1)作為基礎樹脂而構成黏著材層,則黏著材層可於室溫狀態下保持片材狀並且表現出自黏性,具有若於未交聯狀態下加熱則會熔融或流動之熱熔性,進而,可使其光硬化,光硬化後可使其發揮優異之凝聚力而使其接著。 因此,若使用丙烯酸系共聚物(A1)作為黏著材層之基礎聚合物,則即使為未交聯狀態,亦於室溫(20℃)下表現出黏著性,且具有若加熱為50~100℃、更佳為60℃以上或90℃以下之溫度則會軟化或流動化之性質。 構成上述丙烯酸系共聚物(A1)之主鏈成分之共聚物之玻璃轉移溫度較佳為-70~0℃。 此時,所謂構成主鏈成分之共聚物成分之玻璃轉移溫度係指僅使組成丙烯酸系共聚物(A1)之主鏈成分之單體成分進行共聚合所獲得之聚合物之玻璃轉移溫度。具體而言,意指根據由該共聚物各成分之均聚物所獲得之聚合物之玻璃轉移溫度與構成比率,藉由Fox之計算式所算出之值。 再者,所謂Fox之計算式係藉由以下之式求出之計算值,可使用聚合物手冊[Polymer HandBook, J.Brandrup, Interscience, 1989]所記載之值而求出。 1/(273+Tg)=Σ(Wi/(273+Tgi)) [式中,Wi表示單體i之重量分率,Tgi表示單體i之均聚物之Tg(℃)] 由於構成上述丙烯酸系共聚物(A1)之主鏈成分之共聚物成分之玻璃轉移溫度會影響到室溫狀態下之黏著材層之柔軟性、或黏著材層對被黏著體之潤濕性、即接著性,因此為了黏著材層於室溫狀態下獲得適度之接著性(黏性),該玻璃轉移溫度較佳為-70℃~0℃,其中尤佳為-65℃以上或-5℃以下,其中尤佳為-60℃以上或-10℃以下。 但即使該共聚物成分之玻璃轉移溫度為相同之溫度,亦可藉由調整分子量而調整黏彈性。例如藉由減小共聚物成分之分子量,可使其進一步柔軟化。 作為上述丙烯酸系共聚物(A1)之主鏈成分所含之(甲基)丙烯酸酯單體,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸山萮酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸2-苯氧基乙酯、丙烯酸3,5,5-三甲基環己酯、對異丙苯基苯酚EO改性(甲基)丙烯酸酯、(甲基)丙烯酸雙環戊酯、(甲基)丙烯酸雙環戊烯酯、(甲基)丙烯酸雙環戊烯氧基乙酯、(甲基)丙烯酸苄酯等。該等亦可使用:具有親水基或有機官能基等之(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸甘油酯等含羥基之(甲基)丙烯酸酯;或(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基順丁烯二酸、2-(甲基)丙烯醯氧基丙基順丁烯二酸、2-(甲基)丙烯醯氧基乙基丁二酸、2-(甲基)丙烯醯氧基丙基丁二酸、丁烯酸、反丁烯二酸、順丁烯二酸、伊康酸、順丁烯二酸單甲酯、伊康酸單甲酯等含羧基單體;順丁烯二酸酐、伊康酸酐等含酸酐基單體;(甲基)丙烯酸縮水甘油酯、α-乙基丙烯酸縮水甘油酯、(甲基)丙烯酸3,4-環氧丁酯等含環氧基單體;(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸二乙胺基乙酯等含胺基之(甲基)丙烯酸酯系單體;(甲基)丙烯醯胺、N-第三丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、雙丙酮丙烯醯胺、順丁烯二醯胺、順丁烯二醯亞胺等含有醯胺基之單體;乙烯基吡咯啶酮、乙烯基吡啶、乙烯基咔唑等雜環系鹼性單體等。 又,亦可適當地使用能夠與上述丙烯酸系單體或甲基丙烯酸系單體共聚合之苯乙烯、第三丁基苯乙烯、α-甲基苯乙烯、乙烯基甲苯、丙烯腈、甲基丙烯腈、乙酸乙烯酯、丙酸乙烯酯、烷基乙烯醚、羥基烷基乙烯醚、烷基乙烯基單體等各種乙烯基單體。 又,丙烯酸系共聚物(A1)之主鏈成分較佳為含有疏水性之(甲基)丙烯酸酯單體與親水性之(甲基)丙烯酸酯單體作為構成單元。 若丙烯酸系共聚物(A1)之主鏈成分僅由疏水性單體構成,則可觀察到濕熱白化之傾向,故而較佳為亦將親水性單體導入至主鏈成分中而防止濕熱白化。 具體而言,作為上述丙烯酸系共聚物(A1)之主鏈成分,可列舉疏水性之(甲基)丙烯酸酯單體、親水性之(甲基)丙烯酸酯單體、及巨單體之末端之聚合性官能基進行無規共聚合而成之共聚物成分。 此處,作為上述之疏水性之(甲基)丙烯酸酯單體,例如可列舉:(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸山萮酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸雙環戊烯氧基乙酯、甲基丙烯酸甲酯。 又,作為疏水性之乙烯基單體,可列舉:乙酸乙烯酯、苯乙烯、第三丁基苯乙烯、α-甲基苯乙烯、乙烯基甲苯、烷基乙烯基單體等。 作為上述親水性之(甲基)丙烯酸酯單體,例如可列舉:丙烯酸甲酯、(甲基)丙烯酸、(甲基)丙烯酸四氫糠酯;或(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸甘油酯等含羥基之(甲基)丙烯酸酯;或(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基順丁烯二酸、2-(甲基)丙烯醯氧基丙基順丁烯二酸、2-(甲基)丙烯醯氧基乙基丁二酸、2-(甲基)丙烯醯氧基丙基丁二酸、丁烯酸、反丁烯二酸、順丁烯二酸、伊康酸、順丁烯二酸單甲酯、伊康酸單甲酯等含羧基單體;順丁烯二酸酐、伊康酸酐等含酸酐基單體;(甲基)丙烯酸縮水甘油酯、α-乙基丙烯酸縮水甘油酯、(甲基)丙烯酸3,4-環氧丁酯等含環氧基單體;甲氧基聚乙二醇(甲基)丙烯酸酯等烷氧基聚伸烷基二醇(甲基)丙烯酸酯;N,N-二甲基丙烯醯胺、羥基乙基丙烯醯胺等等。 丙烯酸系共聚物(A1)較佳為導入巨單體作為接枝共聚物之支鏈成分,而含有源自巨單體之重複單元。 所謂巨單體係具有末端之聚合性官能基與高分子量骨架成分之高分子單體。 巨單體之玻璃轉移溫度(Tg)較佳為高於構成上述丙烯酸系共聚物(A1)之共聚物成分之玻璃轉移溫度。 具體而言,由於巨單體之玻璃轉移溫度(Tg)會影響到黏著材層2之加熱熔融溫度(熱熔溫度),因此巨單體之玻璃轉移溫度(Tg)較佳為30℃~120℃,其中進而較佳為40℃以上或110℃以下,其中進而較佳為50℃以上或100℃以下。 若為此種玻璃轉移溫度(Tg),則可藉由調整分子量而保持優異之加工性或保管穩定性,並且可以於80℃附近熱熔之方式加以調整。 所謂巨單體之玻璃轉移溫度係指該巨單體本身之玻璃轉移溫度,可藉由示差掃描熱量計(DSC)進行測定。 又,為了達成於室溫狀態下可維持支鏈成分彼此相互拉近,作為黏著劑組合物進行物理性交聯之狀態,並且藉由加熱至適度之溫度可使上述物理性交聯解開而獲得流動性,亦較佳為調整巨單體之分子量或含量。 就該觀點而言,巨單體較佳為以5質量%~30質量%之比例含有於丙烯酸系共聚物(A1)中,其中較佳為6質量%以上或25質量%以下,其中較佳為8質量%以上或20質量%以下。 又,巨單體之數量平均分子量較佳為500以上且未達8000,其中較佳為800以上或未達7500,其中較佳為1000以上或未達7000。 巨單體可適當使用通常製造者(例如東亞合成公司製造之巨單體等)。 巨單體之高分子量骨架成分較佳為包含丙烯酸系聚合物或乙烯系聚合物。 作為上述巨單體之高分子量骨架成分,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸山萮酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸2-苯氧基乙酯、丙烯酸3,5,5-三甲基環己酯、對異丙苯基苯酚EO改性(甲基)丙烯酸酯、(甲基)丙烯酸雙環戊酯、(甲基)丙烯酸雙環戊烯酯、(甲基)丙烯酸雙環戊烯氧基乙酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸羥基烷基酯、(甲基)丙烯酸、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、(甲基)丙烯腈、(甲基)丙烯酸烷氧基烷基酯、烷氧基聚伸烷基二醇(甲基)丙烯酸酯等(甲基)丙烯酸酯單體;或苯乙烯、第三丁基苯乙烯、α-甲基苯乙烯、乙烯基甲苯、烷基乙烯基單體、乙酸乙烯酯、烷基乙烯醚、羥基烷基乙烯醚等各種乙烯基單體,該等可單獨使用或組合2種以上使用。 作為上述巨單體之末端聚合性官能基,例如可列舉:甲基丙烯醯基、丙烯醯基、乙烯基等。 (交聯劑(b)) 交聯劑(b)可使用於使丙烯酸酯聚合物交聯時所使用之交聯單體。例如可列舉具有選自(甲基)丙烯醯基、環氧基、異氰酸酯基、羧基、羥基、碳二醯亞胺基、㗁唑啉基、氮丙啶基、乙烯基、胺基、亞胺基、醯胺基中之至少1種交聯性官能基之交聯劑,可使用1種或組合2種以上使用。 再者,上述交聯性官能基亦可經能夠去保護之保護基保護。 其中,可較佳地使用:具有2個以上(甲基)丙烯醯基之多官能(甲基)丙烯酸酯;具有2個以上異氰酸酯基、環氧基、三聚氰胺基、二醇基、矽氧烷基、胺基等有機官能基之多官能有機官能基樹脂;具有鋅、鋁、鈉、鋯、鈣等之金屬錯合物的有機金屬化合物。 作為上述多官能(甲基)丙烯酸酯,例如可列舉:1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、甘油縮水甘油醚二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、雙酚A聚乙氧基二(甲基)丙烯酸酯、雙酚A聚烷氧基二(甲基)丙烯酸酯、雙酚F聚烷氧基二(甲基)丙烯酸酯、聚伸烷基二醇二(甲基)丙烯酸酯、三羥甲基丙烷三氧基乙基(甲基)丙烯酸酯、ε-己內酯改性三(2-羥基乙基)異氰尿酸酯三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、丙氧化季戊四醇三(甲基)丙烯酸酯、乙氧化季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、丙氧化季戊四醇四(甲基)丙烯酸酯、乙氧化季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、三(丙烯醯氧基乙基)異氰尿酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、三季戊四醇六(甲基)丙烯酸酯、三季戊四醇五(甲基)丙烯酸酯、羥基特戊酸新戊二醇二(甲基)丙烯酸酯、羥基特戊酸新戊二醇之ε-己內酯加成物之二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、烷氧化三羥甲基丙烷三(甲基)丙烯酸酯、二(三羥甲基丙烷)四(甲基)丙烯酸酯等紫外線硬化型之多官能單體類,除此以外,可列舉:聚酯(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、(甲基)丙烯酸胺基甲酸酯、聚醚(甲基)丙烯酸酯等多官能丙烯酸酯低聚物類。 上述所列舉之中,就提高對被黏著體之密接性或抑制濕熱白化之效果之觀點而言,上述多官能(甲基)丙烯酸酯單體中,較佳為含有羥基或羧基、醯胺基等極性官能基之多官能單體或低聚物。其中,較佳為使用具有羥基或醯胺基之多官能(甲基)丙烯酸酯。 就防止濕熱白化之觀點而言,作為上述(甲基)丙烯酸酯共聚物、例如接枝共聚物之主鏈成分,較佳為含有疏水性之丙烯酸酯單體與親水性之丙烯酸酯單體,進而,作為交聯劑,較佳為使用具有羥基之多官能(甲基)丙烯酸酯。 又,為了調整密接性或耐濕熱性、耐熱性等效果,亦可進一步添加與交聯劑進行反應之單官能或多官能之(甲基)丙烯酸酯。 就使作為黏著劑組合物之柔軟性與凝聚力平衡之觀點而言,交聯劑之含量相對於上述(甲基)丙烯酸系共聚物100質量份,較佳為以0.1~20質量份之比例含有,其中尤佳為0.5質量份以上或15質量份以下之比例,其中尤佳為1質量份以上或13質量份以下之比例。 (光聚合起始劑(c)) 於使丙烯酸酯聚合物交聯時,若適當添加交聯起始劑(過氧化起始劑、光聚合起始劑)或反應觸媒(三級胺系化合物、四級銨系化合物、月桂酸錫化合物等),則較為有效。 於紫外線照射交聯之情形時,較佳為調配光聚合起始劑(c)。 光聚合起始劑(c)根據自由基產生機制而大體分為2類,大致分為:可使光聚合性起始劑本身之單鍵斷裂分解而產生自由基之斷裂型光聚合起始劑;及光激發之起始劑與系統中之氫供與體形成激發錯合物而可使氫供與體之氫轉移之奪氫型光聚合起始劑。 該等中之斷裂型光聚合起始劑於藉由光照射而產生自由基時分解而成為其他化合物,一旦被激發則失去作為反應起始劑之功能。因此,若使用該分子內斷裂型作為於可見光區域內具有吸收波長之光聚合起始劑,則與使用奪氫型之情形相比,於藉由光線照射使黏著片材交聯後,光線反應性之光聚合性起始劑作為未反應殘渣殘留於本黏著劑組合物中而導致黏著片材之未預期之經時變化或促進交聯的可能性較低,故而較佳。又,關於光聚合性起始劑特有之著色,亦可適當選擇藉由成為反應分解物,使可見光區域之吸收消失而消色者,故而較佳。 另一方面,奪氫型之光聚合起始劑於藉由紫外線等活性能量線照射之產生自由基之反應時,不會產生如斷裂型光聚合起始劑之分解物,故而反應結束後難以成為揮發成分,可減少對被黏著體之損傷。 作為上述斷裂型光聚合起始劑,例如可列舉:2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮、1-(4-(2-羥基乙氧基)苯基)-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-[4-{4-(2-羥基-2-甲基-丙醯基)苄基}苯基]-2-甲基-丙烷-1-酮、低聚(2-羥基-2-甲基-1-(4-(1-甲基乙烯基)苯基)丙酮)、苯基乙醛酸甲酯、2-苄基-2-二甲胺基-1-(4-𠰌啉基苯基)丁烷-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-𠰌啉基丙烷-1-酮、2-(二甲胺基)-2-[(4-甲基苯基)甲基]-1-[4-(4-𠰌啉基)苯基]-1-丁酮、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)乙氧基苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)2,4,4-三甲基戊基氧化膦、或該等之衍生物等。 其中,就藉由斷裂型光聚合性起始劑,於反應後成為分解物而消色之方面而言,較佳為雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)乙氧基苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)2,4,4-三甲基戊基氧化膦等醯基氧化膦系光起始劑。 進而,就與包含具備巨單體作為支鏈成分之接枝共聚物之丙烯酸系共聚物之相容性而言,較佳為使用2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)乙氧基苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)2,4,4-三甲基戊基氧化膦等作為光聚合起始劑。 光聚合起始劑之含量並無特別限制。例如相對於(甲基)丙烯酸系共聚物100質量份而以0.1~10質量份、其中尤佳為以0.2質量份以上或5質量份以下、其中尤佳為以0.5質量份以上或3質量份以下之比例而含有。但就與其他要素之平衡性之方面而言,亦可超過該範圍。 光聚合起始劑可使用1種或組合2種以上使用。 除了上述成分以外,亦可視需要而適當調配具有近紅外線吸收特性之顏料或染料等色素、黏著賦予劑、抗氧化劑、抗老化劑、吸濕劑、紫外線吸收劑、矽烷偶合劑、天然物或合成物之樹脂類、玻璃纖維或玻璃珠等各種添加劑。 (黏著材層之層結構及厚度) 黏著材層除了單層以外,亦可為兩層、三層等複數層。 又,黏著材層亦可為具有基材層(不具有黏著性之層)作為芯層,且於該基材層之兩側積層包含黏著材之層而成之構成。於此種構成之情形時,作為芯層之基材層較佳為具有變得能夠對黏著片材積層體進行加熱成型之材質或特性。又,較佳為除了基材層以外之黏著材層於損耗正切tanδ(SA)、損耗正切tanδ(SB)、儲存彈性模數G'(SA)及儲存彈性模數G'(SB)方面具有上述特性。 黏著材層之厚度並無特別限定。其中較佳為20 μm~500 μm之範圍。若為該範圍,例如若為如厚度20 μm之較薄之黏著材層,則可提供印刷階差追隨性優異之黏著片材。又,若為如厚度500 μm之較厚之黏著材層,則藉由預先賦形相當於印刷階差之量,亦變得能夠抑制貼合時之黏著材之溢出。 因此,黏著材層之厚度較佳為20 μm~500 μm,其中進而較佳為30 μm以上或300 μm以下,其中進而較佳為50 μm以上或200 μm以下。 <被覆部I> 本黏著片材積層體如圖1所示具備如下之被覆部I,該被覆部I係以可剝離之方式積層於對黏著材層之正面及背面之一側、例如正面賦形凹凸之側而成。 被覆部I於100℃下之儲存彈性模數E'(MA)較佳為1.0×106
~2.0×109
Pa。 由於對本黏著片材積層體進行加熱成型時之溫度通常為70~120℃,故而若於100℃下之儲存彈性模數E'(MA)為1.0×106
~2.0×109
Pa,則於上述黏著劑組合物塑化至流動之溫度範圍內,被覆部I亦能夠充分地追隨凹凸形狀而變形,不僅如此,而且可於在成型時被被覆部I擠壓之黏著材層之表面高精度地、例如以避免角部變圓之方式成型所需凹凸形狀。 先前,作為積層於黏著片材之離型膜,多使用儲存彈性模數較高、換言之「較硬之」材料。其原因在於:對離型膜所要求之特性主要為保護黏著材層、及離型性。然而,根據本發明者等人之研究,發現於在將離型膜積層於黏著片材之狀態下進行加熱成形之新用途中,於要求加熱成型性之新課題之情形時,憑藉先前之離型膜所具備之如上所述之物理特性無法達成要求。因此,對加熱成型時所產生之現象、或黏著材層所具有之特性等進行了詳細調查,結果發現,設為與迄今為止通常使用之離型膜不同之特性對於解決加熱成型性之新課題而言有利。發現尤其是藉由將特定溫度下之儲存彈性模數控制為特定範圍,可解決上述課題。 就該觀點而言,被覆部I於100℃下之儲存彈性模數E'(MA)較佳為1.0×106
~2.0×109
Pa,其中進而較佳為5.0×106
Pa以上或1.0×109
Pa以下,其中進而較佳為1.0×107
Pa以上或5.0×108
Pa以下。 據此,被覆部I於100℃下之儲存彈性模數E'(MA)更佳為1.0×106
~1.0×109
Pa、或1.0×106
~5.0×108
Pa,其中,進而較佳為5.0×106
~2.0×109
Pa、或5.0×106
~1.0×109
Pa,最佳為1.0×107
~1.0×109
Pa以下、或1.0×107
~5.0×108
Pa。 又,被覆部I於30℃下之儲存彈性模數E'(MB)較佳為5.0×107
~1.0×1010
Pa。 若被覆部I於30℃下之儲存彈性模數E'(MB)為5.0×107
~1.0×1010
Pa,則於常態下可維持形狀保持性,故而操作較容易,例如容易剝離,不僅如此,由於並未過硬,因此可抑制於黏著材層形成非意圖需要之凹凸。 就該觀點而言,被覆部I於30℃下之儲存彈性模數E'(MB)較佳為5.0×107
~1.0×1010
Pa,其中進而較佳為1.0×108
Pa以上或8.0×109
Pa以下,其中進而較佳為1.0×109
Pa以上或5.0×109
Pa以下。 據此,被覆部I於30℃下之儲存彈性模數E'(MB)更佳為5.0×107
~8.0×109
Pa、或5.0×107
~5.0×109
Pa,其中,進而較佳為1.0×108
Pa~1.0×1010
Pa、或1.0×108
Pa~8.0×109
Pa,最佳為1.0×109
~8.0×109
Pa、或1.0×109
~5.0×109
Pa。 為了將被覆部I於30℃、100℃下之儲存彈性模數調整為上述,例如可藉由調整基礎樹脂之種類、共聚合樹脂成分、重量平均分子量、玻璃轉移溫度、結晶性等被覆部I之材料之條件,並且調整有無延伸、成形條件、於延伸之情形時調整延伸條件等製造條件而加以調整。但並不限定於該等方法。 進而,較佳為被覆部I於100℃下之儲存彈性模數E'(MA)、與被覆部I於30℃下之儲存彈性模數E'(MB)滿足以下之關係式(1)。 (1)・・E'(MB)/E'(MA)≧2.0 若被覆部I於100℃下之儲存彈性模數E'(MA)與被覆部I於30℃下之儲存彈性模數E'(MB)滿足上述關係式(1),則可獲得充分之成形性,故而更佳。 就該觀點而言,較佳為E'(MB)/E'(MA)≧2.0,其中進而較佳為30≧E'(MB)/E'(MA)或E'(MB)/E'(MA)≧3.0,其中尤佳為10≧E'(MB)/E'(MA)或E'(MB)/E'(MA)≧5.0。 為了調整為E'(MB)與E'(MA)成為上述關係,例如可藉由調整基礎樹脂之種類、共聚合樹脂成分、重量平均分子量、玻璃轉移溫度、結晶性等被覆部I之材料之條件,並且調整有無延伸、成形條件、於延伸之情形時調整延伸條件等製造條件而加以調整。但並不限定於該等方法。 進而又,較佳為上述黏著材層於100℃下之儲存彈性模數G'(SA)與上述被覆部I於100℃下之儲存彈性模數E'(MA)滿足以下之關係式(2)。 (2)・・1.0×103
≦E'(MA)/G'(SA)≦1.0×107
若上述黏著材層於100℃下之儲存彈性模數G'(SA)與上述被覆部I於100℃下之儲存彈性模數E'(MA)滿足上述關係式(2),則可獲得充分之成形性,故而更佳。 就該觀點而言,E'(MA)/G'(SA)較佳為1.0×103
~1.0×107
,其中尤佳為5.0×103
以上或5.0×106
以下,其中尤佳為1.0×104
以上或1.0×106
以下。 據此,E'(MA)/G'(SA)更佳為1.0×103
~5.0×106
、或1.0×103
~1.0×106
,進而較佳為5.0×103
~5.0×106
、或5.0×103
~1.0×106
,最佳為1.0×104
~5.0×106
、或1.0×104
~1.0×106
。 為了調整為E'(MA)及G'(SA)成為上述關係,調整黏著材層或被覆部I之特性即可。作為黏著材層之特性,例如可藉由調整構成黏著材層之組合物之成分或凝膠分率、重量平均分子量等而達成。又,作為被覆部I之特性,例如可藉由調整基礎樹脂之種類、共聚合樹脂成分、重量平均分子量、玻璃轉移溫度、結晶性等被覆部I之材料之條件,並且調整有無延伸、成形條件、於延伸之情形時調整延伸條件等製造條件而加以調整。但並不限定於該等方法。 對於被覆部I,進而於30℃環境下將上述被覆部I從黏著材層剝離時之剝離力F(C)較佳為0.2 N/cm以下。 若剝離力F(C)為0.2 N/cm以下,則可將上述被覆部I從黏著材層容易地剝離。 就該觀點而言,該剝離力F(C)較佳為0.2 N/cm以下,其中進而較佳為0.01 N/cm以上或0.15 N/cm以下,其中進而較佳為0.02 N/cm以上或0.1 N/cm以下。 進而,對於被覆部I,將黏著片材積層體於100℃下加熱5分鐘後冷卻至30℃,於30℃環境下將上述被覆部I從上述黏著材層剝離時之剝離力F(D)較佳為0.2 N/cm以下。 若將黏著片材積層體於100℃下加熱5分鐘後冷卻至30℃,並且於30℃環境下測得之剝離力F(D)與上述剝離力F(C)為相同程度,則即使將黏著片材積層體加熱成型,剝離力F(D)亦不發生變化,故而可將上述被覆部I從黏著材層容易地剝離。 就該觀點而言,該剝離力F(D)較佳為0.2 N/cm以下,其中進而較佳為0.01 N/cm以上或0.15 N/cm以下,其中進而較佳為0.02 N/cm以上或0.1 N/cm以下。 進而,被覆部I較佳為上述剝離力F(C)與上述剝離力F(D)之差之絕對值為0.1 N/cm以下。 若將黏著片材積層體於100℃下加熱5分鐘後冷卻至30℃,並且於30℃環境下測得之剝離力F(D)與通常狀態下之剝離力F(C)之差之絕對值為0.1 N/cm以下,則即使將黏著片材積層體加熱成型,剝離力F(D)亦不發生變化,故而可將上述被覆部I從黏著材層容易地剝離。 就該觀點而言,剝離力F(C)與剝離力F(D)之差之絕對值較佳為0.1 N/cm以下,其中進而較佳為0.08 N/cm以下,其中進而較佳為0.05 N/cm以下。 再者,被覆部I之剝離力F(C)及剝離力F(D)可藉由形成於被覆部I之一側之離型層之種類等加以調製。但並不限定於該方法。 作為被覆部I之構成例,可列舉具備被覆基材層與離型層之構成例。藉由在被覆基材層之單面積層離型層,可以被覆部I容易從黏著材層剝離之方式構成。 此時,該被覆基材層較佳為具備以選自例如由聚酯、共聚合聚酯、聚烯烴及共聚合聚烯烴所組成之群中之1種樹脂或2種以上之樹脂作為主成分之延伸或未延伸之層、即包含以該等樹脂作為主成分之延伸或未延伸之膜之層的單層或複層。 其中,構成上述被覆部I之被覆基材層就機械強度或耐化學品性等觀點而言,較佳為具備包含以例如共聚合聚酯、聚烯烴、或共聚合聚烯烴作為主成分之延伸或未延伸之膜之層的單層或複層。 作為上述共聚合聚酯之具體例,例如可列舉:使作為二羧酸之間苯二甲酸、及作為二醇之環己烷二甲醇、1,4-丁二醇、二乙二醇等任意地共聚合而成之共聚合聚對苯二甲酸乙二酯。 作為上述聚烯烴之具體例,可列舉α-烯烴均聚物,例如可列舉丙烯均聚物或4-甲基戊烯-1之均聚物。 作為上述聚烯烴共聚物之具體例,例如可列舉:乙烯、丙烯、其他α-烯烴或乙烯基單體等之共聚物。 上述離型層較佳為製成除了聚矽氧等離型劑以外亦含有改性聚烯烴之層。 此處,作為構成上述離型層之改性烯烴,可列舉以經不飽和羧酸或其酸酐、或者矽烷系偶合劑改性之聚烯烴作為主成分之樹脂。 作為上述不飽和羧酸或其酸酐,可列舉:丙烯酸、甲基丙烯酸、順丁烯二酸、順丁烯二酸酐、檸康酸、檸康酸酐、伊康酸、伊康酸酐或該等之衍生物之單環氧化合物與上述酸之酯化合物、分子內具有能夠與該等酸反應之基之聚合物與酸之反應生成物等。又,亦可使用該等之金屬鹽。該等中,可更佳地使用順丁烯二酸酐。又,該等之共聚物可各自單獨使用或混合2種以上使用。 為了製造改性聚烯烴系樹脂,例如可於使聚合物進行聚合之階段預先使該等改性單體共聚合,亦可使暫時聚合之聚合物與該等改性單體進行接枝共聚合。又,作為改性聚烯烴系樹脂,可單獨使用該等改性單體或併用複數種,且適宜地使用其含有率為0.1質量%以上、較佳為0.3質量%以上、進而較佳為0.5質量%以上且為5質量%以下、較佳為4.5質量%以下、進而較佳為4.0質量%以下之範圍者。其中,可適宜地使用經接枝改性者。 作為改性聚烯烴系樹脂之適宜之例,可列舉:順丁烯二酸酐改性聚丙烯樹脂、順丁烯二酸酐改性聚乙烯樹脂、順丁烯二酸酐乙烯-乙酸乙烯酯共聚物等。 被覆部I之厚度就成形性之觀點而言,較佳為10 μm~500 μm,其中尤佳為20 μm以上或300 μm以下,其中尤佳為30 μm以上或150 μm以下。 <被覆部II> 如上所述,本黏著片材積層體可採用於黏著材層之正面及背面之一側以可剝離之方式積層被覆部I,並且於與該被覆部I為相反側、即黏著材層之正面及背面之另一側以可剝離之方式積層被覆部II而成之構成。由此,藉由在黏著材層之正面及背面之另一側以可剝離之方式積層被覆部II,可提高操作性。但亦可採用不積層被覆部II之構成。 只要被覆部II為以可剝離之方式積層於黏著材層之正面及背面之另一側而成者,則其材料及構成並無特別限定。 被覆部II例如可為與上述被覆部I相同之積層構成及材料,此時,可為與上述被覆部I相同之厚度,亦可為不同之厚度。 若被覆部II為與被覆部I相同之積層構成及材料,則可防止於加熱本黏著片材積層體時等產生翹曲。 被覆部II亦可採用構成與被覆部I相同,但於100℃下之儲存彈性模數E'(MA)、於30℃下之儲存彈性模數E'(MB)、該等之比率(E'(MB)/E'(MA))、剝離力F(C)、剝離力F(D)等與被覆部I不同者。 進而,被覆部II亦可為與上述被覆部I不同之積層構成及材料。 被覆部II亦可使用例如通常使用之離型膜(亦稱為「剝離膜」)。具體而言,可列舉如於100℃下之儲存彈性模數E'(MC)為2.0×109
~1.0×1011
Pa之材料,例如可使用雙軸延伸聚對苯二甲酸乙二酯(PET)膜等。 [被覆部I] 作為上述被覆部I之構成例,對以為於共聚合聚酯膜之單面設置有塗佈層之塗佈膜,且於100℃下之儲存彈性模數E'為1.5×109
Pa以下為特徵之塗佈膜(稱為「本塗佈膜」)進行說明。 若使用本塗佈膜,則藉由例如於將上述黏著片材積層體加熱後,將模具壓抵於設置有具有離型性之塗佈層之塗佈膜進行成型,而可於黏著片材表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀。又,由於塗佈膜於常態下可維持形狀保持性,故而操作較容易,不僅如此,由於其並未過硬,因此可抑制於黏著片材形成非意圖需要之凹凸。 <共聚合聚酯膜> 構成本塗佈膜之共聚合聚酯膜可為單層構成,亦可為積層構成,例如除了2層、3層構成以外,只要不超過本發明之主旨,則亦可為4層或4層以上之多層,並無特別限定。又,例如於採用3層構成(表層/中間層/表層)之情形時,亦可將其表層或中間層之任意1層、或2層以上之層設為共聚合聚酯成分,且將其餘層設為不含共聚合成分之聚酯成分而構成。 又,共聚合聚酯膜係指將藉由擠出法擠出之熔融聚酯片材冷卻後,視需要加以延伸而成之膜。 作為共聚合聚酯之二羧酸成分,較佳為對苯二甲酸,除此以外,亦可含有草酸、丙二酸、丁二酸、己二酸、壬二酸、癸二酸、鄰苯二甲酸、間苯二甲酸、萘二甲酸、二苯醚二羧酸、環己烷二羧酸等公知之二羧酸之一種以上作為共聚合成分。又,作為二醇成分,較佳為乙二醇,除此以外,亦可含有丙二醇、三亞甲基二醇、四亞甲基二醇、六亞甲基二醇、1,4-環己烷二甲醇、二乙二醇、三乙二醇、聚伸烷基二醇、新戊二醇等公知之二醇之一種以上作為共聚合成分。 其中,更佳為使作為二羧酸成分之鄰苯二甲酸、間苯二甲酸、作為二醇成分之1,4-環己烷二甲醇、1,4-丁二醇、二乙二醇等任意地共聚合而成之共聚合聚對苯二甲酸乙二酯。 共聚合成分之含量較佳為1 mol%以上且50 mol%以下,更佳為3 mol%以上或40 mol%以下,進而較佳為4 mol%以上或30 mol%以下。藉由共聚合成分之含量為1 mol%以上,於使其與黏著片材積層時,可於黏著片材表面形成凹形狀、凸形狀、或凹凸形狀。另一方面,藉由為50 mol%以下,不僅具有充分之尺寸穩定性,而且可充分抑制加工時之褶皺之產生。 共聚合聚酯膜之熔點較佳為以成為較佳為260℃以下、更佳為200~255℃之範圍之方式設計。藉由上述熔點為260℃以下,於延伸後之熱處理步驟中,即使為低於共聚合聚酯膜之熔點之溫度之熱處理,亦可獲得充分之強度。 就提高膜作業性之方面而言,較理想為於共聚合聚酯膜中含有粒子。作為粒子,可列舉:碳酸鈣、碳酸鎂、硫酸鈣、硫酸鋇、磷酸鋰、磷酸鎂、磷酸鈣、氟化鋰、氧化鋁、氧化矽、高嶺土等無機粒子;丙烯酸系樹脂、胍胺樹脂等有機粒子;將觸媒殘差粒子化而成之析出粒子,但並不限定於該等。該等粒子之粒徑或共聚合聚酯膜中之含量可根據目的而適當決定。所含有之粒子可為單成分,又,亦可同時使用2種成分以上。又,亦可適當添加各種穩定劑、潤滑劑、防靜電劑等。 共聚合聚酯膜中所含之粒子之平均粒徑較佳為0.1~5.0 μm。於上述粒子之平均粒徑未達0.1 μm之情形時,存在膜之滑動性變得不充分,而作業性降低之情形。另一方面,於上述粒子之平均粒徑超過5.0 μm之情形時,存在膜表面之平滑性受損之情形。 共聚合聚酯膜中所含之粒子之含量較佳為0.01~0.3重量%。於上述粒子之含量未達0.01重量%之情形時,存在膜之滑動性變得不充分,而作業性降低之情形。另一方面,於上述粒子之含量超過0.3重量%之情形時,存在膜表面之平滑性受損之情形。 作為於共聚合聚酯膜中添加粒子之方法,並無特別限定,可採用公知之方法。例如,可於製造聚酯之任意階段添加,較佳為於酯化之階段、或亦可於酯交換反應結束後縮聚反應開始前之階段以分散於乙二醇等中之漿料之形式添加而進行縮聚反應。又,可藉由使用附排氣孔之混練擠出機將分散於乙二醇或水等中之粒子之漿料與聚酯原料摻合之方法、或使用混練擠出機將經乾燥之粒子與聚酯原料摻合之方法、於聚酯製造步驟系統中使粒子析出之方法等進行。 共聚合聚酯之極限黏度通常為0.40~1.10 dl/g,較佳為0.45~0.90 dl/g,進而較佳為0.50~0.80 dl/g。若極限黏度未達0.40 dl/g,則有膜之機械強度變弱之傾向,於極限黏度超過1.10 dl/g之情形時,存在熔融黏度變高,而會對擠出機過度地施加負荷之情形。 繼而,對共聚合聚酯膜之製造例進行具體說明,但並不受以下之製造例任何限定。 較佳為如下方法:首先,使用先前所述之共聚合聚酯原料,藉由冷卻輥將從模具擠出之熔融片材冷卻固化而獲得未延伸片材。於該情形時,為了提高片材之平面性,必須提高片材與旋轉冷卻轉筒之密接性,可較佳地採用靜電施加密接法及/或液體塗佈密接法。 繼而,較佳為將所獲得之未延伸片材至少沿單軸方向延伸,更佳為沿雙軸方向延伸之雙軸延伸。例如,作為雙軸延伸,於逐次雙軸延伸之情形時,藉由輥或拉輻方式之延伸機使上述未延伸片材於一個方向上沿機械方向延伸。延伸溫度通常為70~120℃,較佳為75~110℃,延伸倍率通常為2.5~7.0倍,較佳為3.0~6.0倍。其次,沿與第一階段之延伸方向(機械方向)垂直之方向延伸。延伸溫度通常為70~170℃,延伸倍率通常為3.0~7.0倍,較佳為3.5~6.0倍。然後,繼續於150~270℃之溫度下,於拉伸下或30%以內之鬆弛下進行熱處理,而獲得雙軸配向膜。於上述雙軸延伸中,亦可採用將一個方向之延伸進行2階段以上之方法。於該情形時,較佳為以兩個方向之延伸倍率最終分別成為上述範圍之方式而進行。 又,關於共聚合聚酯膜之製造,亦可採用同時雙軸延伸。同時雙軸延伸係於通常70~120℃、較佳為75~110℃下將上述未延伸片材於溫度經控制之狀態下沿機械方向及寬度方向同時延伸並使其配向之方法。作為延伸倍率,以面積倍率計較佳為4~50倍,更佳為7~35倍,進而較佳為10~25倍。然後,繼續於150~250℃之溫度下,於拉伸下或30%以內之鬆弛下進行熱處理,而獲得雙軸延伸膜。關於採用上述延伸方式之同時雙軸延伸裝置,可採用螺旋方式、縮放儀方式、線型驅動方式等自先前起公知之延伸方式。 (塗佈層) 於本塗佈膜中,重要的是於共聚合聚酯膜之至少單面設置塗佈層。作為塗佈層,並無特別限定,可具體地列舉離型層、防靜電層、低聚物密封層、易接著層、底塗層等。其中,就製造與黏著片材積層而成之黏著片材積層體之方面而言,更佳為離型層。又,亦可將如上所述之功能層組合2種以上。 作為構成塗佈膜之塗佈層之具體例,以下對離型層進行說明。 具體而言,離型層所使用之樹脂之種類可列舉硬化型聚矽氧樹脂、氟系樹脂、聚烯烴系樹脂等,其中較佳為硬化型聚矽氧樹脂。可為硬化型聚矽氧樹脂,亦可為以硬化型聚矽氧樹脂作為主成分之類型,於無損及本發明之主旨之範圍內,亦可使用藉由與胺基甲酸酯樹脂、環氧樹脂、醇酸樹脂等有機樹脂之接枝聚合等獲得之改性聚矽氧型等。 作為硬化型聚矽氧樹脂之種類,可使用加成型、縮合型、紫外線硬化型、電子束硬化型、無溶劑型等任一硬化反應型。若列舉具體例,則可例示:信越化學工業股份有限公司製造之KS-774、KS-775、KS-778、KS-779H、KS-847H、KS-856、X-62-2422、X-62-2461、X-62-1387、X-62-5039、X-62-5040、KNS-3051、X-62-1496、KNS320A、KNS316、X-62-1574A/B、X-62-7052、X-62-7028A/B、X-62-7619、X-62-7213;Momentive Performance Materials製造之YSR-3022、TPR-6700、TPR-6720、TPR-6721、TPR6500、TPR6501、UV9300、UV9425、XS56-A2775、XS56-A2982、UV9430、TPR6600、TPR6604、TPR6605;Dow Corning Toray股份有限公司製造之SRX357、SRX211、SD7220、SD7292、LTC750A、LTC760A、LTC303E、SP7259、BY24-468C、SP7248S、BY24-452、DKQ3-202、DKQ3-203、DKQ3-204、DKQ3-205、DKQ3-210等。進而,為了調整離型層之剝離性等,亦可併用剝離控制劑。 於共聚合聚酯膜上形成離型層時之硬化條件並無特別限定。於藉由離線塗佈設置離型層之情形時,通常宜於120~200℃下3~40秒、較佳為於100~180℃下3~40秒為標準進行熱處理。又,亦可視需要而併用熱處理與紫外線照射等活性能量線照射。再者,作為用於藉由活性能量線照射進行之硬化之能量源,可使用自先前起公知之裝置、能量源。離型層之塗敷量(乾燥後)就塗敷性之方面而言,通常為0.005~1 g/m2
之範圍,較佳為0.005~0.5 g/m2
之範圍,進而較佳為0.01~0.2 g/m2
之範圍。於塗敷量(乾燥後)未達0.005 g/m2
之情形時,存在就塗敷性之方面而言缺乏穩定性,而難以獲得均勻之塗膜之情形。另一方面,於超過1 g/m2
而較厚地塗佈之情形時,存在離型層本身之塗膜密接性、硬化性等降低之情形。 作為於共聚合聚酯膜設置離型層之方法,可使用反向凹版塗佈、直接凹版塗佈、輥式塗佈、模嘴塗佈、棒式塗佈、淋幕式塗佈等先前公知之塗敷方式。關於塗敷方式,於「塗佈方式」(槙書店 原崎勇次著,1979年發行)中有記載例。 又,為了於共聚合聚酯膜設置塗佈層,亦可預先對其實施電暈處理、電漿處理、紫外線照射處理等表面處理。 (塗佈膜) 本塗佈膜之厚度通常為9 μm~250 μm,較佳為12 μm~125 μm,進而較佳為25 μm~75 μm。 於上述厚度未達9 μm之情形時,存在膜張力變得不充分,而產生於切條時容易產生褶皺等異常之情形。另一方面,若超過250 μm,則存在例如對具有曲面形狀之成形品之追隨性變得不充分之情形。 本塗佈膜於100℃下之儲存彈性模數E'為1.5×109
Pa以下,較佳為1.0×109
Pa以下。藉由上述儲存彈性模數E'為1.5×109
Pa以下,於使其與黏著片材積層時,可於黏著片材表面形成凹形狀、凸形狀、或凹凸形狀。為了使100℃下之儲存彈性模數E'滿足上述範圍,可藉由調整共聚合聚酯膜所含之共聚合成分之種類及含量而滿足。 另一方面,作為下限,並無特別限定,較佳為1.0×107
Pa以上,更佳為1.0×108
Pa以上。 本塗佈膜於120℃下加熱5分鐘後之收縮率為3.0%以下,較佳為2.5%以下。藉由上述收縮率為3.0%以下,而具有充分之尺寸穩定性,故而於使其與黏著片材積層時,可於黏著片材表面形成凹形狀、凸形狀、或凹凸形狀。進而,可抑制加工時褶皺之產生,因此不會將褶皺轉印至黏著片材,而可製造具有充分之外觀之黏著片材。 其中,於120℃下加熱5分鐘後之機械方向(MD)之收縮率較佳為3.0%以下,較佳為2.5%以下。另一方面,作為下限,並無特別限定,較佳為0.1%以上,更佳為0.5%以上。 又,於120℃下加熱5分鐘後之與機械方向垂直之方向(TD)之收縮率較佳為1.0%以下,較佳為0.8%以下。另一方面,作為下限,較佳為-1.0%以上,更佳為-0.5%以上。 本塗佈膜就成形加工時防止由低聚物(環狀三聚物)對模具之附著引起之污染之觀點而言,較佳為熱處理(180℃、10分鐘)後低聚物從塗佈層表面之提取量為1.0×10-3
mg/cm2
以下,更佳為5.0×10-4
mg/cm2
以下。 於上述低聚物提取量超過該範圍之情形時,存在成形加工時由低聚物對模具之附著引起之污染變得嚴重之情形。作為一例,於多次連續加熱成形之加工中,因析出低聚物之沈積導致促進模具污染,故而控制加熱時之低聚物析出量變得重要。基於上述理由,上述低聚物提取量越少越佳。 [本黏著片材積層體之製造方法] 作為本黏著片材積層體之製造方法之一例,例如可列舉如下方法:以2片被覆部I或II夾持黏著劑組合物,使用貼合機而形成黏著材層。又,作為其他方法,可列舉將黏著劑組合物塗佈於被覆部I或II而形成黏著材層之方法。但並不限定於該製造方法。 作為塗佈黏著劑組合物之方法,例如可列舉逆輥塗佈、凹版塗佈、棒式塗佈、刮刀塗佈等先前公知之塗敷方式。 [本賦形黏著片材積層體] 可使用本黏著片材積層體,以如下方式製作於黏著材層表面形成有凹凸形狀之賦形黏著片材積層體1(稱為「本賦形黏著片材積層體1」)。 如圖3所示,本賦形黏著片材積層體1可製成具備如下所述構成者:其具備黏著材層2、以可剝離之方式積層於該黏著材層2之正面及背面之一側而成之被覆部I、及以可剝離之方式積層於該黏著材層2之正面及背面之另一側而成之被覆部II, 黏著材層2於正面及背面之一側表面2A具備凹部、凸部或凹凸部(稱為「黏著片材表面凹凸部2B」),且正面及背面之另一側表面2C為平坦面, 被覆部I密接於上述黏著片材2之正面及背面之一側表面2A,於正面及背面之一側表面3A具備凹部、凸部或凹凸部(稱為「被覆部表面凹凸部3B」),且於片材背面3C具備與上述黏著片材表面凹凸部2B相符、換言之形成嵌合之凹凸之凸部、凹部或凸凹部(稱為「保護片材背面凸凹部3D」), 被覆部II沿上述黏著片材2之正面及背面之另一側表面2C包含平坦面。 再者,正面及背面之另一側表面2C可如圖3所示般製成平坦面,又,正面及背面之另一側表面2C亦可以具備凹部、凸部或凹凸部之方式形成。 具備此種構成之本賦形黏著片材積層體1可如圖2所示,藉由利用將上述本黏著片材積層體進行加壓成形、真空成形、壓空成形或輥壓成形,以一體方式對本黏著片材積層體賦形凹凸形狀而製造。 藉由以上述方式製造,可使黏著材層2之黏著片材表面凹凸部2B、被覆部I之保護片材表面凹凸部3B及保護片材背面凸凹部3D於同一部位各自對應而形成凹凸。 黏著材層2可用作例如用以將構成圖像顯示裝置之2個圖像顯示裝置構成構件(分別亦稱為「被黏著體」)貼合之雙面黏著片材。 即,上述黏著材層2中之黏著片材表面凹凸部2B可以與上述被黏著體之貼合面中之凹部、凸部或凹凸部(稱為「被黏著體表面凹凸部」)相符之方式形成,較佳為形成為同一輪廓形狀。藉此,可使本賦形黏著片材積層體1中之黏著片材表面凹凸部2B與作為被黏著體之圖像顯示裝置構成構件中之被黏著體表面凹凸部嵌合。 此處,作為上述圖像顯示裝置,例如可列舉:具備液晶顯示裝置(liquid crystal display,LCD)、有機EL(electroluminescence,電致發光)顯示裝置(OLED(organic light emitting diode,有機發光二極體))、電子紙、微機電系統(microelectromechanical system,MEMS)顯示器及電漿顯示器(PDP)等之智慧型手機、平板終端、行動電話、電視、遊戲機、個人電腦、汽車導航系統、ATM(automatic teller machine,自動櫃員機)、魚群探測儀等。但並不限定於該等。 此外,所謂作為被黏著體之圖像顯示裝置構成構件係構成該等圖像顯示裝置之構件,例如可列舉表面保護面板、觸控面板、圖像顯示面板等,本賦形黏著片材積層體1例如可用於將選自表面保護面板、觸控面板及圖像顯示面板中之任意2個被黏著體貼合。例如,可用於將表面保護面板與觸控面板、或觸控面板與圖像顯示面板貼合。但並不將被黏著體限定於該等。 <製造方法> 此處,對本賦形黏著片材積層體1之製造方法之詳細進行說明。 如上所述,可如圖2所示,藉由利用加熱上述本黏著片材積層體進行成形,以一體方式對本黏著片材積層體1賦形凹凸形狀而製造。 此時,作為成形加工方法,例如可列舉加壓成形、真空成形、壓空成形、利用輥之賦形、利用積層之賦形等。其中,就成形性及加工性之觀點而言,尤佳為加壓成形。 對更詳細之具體例進行說明。 藉由加熱器預熱本黏著片材積層體,於加熱為特定溫度之階段將本黏著片材積層體搬送至加壓成形機,利用預先仿照與被黏著體之印刷階差形狀相當之凹凸形狀之模具進行加壓加工,同時加以冷卻,藉此可使模具形狀轉印至本黏著片材積層體之單面,而製造於單面賦形有凹凸之本賦形黏著片材積層體1。 此時,本黏著片材積層體之預熱較佳為加熱為黏著材層柔軟化之溫度,具體而言,較佳為加熱為70~120℃。 凹凸賦形所使用之模具之材質並無特別限定。例如可列舉聚矽氧樹脂或氟樹脂等樹脂系材料、不鏽鋼或鋁等金屬系材料等。其中,由於對被黏著體之凹凸賦形要求高精度之成形性,因此尤佳為能夠控制成形時之溫度之金屬系之模具。 又,加壓加工後之冷卻可於開模後進行冷卻,亦可預先將模具冷卻,於加壓之同時進行冷卻。 再者,於本發明中,加壓壓力、加壓時間等成形之條件並無特別指定,根據所成形之尺寸或形狀、所使用之材料等適當調整即可。 又,於成形加工後亦可使用湯姆生刀(Thomson blade)或旋切刀等加以切割。 [本賦形黏著片材積層體之製造方法] 繼而,對具備具有黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I,且於該黏著材之一面賦形凹部、凸部或凹凸部(稱為「黏著材層表面凹凸部」)而成之構成之賦形黏著片材積層體之製造方法的尤佳之形態進行說明。 與下文所述之本製造方法1及本製造方法2相關之發明提出一種可於黏著材層表面高精度地形成與本被黏著體表面之凹凸部相符之黏著材層表面凹凸部、較佳為可連續地製造之新穎之賦形黏著片材積層體之製造方法。 作為本發明之實施形態之一例,提出一種新穎之賦形黏著片材積層體之製造方法(稱為「本製造方法1」),該賦形黏著片材積層體係具備具有黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I,且於該黏著材之一面賦形凹部、凸部或凹凸部(稱為「黏著材層表面凹凸部」)而成之構成者,該製造方法之特徵在於:其係具備黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I,並對黏著片材積層體進行加熱,將經加熱之黏著片材積層體成形,並且加以冷卻而製造賦形黏著片材積層體之製造方法,且對黏著片材積層體進行加熱,於被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之狀態下開始成形,於被覆部I之儲存彈性模數E'(MF)為5.0×107
~1.0×1010
Pa之狀態下結束成形。 於本製造方法1中,進而提出一種上述新穎之賦形黏著片材積層體之製造方法,其於將經加熱之黏著片材積層體成形時,使用經冷卻之模具進行成形。 根據本製造方法1,例如藉由將上述黏著片材積層體加熱後,被覆部I於特定之狀態下開始成形,且被覆部I於特定之狀態結束成形,而可於黏著材層表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀。 進而,於將經加熱之黏著片材積層體成形時,若使用經冷卻之模具進行成形,則可於成形之同時進行冷卻並且同時結束,故而可連續地進行上述製造方法。 <本製造方法1> 本製造方法1係本實施形態之一例之賦形黏著片材積層體之製造方法(稱為「本製造方法」)包括加熱下文所述之黏著片材積層體(加熱步驟)、將經加熱之黏著片材積層體成形並且加以冷卻(成形、冷卻步驟)之步驟之製造方法。 本製造方法1只要包括上述加熱步驟及上述成形、冷卻步驟,則亦可包括其他步驟。例如可視需要包括熱處理步驟、搬送步驟、切條步驟、裁斷步驟等步驟。但並不限定於該等步驟。 (黏著片材積層體) 作為本製造方法1中之起始構件之黏著片材積層體具備黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I即可,亦可具備其他構件。例如,如圖1所示,可例示具備黏著材層、以可剝離之方式積層於該黏著材層之正面及背面之一側而成之被覆部I、及以可剝離之方式積層於該黏著材層之正面及背面之另一側而成之被覆部II之黏著片材積層體。但是否具備被覆部II為任意,亦可採用不積層被覆部II之構成。 再者,關於黏著片材積層體之詳細情況係如上文所述。 (加熱步驟) 於本製造方法1中,較佳為加熱上述黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為1.0×106
~2.0×109
Pa之狀態。 若被覆部I之儲存彈性模數E'(M)為上述範圍,則可使被覆部I變形為適於成形之程度,且可對黏著材層之表面精度良好地賦形所需之凹凸形狀。 就該觀點而言,較佳為加熱黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為1.0×106
~2.0×109
Pa之狀態,其中進而較佳為設為5.0×106
Pa以上或1.0×109
Pa以下之狀態,其中進而較佳為設為1.0×107
Pa以上或5.0×108
Pa以下之狀態。 據此,更佳為加熱黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為1.0×106
~1.0×109
Pa、或1.0×106
~5.0×108
之狀態,其中,進而較佳為設為5.0×106
~2.0×109
Pa、或5.0×106
~1.0×109
Pa之狀態,最佳為設為1.0×107
~1.0×109
Pa、或1.0×107
~~5.0×108
之狀態。 此處,為了以加熱黏著片材積層體,被覆部I之儲存彈性模數E'(M)成為上述範圍之方式進行調整,可藉由根據構成被覆部I之組合物之成分或凝膠分率、重量平均分子量等調整加熱溫度而加以調整。但並不限定於該方法。 進而,進而更佳為加熱上述黏著片材積層體,而設為被覆部I之儲存彈性模數E'(M)為1.0×106
~2.0×109
Pa,且黏著材層之儲存彈性模數G'(S)未達1.0×104
Pa之狀態。 若將被覆部I之儲存彈性模數E'(M)調整為上述範圍,則可獲得如上所述之效果,除此以外,若黏著材層之儲存彈性模數G'(S)未達1.0×104
Pa,則可對黏著材層賦予充分之成形性。 就該觀點而言,較佳為加熱黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為上述範圍且黏著材層之儲存彈性模數G'(S)未達1.0×104
Pa之狀態,其中較佳為設為5.0×101
Pa以上或5.0×103
Pa以下之狀態,其中較佳為設為1.0×102
Pa以上或1.0×103
Pa以下之狀態。 據此,更佳為加熱黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為上述範圍且黏著材層之儲存彈性模數G'(S)為5.0×101
Pa以上且未達1.0×104
Pa、或為5.0×101
Pa以上且5.0×103
Pa以下之狀態,其中進而較佳為設為1.0×102
Pa以上且未達1.0×104
Pa、或1.0×102
Pa以上且5.0×103
Pa以下之狀態,最佳為設為1.0×102
Pa以上且1.0×103
Pa以下之狀態。 此處,黏著材層之儲存彈性模數G'(S)可根據構成黏著材層之組合物之成分或凝膠分率、重量平均分子量等調整加熱溫度而加以調整。但並不限定於該方法。 進而,尤佳為加熱黏著片材積層體而使黏著材層之損耗正切tanδ之值成為1.0以上。再者,下文對該損耗正切tanδ進行說明。 若黏著材層之損耗正切tanδ之值為1.0以上,則具有能夠成形之程度之柔軟性,故而較佳。 就該觀點而言,尤佳為加熱黏著片材積層體而使黏著材層之損耗正切tanδ之值成為1.0以上,其中進而較佳為使其成為1.5以上或20以下,進而,其中進而較佳為使其成為3.0以上或10以下。但上限並不限於此。 於本製造方法1中,較佳為加熱黏著片材積層體而使被覆部I之表面溫度成為70~180℃。 若被覆部I之表面溫度為70℃以上,則黏著材層充分軟化,且可使被覆部I能夠充分變形,若為180℃以下,則可抑制由熱收縮引起之褶皺之產生、或由熱引起之黏著材層之分解等弊端,故而較佳。 就該觀點而言,較佳為加熱上述黏著片材積層體而使被覆部I之表面溫度成為70~180℃,其中更佳為使其成為75℃以上或150℃以下,其中更佳為使其成為80℃以上或120℃以下。 作為黏著片材積層體之加熱方法,例如可列舉:使黏著片材積層體存在於內部具備電熱加熱器等加熱體之上下之加熱板之間而從上下加熱之方法、或以加熱板直接夾持之方法、使用加熱輥之方法、將其浸漬於熱水中之方法等。但並不限定於該等方法。 (成形、冷卻步驟) 於本步驟中,如上所述將經加熱之黏著片材積層體成形,於將黏著片材積層體成形之同時進行冷卻。即,直接將積層黏著材層及被覆部I而成為一體之狀態之黏著片材積層體成形。由此,利用模具將被覆部I成形,同時介隔該被覆部I亦將黏著材層成形。 於本步驟中,可於將經加熱之黏著片材積層體成形後進行冷卻,又,亦可於成形之同時進行冷卻。例如藉由利用經冷卻之模具進行加壓,可同時進行成形與冷卻並且同時結束。藉此,可如下文所述般連續地實施本製造方法1。 作為成形方法,只要可以一體方式對黏著片材積層體賦形凹凸形狀,則並不特別限定成形方法。例如可列舉:加壓成形、真空成形、壓空成形、利用輥進行之賦形、壓縮成形、利用積層進行之賦形等。其中,就成形性及加工性之觀點而言,尤佳為加壓成形。 模具之材質並無特別限定。例如可列舉聚矽氧樹脂或氟樹脂等樹脂系材料、不鏽鋼或鋁等金屬系材料等。其中,由於對被黏著體之凹凸賦形要求高精度之成形性,因此尤佳為能夠控制成形時之溫度之金屬系之模具。 模具之冷卻方法可採用通常進行之冷卻方法。例如可列舉水冷或利用壓縮空氣之冷卻方法。 對於模具,例如藉由如圖2所示,預先於開閉之一對模具中之至少一模具之內壁面設置特定之凹凸形狀,例如設置與黏著黏著材層之被黏著體之貼合面中的凹部、凸部或凹凸部相符之凹凸形狀,而可藉由使用該模具將黏著片材積層體進行加壓成形、真空成形、壓空成形或輥壓成形,將上述凹凸形狀轉印至黏著片材積層體而賦形。 於本步驟中,較佳為如上所述,於黏著片材積層體中之被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之狀態下開始成形。 此處,所謂「開始成形」,例如於使用模具之成形之情形時,意指關閉模具,即開始利用模具擠壓黏著片材積層體。 若被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之範圍,則可使被覆部I變形為適於成形之程度,且可對黏著材層之表面精度良好地賦形所需之凹凸形狀。 就該觀點而言,較佳為於被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之狀態下開始黏著片材積層體之成形,其中更佳為於為5.0×106
Pa以上或1.0×109
Pa以下之狀態下開始成形,其中更佳為於為1.0×107
Pa以上或5.0×108
Pa以下之狀態下開始成形。 據此,更佳為於被覆部I之儲存彈性模數E'(MS)為1.0×106
~1.0×109
Pa、或1.0×106
~5.0×108
Pa之狀態下開始黏著片材積層體之成形,其中,進而較佳為於為5.0×106
~1.0×109
Pa、或5.0×106
~5.0×108
Pa之狀態下開始成形,最佳為於為1.0×107
~1.0×109
Pa、或1.0×107
~5.0×108
Pa之狀態下開始成形。 進而,更佳為於被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa,且黏著材層之儲存彈性模數G'(SS)未達1.0×104
Pa之狀態下開始黏著片材積層體之成形。 若於被覆部I之儲存彈性模數E'(MS)為上述範圍之狀態下開始成形,則可獲得如上所述之效果,除此以外,若於黏著材層之儲存彈性模數G'(SS)未達1.0×104
Pa之狀態下開始成形,則可於黏著材層具有更充分之成形性之狀態下進行成形。 就該觀點而言,進而較佳為於被覆部I之儲存彈性模數E'(MS)為上述範圍之狀態且黏著材層之儲存彈性模數G'(SS)未達1.0×104
Pa之狀態下開始成形,其中進而較佳為於該G'(SS)為5.0×101
Pa以上或5.0×103
Pa以下之狀態下開始成形,其中進而更佳為於為1.0×102
Pa以上或1.0×103
Pa以下之狀態下開始成形。 據此,更佳為於被覆部I之儲存彈性模數E'(MS)為上述範圍之狀態且黏著材層之儲存彈性模數G'(SS)為5.0×101
Pa以上且未達1.0×104
Pa、或為5.0×101
Pa以上且5.0×103
Pa以下之狀態下開始成形,其中,進而較佳為於為1.0×102
Pa以上且未達1.0×104
Pa、或為1.0×102
Pa以上且5.0×103
Pa以下之狀態下開始成形,最佳為於為1.0×102
Pa以上且1.0×103
Pa以下之狀態下開始成形。 又,較佳為於上述被覆部I之表面溫度為70~180℃之狀態下開始成形。 若該被覆部I之表面溫度為70℃以上,則黏著材層充分軟化,且可使被覆部I能夠充分變形,若為180℃以下,則可抑制由熱收縮引起之褶皺之產生、或由熱引起之黏著材層之分解等弊端,故而較佳。 因此,較佳為於被覆部I之表面溫度為70~180℃之狀態下開始成形,其中更佳為使其成為75℃以上或150℃以下,其中更佳為使其成為80℃以上或120℃以下。 另一方面,於本步驟中,較佳為於上述被覆部I之儲存彈性模數E'(MF)為5.0×107
~1.0×1010
Pa之狀態下結束成形。 此處,所謂「結束成形」意指結束對黏著片材積層體施加成形壓力,若為模具成形,則意指打開模具。 若上述被覆部I之儲存彈性模數E'(MF)為5.0×107
Pa以上且1.0×1010
Pa以下之範圍,則成形後之形狀穩定性優異,故而較佳。 就該觀點而言,較佳為於上述被覆部I之儲存彈性模數E'(MF)為5.0×107
~1.0×1010
Pa之狀態下結束成形,其中更佳為於為1.0×108
Pa以上或8.0×109
Pa以下之狀態下結束成形,其中更佳為於為1.0×109
Pa以上或5.0×109
Pa以下之狀態下結束成形。 據此,於本步驟中,更佳為於上述被覆部I之儲存彈性模數E'(MF)為、5.0×107
~8.0×109
Pa、或5.0×107
~5.0×109
Pa之狀態下結束成形,其中,較佳為於為1.0×108
~8.0×109
Pa、或1.0×108
~5.0×109
Pa之狀態下結束成形,最佳為於為1.0×109
~8.0×109
Pa、或1.0×109
~5.0×109
Pa之狀態下結束成形。 進而,更佳為於上述被覆部I之儲存彈性模數E'(MF)處於上述範圍之狀態且黏著材層之儲存彈性模數G'(SF)為1.0×104
Pa以上之狀態下結束成形。 若於上述被覆部I之儲存彈性模數E'(MF)為上述範圍之狀態下結束成形,則可獲得如上所述之效果,除此以外,若於黏著材層之儲存彈性模數G'(SS)為1.0×104
Pa以上之狀態下結束成形,則所成形之黏著材層可維持形狀。 就該觀點而言,較佳為於上述被覆部I之儲存彈性模數E'(MF)處於上述範圍之狀態且黏著材層之儲存彈性模數G'(SF)為1.0×104
Pa以上之狀態下結束成形,其中,進而較佳為於黏著材層之儲存彈性模數G'(SF)為5.0×104
Pa以上或5.0×107
Pa以下之狀態下結束成形,其中進而較佳為於為1.0×104
Pa以上或1.0×107
Pa以下之狀態下結束成形。 又,較佳為於上述被覆部I之表面溫度成為未達50℃之狀態下結束成形。例如,於加壓成形之情形時,較佳為於表面溫度成為未達50℃之狀態下打開模具。 若被覆部I之表面溫度未達50℃,且被覆部I之儲存彈性模數E'(MS)為5.0×107
~1.0×1010
Pa之範圍,則可抑制成形結束後於取出成形體時發生變形、或伴隨被覆部I之熱收縮而產生翹曲,故而較佳。 就該觀點而言,較佳為於被覆部I之表面溫度成為未達50℃之狀態下結束成形,其中較佳為於成為0℃以上或45℃以下之狀態下結束成形,其中較佳為於成為10℃以上或40℃以下之狀態下結束成形。 進而,較佳為上述成形開始時之被覆部I之儲存彈性模數E'(MS)與上述成形結束時之被覆部I之儲存彈性模數E'(MF)滿足以下之關係式(1)。 (1)・・E'(MF)/E'(MS)≧1.3 此處,若上述被覆部I之儲存彈性模數E'(MS)與上述成形結束時之被覆部I之儲存彈性模數E'(MF)滿足上述關係式(1),則於成形開始時軟至能夠成形之程度,且於成形結束後具有能夠維持所成形之形狀之程度之硬度,故而較佳。 就該觀點而言,較佳為E'(MF)/E'(MS)≧1.3,其中進而較佳為100≧E'(MF)/E'(MS)或E'(MF)/E'(MS)≧3.0,其中尤佳為50≧E'(MF)/E'(MS)或E'(MF)/E'(MS)≧5.0。但E'(MF)/E'(MS)之上限並不限定於此。 又,較佳為上述成形結束時之被覆部I之儲存彈性模數E'(MF)與上述成形結束時之黏著材層之儲存彈性模數G'(SF)滿足以下之關係式(2)。 (2)・・E'(MF)/G'(SF)≦1.0×107
此處,若上述成形結束時之被覆部I之儲存彈性模數E'(MF)與上述成形結束時之黏著材層之儲存彈性模數G'(SF)滿足上述關係式(2),則所成形之黏著材層可維持形狀。 就該觀點而言,較佳為E'(MF)/G'(SF)≦1.0×107
,其中進而較佳為1.0≦E'(MF)/G'(SF)或E'(MF)/G'(SF)≦5.0×106
,其中進而較佳為1.0×101
≦E'(MF)/G'(SF)或E'(MF)/G'(SF)≦1.0×106
。 雖然有所重複,但於本製造方法1中,可利用模具加壓成形,於開模後加以冷卻,亦可預先將模具冷卻,於加壓成形之同時進行冷卻。若如此預先將模具冷卻,於加壓成形之同時進行冷卻,則可同時結束成形與冷卻。藉此,可於結束成形及冷卻後立即將賦形黏著片材積層體搬送至下一步驟,故而可連續地製造賦形黏著片材積層體。 於在模具成形之同時進行冷卻之情形時,模具之表面溫度較佳為0~50℃。 若模具之表面溫度為50℃以下,則可於短時間內固定黏著片材積層體之形狀,所獲得之成形體精度良好,且可抑制伴隨成形後之冷卻過程中之熱收縮之翹曲,就該觀點而言較佳。 因此,模具之表面溫度較佳為0~50℃,其中進而較佳為10℃以上或40℃以下,其中較佳為15℃以上或30℃以下。 再者,加壓壓力、加壓時間等加壓成形之條件並無特別限定,根據所成形之尺寸或形狀、所使用之材料等適當調整即可。 (其他) 上述成形、冷卻步驟中獲得之賦形黏著片材積層體可直接捲取,又,亦可進行熱處理,又,亦可裁斷為特定之大小及形狀。 於裁斷時,例如可列舉使用湯姆生刀(Thomson blade)或旋切刀等進行裁斷之方法。 於本製造方法1中,較佳為連續製造賦形黏著片材積層體。 例如可將黏著片材積層體搬送至加熱單元、例如加熱器中,於該加熱單元中將搬送停止特定時間進行加熱,或一邊搬送一邊加熱後,將經加熱之黏著片材積層體搬送至成形單元、例如成形模具中,於該成形單元中,例如藉由經冷卻之模具進行加壓,於成形之同時進行冷卻,進而視需要搬送至下一單元中,而連續地製造賦形黏著片材積層體。 <本製造方法2> 作為本發明之實施形態之一例,提出一種賦形黏著片材積層體之製造方法(稱為「本製造方法2」),該賦形黏著片材積層體係具備具有黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I,且於該黏著材之一面賦形凹部、凸部或凹凸部(稱為「黏著材層表面凹凸部」)而成之構成者,該製造方法之特徵在於:其係對具備黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I之黏著片材積層體進行加熱,利用模具將經加熱之黏著片材積層體成形而製造賦形黏著片材積層體之製造方法,且對黏著片材積層體進行加熱,於被覆部I之表面溫度為70~180℃之狀態下開始成形,於被覆部I之表面溫度成為未達60℃後從模具取出賦形黏著片材積層體。 根據本製造方法2,藉由對黏著片材積層體進行加熱,於被覆部I之表面溫度為70~180℃之狀態下開始成形,於被覆部I之表面溫度成為未達60℃後從模具取出賦形黏著片材積層體,而例如可於黏著材層表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀。 本製造方法2係包括加熱下文所述之黏著片材積層體(加熱步驟)、將經加熱之黏著片材積層體成形並且冷卻(成形、冷卻步驟)之步驟之製造方法。 本製造方法2只要包括上述加熱步驟及上述成形、冷卻步驟,則亦可包括其他步驟。例如可視需要包括熱處理步驟、搬送步驟、切條步驟、裁斷步驟等步驟。但並不限定於該等步驟。 (黏著片材積層體) 作為本製造方法2中之起始構件之黏著片材積層體具備黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I即可,亦可具備其他構件。例如,如圖1所示,可例示具備黏著材層、以可剝離之方式積層於該黏著材層之正面及背面之一側而成之被覆部I、及以可剝離之方式積層於該黏著材層之正面及背面之另一側而成之被覆部II之黏著片材積層體。但是否具備被覆部II為任意,亦可採用不積層被覆部II之構成。 再者,關於黏著片材積層體之詳細情況係如上文所述。 (加熱步驟) 於本步驟中,加熱上述黏著片材積層體而使被覆部I之表面溫度成為70~180℃。 若被覆部I之表面溫度為70℃以上,則黏著材層充分軟化,且可使被覆部I能夠充分變形,若為180℃以下,則可抑制由熱收縮引起之褶皺之產生、或由熱引起之黏著材層之分解等弊端,故而較佳。 就該觀點而言,較佳為加熱上述黏著片材積層體而使被覆部I之表面溫度成為70~180℃,其中更佳為使其成為75℃以上或150℃以下,其中更佳為使其成為80℃以上或120℃以下。 據此,更佳為加熱上述黏著片材積層體而使被覆部I之表面溫度成為70~150℃、或70~120℃,其中,進而較佳為使其成為75~150℃、或75~120℃,最佳為使其成為80~150℃、或80~120℃。 作為黏著片材積層體之加熱方法,例如可列舉:使黏著片材積層體存在於內部具備電熱加熱器等加熱體之上下之加熱板之間而從上下加熱之方法、或以加熱板直接夾持之方法、使用加熱輥之方法、將其浸漬於熱水中之方法等。但並不限定於該等方法。 (成形、冷卻步驟) 於本步驟中,較佳為於如上述般將被覆部I之表面溫度加熱至70~180℃之狀態下開始黏著片材積層體之成形。即,較佳為直接將積層黏著材層及被覆部I而成為一體之狀態之黏著片材積層體進行成形。藉此,可於將被覆部I成形之同時,亦介隔該被覆部I而將黏著材層成形。 於本步驟中,可於將經加熱之黏著片材積層體成形後進行冷卻,又,亦可於成形之同時進行冷卻。例如藉由利用經冷卻之模具進行加壓,可同時進行成形與冷卻並且同時結束。藉此,可如下文所述般連續地實施本製造方法2。 作為成形方法,只要可以一體方式對黏著片材積層體賦形凹凸形狀,則並不特別限定成形方法。例如可列舉:加壓成形、真空成形、壓空成形、利用輥進行之賦形(輥壓成形)、壓縮成形、利用積層進行之賦形等。其中,就成形性及加工性之觀點而言,尤佳為加壓成形。 於使用模具進行成形之情形時,模具之材質並無特別限定。例如可列舉聚矽氧樹脂或氟樹脂等樹脂系材料、不鏽鋼或鋁等金屬系材料等。其中,由於對被黏著體之凹凸賦形要求高精度之成形性,因此尤佳為能夠控制成形時之溫度之金屬系之模具。 模具之冷卻方法可採用通常進行之冷卻方法。例如可列舉水冷或利用壓縮空氣之冷卻方法。 對於模具,例如藉由如圖2所示,預先於開閉之一對模具中之至少一模具之內壁面設置特定之凹凸形狀,例如設置與黏著黏著材層之被黏著體之貼合面中的凹部、凸部或凹凸部相符之凹凸形狀,而可藉由使用該模具將黏著片材積層體進行加壓成形、真空成形、壓空成形或輥壓成形,將上述凹凸形狀轉印至黏著片材積層體而賦形。 如上所述,較佳為於上述被覆部I之表面溫度為70~180℃之狀態下開始成形。若該被覆部I之表面溫度為70℃以上,則黏著材層充分軟化,且可使被覆部I能夠充分變形,若為180℃以下,則可抑制由熱收縮引起之褶皺之產生、或由熱引起之黏著材層之分解等弊端,故而較佳。 因此,較佳為於被覆部I之表面溫度為70~180℃之狀態下開始成形,其中更佳為使其成為75℃以上或150℃以下,其中更佳為使其成為80℃以上或120℃以下。 另一方面,於本步驟中,較佳為於上述被覆部I之表面溫度成為未達60℃之狀態下結束成形。例如,於加壓成形之情形時,較佳為於表面溫度成為未達60℃之狀態下打開模具。 此處,所謂「結束成形」意指結束對黏著片材積層體施加成形壓力,若為模具成形,則意指打開模具。 若被覆部I之表面溫度未達60℃,則可抑制成形結束後於取出成形體時發生變形、或伴隨被覆部I之熱收縮而產生翹曲,故而較佳。 就該觀點而言,較佳為於被覆部I之表面溫度成為未達60℃之狀態下結束成形,其中較佳為於成為0℃以上或50℃以下之狀態下結束成形,其中較佳為於成為10℃以上或40℃以下之狀態下結束成形。 雖然有所重複,但於本製造方法2中,可利用模具加壓成形,於開模後加以冷卻,亦可預先將模具冷卻,於加壓成形之同時進行冷卻。若如此預先將模具冷卻,於加壓成形之同時進行冷卻,則可同時結束成形與冷卻。藉此,可於結束成形及冷卻後立即將賦形黏著片材積層體搬送至下一步驟,故而可連續地製造賦形黏著片材積層體。 於在模具成形之同時進行冷卻之情形時,模具之表面溫度較佳為未達60℃。 若模具之表面溫度未達60℃,則可於短時間內固定黏著片材積層體之形狀,所獲得之成形體精度良好,且可抑制伴隨成形後之冷卻過程中之熱收縮之翹曲,就該觀點而言較佳。 因此,模具之表面溫度較佳為未達60℃,其中進而較佳為0℃以上或50℃以下,其中進而較佳為10℃以上或40℃以下。 又,成形開始時與成形結束時之被覆部I之表面溫度之差較佳為10~100℃,其中進而較佳為20℃以上或90℃以下。藉由上述被覆部I之表面溫度之差為10~100℃,例如於將上述凹凸形狀轉印至黏著片材積層體而賦形時,可於結束成形及冷卻後立即將賦形黏著片材積層體搬送至下一步驟,故而可連續地製造賦形黏著片材積層體。 再者,加壓壓力、加壓時間等加壓成形之條件並無特別限定,根據所成形之尺寸或形狀、所使用之材料等適當調整即可。 (其他) 上述成形、冷卻步驟中獲得之賦形黏著片材積層體可直接捲取,又,亦可進行熱處理,又,亦可裁斷為特定之大小及形狀。 於裁斷時,例如可列舉使用湯姆生刀(Thomson blade)或旋切刀等進行裁斷之方法。 於本製造方法2中,較佳為連續製造賦形黏著片材積層體。 例如可將黏著片材積層體搬送至加熱單元、例如加熱器中,於該加熱單元中將搬送停止特定時間進行加熱,或一邊搬送一邊加熱後,將經加熱之黏著片材積層體搬送至成形單元、例如成形模具中,於該成形單元中,例如藉由經冷卻之模具進行加壓,於成形之同時進行冷卻,進而視需要搬送至下一單元中,而連續地製造賦形黏著片材積層體。 <用途> 此處,對本賦形黏著片材積層體1之利用用途之一例進行說明。 近年,隨著行動電話或智慧型手機、平板終端等通用化,因使用者失誤將其掉落等導致圖像顯示部受損之事例偏多。尤其是於圖像顯示裝置為觸控面板方式之情形時,不僅因破損而變得難以觀察到顯示,而且因物理障礙或水之滲入等導致觸控面板操作本身無法進行、或成為故障之原因。因此,存在進行僅更換圖像顯示部之維修、即修理之情形。 於圖像顯示裝置之維修中,於安裝新圖像顯示部時亦使用黏著片材。通常,維修較多情況下係修理作業者以手工作業進行,修理作業者必須熟練。即,若非熟練者,則於介隔黏著片材安裝圖像顯示部時,空氣會進入內部,或會擠出黏著材。 與此相對,若使用本賦形黏著片材積層體1,則由於可預先賦予精度較高之階差形狀等,因此例如藉由預先對黏著材層賦予與圖像顯示裝置之機種相對應之階差形狀,而可大幅簡化維修作業,無需修理作業者之熟練亦可實施。如上所述,本發明之黏著片材積層體可有用地用於圖像顯示裝置之維修。 <語句之說明> 於本說明書中,於表述為「X~Y」(X、Y為任意之數字)之情形時,若無特別說明,則表示「X以上且Y以下」之含義,並且亦包含「較佳為大於X」或「較佳為小於Y」之含義。 又,於表述為「X以上」(X為任意之數字)或「Y以下」(Y為任意之數字)之情形時,亦包含「較佳為大於X」或「較佳為未達Y」之含義。 於本發明中,片材與膜之邊界並不確定,於本發明中不必於文語上將兩者加以區別,故而於本發明中,稱為「膜」之情形時亦包含「片材」,稱為「片材」之情形時亦包含「膜」。 實施例 以下,藉由實施例進一步具體地說明本發明。但本發明並不限定於實施例。 [實施例、比較例之群1] <被覆部1-I> 實施例1-1~1-3及比較例1-1(以下亦統稱為「實施例、比較例之群1」)中之黏著片材積層體之被覆部1-I使用以下之被覆部1-A~被覆部1-D。將各自之儲存彈性模數之值示於表1。 ・被覆部1-A:於雙軸延伸間苯二甲酸共聚合PET膜(厚度:75 μm)之單面積層包含聚矽氧系化合物之離型層(厚度:2 μm)而成之膜。 ・被覆部1-B:於包含4-甲基戊烯-1之未延伸之聚烯烴膜(厚度:50 μm)之單面積層包含改性聚烯烴之離型層(厚度:38 μm)而成之膜。 ・被覆部1-C:包含含有未延伸聚丙烯之聚烯烴膜(厚度:70 μm)之膜。 ・被覆部1-D:於雙軸延伸均聚PET膜(厚度:75 μm)之單面積層包含聚矽氧系化合物之離型層(厚度:2 μm)而成之膜。 <實施例1-1> (雙面黏著片材之製作) 將作為(甲基)丙烯酸系共聚物(1-a)之數量平均分子量2400之聚甲基丙烯酸甲酯巨單體(Tg:105℃)15質量份(18 mol%)、丙烯酸丁酯(Tg:-55℃)81質量份(75 mol%)及丙烯酸(Tg:106℃)4質量份(7 mol%)無規共聚合而成之丙烯酸系共聚物(1-a-1)(重量平均分子量23萬)1 kg、作為交聯劑(1-b)之甘油二甲基丙烯酸酯(日油公司製造,製品名:GMR)(1-b-1)90 g、及作為光聚合起始劑(1-c)之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造,製品名:Esacure TZT)(1-c-1)15 g均勻地混合,而製作黏著材層所使用之樹脂組合物1-1。所獲得之樹脂組合物之玻璃轉移溫度為-5℃。 利用經離型處理之PET膜(三菱樹脂公司製造,製品名:Diafoil MRV-V06,厚度:100 μm)與被覆部1-A之2片將所獲得之樹脂組合物1-1夾持,使用貼合機以樹脂組合物1-1之厚度成為100 μm之方式賦形為片材狀,而製作黏著片材積層體1-1。再者,以與樹脂組合物1-1相接之方式配置被覆部1-A之離型層側。 所獲得之黏著片材積層體1-1係使用真空壓空成形機(第一實業公司製造,FKS-0632-20形),藉由以下之製程進行熱成形,而製作賦形黏著片材積層體1-1。 即,藉由預熱為400℃之IR加熱器,加熱至黏著片材積層體1-1之表面達到100℃,繼而使用冷卻為25℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,而製作對表面賦形凹凸而成之賦形黏著片材積層體1-1。 <實施例1-2> 使用被覆部1-B代替上述被覆部1-A,除此以外,以與實施例1-1同樣之方式,製作黏著片材積層體1-2及賦形黏著片材積層體1-2。 <實施例1-3> 使用被覆部1-C代替上述被覆部1-A,除此以外,以與實施例1-1同樣之方式,製作黏著片材積層體1-3及賦形黏著片材積層體1-3。 <比較例1-1> 使用被覆部1-D代替上述被覆部1-A,除此以外,以與實施例1-1同樣之方式,製作黏著片材積層體1-4及賦形黏著片材積層體1-4。 <測定及評價方法> 對實施例1-1~1-3、比較例1-1中獲得之樣品之各種物性值之測定方法及評價方法進行說明。 (被覆部之彈性模數) 將實施例、比較例之群1所使用之被覆部1-A~1-D分別切成長度50 mm、寬度4 mm,使用動態黏彈性裝置(IT Meter and Control股份有限公司之DVA-200),以夾頭間距為25 mm並且施加1%之形變而進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。將所獲得之資料的於100℃下之儲存彈性模數之值設為E'(MA),將於30℃下之儲存彈性模數之值設為E'(MB)。 (黏著材層之彈性模數) 將實施例、比較例之群1中獲得之黏著材層重疊而積層為1 mm之厚度,使用流變儀(Thermo Fisher Scientific公司製造之MARSII)進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。 將所獲得之資料的於100℃下之儲存彈性模數之值設為G'(SA),將損耗彈性模數之值設為G''(SA),將於30℃下之儲存彈性模數之值設為G'(SB),將損耗彈性模數之值設為G''(SB),將各溫度條件下之G''/G'之值設為各黏著材層之損耗正切tanδ(SA,SB)。 (凝膠分率) 黏著材層之凝膠分率係分別採集約0.05 g之實施例、比較例之群1中獲得之黏著材層,藉由預先測定質量(X)之SUS絲網(#200)包裹為袋狀,將袋口彎折封閉,測定該包裹之質量(Y)後,將其浸漬於100 ml之乙酸乙酯中,於23℃下在暗處保管24小時後,取出包裹於70℃下加熱4.5小時而使所附著之乙酸乙酯蒸發,測定經乾燥之包裹之質量(Z),將所求出之質量代入下述式中而求出。 凝膠分率[%]=[(Z-X)/(Y-X)]×100 (成形性) 為了確認成形性,而使用以下所說明之模具實施實施例、比較例之群1之成形測試。即,如圖5所示,成形用之模具之上下一模具為長度270 mm、寬度170 mm、厚度40 mm之凸模具,上下另一模具為長度270 mm、寬度170 mm、厚度40 mm之鋁平板。 對於上述凸模具之成形面,如圖5所示,於中央設置縱187 mm、橫125 mm、高1 mm之凸部,進而,於該凸部之成形面內設置深度為25 μm、50 μm、75 μm、100 μm之4個俯視長方形狀(縱89 mm、橫58 mm)之成形凹部。 將藉由實施例、比較例之群1所記載之方法獲得之賦形有凹凸之賦形黏著片材積層體之被覆部1-A~1-D剝離,分別使用掃描式白色干涉顯微鏡,以非接觸方式計測相當於印刷階差之凹部與相當於顯示器面之凸部之高度。 計測成形體之凸部(與凹部之邊界部)相對於模具之深度100 μm之高度h,將由下述計算式導出之轉印率為50%以上者評價為○,將未達50%者評價為×。 轉印率(%)=h(成形體高度)/100(模具深度)×100 (剝離力) 將實施例、比較例之群1中所製作之黏著片材積層體切成長度150 mm、寬度50 mm,對被覆部1-A~1-D與黏著材層之界面以試驗速度300 mm/min進行180°剝離試驗。 將30℃環境下之剝離力設為F(C),將於100℃下加熱5分鐘後使其自然冷卻至30℃後之剝離力設為F(D),以所獲得之值分別作為被覆部1-A~1-D之剝離力。 將實施例及比較例中獲得之黏著片材積層體1-1~1-4及賦形黏著片材積層體1-1~1-4之評價結果示於表1。 [表1]
根據表1及圖4之結果以及至此為止之試驗結果,確認到如實施例1-1至實施例1-3所示,藉由將於30℃下之儲存彈性模數E'(MB)為5.0×107
~1.0×1010
Pa且於100℃下之儲存彈性模數E'(MA)為1.0×106
~2.0×109
Pa之被覆部積層於黏著材層進行成形,而可對黏著材層高精度地賦形凹凸形狀。 另一方面,如比較例1-1所示,於使用通常廣泛使用之雙軸延伸均聚PET膜作為離型膜之情形時,即使於高溫範圍內被覆部之儲存彈性模數亦超過2.0×109
Pa,故而即使進行熱成形亦無法對黏著材層賦形充分之凹凸。 由此得知,藉由將於30℃下之儲存彈性模數E'(MB)為5.0×107
~1.0×1010
Pa且於100℃下之儲存彈性模數E'(MA)為1.0×106
~2.0×109
Pa之被覆部積層於黏著材層進行成形,而可良好地獲得賦形有凹凸之賦形黏著片材。 亦得知:藉由使用進而較佳為滿足黏著材層於100℃下之損耗正切tanδ(A)為1.0以上之條件且滿足黏著材層於30℃下之損耗正切tanδ(B)未達1.0之條件之黏著片材積層體,而可達成更高精度之賦形。 因此確認,藉由使用如上述之黏著片材積層體,精度良好地賦形相當於成為被黏著體之圖像顯示裝置之印刷階差的凹凸,而可製造與被黏著體之間無間隙、且即使於如印刷部為窄邊緣設計之被黏著體中黏著材亦可不溢出而良好地密接貼合之圖像顯示裝置用賦形黏著片材積層體。 又,就剝離力而言,測定剝離力F(D)時之加熱冷卻條件、即於100℃下加熱5分鐘後使其自然冷卻至30℃之條件係製造賦形黏著片材積層體時之典型之加熱冷卻條件。由於上述實施例中剝離力F(C)與剝離力F(D)之差之絕對值均為0.1 N/cm以下,故而確認賦形黏著片材積層體中之被覆部1-A~1-D之剝離力與黏著片材積層體中之被覆部1-A~1-D之剝離力相同。 [實施例、比較例之群2] <被覆部2-I> 作為實施例2-1~2-4及比較例2-1(以下亦統稱為「實施例、比較例之群2」)中之黏著片材積層體之被覆部I,使用於雙軸延伸間苯二甲酸共聚合PET膜(厚度:75 μm)之單面積層包含聚矽氧系化合物之離型層(厚度:2 μm)而成之膜。將各自之儲存彈性模數之值示於表2。 <實施例2-1> (雙面黏著片材之製作) 將作為(甲基)丙烯酸系共聚物(2-a)之數量平均分子量2400之聚甲基丙烯酸甲酯巨單體(Tg:105℃)15質量份(18 mol%)、丙烯酸丁酯(Tg:-55℃)81質量份(75 mol%)及丙烯酸(Tg:106℃)4質量份(7 mol%)無規共聚合而成之丙烯酸系共聚物(2-a-1)(重量平均分子量23萬)1 kg、作為交聯劑(2-b)之甘油二甲基丙烯酸酯(日油公司製造,製品名:GMR)(2-b-1)90 g、及作為光聚合起始劑(2-c)之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造,製品名:Esacure TZT)(2-c-1)15 g均勻地混合,而製作黏著材層所使用之樹脂組合物2-1。所獲得之樹脂組合物之玻璃轉移溫度為-5℃。 利用經離型處理之PET膜(三菱樹脂公司製造,製品名:Diafoil MRV-V06,厚度:100 μm)與被覆部2-I之2片將所獲得之樹脂組合物2-1夾持,使用貼合機以樹脂組合物2-1之厚度成為100 μm之方式賦形為片材狀,而製作黏著片材積層體2-1。再者,以與樹脂組合物2-1相接之方式配置被覆部2-I之離型層側。 所獲得之黏著片材積層體2-1係使用真空壓空成形機(第一實業公司製造,FKS-0632-20形)及成形用模具,藉由以下之製程進行熱成形,而製作賦形黏著片材積層體2-1。 關於成形用之模具,如圖5所示,上下一模具為長度270 mm、寬度170 mm、厚度40 mm之凸模具,上下另一模具為長度270 mm、寬度170 mm、厚度40 mm之鋁平板。對於上述凸模具之成形面,如圖5所示,於中央設置縱187 mm、橫125 mm、高1 mm之凸部,進而,於該凸部之成形面內設置深度為25 μm、50 μm、75 μm、100 μm之4個俯視長方形狀(縱89 mm、橫58 mm)之成形凹部。 藉由預熱為400℃之IR加熱器,加熱至黏著片材積層體2-1之被覆部2-I之表面達到100℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為2.1×108
Pa且黏著材層之儲存彈性模數G'(SS)為2.9×102
Pa之狀態下,使用將模具表面溫度冷卻為30℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-1。 再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為13.3。 又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為4.6×104
。 又,成形開始時之黏著材層之損耗正切tanδ(SS)為4.8,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。 <實施例2-2> 對於實施例2-1所使用之黏著片材積層體2-1,使用預熱為400℃之IR加熱器,加熱至黏著片材積層體2-2之被覆部2-I之表面達到110℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為1.3×108
Pa且黏著材層之儲存彈性模數G'(SS)為9.6×101
Pa之狀態下,使用將模具表面溫度冷卻為30℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-2。 <實施例2-3> 對於實施例2-1所使用之黏著片材積層體2-1,使用預熱為400℃之IR加熱器,加熱至黏著片材積層體2-3之被覆部2-I之表面達到90℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為3.5×108
Pa且黏著材層之儲存彈性模數G'(SS)為8.9×102
Pa之狀態下,使用將模具表面溫度冷卻為30℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-3。 再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為8.0。 又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為4.6×104
。 又,成形開始時之黏著材層之損耗正切tanδ(SS)為2.7,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。 <實施例2-4> 對於實施例2-1所使用之黏著片材積層體2-1,使用預熱為400℃之IR加熱器,加熱至黏著片材積層體2-4之被覆部2-I之表面達到70℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為1.9×109
Pa且黏著材層之儲存彈性模數G'(SS)為6.4×103
Pa之狀態下,使用將模具表面溫度冷卻為25℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-4。 再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為1.4。 又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為4.6×104
。 又,成形開始時之黏著材層之損耗正切tanδ(SS)為1.4,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。 <比較例2-1> 對於實施例2-1所使用之黏著片材積層體2-1,使用預熱為400℃之IR加熱器,加熱至黏著片材積層體2-5之被覆部2-I之表面達到60℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為2.4×109
Pa且黏著材層之儲存彈性模數G'(SS)為1.3×104
Pa之狀態下,使用將模具表面溫度冷卻為25℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-5。 再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為1.2。 又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為4.6×104
。 又,成形開始時之黏著材層之損耗正切tanδ(SS)為1.1,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。 再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為8.0。 又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為9.7×103
。 又,成形開始時之黏著材層之損耗正切tanδ(SS)為0.6,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。 <測定及評價方法> 對實施例2-1~2-4、比較例2-1中獲得之樣品之各種物性值之測定方法及評價方法進行說明。 (被覆部之彈性模數) 被覆部2-I之儲存彈性模數E'(MS)及E'(MF)係切成長度50 mm、寬度4 mm,使用動態黏彈性裝置(IT Meter and Control股份有限公司之DVA-200),以夾頭間距為25 mm並且施加1%之形變而進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。 將實施例及比較例之各成形開始時溫度下之儲存彈性模數之值設為E'(MS),將各成形結束時溫度下之儲存彈性模數之值設為E'(MF)。 再者,於實施例2-1中,由於成形開始時溫度為100℃,因此實施例2-1之儲存彈性模數E'(MS)係於100℃下之儲存彈性模數E'(MA)。 又,由於實施例、比較例之群2中成形結束時溫度均為30℃,因此關於任一實施例、比較例之群2,該E'(MF)均與30℃下之儲存彈性模數E'(MB)相同。 (黏著材層之彈性模數) 將實施例、比較例之群2中獲得之黏著材層重疊而積層為1 mm之厚度,使用流變儀(Thermo Fisher Scientific公司製造之MARSII)進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。 於所獲得之資料中,將100℃下之儲存彈性模數之值設為G'(SA),將損耗彈性模數之值設為G''(SA),將30℃下之儲存彈性模數之值設為G'(SB),將損耗彈性模數之值設為G''(SB),將各溫度條件下之G''/G'之值設為各黏著材層之損耗正切tanδ(SA,SB)。 另一方面,關於黏著材層之儲存彈性模數G'(SA)及G'(SB),將實施例、比較例之群2中獲得之黏著材層重疊而積層為1 mm之厚度,使用流變儀(Thermo Fisher Scientific公司製造之MARSII)進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。 於所獲得之資料中,將實施例、比較例之群2之各成形開始時溫度下的儲存彈性模數之值設為G'(SS),將損耗彈性模數之值設為G''(SS),將各成形結束時溫度下之儲存彈性模數之值設為G'(SF),將損耗彈性模數之值設為G''(SF),進而,將各溫度條件下之G''/G'之值設為各黏著材層之損耗正切tanδ(SS,SF)。 (凝膠分率) 關於黏著材層之凝膠分率,分別採集約0.05 g之實施例、比較例之群2中獲得之黏著材層,藉由預先測定質量(X)之SUS絲網(#200)包裹為袋狀,將袋口彎折封閉,測定該包裹之質量(Y)後,將其浸漬於100 ml之乙酸乙酯中,於23℃下在暗處保管24小時後,取出包裹於70℃下加熱4.5小時而使所附著之乙酸乙酯蒸發,測定經乾燥之包裹之質量(Z),將所求出之質量代入下述式中而求出。 凝膠分率[%]=[(Z-X)/(Y-X)]×100 (成形性) 將實施例、比較例之群2中獲得之賦形有凹凸之賦形黏著片材積層體之被覆部I剝離,分別使用掃描式白色干涉顯微鏡,以非接觸方式計測相當於印刷階差之凹部與相當於顯示器面之凸部之高度。 計測成形體之凸部(與凹部之邊界部)相對於模具之深度100 μm之高度h,將由下述計算式導出之轉印率為50%以上者評價為○,將未達50%者評價為×。 轉印率(%)=h(成形體高度)/100(模具深度)×100 (剝離力) 將實施例、比較例之群2中所製作之黏著片材積層體切成長度150 mm、寬度50 mm,對被覆部2-I與黏著材層之界面以試驗速度300 mm/min進行180°剝離試驗。 將30℃環境下之剝離力設為F(C),將於100℃下加熱5分鐘後使其自然冷卻至30℃後之剝離力設為F(D),以所獲得之值分別作為被覆部2-I之剝離力。 將實施例2-1~2-4及比較例2-1中獲得之賦形黏著片材積層體2-1~2-5之評價結果示於表2。 [表2]
根據表2及圖4之結果以及至此為止之試驗結果,確認到如實施例2-1至實施例2-4所示,藉由以成形開始時之被覆部2-I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa,且成形結束時之被覆部2-I之儲存彈性模數E'(MF)成為5.0×107
~1.0×1010
Pa之方式調整並進行成形,可對黏著材層高精度地賦形凹凸形狀。 另一方面,如比較例2-1所示,於成形開始時之被覆部2-I之儲存彈性模數E'(MS)大於2.0×109
Pa之情形時,即使進行熱成形亦無法對黏著材層賦形充分之凹凸。 由此得知,藉由以成形開始時之被覆部2-I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa且成形結束時之被覆部2-I之儲存彈性模數E'(MF)成為5.0×107
~1.0×1010
Pa之方式調整並進行成形,而可良好地獲得賦形有凹凸之賦形黏著片材。 亦得知:藉由以進而較佳為滿足成形開始時之黏著材層之損耗正切tanδ(SS)為1.0以上之條件且滿足成形結束時之黏著材層之損耗正切tanδ(SF)未達1.0之條件之方式調整並進行成形,而可達成更高精度之賦形。 因此確認,藉由使用如上述之黏著片材積層體,精度良好地賦形相當於成為被黏著體之圖像顯示裝置之印刷階差的凹凸,而可製造與被黏著體之間無間隙、且即使於如印刷部為窄邊緣設計之被黏著體中黏著材亦可不溢出而良好地密接貼合之圖像顯示裝置用賦形黏著片材積層體。 又,就剝離力而言,測定剝離力F(D)時之加熱冷卻條件、即於100℃下加熱5分鐘後使其自然冷卻至30℃之條件係製造賦形黏著片材積層體時之典型之加熱冷卻條件。由於上述實施例中剝離力F(C)與剝離力F(D)之差之絕對值均為0.1 N/cm以下,因此確認剝離力於加熱前後幾乎無變化。 進而得知,藉由加熱黏著片材積層體,於被覆部2-I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之狀態下開始成形,於被覆部2-I之儲存彈性模數E'(MF)為5.0×107
~1.0×1010
Pa之狀態下結束成形,而可於黏著材層表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀。 [實施例、比較例之群3] <被覆部3-I> 作為實施例3-1~3-3及比較例3-1~3-2(以下亦統稱為「實施例、比較例之群3」)中之黏著片材積層體之被覆部3-I,使用於雙軸延伸間苯二甲酸共聚合PET膜(厚度:75 μm)之單面積層包含聚矽氧系化合物之離型層(厚度:2 μm)而成之膜。將各自之儲存彈性模數之值示於表3。 <實施例3-1> (雙面黏著片材之製作) 將作為(甲基)丙烯酸系共聚物(3-a)之數量平均分子量2400之聚甲基丙烯酸甲酯巨單體(Tg:105℃)15質量份(18 mol%)、丙烯酸丁酯(Tg:-55℃)81質量份(75 mol%)及丙烯酸(Tg:106℃)4質量份(7 mol%)無規共聚合而成之丙烯酸系共聚物(3-a-1)(重量平均分子量23萬)1 kg、作為交聯劑(3-b)之甘油二甲基丙烯酸酯(日油公司製造,製品名:GMR)(3-b-1)90 g、及作為光聚合起始劑(3-c)之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造,製品名:Esacure TZT)(3-c-1)15 g均勻地混合,而製作黏著材層所使用之樹脂組合物3-1。所獲得之樹脂組合物之玻璃轉移溫度為-5℃。 利用經離型處理之PET膜(三菱樹脂公司製造,製品名:Diafoil MRV-V06,厚度:100 μm)與被覆部3-I之2片將所獲得之樹脂組合物3-1夾持,使用貼合機以樹脂組合物3-1之厚度成為100 μm之方式賦形為片材狀,而製作黏著片材積層體3-1。再者,以與樹脂組合物3-1相接之方式配置被覆部3-I之離型層側。 所獲得之黏著片材積層體3-1係使用真空壓空成形機(第一實業公司製造,FKS-0632-20形)及成形用模具,藉由以下之製程進行熱成形,而製作賦形黏著片材積層體3-1。 關於成形用之模具,如圖5所示,上下一模具為長度270 mm、寬度170 mm、厚度40 mm之凸模具,上下另一模具為長度270 mm、寬度170 mm、厚度40 mm之鋁平板。對於上述凸模具之成形面,如圖5所示,於中央設置縱187 mm、橫125 mm、高1 mm之凸部,進而,於該凸部之成形面內設置深度為25 μm、50 μm、75 μm、100 μm之4個俯視長方形狀(縱89 mm、橫58 mm)之成形凹部。 藉由預熱為400℃之IR加熱器,加熱至黏著片材積層體3-1之被覆部3-I之表面達到100℃,使用將模具表面溫度冷卻為30℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-1。 <實施例3-2> 使用預熱為400℃之IR加熱器,將實施例3-1中所使用之黏著片材積層體3-1加熱至黏著片材積層體3-2之被覆部3-I之表面達到70℃,使用將模具表面溫度冷卻為30℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-2。 <實施例3-3> 使用預熱為400℃之IR加熱器,將實施例3-1中所使用之黏著片材積層體3-1加熱至黏著片材積層體3-3之被覆部3-I之表面達到100℃,使用將模具表面溫度調整為50℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-3。 <比較例3-1> 使用預熱為400℃之IR加熱器,將實施例3-1中所使用之黏著片材積層體3-1加熱至黏著片材積層體3-5之被覆部3-I之表面達到60℃,使用將模具表面溫度冷卻為30℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-4。 <比較例3-2> 使用預熱為400℃之IR加熱器,將實施例3-1中所使用之黏著片材積層體3-1加熱至黏著片材積層體3-5之被覆部3-I之表面達到100℃,使用將模具表面溫度調整為80℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-5。 <測定及評價方法> 對實施例3-1~3-3及比較例3-1~3-2中獲得之樣品之各種物性值之測定方法及評價方法進行說明。 (被覆部之彈性模數) 被覆部3-I之儲存彈性模數係切成長度50 mm、寬度4 mm,使用動態黏彈性裝置(IT Meter and Control股份有限公司之DVA-200),以夾頭間距為25 mm並且施加1%之形變而進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。 於所獲得之資料中,將30℃下之被覆部3-I之儲存彈性模數之值設為E'(MB),將100℃下之被覆部3-I之儲存彈性模數之值設為E'(MA)。 (黏著材層之彈性模數) 將實施例、比較例之群3中獲得之黏著材層重疊而積層為1 mm之厚度,使用流變儀(Thermo Fisher Scientific公司製造之MARSII)進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。 於所獲得之資料中,將100℃下之儲存彈性模數之值設為G'(SA),將損耗彈性模數之值設為G''(SA),將30℃下之儲存彈性模數之值設為G'(SB),將損耗彈性模數之值設為G''(SB),將各溫度條件下之G''/G'之值設為各黏著材層之損耗正切tanδ(SA,SB)。 (成形性) 將實施例、比較例之群3中獲得之賦形有凹凸之賦形黏著片材積層體之被覆部I剝離,分別使用掃描式白色干涉顯微鏡,以非接觸方式計測相當於印刷階差之凹部與相當於顯示器面之凸部之高度。 計測成形體之凸部(與凹部之邊界部)相對於模具之深度100 μm之高度h,將由下述計算式導出之轉印率為50%以上者評價為「○」,將未達50%者評價為「×」。 轉印率(%)=h(成形體高度)/100(模具深度)×100 (翹曲、彎曲) 將實施例、比較例之群3之各成形條件下所製作之黏著片材積層體切成長度100 mm之正方形,計測各頂點之高度。將所獲得之4點之高度進行平均而以該值作為翹曲。將翹曲之高度未達10 mm者判定為「○」,將為10 mm以上者判定為「×」。 (剝離力) 將實施例、比較例之群3中所製作之黏著片材積層體切成長度150 mm、寬度50 mm,對被覆部3-I與黏著材層之界面以試驗速度300 mm/min進行180°剝離試驗。 將30℃環境下之剝離力設為F(C),將於100℃下加熱5分鐘後使其自然冷卻至30℃後之剝離力設為F(D),以所獲得之值分別作為被覆部3-I之剝離力。 將實施例3-1~3-3及比較例3-1~3-2中獲得之賦形黏著片材積層體3-1~3-5之評價結果示於表3。 [表3]
根據表3之結果以及至此為止之試驗結果,確認到如實施例3-1至實施例3-3所示,藉由以於被覆部3-I之表面溫度為70~180℃之狀態下開始成形,於被覆部3-I之表面溫度成為未達60℃後結束成形,並從模具取出成形品之方式進行成形,而可對黏著材層高精度地賦形凹凸形狀。 另一方面,如比較例3-1所示,若成形開始時之被覆部3-I之溫度未達70℃,則即使進行熱成形亦無法對黏著材層賦形充分之凹凸。 又,得知如比較例3-2所示,若於結束成形並從模具取出成形品時被覆部3-I之表面溫度為70℃以上,則伴隨片材之熱收縮,成形品會產生翹曲或彎曲而欠佳。 由此得知,為了更高精度地進行凹凸賦形,較佳為以於被覆部3-I之表面溫度為70~180℃之狀態下開始成形,於被覆部3-I之表面溫度成為未達60℃後結束成形,並從模具取出成形品之方式進行成形。 因此確認,藉由使用如上述之黏著片材積層體,精度良好地賦形相當於成為被黏著體之圖像顯示裝置之印刷階差的凹凸,而可製造與被黏著體之間無間隙、且即使於如印刷部為窄邊緣設計之被黏著體中黏著材亦可不溢出而良好地密接貼合之圖像顯示裝置用賦形黏著片材積層體。 又,就剝離力而言,測定剝離力F(D)時之加熱冷卻條件、即於100℃下加熱5分鐘後使其自然冷卻至30℃之條件係製造賦形黏著片材積層體時之典型之加熱冷卻條件。由於上述實施例中剝離力F(C)與剝離力F(D)之差之絕對值均為0.1 N/cm以下,因此確認剝離力於加熱前後幾乎無變化。 [實施例之群4] 以下之實施例4-1~4-5(以下亦統稱為「實施例之群4」)中所使用之聚酯原料之製造方法如下所述。 (聚酯4-A之製造方法) 取對苯二甲酸二甲酯100份、乙二醇70份、及乙酸鈣一水合物0.07份置於反應器中,進行加熱升溫並且將甲醇蒸餾去除而進行酯交換反應,反應開始後,需要約4個半小時升溫為230℃,而實質性地結束酯交換反應。 繼而,添加磷酸0.04份及三氧化銻0.035份,按照常規方法進行聚合。即,緩緩提高反應溫度,最終設為280℃,另一方面,緩緩降低壓力,最終設為0.05 mmHg。4小時後,結束反應,按照常規方法進行碎片化而獲得聚酯4-A。所獲得之聚酯碎片之極限黏度IV為0.70 dl/g。 (聚酯4-B之製造方法) 於上述聚酯4-A之製造方法中,作為二羧酸單元,將對苯二甲酸設為78 mol%,將間苯二甲酸設為22 mol%,除此以外,藉由與聚酯A相同之方法進行製造而獲得聚酯4-B。所獲得之聚酯碎片之極限黏度IV為0.70 dl/g。 (聚酯4-C之製造方法) 於製造上述聚酯4-A時,添加平均粒徑3 μm之非晶質二氧化矽6000 ppm,而製作聚酯4-C。 (聚酯4-D之製造方法) 於製造上述聚酯4-A時,添加平均粒徑4 μm之非晶質二氧化矽6000 ppm,而製作聚酯4-D。 [實施例4-1] 藉由熔融擠出機將分別以65重量%、30重量%、5重量%之比例混合上述聚酯4-B、4-A、及4-D而成之原料熔融擠出,而獲得單層之無定形片材。 繼而,將片材共擠出至經冷卻之流延鼓上,使其冷卻固化而獲得無配向片材。繼而,於80℃下沿機械方向(縱向)延伸3.4倍後,進一步於拉輻機內經過預熱步驟,而於80℃下沿與機械方向垂直之方向(橫向)延伸3.9倍。進行雙軸延伸後,於185℃下進行3秒之熱處理,其後沿寬度方向進行6.4%之鬆弛處理,而獲得厚度50 μm之聚酯膜。將評價結果示於下述表4。 [實施例4-2]、[實施例4-3] 除了變更為下述表4所示之條件以外,以與實施例4-1相同之方式獲得聚酯膜。將評價結果示於下述表4。 [實施例4-4] 以將上述聚酯4-A及4-C分別以86重量%、14重量%之比例混合而成之原料作為表層用之原料,以將聚酯4-B及4-A分別以45重量%、55重量%之比例混合而成之原料作為中間層用之原料。分別藉由不同之熔融擠出機熔融擠出,而獲得2種3層積層(表層/中間層/表層)之無定形片材。 繼而,藉由將片材共擠出至經冷卻之流延鼓上,並使其冷卻固化,而獲得無配向片材。繼而,於82℃下沿機械方向(MD)延伸3.4倍後,進一步於拉輻機內經過預熱步驟,而於110℃下沿與機械方向垂直之方向(寬度方向,TD)延伸3.9倍。進行雙軸延伸後,於210℃下進行3秒之熱處理,其後沿寬度方向進行2.4%之鬆弛處理,而獲得厚度50 μm之聚酯膜。將評價結果示於下述表4。 [實施例4-5] 除了變更為下述表4所示之條件以外,以與實施例4-4相同之方式獲得聚酯膜。將評價結果示於下述表4。 <測定及評價方法> 對實施例之群4中獲得之樣品之各種物性值之測定方法及評價方法進行說明。 (1)儲存彈性模數(E') 關於實施例之群4中獲得之膜,以長度方向成為機械方向之方式採集長度方向30 mm×寬度方向5 mm之樣品。繼而,使用動態黏彈性裝置(IT Meter and Control公司製造之「DVA-220」),將樣品夾持於將間隔設置為20 mm之夾頭而加以固定後,以升溫速度10℃/min從常溫升溫至200℃,於頻率10 Hz下測定儲存彈性模數。根據所獲得之資料,讀取100℃下之儲存彈性模數。 (2)加熱收縮率 從實施例之群4中獲得之膜之寬度方向中央位置起,以樣品長度方向成為測定方向之方式將樣品切成短條狀(15 mm寬×150 mm長),於無張力狀態、120℃環境下熱處理5分鐘,測定熱處理前後之樣品之長度,藉由下述式計算膜之熱收縮率(%)。再者,下述式中之a為熱處理前之樣品長度,b為熱處理後之樣品長度。 加熱收縮率(%)=[(a-b)/a]×100 (3)加熱處理後之膜表面低聚物量 對於實施例之群4中獲得之膜,於氮氣環境下藉由180℃之熱風循環烘箱將聚酯膜處理10分鐘。使熱處理後之聚酯膜之表面與DMF(二甲基甲醯胺)接觸3分鐘,使析出至表面之低聚物溶解。該操作可採用於例如關於聚烯烴等合成樹脂製食品容器包裝等之自願性基準中,於溶出試驗中之單面溶出法所使用之溶出用器具中所記載之方法。 繼而,視需要藉由稀釋等方法調整所獲得之DMF之濃度,供給於液相層析儀(島津LC-2010)而求出DMF中之低聚物量,該值除以接觸DMF之膜面積,作為膜表面低聚物量(mg/cm2
)。 DMF中之低聚物量係根據標準試樣峰面積與測定試樣峰面積之峰面積比求出(絕對校準曲線法)。 標準試樣之製作係準確地稱量預先分取之低聚物(環狀三聚物),溶解於經準確地稱量之DMF中而製作。標準試樣之濃度較佳為0.001~0.01 mg/ml之範圍。 (4)成型加工適性 將作為(甲基)丙烯酸系共聚物之數量平均分子量2400之聚甲基丙烯酸甲酯巨單體(Tg:105℃)15質量份(18 mol%)、丙烯酸丁酯(Tg:-55℃)81質量份(75 mol%)及丙烯酸(Tg:106℃)4質量份(7 mol%)無規共聚合而成之丙烯酸系共聚物(重量平均分子量23萬)1 kg、作為交聯劑之甘油二甲基丙烯酸酯(日油公司製造,製品名:GMR)(b-1)90 g、及作為光聚合起始劑之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造,製品名:Esacure TZT)15 g均勻地混合,而製作黏著片材所使用之樹脂組合物。 利用2片由實施例之群4所示之聚酯膜獲得之離型膜上下夾持所獲得之樹脂組合物(上下之組合設為以相同之離型膜彼此夾持),使用貼合機以樹脂組合物之厚度成為100 μm之方式賦形為片材狀,而製作黏著片材積層體。再者,以與樹脂組合物相接之方式配置聚酯膜之離型層側。 所獲得之黏著片材積層體係使用真空壓空成形機(第一實業公司製造,FKS-0632-20形),藉由以下之製程進行熱成形,而製作賦形黏著片材積層體。即,藉由預熱為400℃之IR加熱器,加熱至黏著片材積層體之表面達到100℃,繼而使用冷卻為25℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,而製作對表面賦形凹凸而成之賦形黏著片材積層體。 將賦形有凹凸之賦形黏著片材積層體之聚酯膜剝離,分別使用掃描式白色干涉顯微鏡,以非接觸方式計測賦形黏著片材之凹部與凸部之高度,將成形體之高度設為h。 計測成形體之凸部相對於模具之深度100 μm之高度h,將由下述計算式導出之轉印率為70%以上者評價為○,將為50%以上且未達70%者評價為△,將未達50%者評價為×。 轉印率(%)=h(成形體高度)/100(模具深度)×100 (5)黏著層外觀(褶皺) 藉由以下所示之評價方法分別評價藉由(4)所記載之方法獲得之加壓成型前的黏著層積層體之外觀。 <評價方法> ○:得以無褶皺地層壓,保持良好之外觀。 ×:膜產生褶皺,並且褶皺轉印至黏著層,為無法用作製品之狀態。[表4]
[產業上之可利用性] 本發明之賦形黏著片材積層體於形成例如個人電腦、移動終端(PDA)、遊戲機、電視(TV)、汽車導航系統、觸控面板、手寫板等之類之圖像顯示裝置時可適宜地使用。 又,本發明之黏著片材積層體或塗佈膜於形成此種賦形黏著片材積層體時可適宜地使用。Hereinafter, an example of an embodiment of the present invention will be described. However, the present invention is not limited to the following embodiments. [This adhesive sheet laminate] An adhesive sheet laminate (referred to as "the present adhesive sheet laminate") as an example of an embodiment of the present invention, as shown in Fig. 1 , is provided with an adhesive layer and can be peeled off. Coating part I laminated on one side of the front and back of the adhesive material layer, and adhesive sheet of the covering part II laminated on the other side of the front and back of the adhesive material layer in a peelable manner Laminated body. Here, the covering portion II is arbitrary, and a configuration in which the covering portion II is not laminated may be employed. <Adhesive layer> The adhesive layer of the adhesive sheet laminate is capable of functioning as a double-sided adhesive sheet when the covering portion I and the covering portion II are peeled off, and has a property of softening or melting when heated. Hot melt can be used. The adhesive material layer preferably has a loss tangent tan δ (SA) at 100° C. of 1.0 or more. Moreover, it is preferable that the loss tangent tan delta (SB) at 30 degreeC is less than 1.0. Here, the loss tangent tanδ means the ratio (G''/G') of the loss elastic modulus G'' to the storage elastic modulus G'. Since the temperature at the time of heat-molding the adhesive sheet laminate is usually 70 to 120°C, if the loss tangent tanδ (SA) at 100°C is 1.0 or more, it becomes easy to form uneven shapes on the surface of the adhesive layer. . In addition, if the loss tangent tanδ(SB) of the adhesive material layer at 30°C is less than 1.0, the shape can be maintained under normal conditions, so that the surface of the adhesive material layer can be kept on the surface of the adhesive material layer and conform to the unevenness of the surface of the adherend with high precision. The state of the concave and convex shape. Generally, polymer materials have both viscous properties and elastic properties, and the loss tangent tanδ is above 1.0, and the larger the value, the stronger the viscous properties. On the other hand, the loss tangent tanδ is less than 1.0, and the smaller the value, the stronger the elastic properties. Therefore, by controlling the loss tangent tanδ of the adhesive layer at different temperatures, both formability and shape retention can be achieved. From this viewpoint, the loss tangent tanδ (SA) of the adhesive layer at 100° C. is preferably 1.0 or more, preferably 1.5 or more or 30 or less, and more preferably 3.0 or more or 20 or less. On the other hand, the loss tangent tanδ(SB) of the adhesive layer at 30°C is preferably less than 1.0, preferably 0.01 or more or 0.9 or less, and preferably 0.1 or more or 0.8 or less. Here, the loss tangent tanδ (SA) at 100°C and the loss tangent tanδ (SB) at 30°C of the adhesive layer can be adjusted by adjusting the composition, gel fraction, and weight average of the composition constituting the adhesive layer. The molecular weight etc. are adjusted to the said range. Furthermore, the storage elastic modulus G'(SA) of the adhesive layer at 100° C. is preferably less than 1.0×10 4 Pa. In addition, the storage elastic modulus G'(SB) of the above-mentioned adhesive material layer at 30° C. is preferably 1.0×10 4 Pa or more. If the storage elastic modulus G'(SA) of the adhesive layer at 100°C does not reach 1.0×10 4 Pa is preferable because sufficient formability can be obtained. On the other hand, if the storage elastic modulus G'(SB) of the adhesive layer at 30°C is 1.0×10 4 Pa or more is preferable from the viewpoint of shape stability after molding. From this viewpoint, the storage elastic modulus G'(SA) of the adhesive layer at 100° C. is preferably less than 1.0×10 4 Pa, more preferably 5.0×10 1 Pa or more or 5.0×10 3 Pa or less, and more preferably 1.0×10 2 Pa or more or 1.0×10 3 Pa or less. Accordingly, the storage elastic modulus G'(SA) of the adhesive layer at 100°C is more preferably 5.0×10 1 Pa or more and less than 1.0×10 4 Pa, or 5.0×10 1 Pa or more and 5.0×10 3 Pa or less, and more preferably 1.0×10 2 Pa or more and less than 1.0×10 4 Pa, or 1.0×10 2 Pa or more and 5.0×10 3 Below Pa, the best is 1.0×10 2 Pa or more and 1.0×10 3 Pa or less. Moreover, from this viewpoint, the storage elastic modulus G'(SB) of the adhesive layer at 30° C. is preferably 1.0×10 4 Pa or more, and more preferably 2.0×10 4 Pa or more or 1.0×10 7 Pa or less, and more preferably 5.0×10 4 Pa or more or 1.0×10 6 Pa or less. Moreover, according to this, the storage elastic modulus G'(SB) of the adhesive layer at 30° C. is more preferably 1.0×10 4 Pa or more and 1.0×10 7 Pa or less, or 1.0×10 4 Pa or more and 1.0×10 6 Pa or less, more preferably 2.0×10 4 Pa or more and 1.0×10 7 Pa or less, or 2.0×10 4 Pa or more and 1.0×10 6 Below Pa, the best is 5.0×10 4 Pa or more and 1.0×10 6 Pa or less. Here, the storage elastic modulus G'(SA) of the adhesive material layer at 100°C and the storage elastic modulus G'(SB) of the adhesive material layer at 30°C can be adjusted by adjusting the composition of the adhesive material layer. The components, gel fraction, weight average molecular weight, etc. are adjusted to the above ranges. The temperature at which the loss tangent tanδ of the adhesive layer becomes 1.0 is preferably 50 to 150°C, more preferably 60°C or higher or 130°C or lower, and more preferably 70°C or higher or 110°C or lower. If the temperature at which the loss tangent tanδ of the adhesive layer becomes 1.0 is 50 to 150° C., the present adhesive sheet laminate can be preheated to 50 to 150° C. for mold forming. The glass transition temperature (Tg) of the base resin of the adhesive layer is preferably -50 to 40°C, more preferably -30°C or higher or 25°C or lower, and further preferably -10°C or higher or 20°C or lower. Here, the measurement of the glass transition temperature means the midpoint between the inflection points of the baseline movement when the temperature is raised at a rate of 3° C./min using a differential scanning calorimeter (DSC). If the glass transition temperature (Tg) of the base resin of the adhesive material layer is in the above range, the adhesive material layer can be given adhesiveness, and further, the temperature at which the loss tangent tanδ of the adhesive material layer becomes 1.0 can be adjusted to 50 to 150°C. As the material of the adhesive material layer, a previously known adhesive sheet can be used as long as it can be prepared to have a specific viscoelastic behavior. For example, 1) using a (meth)acrylate-based polymer (meaning including a copolymer, hereinafter referred to as "acrylate-based (co)polymer") as a base resin, in which a crosslinking monomer is formulated the adhesive sheet formed by the cross-linking reaction, or 2) using butadiene or isoprene-based copolymer as the base resin, in Among them, the cross-linking monomers, cross-linking initiators or reaction catalysts, etc. are adjusted as needed to make the adhesive sheets formed by cross-linking reaction; or 3) using polysiloxane-based polymers as the base resin, in Wherein, cross-linking monomers, cross-linking initiators or reaction catalysts, etc. are prepared as needed, so that the adhesive sheets formed by the cross-linking reaction, etc. are prepared; or 4) polyurethane-based polymers are used as the basis Resin polyurethane adhesive sheet, etc. The physical properties of the adhesive layer itself are not an essential problem in the present invention except for the above-mentioned viscoelastic properties or thermal properties. However, from the viewpoints of adhesiveness, transparency, and weather resistance, it is preferable to use the acrylate-based (co)polymer of the above 1) as the base resin. When properties such as electrical properties and low refractive index are required, it is preferable to use the butadiene or isoprene-based copolymer of the above 2) as the base resin. When properties such as heat resistance and rubber elasticity in a wide temperature range are required, the polysiloxane-based copolymer of the above 3) is preferably used as the base resin. When properties such as releasability are required, it is preferable to use the polyurethane-based polymer of the above 4) as the base resin. As an example of the said adhesive material layer, what is formed from the resin composition containing the (meth)acrylic type copolymer (a) which is a base resin, a crosslinking agent (b), and a photopolymerization initiator (c) can be illustrated. The adhesive sheet. In this case, it is necessary to satisfy the above-mentioned viscoelastic properties in an uncrosslinked state, that is, in a state before a three-dimensionally crosslinked network structure is formed. From this viewpoint, the gel fraction of the adhesive layer is preferably 40% or less. If the gel fraction of the adhesive material layer is 40% or less, the bonding of molecular chains constituting the adhesive material layer can be suppressed in an appropriate range, so that when it is molded into a shaped adhesive sheet laminate, an appropriate amount of fluidity. From this viewpoint, the gel fraction of the adhesive material layer is preferably 40% or less, particularly preferably 20% or less, and particularly preferably 10% or less. Furthermore, the lower limit of the gel fraction of the adhesive layer is not limited, and may be 0%. In addition, the gel fraction of the above-mentioned adhesive material layer is not limited to the one containing the (meth)acrylic copolymer (a) as the base resin, the crosslinking agent (b), and the photopolymerization initiator (c). In the case of the resin composition, the same applies to the case of using another resin composition as the adhesive layer. ((Meth)acrylic copolymer (a)) The (meth)acrylic copolymer (a) can be further changed depending on the type of the acrylic monomer or methacrylic monomer used for polymerization, the composition ratio, and the Properties such as glass transition temperature (Tg) are appropriately adjusted according to polymerization conditions and the like. Examples of acrylic monomers or methacrylic monomers for polymerizing acrylate polymers include 2-ethylhexyl acrylate, n-octyl acrylate, n-butyl acrylate, ethyl acrylate, methyl acrylate Methyl acrylate, etc. Vinyl acetate, hydroxyethyl acrylate, acrylic acid, glycidyl acrylate, acrylamide, acrylonitrile, methacrylonitrile, and fluoroacrylate, which are copolymerized with a hydrophilic group or an organic functional group, can also be used. , polysiloxane acrylate, etc. Among the acrylate polymers, an alkyl (meth)acrylate-based copolymer is particularly preferred. As the (meth)acrylate for forming the (meth)acrylate-based copolymer, that is, the alkyl acrylate or the alkyl methacrylate component, the alkyl group is preferably n-octyl, isooctyl , 1 of 2-ethylhexyl, n-butyl, isobutyl, methyl, ethyl, and isopropyl alkyl acrylate or alkyl methacrylate, or selected from them A mixture of 2 or more. As other components, acrylate or methacrylate having organic functional groups such as a carboxyl group, a hydroxyl group, and a glycidyl group may be copolymerized. Specifically, the monomer component obtained by selectively combining the above-mentioned alkyl (meth)acrylate component and the (meth)acrylate component having an organic functional group can be heated and polymerized as a starting material to obtain (Meth)acrylate type copolymer polymer. Among them, preferably, one kind of alkyl acrylates such as isooctyl acrylate, n-octyl acrylate, n-butyl acrylate, and 2-ethylhexyl acrylate, or a mixture of two or more kinds selected from these, or Examples include those obtained by copolymerizing at least one of isooctyl acrylate, n-octyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, and the like with acrylic acid. As the polymerization treatment using these monomers, known polymerization methods such as solution polymerization, emulsion polymerization, bulk polymerization, and suspension polymerization can be employed. In this case, polymerization is performed using a thermal polymerization initiator or a photopolymerization initiator, etc. starter, through which acrylate copolymers can be obtained. (Acrylic copolymer (A1)) As an example of a preferable base polymer of the adhesive layer, a (meth)acrylic copolymer (A1) containing a graft copolymer having a macromonomer as a branch component can be mentioned . If the above-mentioned acrylic copolymer (A1) is used as the base resin to constitute the adhesive material layer, the adhesive material layer can maintain a sheet shape at room temperature and exhibit self-adhesiveness, and there is a possibility that if it is heated in an uncrosslinked state, it will The hot-melt property of melting or flowing can be further light-hardened, and after light-hardening, it can exert excellent cohesive force and adhere to it. Therefore, if the acrylic copolymer (A1) is used as the base polymer of the adhesive layer, even in an uncrosslinked state, it exhibits adhesiveness at room temperature (20° C.), and has the ability to be heated to 50 to 100° C. ℃, more preferably 60 ℃ or more or 90 ℃ or less temperature will soften or fluidize. The glass transition temperature of the copolymer constituting the main chain component of the acrylic copolymer (A1) is preferably -70 to 0°C. In this case, the glass transition temperature of the copolymer component constituting the main chain component refers to the glass transition temperature of a polymer obtained by copolymerizing only the monomer components constituting the main chain component of the acrylic copolymer (A1). Specifically, it means the value calculated by Fox's calculation formula based on the glass transition temperature and the composition ratio of the polymer obtained from the homopolymer of each component of the copolymer. In addition, the calculation formula of Fox is the calculated value calculated|required by the following formula, and can be calculated|required using the value described in the polymer handbook [Polymer HandBook, J. Brandrup, Interscience, 1989]. 1/(273+Tg)=Σ(Wi/(273+Tgi)) [wherein Wi represents the weight fraction of monomer i, and Tgi represents the Tg (°C) of the homopolymer of monomer i] The glass transition temperature of the copolymer component of the main chain component (A1) will affect the flexibility of the adhesive layer at room temperature, or the wettability of the adhesive layer to the adherend, that is, the adhesiveness. Therefore, in order to adhere The material layer obtains moderate adhesion (tackiness) at room temperature, and the glass transition temperature is preferably -70°C to 0°C, particularly preferably -65°C or above or -5°C, and particularly preferably - Above 60°C or below -10°C. However, even if the glass transition temperature of the copolymer component is the same temperature, the viscoelasticity can be adjusted by adjusting the molecular weight. For example, by reducing the molecular weight of the copolymer component, it can be further softened. Examples of the (meth)acrylate monomer contained in the main chain component of the acrylic copolymer (A1) include methyl (meth)acrylate, ethyl (meth)acrylate, and (meth)acrylic acid. Propyl, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, 2-butyl (meth)acrylate, 3-butyl (meth)acrylate, Amyl (meth)acrylate, isoamyl (meth)acrylate, neopentyl (meth)acrylate, hexyl (meth)acrylate, cyclohexyl (meth)acrylate, heptyl (meth)acrylate , 2-ethylhexyl acrylate, n-octyl acrylate, isooctyl acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, tert-butylcyclohexyl (meth)acrylate, ( Decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, cetyl (meth)acrylate, hard (meth)acrylate Fatty esters, isostearyl (meth)acrylate, behenyl (meth)acrylate, iso(meth)acrylate, 2-phenoxyethyl (meth)acrylate, 3,5 acrylate, 5-trimethylcyclohexyl ester, p-cumylphenol EO modified (meth)acrylate, (meth)acrylate dicyclopentenyl, (meth)acrylate dicyclopentenyl, (meth)acrylate bicyclo Pentenoxyethyl ester, benzyl (meth)acrylate, etc. These can also be used: hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, glycerol (meth)acrylate, etc. having a hydrophilic group or an organic functional group, etc. Hydroxyl-containing (meth)acrylate; or (meth)acrylic acid, 2-(meth)acrylooxyethylhexahydrophthalic acid, 2-(meth)acrylooxypropylhexahydro Phthalic acid, 2-(meth)acryloyloxyethyl phthalic acid, 2-(meth)acryloyloxypropyl phthalic acid, 2-(meth)acryloyloxyethyl phthalate maleic acid, 2-(meth)acryloyloxypropyl maleic acid, 2-(meth)acryloyloxyethylsuccinic acid, 2-(meth)acryloyloxy Carboxyl-containing monomers such as propylpropyl succinic acid, crotonic acid, fumaric acid, maleic acid, itaconic acid, monomethyl maleate, monomethyl itaconic acid; Acid anhydride group-containing monomers such as enedioic anhydride and itaconic anhydride; epoxy group-containing monomers such as glycidyl (meth)acrylate, glycidyl α-ethylacrylate, and 3,4-epoxybutyl (meth)acrylate Monomers; (meth)acrylate monomers containing amine groups such as dimethylaminoethyl (meth)acrylate and diethylaminoethyl (meth)acrylate; (meth)acrylamide, N -Tertiary butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-butoxymethyl (methyl) base) acrylamide, diacetone acrylamide, malediamide, maleimide and other monomers containing amide groups; vinylpyrrolidone, vinylpyridine, vinylcarbazole, etc. Heterocyclic basic monomers, etc. In addition, styrene, t-butylstyrene, α-methylstyrene, vinyltoluene, acrylonitrile, methyl styrene, which can be copolymerized with the above-mentioned acrylic monomer or methacrylic monomer can also be appropriately used. Various vinyl monomers such as acrylonitrile, vinyl acetate, vinyl propionate, alkyl vinyl ether, hydroxyalkyl vinyl ether, and alkyl vinyl monomers. Moreover, it is preferable that the main chain component of an acrylic copolymer (A1) contains a hydrophobic (meth)acrylate monomer and a hydrophilic (meth)acrylate monomer as a structural unit. When the main chain component of the acrylic copolymer (A1) is composed of only a hydrophobic monomer, the tendency of wet heat whitening is observed, so it is preferable to also introduce a hydrophilic monomer into the main chain component to prevent wet heat whitening. Specifically, as the main chain component of the above-mentioned acrylic copolymer (A1), hydrophobic (meth)acrylate monomers, hydrophilic (meth)acrylate monomers, and ends of macromonomers can be mentioned The polymerizable functional group is randomly copolymerized to form a copolymer component. Here, as the above-mentioned hydrophobic (meth)acrylate monomer, for example, n-butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, tert-butyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, neopentyl (meth)acrylate, hexyl (meth)acrylate, cyclo(meth)acrylate Hexyl ester, heptyl (meth)acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, isooctyl acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, (meth) tert-butylcyclohexyl acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, (meth)acrylic acid Cetyl ester, stearyl (meth)acrylate, isostearyl (meth)acrylate, behenyl (meth)acrylate, iso-(meth)acrylate, cyclohexyl (meth)acrylate , Dicyclopentenyloxyethyl (meth)acrylate, methyl methacrylate. Moreover, as a hydrophobic vinyl monomer, vinyl acetate, styrene, tertiary butyl styrene, (alpha)-methyl styrene, vinyltoluene, an alkyl vinyl monomer, etc. are mentioned. Examples of the hydrophilic (meth)acrylate monomers include methyl acrylate, (meth)acrylic acid, and tetrahydrofurfuryl (meth)acrylate; or hydroxyethyl (meth)acrylate, (meth)acrylate (meth)acrylates containing hydroxyl groups such as hydroxypropyl acrylate, hydroxybutyl (meth)acrylate, and glycerol (meth)acrylate; or (meth)acrylic acid, 2-(meth)acryloyloxy ethyl hexahydrophthalic acid, 2-(meth)acryloyloxypropyl hexahydrophthalic acid, 2-(meth)acryloyloxyethyl phthalic acid, 2-(methyl) base) acryloyloxypropyl phthalic acid, 2-(meth)acryloyloxyethyl maleic acid, 2-(meth)acryloyloxypropyl maleic acid, 2 -(Meth)acryloyloxyethylsuccinic acid, 2-(meth)acryloyloxypropylsuccinic acid, crotonic acid, fumaric acid, maleic acid, itonic acid , monomethyl maleate, monomethyl itaconic acid and other carboxyl group-containing monomers; maleic anhydride, itaconic acid anhydride and other acid anhydride group-containing monomers; (meth)acrylate glycidyl ester, α-ethyl acetate Epoxy group-containing monomers such as glycidyl acrylate and 3,4-epoxybutyl (meth)acrylate; alkoxy polyalkylene glycols such as methoxypolyethylene glycol (meth)acrylate (Meth)acrylates; N,N-Dimethacrylamide, hydroxyethylacrylamide, and the like. The acrylic copolymer (A1) preferably has a macromonomer introduced as a branch component of the graft copolymer, and contains repeating units derived from the macromonomer. The so-called macromonomer system has a polymerizable functional group at the end and a polymer monomer of a high molecular weight skeleton component. The glass transition temperature (Tg) of the macromonomer is preferably higher than the glass transition temperature of the copolymer component constituting the above-mentioned acrylic copolymer (A1). Specifically, since the glass transition temperature (Tg) of the giant monomer will affect the heating and melting temperature (hot melting temperature) of the adhesive layer 2 , the glass transition temperature (Tg) of the giant monomer is preferably 30° C. to 120° C. °C, among them, 40°C or more or 110°C or less is more preferable, and among them, 50°C or more or 100°C or less is more preferable. With such a glass transition temperature (Tg), excellent workability and storage stability can be maintained by adjusting the molecular weight, and it can be adjusted by thermal fusion at around 80°C. The so-called glass transition temperature of the giant monomer refers to the glass transition temperature of the giant monomer itself, which can be measured by a differential scanning calorimeter (DSC). In addition, in order to maintain a state in which the branched components are kept close to each other at room temperature, the adhesive composition is physically cross-linked, and the above-mentioned physical cross-linking can be released by heating to a moderate temperature to obtain fluidity. It is also preferable to adjust the molecular weight or content of the macromonomer. From this point of view, the macromonomer is preferably contained in the acrylic copolymer (A1) in a ratio of 5 to 30 mass %, and is preferably 6 mass % or more or 25 mass % or less, and is preferably It is 8 mass % or more or 20 mass % or less. In addition, the number average molecular weight of the macromonomer is preferably 500 or more and less than 8,000, preferably 800 or more or less than 7,500, and preferably 1,000 or more or less than 7,000. As the megamonomer, a common manufacturer (eg, a megamonomer manufactured by Toa Gosei Co., Ltd., etc.) can be appropriately used. The high molecular weight backbone component of the macromonomer preferably contains an acrylic polymer or a vinyl polymer. Examples of high molecular weight skeleton components of the above-mentioned macromonomers include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, (meth)acrylate base) n-butyl acrylate, isobutyl (meth)acrylate, 2nd butyl (meth)acrylate, 3rd butyl (meth)acrylate, amyl (meth)acrylate, isobutyl (meth)acrylate Amyl, neopentyl (meth)acrylate, hexyl (meth)acrylate, cyclohexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, Isooctyl acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, tert-butylcyclohexyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate ester, undecyl (meth)acrylate, lauryl (meth)acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, ( Behenyl (meth)acrylate, iso(meth)acrylate, 2-phenoxyethyl (meth)acrylate, 3,5,5-trimethylcyclohexyl acrylate, p-cumyl Phenol EO modified (meth)acrylate, (meth)acrylate dicyclopentenyl, (meth)acrylate dicyclopentenyl, (meth)acrylate dicyclopentenyloxyethyl, (meth)acrylate benzyl , Hydroxyalkyl (meth)acrylate, (meth)acrylic acid, glycidyl (meth)acrylate, (meth)acrylamide, N,N-dimethyl (meth)acrylamide, ( (meth)acrylate monomers such as meth)acrylonitrile, alkoxyalkyl (meth)acrylate, alkoxypolyalkylene glycol (meth)acrylate; or styrene, tert-butylene Various vinyl monomers such as vinyl styrene, alpha-methyl styrene, vinyl toluene, alkyl vinyl monomers, vinyl acetate, alkyl vinyl ethers, hydroxyalkyl vinyl ethers, etc., which can be used alone or in combination Use 2 or more. As a terminal polymerizable functional group of the said macromonomer, a methacryloyl group, an acryl group, a vinyl group, etc. are mentioned, for example. (Crosslinking agent (b)) The crosslinking agent (b) can be used as a crosslinking monomer used for crosslinking the acrylate polymer. For example, a group selected from the group consisting of a (meth)acryloyl group, an epoxy group, an isocyanate group, a carboxyl group, a hydroxyl group, a carbodiimide group, an oxazoline group, an aziridine group, a vinyl group, an amino group, and an imine group can be mentioned. The crosslinking agent of at least one crosslinkable functional group among the group and the amide group can be used alone or in combination of two or more. Furthermore, the above-mentioned crosslinkable functional group may be protected by a protecting group capable of deprotection. Among them, can be preferably used: polyfunctional (meth)acrylates having two or more (meth)acryloyl groups; having two or more isocyanate groups, epoxy groups, melamine groups, glycol groups, siloxanes Polyfunctional organofunctional resins with organofunctional groups such as bases, amine groups, etc.; organometallic compounds with metal complexes of zinc, aluminum, sodium, zirconium, calcium, etc. As said polyfunctional (meth)acrylate, 1, 4- butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, glycerol di(meth)acrylate, for example , glycerol glycidyl ether di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, tricyclodecane dimethanol two (Meth)acrylate, Bisphenol A polyethoxydi(meth)acrylate, Bisphenol A polyalkoxydi(meth)acrylate, Bisphenol F polyalkoxydi(meth)acrylate Ester, polyalkylene glycol di(meth)acrylate, trimethylolpropane trioxyethyl(meth)acrylate, ε-caprolactone modified tris(2-hydroxyethyl) isocyanide Urate tri(meth)acrylate, pentaerythritol tri(meth)acrylate, propoxylated pentaerythritol tri(meth)acrylate, ethoxylated pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate , Propoxylated pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, polyethylene glycol di(meth)acrylate, tri(acryloyloxy) ethyl) isocyanurate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, tripentaerythritol hexa(meth)acrylate, tri- Pentaerythritol penta(meth)acrylate, hydroxypivalate neopentyl glycol di(meth)acrylate, di(meth)acrylate of ε-caprolactone adduct of hydroxypivalate neopentyl glycol , Trimethylolpropane tri(meth)acrylate, alkoxylated trimethylolpropane tri(meth)acrylate, di(trimethylolpropane)tetra(meth)acrylate and other UV-curable types In addition to functional monomers, polyester (meth)acrylate, epoxy (meth)acrylate, (meth)acrylate urethane, polyether (meth)acrylate, etc. Multifunctional acrylate oligomers. Among the above-mentioned polyfunctional (meth)acrylate monomers, from the viewpoint of improving the adhesiveness to the adherend or the effect of suppressing wet-heat whitening, it is preferable that a hydroxyl group, a carboxyl group, an amide group are contained in the polyfunctional (meth)acrylate monomers. Polyfunctional monomers or oligomers with isopolar functional groups. Among them, polyfunctional (meth)acrylates having a hydroxyl group or an amide group are preferably used. From the viewpoint of preventing whitening by moist heat, as the main chain component of the above-mentioned (meth)acrylate copolymer, for example, the graft copolymer, it is preferable to contain a hydrophobic acrylate monomer and a hydrophilic acrylate monomer, Furthermore, as a crosslinking agent, it is preferable to use the polyfunctional (meth)acrylate which has a hydroxyl group. Moreover, in order to adjust the effect, such as adhesiveness, heat-and-moisture resistance, and heat resistance, you may further add the monofunctional or polyfunctional (meth)acrylate which reacts with a crosslinking agent. From the viewpoint of balancing flexibility and cohesion as an adhesive composition, the content of the crosslinking agent is preferably contained in a ratio of 0.1 to 20 parts by mass with respect to 100 parts by mass of the (meth)acrylic copolymer. , the ratio of 0.5 parts by mass or more or 15 parts by mass or less is particularly preferred, and the ratio of 1 part by mass or more or 13 parts by mass or less is particularly preferred. (Photopolymerization initiator (c)) When crosslinking the acrylate polymer, a crosslinking initiator (peroxidation initiator, photopolymerization initiator) or a reaction catalyst (tertiary amine-based compounds, quaternary ammonium compounds, tin laurate compounds, etc.) are more effective. In the case of crosslinking by ultraviolet irradiation, it is preferable to prepare a photopolymerization initiator (c). Photopolymerization initiators (c) are roughly classified into two categories according to the mechanism of generating free radicals, and are roughly divided into: cleavage-type photopolymerization initiators that can break and decompose the single bond of the photopolymerizable initiator itself to generate free radicals ; And the photo-excited initiator forms an excited complex with the hydrogen donor in the system, which can transfer the hydrogen of the hydrogen donor to a hydrogen-abstracting photopolymerization initiator. Among these, the cleavage-type photopolymerization initiator decomposes into other compounds when a radical is generated by light irradiation, and once excited, loses its function as a reaction initiator. Therefore, if the intramolecular cleavage type is used as a photopolymerization initiator having an absorption wavelength in the visible light region, compared with the case of using the hydrogen abstraction type, after the adhesive sheet is cross-linked by light irradiation, the light reacts It is preferable that the photopolymerizable initiator remains as unreacted residue in the present adhesive composition to cause unexpected time-dependent changes in the adhesive sheet or to promote cross-linking. In addition, regarding the coloration peculiar to the photopolymerizable initiator, it is also preferable to select a coloration that disappears absorption in the visible light region by becoming a reaction decomposition product. On the other hand, the hydrogen abstraction type photopolymerization initiator does not generate a decomposition product such as a cleavage type photopolymerization initiator when it is irradiated with active energy rays such as ultraviolet rays to generate a radical reaction, so it is difficult after the reaction is completed. As a volatile component, it can reduce the damage to the adherend. As the above-mentioned cleavage-type photopolymerization initiator, for example, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy- 2-Methyl-1-phenyl-propan-1-one, 1-(4-(2-hydroxyethoxy)phenyl)-2-hydroxy-2-methyl-1-propan-1-one, 2-Hydroxy-1-[4-{4-(2-Hydroxy-2-methyl-propionyl)benzyl}phenyl]-2-methyl-propan-1-one, oligo(2-hydroxy -2-methyl-1-(4-(1-methylvinyl)phenyl)acetone), methyl phenylglyoxylate, 2-benzyl-2-dimethylamino-1-(4- 𠰌olinylphenyl)butan-1-one, 2-methyl-1-[4-(methylthio)phenyl]-2-𠰌olinylpropan-1-one, 2-(dimethylamino) )-2-[(4-methylphenyl)methyl]-1-[4-(4-𠰌linyl)phenyl]-1-butanone, bis(2,4,6-trimethylbenzene carboxyl)-phenylphosphine oxide, 2,4,6-trimethylbenzyldiphenylphosphine oxide, (2,4,6-trimethylbenzyl)ethoxyphenyl oxide Phosphine, bis(2,6-dimethoxybenzyl) 2,4,4-trimethylpentylphosphine oxide, or derivatives thereof, and the like. Among them, bis(2,4,6-trimethylbenzyl)-phenyl is preferable in that it becomes a decomposed product after the reaction by the cleavage-type photopolymerizable initiator and decolorizes Phosphine oxide, 2,4,6-trimethylbenzyldiphenylphosphine oxide, (2,4,6-trimethylbenzyl)ethoxyphenylphosphine oxide, bis(2,6 - Dimethoxybenzyl) 2,4,4-trimethylpentylphosphine oxide and other acylphosphine oxide-based photoinitiators. Furthermore, in terms of compatibility with an acrylic copolymer containing a graft copolymer having a macromonomer as a branch component, 2,4,6-trimethylbenzyldiphenyl is preferably used Phosphine oxide, (2,4,6-trimethylbenzyl)ethoxyphenylphosphine oxide, bis(2,6-dimethoxybenzyl)2,4,4-trimethyl Amylphosphine oxide and the like are used as photopolymerization initiators. The content of the photopolymerization initiator is not particularly limited. For example, the amount is 0.1 to 10 parts by mass, particularly preferably 0.2 parts by mass or more or 5 parts by mass or less, and particularly preferably 0.5 parts by mass or more or 3 parts by mass with respect to 100 parts by mass of the (meth)acrylic copolymer. The following ratios are included. However, in terms of balance with other elements, it may exceed this range. The photopolymerization initiator may be used alone or in combination of two or more. In addition to the above components, pigments such as pigments or dyes with near-infrared absorption properties, adhesion imparting agents, antioxidants, antiaging agents, moisture absorbing agents, ultraviolet absorbers, silane coupling agents, natural or synthetic agents can also be appropriately formulated as required. Various additives such as resins, glass fibers or glass beads. (Layer Structure and Thickness of Adhesive Material Layer) In addition to a single layer, the adhesive material layer may also be a plurality of layers such as two layers or three layers. Moreover, the adhesive material layer may have a base material layer (layer without adhesiveness) as a core layer, and the structure which laminated|stacked the layer containing an adhesive material on both sides of this base material layer. In the case of such a configuration, the base material layer serving as the core layer preferably has a material or characteristic that enables thermoforming of the adhesive sheet laminate. Moreover, it is preferable that the adhesive material layers other than the base material layer have loss tangent tanδ (SA), loss tangent tanδ (SB), storage elastic modulus G' (SA), and storage elastic modulus G' (SB) above characteristics. The thickness of the adhesive material layer is not particularly limited. Among them, the range of 20 μm to 500 μm is preferable. Within this range, for example, if the adhesive layer is as thin as 20 μm in thickness, it is possible to provide an adhesive sheet excellent in print step followability. Moreover, if it is a thick adhesive material layer such as thickness 500 micrometers, it becomes possible to suppress the overflow of the adhesive material at the time of lamination by shaping|molding in advance the quantity equivalent to a printing level difference. Therefore, the thickness of the adhesive material layer is preferably 20 μm to 500 μm, more preferably 30 μm or more or 300 μm or less, and more preferably 50 μm or more or 200 μm or less. <Coating portion I> As shown in FIG. 1 , the present adhesive sheet laminate is provided with the following coating portion I, which is releasably laminated on one of the front and back surfaces of the adhesive layer, such as the front surface. It is formed on the side of the concave and convex shape. The storage elastic modulus E'(MA) of the covering part I at 100°C is preferably 1.0×10 6 ~2.0×10 9 Pa. Since the temperature during thermoforming of the adhesive sheet laminate is usually 70 to 120°C, the storage elastic modulus E' (MA) at 100°C is 1.0×10 6 ~2.0×10 9 Pa, within the temperature range where the above-mentioned adhesive composition is plasticized to flow, the covering portion I can also be sufficiently deformed to follow the concave-convex shape, not only that, but also the adhesive layer pressed by the covering portion I during molding The surface is formed into the desired concavo-convex shape with high precision, for example, to avoid rounding of the corners. Previously, as a release film laminated on an adhesive sheet, a material with a higher storage elastic modulus, in other words, a "harder" material was often used. The reason is that the properties required for the release film are mainly to protect the adhesive layer and release properties. However, according to the research of the present inventors, it was found that in the new application of thermoforming in the state of laminating a release film on an adhesive sheet, when a new subject of thermoformability is required, it is The above-mentioned physical properties of the film cannot meet the requirements. Therefore, the phenomenon that occurs during thermoforming and the characteristics of the adhesive layer have been investigated in detail, and as a result, it has been found that setting the characteristics different from the conventionally used release films can solve the new problem of thermoformability. beneficial. It has been found that, in particular, the above-mentioned problems can be solved by controlling the storage elastic modulus at a specific temperature within a specific range. From this viewpoint, the storage elastic modulus E' (MA) at 100° C. of the covering portion I is preferably 1.0×10 6 ~2.0×10 9 Pa, more preferably 5.0×10 6 Pa or more or 1.0×10 9 Pa or less, and more preferably 1.0×10 7 Pa or more or 5.0×10 8 Pa or less. Accordingly, the storage elastic modulus E'(MA) of the coating portion I at 100° C. is more preferably 1.0×10 6 ~1.0×10 9 Pa, or 1.0×10 6 ~5.0×10 8 Among them, Pa is more preferably 5.0×10 6 ~2.0×10 9 Pa, or 5.0×10 6 ~1.0×10 9 Pa, the best is 1.0×10 7 ~1.0×10 9 Pa or less, or 1.0×10 7 ~5.0×10 8 Pa. In addition, the storage elastic modulus E' (MB) of the covering portion I at 30° C. is preferably 5.0×10 7 ~1.0×10 10 Pa. If the storage elastic modulus E' (MB) of the covering part I at 30°C is 5.0×10 7 ~1.0×10 10 Pa can maintain shape retention under normal conditions, so it is easy to handle, such as easy peeling, and not only that, because it is not too hard, it can suppress the formation of unintended unevenness in the adhesive material layer. From this viewpoint, the storage elastic modulus E' (MB) of the covering portion I at 30° C. is preferably 5.0×10 7 ~1.0×10 10 Pa, more preferably 1.0×10 8 Pa or more or 8.0×10 9 Pa or less, and more preferably 1.0×10 9 Pa or more or 5.0×10 9 Pa or less. Accordingly, the storage elastic modulus E'(MB) of the covering portion I at 30°C is more preferably 5.0×10 7 ~8.0×10 9 Pa, or 5.0×10 7 ~5.0×10 9 Among them, Pa is more preferably 1.0×10 8 Pa~1.0×10 10 Pa, or 1.0×10 8 Pa~8.0×10 9 Pa, the best is 1.0×10 9 ~8.0×10 9 Pa, or 1.0×10 9 ~5.0×10 9 Pa. In order to adjust the storage elastic modulus of the coating portion I at 30° C. and 100° C. as described above, the coating portion I can be adjusted, for example, by adjusting the type of base resin, copolymer resin composition, weight average molecular weight, glass transition temperature, crystallinity, etc. The conditions of the material are adjusted, and the manufacturing conditions such as the presence or absence of stretching, forming conditions, and stretching conditions in the case of stretching are adjusted. However, it is not limited to these methods. Furthermore, it is preferable that the storage elastic modulus E'(MA) of the covering portion I at 100°C and the storage elastic modulus E'(MB) of the covering portion I at 30°C satisfy the following relational expression (1). (1)・・E'(MB)/E'(MA)≧2.0 If the storage elastic modulus E'(MA) of the covering part I at 100°C and the storage elastic modulus E of the covering part I at 30°C '(MB) satisfies the above-mentioned relational expression (1), since sufficient formability can be obtained, which is more preferable. From this viewpoint, E'(MB)/E'(MA)≧2.0 is preferable, and 30≧E'(MB)/E'(MA) or E'(MB)/E' is more preferable. (MA)≧3.0, especially preferably 10≧E'(MB)/E'(MA) or E'(MB)/E'(MA)≧5.0. In order to adjust E'(MB) and E'(MA) to have the above relationship, for example, the type of base resin, copolymer resin component, weight average molecular weight, glass transition temperature, crystallinity, etc. conditions, and adjust the manufacturing conditions such as the presence or absence of stretching, molding conditions, and stretching conditions in the case of stretching. However, it is not limited to these methods. Furthermore, it is preferable that the storage elastic modulus G'(SA) of the adhesive material layer at 100°C and the storage elastic modulus E'(MA) of the coating portion I at 100°C satisfy the following relational expression (2 ). (2)・・1.0×10 3 ≦E'(MA)/G'(SA)≦1.0×10 7 If the storage elastic modulus G'(SA) of the adhesive material layer at 100°C and the storage elastic modulus E'(MA) of the coating portion I at 100°C satisfy the above relational expression (2), sufficient The formability is therefore better. From this viewpoint, E'(MA)/G'(SA) is preferably 1.0×10 3 ~1.0×10 7 , of which 5.0×10 is particularly preferred 3 above or 5.0×10 6 Below, the most preferable one is 1.0×10 4 above or 1.0×10 6 the following. Accordingly, E'(MA)/G'(SA) is more preferably 1.0×10 3 ~5.0×10 6 , or 1.0×10 3 ~1.0×10 6 , and more preferably 5.0×10 3 ~5.0×10 6 , or 5.0×10 3 ~1.0×10 6 , the best is 1.0×10 4 ~5.0×10 6 , or 1.0×10 4 ~1.0×10 6 . In order to adjust so that E'(MA) and G'(SA) may become the said relationship, what is necessary is just to adjust the characteristic of the adhesive material layer or the coating part I. As a characteristic of an adhesive material layer, for example, it can be achieved by adjusting the component of the composition which comprises an adhesive material layer, a gel fraction, a weight average molecular weight, etc.. In addition, as the properties of the coating portion I, for example, conditions of the material of the coating portion I such as the type of base resin, copolymer resin composition, weight average molecular weight, glass transition temperature, and crystallinity can be adjusted, and the presence or absence of stretching and molding conditions can be adjusted. , In the case of stretching, adjust the manufacturing conditions such as stretching conditions and adjust them. However, it is not limited to these methods. It is preferable that the peeling force F(C) at the time of peeling the said cover part I from the adhesive material layer in 30 degreeC environment about the cover part I is 0.2 N/cm or less. If the peeling force F(C) is 0.2 N/cm or less, the coating portion I described above can be easily peeled off from the adhesive material layer. From this point of view, the peeling force F(C) is preferably 0.2 N/cm or less, more preferably 0.01 N/cm or more or 0.15 N/cm or less, and still more preferably 0.02 N/cm or more or 0.1 N/cm or less. Furthermore, for the coating portion I, the adhesive sheet laminate was heated at 100° C. for 5 minutes, then cooled to 30° C., and peeling force F (D) when the coating portion I was peeled from the adhesive material layer in an environment of 30° C. Preferably it is 0.2 N/cm or less. If the adhesive sheet laminate is heated at 100°C for 5 minutes and then cooled to 30°C, and the peel force F(D) measured at 30°C is the same as the above-mentioned peel force F(C), even if the Even when the adhesive sheet laminate is heated and molded, the peeling force F(D) does not change, so that the coating portion I can be easily peeled off from the adhesive layer. From this viewpoint, the peeling force F(D) is preferably 0.2 N/cm or less, more preferably 0.01 N/cm or more or 0.15 N/cm or less, and more preferably 0.02 N/cm or more or more. 0.1 N/cm or less. Furthermore, it is preferable that the absolute value of the difference of the said peeling force F(C) and the said peeling force F(D) of the coating part I is 0.1 N/cm or less. If the adhesive sheet laminate is heated at 100°C for 5 minutes and then cooled to 30°C, the absolute difference between the peel force F(D) measured at 30°C and the peel force F(C) in the normal state If the value is 0.1 N/cm or less, the peeling force F(D) does not change even when the adhesive sheet laminate is thermoformed, so that the coating portion I can be easily peeled off from the adhesive layer. From this viewpoint, the absolute value of the difference between the peeling force F(C) and the peeling force F(D) is preferably 0.1 N/cm or less, more preferably 0.08 N/cm or less, and still more preferably 0.05 N/cm or less. In addition, the peeling force F(C) and peeling force F(D) of the covering part I can be adjusted by the type of the release layer formed on one side of the covering part I, and the like. However, it is not limited to this method. As a structural example of the coating part I, the structural example provided with a coating base material layer and a release layer is mentioned. By layering the release layer on a single area of the covering base material layer, the covering portion I can be easily peeled off from the adhesive material layer. In this case, the covering base material layer preferably includes, for example, one resin or two or more resins selected from the group consisting of polyester, copolyester, polyolefin, and copolyolefin as a main component. The stretched or unstretched layer, that is, a single layer or a multi-layered layer comprising a stretched or unstretched film with these resins as the main component. Among them, the covering base material layer constituting the above-mentioned covering portion I preferably has, from the viewpoints of mechanical strength, chemical resistance, and the like, an extension comprising, for example, a copolymerized polyester, a polyolefin, or a copolymerized polyolefin as a main component. Or a single layer or multiple layers of layers of unextended film. Specific examples of the above-mentioned copolymerized polyester include isophthalic acid as a dicarboxylic acid, and cyclohexanedimethanol, 1,4-butanediol, and diethylene glycol as a diol. Copolymerized polyethylene terephthalate. As a specific example of the said polyolefin, an alpha-olefin homopolymer is mentioned, for example, a propylene homopolymer or the homopolymer of 4-methylpentene-1 is mentioned. As a specific example of the said polyolefin copolymer, the copolymer of ethylene, propylene, another alpha-olefin, a vinyl monomer, etc. is mentioned, for example. The above-mentioned release layer is preferably a layer containing modified polyolefin in addition to the release agent such as polysiloxane. Here, as a modified olefin which comprises the said release layer, the resin which has as a main component a polyolefin modified with an unsaturated carboxylic acid or its acid anhydride, or a silane type coupling agent is mentioned. Examples of the above-mentioned unsaturated carboxylic acid or anhydride thereof include acrylic acid, methacrylic acid, maleic acid, maleic anhydride, citraconic acid, citraconic anhydride, itaconic acid, itaconic anhydride, or the like. The monoepoxy compound of the derivative and the ester compound of the above-mentioned acid, the reaction product of the polymer having a group capable of reacting with the acid in the molecule, and the acid, etc. Moreover, these metal salts can also be used. Among these, maleic anhydride can be more preferably used. In addition, these copolymers can be used individually or in mixture of 2 or more types. In order to manufacture the modified polyolefin-based resin, for example, these modified monomers may be preliminarily copolymerized at the stage of polymerizing the polymer, or the temporarily polymerized polymer may be graft-copolymerized with these modified monomers. . In addition, as the modified polyolefin-based resin, these modified monomers may be used alone or in combination, and the content thereof is preferably 0.1 mass % or more, preferably 0.3 mass % or more, and more preferably 0.5 mass % or more. It is more than mass % and 5 mass % or less, Preferably it is 4.5 mass % or less, More preferably, it is in the range of 4.0 mass % or less. Among them, graft-modified ones can be suitably used. Suitable examples of the modified polyolefin-based resin include maleic anhydride-modified polypropylene resin, maleic anhydride-modified polyethylene resin, maleic anhydride ethylene-vinyl acetate copolymer, and the like . From the viewpoint of formability, the thickness of the coating portion I is preferably 10 μm to 500 μm, particularly preferably 20 μm or more or 300 μm or less, and especially preferably 30 μm or more or 150 μm or less. <Coating portion II> As described above, the adhesive sheet laminate can be used to laminate the coating portion I releasably on one of the front and back sides of the adhesive material layer, and on the opposite side to the coating portion I, that is, The other side of the front surface and the back surface of an adhesive material layer is the structure which laminated|stacked the coating part II so that peeling was possible. Thereby, workability|operativity can be improved by laminating|stacking the covering part II so that peeling is possible on the other side of the front surface and the back surface of an adhesive material layer. However, it is also possible to employ a configuration in which the coating portion II is not laminated. The material and the structure of the coating portion II are not particularly limited as long as the coating portion II is releasably laminated on the other side of the front surface and the back surface of the adhesive material layer. For example, the coating portion II may have the same laminate structure and material as the coating portion I described above. In this case, the coating portion I may have the same thickness or a different thickness. When the coating portion II has the same laminate structure and material as the coating portion I, it is possible to prevent the occurrence of warpage, etc., when the present adhesive sheet laminate is heated. Covering part II can also have the same structure as covering part I, but the storage elastic modulus E' (MA) at 100°C, the storage elastic modulus E' (MB) at 30°C, and the ratio (E) '(MB)/E'(MA)), peeling force F(C), peeling force F(D), etc. are different from those of the coating portion I. Furthermore, the coating portion II may have a layered structure and material different from those of the coating portion I described above. For the covering portion II, for example, a commonly used release film (also referred to as a "peeling film") can also be used. Specifically, for example, the storage elastic modulus E' (MC) at 100° C. is 2.0×10 9 ~1.0×10 11 As the material of Pa, for example, a biaxially stretched polyethylene terephthalate (PET) film or the like can be used. [Coating Part I] As a configuration example of the above-mentioned covering part I, the storage elastic modulus E' at 100° C. is 1.5× for a coating film in which a coating layer is provided on one side of a copolymerized polyester film. 10 9 A coating film characterized below Pa (referred to as "the present coating film") will be described. When this coating film is used, for example, after heating the above-mentioned adhesive sheet laminate, the mold can be pressed against the coating film provided with the coating layer having mold release properties, and the adhesive sheet can be formed on the adhesive sheet. The surface is precisely formed in a concavo-convex shape conforming to the concavo-convex portion on the surface of the adherend. Moreover, since the coating film can maintain shape retention under normal conditions, it is easy to handle, and not only that, since it is not too hard, it is possible to suppress the formation of unintended irregularities on the adhesive sheet. <Copolymerized polyester film> The copolymerized polyester film constituting the present coating film may have a single-layer structure or a laminated structure. For example, other than the two-layer and three-layer structures, as long as it does not exceed the gist of the present invention It may be a multilayer of four or more layers, and is not particularly limited. Furthermore, for example, when a three-layer structure (surface layer/intermediate layer/surface layer) is adopted, any one layer of the surface layer or intermediate layer, or any layer of two or more layers may be used as the copolymerized polyester component, and the rest may be used as the copolymerized polyester component. The layer is composed of a polyester component that does not contain a copolymerization component. In addition, the copolymerized polyester film refers to a film obtained by cooling the molten polyester sheet extruded by the extrusion method, and then extending as necessary. As the dicarboxylic acid component of the copolymerized polyester, terephthalic acid is preferred, and other than these, oxalic acid, malonic acid, succinic acid, adipic acid, azelaic acid, sebacic acid, phthalic acid may be contained One or more of known dicarboxylic acids such as dicarboxylic acid, isophthalic acid, naphthalenedicarboxylic acid, diphenyl ether dicarboxylic acid, and cyclohexane dicarboxylic acid are used as a copolymerization component. Moreover, as a glycol component, ethylene glycol is preferable, and propylene glycol, trimethylene glycol, tetramethylene glycol, hexamethylene glycol, 1, 4- cyclohexane may be contained in addition to this One or more of known diols, such as dimethanol, diethylene glycol, triethylene glycol, polyalkylene glycol, and neopentyl glycol, are used as a copolymerization component. Among them, phthalic acid and isophthalic acid as dicarboxylic acid components, 1,4-cyclohexanedimethanol, 1,4-butanediol, and diethylene glycol as diol components are more preferable. Copolymerized polyethylene terephthalate obtained by arbitrary copolymerization. The content of the copolymerization component is preferably 1 mol% or more and 50 mol% or less, more preferably 3 mol% or more or 40 mol% or less, and still more preferably 4 mol% or more or 30 mol% or less. When the content of the copolymerization component is 1 mol% or more, when it is laminated with the adhesive sheet, a concave shape, a convex shape, or a concave and convex shape can be formed on the surface of the adhesive sheet. On the other hand, by being 50 mol% or less, not only sufficient dimensional stability is obtained, but also the generation of wrinkles during processing can be sufficiently suppressed. The melting point of the copolymerized polyester film is preferably designed to be in the range of preferably 260°C or lower, more preferably 200 to 255°C. Since the above-mentioned melting point is 260° C. or lower, sufficient strength can be obtained even in the heat treatment at a temperature lower than the melting point of the copolymerized polyester film in the heat treatment step after stretching. From the viewpoint of improving film workability, it is preferable to contain particles in the copolymerized polyester film. Examples of the particles include inorganic particles such as calcium carbonate, magnesium carbonate, calcium sulfate, barium sulfate, lithium phosphate, magnesium phosphate, calcium phosphate, lithium fluoride, alumina, silicon oxide, and kaolin; acrylic resins, guanamine resins, and the like Organic particles; precipitation particles obtained by granulating catalyst residues, but not limited to these. The particle diameter of these particles or the content in the copolymerized polyester film can be appropriately determined according to the purpose. The particles contained may be a single component, or two or more components may be used simultaneously. In addition, various stabilizers, lubricants, antistatic agents, etc. may be appropriately added. The average particle diameter of the particles contained in the copolymerized polyester film is preferably 0.1 to 5.0 μm. When the average particle diameter of the said particle|grains is less than 0.1 micrometer, the sliding property of a film may become inadequate and workability|operativity may fall. On the other hand, when the average particle diameter of the above-mentioned particles exceeds 5.0 μm, the smoothness of the film surface may be impaired. The content of the particles contained in the copolymerized polyester film is preferably 0.01 to 0.3% by weight. When content of the said particle|grains is less than 0.01 weight%, the sliding property of a film may become inadequate and workability|operativity may fall. On the other hand, when content of the said particle exceeds 0.3 weight%, the smoothness of a film surface may be impaired. It does not specifically limit as a method of adding particle|grains to a copolymerized polyester film, A well-known method can be employ|adopted. For example, it can be added in any stage of polyester production, preferably in the stage of esterification, or can also be added in the form of a slurry dispersed in ethylene glycol or the like after the end of the transesterification reaction and before the start of the polycondensation reaction And the polycondensation reaction is carried out. In addition, the slurry of particles dispersed in ethylene glycol or water can be mixed with polyester raw materials by using a kneading extruder with vent holes, or the dried particles can be mixed using a kneading extruder. A method of blending with a polyester raw material, a method of precipitating particles in a polyester production step system, and the like are performed. The limiting viscosity of the copolymerized polyester is usually 0.40-1.10 dl/g, preferably 0.45-0.90 dl/g, and more preferably 0.50-0.80 dl/g. If the limiting viscosity is less than 0.40 dl/g, the mechanical strength of the film tends to be weakened. When the limiting viscosity exceeds 1.10 dl/g, the melt viscosity may increase, which may cause an excessive load on the extruder. situation. Next, although the production example of a copolymerization polyester film is demonstrated concretely, it is not limited at all to the following production example. Preferably, the method is as follows: First, using the copolyester raw material described above, the molten sheet extruded from the die is cooled and solidified by cooling rolls to obtain an unstretched sheet. In this case, in order to improve the flatness of the sheet, it is necessary to improve the adhesion between the sheet and the rotating cooling drum, and electrostatic application bonding and/or liquid coating bonding can be preferably used. Then, it is preferable to extend the obtained unstretched sheet in at least a uniaxial direction, and it is more preferable to extend biaxially in a biaxial direction. For example, as biaxial stretching, in the case of successive biaxial stretching, the above-mentioned unstretched sheet is stretched in one direction along the machine direction by a stretching machine of a roll or draw-spoke type. The stretching temperature is usually 70 to 120°C, preferably 75 to 110°C, and the stretching ratio is usually 2.5 to 7.0 times, preferably 3.0 to 6.0 times. Next, it extends in a direction perpendicular to the extending direction (machine direction) of the first stage. The stretching temperature is usually 70 to 170°C, and the stretching ratio is usually 3.0 to 7.0 times, preferably 3.5 to 6.0 times. Then, heat treatment is continued at a temperature of 150 to 270° C. under stretching or under relaxation within 30% to obtain a biaxially oriented film. In the above-mentioned biaxial stretching, a method in which the stretching in one direction is carried out in two or more stages may be adopted. In this case, it is preferable to carry out so that the extension magnification of both directions may become the said range finally, respectively. Moreover, regarding manufacture of a copolymerized polyester film, simultaneous biaxial stretching can also be used. Simultaneous biaxial stretching is a method in which the above-mentioned unstretched sheet is simultaneously stretched and aligned in the machine direction and the width direction in a temperature-controlled state at usually 70-120°C, preferably 75-110°C. The stretching ratio is preferably 4 to 50 times, more preferably 7 to 35 times, and still more preferably 10 to 25 times in terms of area ratio. Then, heat treatment is continued at a temperature of 150 to 250° C. under stretching or under relaxation within 30% to obtain a biaxially stretched film. As for the simultaneous biaxial stretching device using the above-described stretching method, a previously known stretching method such as a helical method, a pantograph method, and a linear drive method can be used. (Coating layer) In the present coating film, it is important to provide a coating layer on at least one side of the copolymerized polyester film. It does not specifically limit as a coating layer, Specifically, a release layer, an antistatic layer, an oligomer sealing layer, an easily bonding layer, a primer layer etc. are mentioned. Among them, a release layer is more preferable in terms of producing an adhesive sheet layered product laminated with an adhesive sheet. Moreover, you may combine two or more types of the above-mentioned functional layers. As a specific example of the coating layer constituting the coating film, the release layer will be described below. Specifically, the type of resin used in the release layer includes curable polysiloxane resin, fluorine-based resin, polyolefin-based resin, etc. Among them, curable polysiloxane resin is preferable. It may be a hardening type polysiloxane resin, or a type having a hardening type polysiloxane resin as the main component, and within the scope of not damaging the gist of the present invention, it can also be used by combining with urethane resin, cyclic resin, etc. Modified polysiloxane type obtained by graft polymerization of organic resins such as oxygen resin and alkyd resin. As a kind of hardening type silicone resin, any hardening reaction type, such as an addition type, a condensation type, an ultraviolet curing type, an electron beam curing type, and a solvent-free type, can be used. Specific examples include: KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-856, X-62-2422, X-62 manufactured by Shin-Etsu Chemical Co., Ltd. -2461, X-62-1387, X-62-5039, X-62-5040, KNS-3051, X-62-1496, KNS320A, KNS316, X-62-1574A/B, X-62-7052, X -62-7028A/B, X-62-7619, X-62-7213; YSR-3022, TPR-6700, TPR-6720, TPR-6721, TPR6500, TPR6501, UV9300, UV9425, XS56- A2775, XS56-A2982, UV9430, TPR6600, TPR6604, TPR6605; SRX357, SRX211, SD7220, SD7292, LTC750A, LTC760A, LTC303E, SP7259, BY24-468C, SP7248S, BY24-4 manufactured by Dow Corning Toray Co., Ltd. 202, DKQ3-203, DKQ3-204, DKQ3-205, DKQ3-210, etc. Furthermore, in order to adjust the peelability of a release layer, etc., you may use a peeling control agent together. The curing conditions when the release layer is formed on the copolymerized polyester film are not particularly limited. When the release layer is provided by off-line coating, the heat treatment is usually performed at 120-200° C. for 3-40 seconds, preferably at 100-180° C. for 3-40 seconds. Moreover, active energy ray irradiation, such as heat processing and ultraviolet irradiation, can also be used together as needed. In addition, as an energy source for hardening by active energy ray irradiation, a conventionally known apparatus and energy source can be used. The coating amount of the release layer (after drying) is usually 0.005 to 1 g/m in terms of coatability 2 range, preferably 0.005 to 0.5 g/m 2 range, more preferably 0.01 to 0.2 g/m 2 range. Less than 0.005 g/m in coating amount (after drying) 2 In such a case, stability may be lacking in coating properties, and it may be difficult to obtain a uniform coating film. On the other hand, in excess of 1 g/m 2 On the other hand, in the case of thick coating, the coating film adhesion, curability, etc. of the release layer itself may decrease. As a method of providing a release layer on the copolymerized polyester film, previously known reverse gravure coating, direct gravure coating, roll coating, die coating, bar coating, curtain coating, etc. can be used the coating method. Regarding the coating method, there is an example described in "Coating Method" (Written by Maki Shoten Isamaki Harasaki, published in 1979). Moreover, in order to provide a coating layer in the copolymerized polyester film, surface treatment, such as corona treatment, plasma treatment, and ultraviolet irradiation treatment, may be performed in advance. (Coating film) The thickness of this coating film is usually 9 μm to 250 μm, preferably 12 μm to 125 μm, and more preferably 25 μm to 75 μm. When the above-mentioned thickness is less than 9 μm, the film tension becomes insufficient, and an abnormality such as wrinkles is likely to occur at the time of slitting. On the other hand, if it exceeds 250 μm, for example, the followability to a molded product having a curved shape may become insufficient. The storage elastic modulus E' of the coating film at 100°C is 1.5×10 9 Pa or less, preferably 1.0×10 9 Pa or less. By the above storage elastic modulus E' is 1.5 × 10 9 Pa or less, when it is laminated with an adhesive sheet, a concave shape, a convex shape, or a concave-convex shape can be formed on the surface of the adhesive sheet. In order to make the storage elastic modulus E' at 100 degreeC satisfy|fill the said range, it can satisfy by adjusting the kind and content of the copolymerization component contained in the copolymerization polyester film. On the other hand, the lower limit is not particularly limited, but is preferably 1.0×10 7 Pa or more, more preferably 1.0×10 8 Pa or more. The shrinkage ratio of the coating film after heating at 120° C. for 5 minutes is 3.0% or less, preferably 2.5% or less. Since the above-mentioned shrinkage ratio is 3.0% or less, it has sufficient dimensional stability, so that when it is laminated with an adhesive sheet, a concave shape, a convex shape, or a concave-convex shape can be formed on the surface of the adhesive sheet. Furthermore, since the generation of wrinkles during processing can be suppressed, the wrinkles are not transferred to the adhesive sheet, and an adhesive sheet having a sufficient appearance can be produced. Among them, the shrinkage in the machine direction (MD) after heating at 120° C. for 5 minutes is preferably 3.0% or less, more preferably 2.5% or less. On the other hand, it does not specifically limit as a lower limit, Preferably it is 0.1% or more, More preferably, it is 0.5% or more. Moreover, after heating at 120 degreeC for 5 minutes, the shrinkage rate of the direction (TD) perpendicular|vertical to a machine direction becomes like this. Preferably it is 1.0 % or less, More preferably, it is 0.8 % or less. On the other hand, as a lower limit, -1.0% or more is preferable, and -0.5% or more is more preferable. From the viewpoint of preventing contamination caused by the adhesion of the oligomer (cyclic trimer) to the mold during the molding process of the coating film, it is preferable that the oligomer is removed from the coating after the heat treatment (180° C., 10 minutes). The amount of extraction on the surface of the layer is 1.0×10 -3 mg/cm 2 or less, more preferably 5.0×10 -4 mg/cm 2 the following. When the above-mentioned oligomer extraction amount exceeds this range, contamination due to adhesion of the oligomer to the mold during molding may become serious. As an example, in the process of multiple continuous heating and molding, the deposition of precipitated oligomers promotes mold contamination, so it is important to control the amount of oligomers precipitated during heating. For the above-mentioned reasons, it is preferable that the extraction amount of the above-mentioned oligomer is as small as possible. THE MANUFACTURING METHOD OF THE PRESENT ADHESIVE LAMINATED BODY As an example of the manufacturing method of the present adhesive sheet laminated body, the following method is mentioned, for example: The adhesive composition is sandwiched between two covering parts I or II, and a laminating machine is used. An adhesive layer is formed. Moreover, as another method, the method of apply|coating an adhesive composition to the coating part I or II, and forming an adhesive material layer is mentioned. However, it is not limited to this manufacturing method. As a method of coating the adhesive composition, for example, conventionally known coating methods such as reverse roll coating, gravure coating, bar coating, and blade coating are exemplified. [The present shaped pressure-sensitive adhesive sheet laminate] The shaped pressure-sensitive adhesive sheet layered body 1 (referred to as "the present shaped pressure-sensitive adhesive sheet") can be produced in the following manner in which a concave-convex shape is formed on the surface of the pressure-sensitive adhesive layer. Material laminate 1"). As shown in FIG. 3 , the present shaped adhesive sheet laminate 1 can be made to have the following structure: it has an adhesive material layer 2 and is laminated on one of the front and back surfaces of the adhesive material layer 2 in a releasable manner The covering portion I formed on the side, and the covering portion II formed by laminating the other side of the front and back surfaces of the adhesive material layer 2 in a peelable manner, the adhesive material layer 2 has a side surface 2A of the front and back surfaces. The concave part, convex part or concavo-convex part (referred to as "adhesive sheet surface concavo-convex part 2B"), and the other side surface 2C of the front and back surfaces is a flat surface, and the coating part 1 is in close contact with the front and back surfaces of the above-mentioned adhesive sheet 2. One side surface 2A is provided with concave portions, convex portions or concave and convex portions (referred to as "coated portion surface concave and convex portions 3B") on one side surface 3A of the front and back, and the sheet back surface 3C is provided with the above-mentioned adhesive sheet surface concave and convex portions 2B is consistent with, in other words, the convex, concave, or convex-concave portion that forms a fitting concave-convex portion (referred to as "protective sheet back convex-concave portion 3D"), and the coating portion II is along the other side surface 2C of the front and back surfaces of the above-mentioned adhesive sheet 2 Contains flat surfaces. Furthermore, the other side surfaces 2C of the front and back surfaces can be formed as flat surfaces as shown in FIG. The present shaping adhesive sheet laminate 1 having such a structure can be integrated by subjecting the above-mentioned present adhesive sheet laminate to pressure forming, vacuum forming, air pressure forming or roll forming, as shown in FIG. 2 . The present pressure-sensitive adhesive sheet laminate is produced by forming a concavo-convex shape. By manufacturing in the above-described manner, the surface unevenness 2B of the adhesive sheet of the adhesive layer 2, the surface unevenness 3B of the protective sheet of the covering portion 1, and the unevenness 3D of the back surface of the protective sheet can be formed corresponding to the same position respectively to form unevenness. The adhesive layer 2 can be used, for example, as a double-sided adhesive sheet for laminating two image display device constituent members (respectively referred to as "adhered bodies") constituting the image display device. That is, the concave and convex portion 2B on the surface of the adhesive sheet in the above-mentioned adhesive material layer 2 may be in a manner that corresponds to the concave portion, convex portion or concave and convex portion (referred to as "surface concave and convex portion of the adherend") in the bonding surface of the above-mentioned adherend It is preferably formed in the same outline shape. As a result, the adhesive sheet surface concavo-convex portion 2B in the present shaped adhesive sheet laminate 1 can be fitted with the adherend surface concavo-convex portion in the image display device constituting member serving as the adherend. Here, examples of the above-mentioned image display device include a liquid crystal display (LCD), an organic EL (electroluminescence) display (OLED), and an organic light emitting diode (OLED). )), electronic paper, microelectromechanical system (microelectromechanical system, MEMS) display and plasma display (PDP) and other smart phones, tablet terminals, mobile phones, TVs, game consoles, personal computers, car navigation systems, ATM (automatic teller machine, automatic teller machine), fish detector, etc. However, it is not limited to these. In addition, the image display device constituting member as the adherend is a member constituting these image display devices, for example, a surface protection panel, a touch panel, an image display panel, etc. 1 can be used to bond any two adherends selected from a surface protection panel, a touch panel, and an image display panel, for example. For example, it can be used for bonding a surface protection panel and a touch panel, or a touch panel and an image display panel. However, the adherend is not limited to these. <Manufacturing method> Here, the manufacturing method of this shaping|molding adhesive sheet laminated body 1 is demonstrated in detail. As described above, as shown in FIG. 2 , the present adhesive sheet layered body 1 can be integrally molded into a concavo-convex shape by heating the present adhesive sheet layered body to be produced. In this case, as a forming method, for example, press forming, vacuum forming, air pressure forming, forming by roll, forming by lamination, etc. are mentioned. Among them, press forming is particularly preferred from the viewpoint of formability and workability. A more detailed specific example will be described. The adhesive sheet laminate is preheated by a heater, and the adhesive sheet laminate is transported to a press molding machine at the stage of heating to a specific temperature, and the uneven shape corresponding to the printing step shape of the to-be-adhered body is imitated in advance. The mold is press-processed and cooled at the same time, so that the shape of the mold can be transferred to one side of the adhesive sheet laminate, and the present shaped adhesive sheet laminate 1 having concavities and convexities formed on one side is produced. At this time, the preheating of the adhesive sheet laminate is preferably heated to a temperature at which the adhesive layer is softened, and specifically, it is preferably heated at 70 to 120°C. The material of the mold used for concave-convex forming is not particularly limited. For example, resin-based materials such as polysiloxane and fluororesin, metal-based materials such as stainless steel and aluminum, and the like can be mentioned. Among them, since high-precision formability is required for the concavo-convex forming of the adherend, a metal-based mold capable of controlling the temperature during forming is particularly preferred. In addition, the cooling after the press working may be performed after the mold is opened, or the mold may be cooled in advance, and the cooling may be performed simultaneously with the pressurization. Furthermore, in the present invention, the molding conditions such as the pressing pressure and the pressing time are not particularly specified, and may be appropriately adjusted according to the size or shape to be formed, the material to be used, and the like. Moreover, you may cut using a Thomson blade, a rotary cutter, etc. after shaping|molding. [Manufacturing Method of the Present Shaped Adhesive Sheet Laminated Product] Next, a covering portion 1 having an adhesive material layer and laminated on one surface of the adhesive material layer in a peelable manner is provided on one surface of the adhesive material. A particularly preferred embodiment of the method for producing a shaped adhesive sheet laminate having a configuration of concave portions, convex portions, or concave-convex portions (referred to as "adhesive layer surface concavo-convex portions") will be described. Inventions related to the present manufacturing method 1 and the present manufacturing method 2 described below propose a surface concavo-convex portion of the adhesive material layer that can be formed on the surface of the adhesive material layer with high precision and conforming to the concavo-convex portion on the surface of the adherend, preferably A method for producing a novel shape-forming adhesive sheet laminate that can be produced continuously. As an example of an embodiment of the present invention, a novel manufacturing method of a shaped pressure-sensitive adhesive sheet laminate (referred to as "this manufacturing method 1") is proposed. A structure formed by laminating the coating part I on one side of the adhesive material layer by peeling, and forming a concave part, a convex part or a concave-convex part (referred to as "the surface concave-convex part of the adhesive material layer") on one surface of the adhesive material The manufacturing method is characterized in that it comprises an adhesive material layer and a covering portion 1 formed by peeling the adhesive layer laminated on one side of the adhesive material layer, and heating the adhesive sheet laminate to heat the heated adhesive sheet layered body. An adhesive sheet laminate is formed and cooled to produce a manufacturing method for a shaped adhesive sheet laminate, and the adhesive sheet laminate is heated, and the storage elastic modulus E' (MS) in the coating portion I is 1.0× 10 6 ~2.0×10 9 Forming started in the state of Pa, and the storage elastic modulus E' (MF) of the covering part I was 5.0×10 7 ~1.0×10 10 The forming is completed in the state of Pa. In the present manufacturing method 1, a method for manufacturing the above-mentioned novel shaped adhesive sheet laminate is further proposed, which uses a cooled mold for forming the heated adhesive sheet laminate. According to the present manufacturing method 1, for example, after the above-mentioned adhesive sheet laminate is heated, the covering part I starts to be formed in a specific state, and the covering part I finishes forming in a specific state, so that the surface of the adhesive layer can be formed with high precision. A concave-convex shape corresponding to the concave-convex portion on the surface of the adherend is formed. Furthermore, when molding the heated adhesive sheet laminate, if molding is performed using a cooled mold, cooling can be performed at the same time as molding and it can be completed at the same time, so that the above-described manufacturing method can be continuously performed. <This production method 1> This production method 1 is a production method (referred to as "the present production method") of a shaped pressure-sensitive adhesive sheet layered product as an example of the present embodiment, which includes heating the pressure-sensitive adhesive sheet layered body (heating step) described below. ), the manufacturing method of the steps of forming the heated adhesive sheet laminate and cooling (forming and cooling steps). The present manufacturing method 1 may include other steps as long as the above-mentioned heating step and the above-mentioned forming and cooling steps are included. For example, if necessary, steps such as a heat treatment step, a conveying step, a slitting step, and a cutting step are included. But it is not limited to these steps. (Adhesive sheet laminate) The adhesive sheet laminate serving as the starting member in the manufacturing method 1 may include an adhesive layer and a coating portion 1 formed by releasably laminated on one surface of the adhesive layer, Other components may also be provided. For example, as shown in FIG. 1, it is possible to exemplify a coating portion I including an adhesive layer, laminated on one of the front and back sides of the adhesive layer in a releasable manner, and laminated on the adhesive in a releasable manner. The adhesive sheet laminate of the covering portion II formed from the other side of the front and back surfaces of the material layer. However, whether or not the covering portion II is provided is optional, and a configuration in which the covering portion II is not laminated may be adopted. In addition, the details of the adhesive sheet laminate are as described above. (Heating step) In the present manufacturing method 1, it is preferable to heat the above-mentioned adhesive sheet laminate so that the storage elastic modulus E' (M) of the covering portion I is 1.0×10 6 ~2.0×10 9 The state of Pa. If the storage elastic modulus E′(M) of the covering portion I is in the above-mentioned range, the covering portion I can be deformed to an extent suitable for molding, and the surface of the adhesive material layer can be shaped into a desired concavo-convex shape with high accuracy . From this viewpoint, it is preferable that the storage elastic modulus E' (M) of the coating portion I is 1.0×10 by heating the adhesive sheet laminate. 6 ~2.0×10 9 The state of Pa, which is more preferably set to 5.0×10 6 Pa or more or 1.0×10 9 The state of Pa or less is more preferably set to 1.0×10 7 Pa or more or 5.0×10 8 A state below Pa. Accordingly, it is more preferable that the storage elastic modulus E' (M) of the covering portion I be 1.0×10 by heating the adhesive sheet laminate. 6 ~1.0×10 9 Pa, or 1.0×10 6 ~5.0×10 8 The state of the 6 ~2.0×10 9 Pa, or 5.0×10 6 ~1.0×10 9 The state of Pa is best set to 1.0×10 7 ~1.0×10 9 Pa, or 1.0×10 7 ~~5.0×10 8 state. Here, in order to adjust the storage elastic modulus E'(M) of the covering portion 1 so as to be in the above-mentioned range in order to heat the adhesive sheet laminate, it can be adjusted according to the composition or the gel fraction of the composition constituting the covering portion 1. The ratio, weight average molecular weight, etc. are adjusted by adjusting the heating temperature. However, it is not limited to this method. Furthermore, it is more preferable to heat the above-mentioned adhesive sheet laminate so that the storage elastic modulus E' (M) of the covering portion I is 1.0×10 6 ~2.0×10 9 Pa, and the storage elastic modulus G'(S) of the adhesive layer is less than 1.0×10 4 The state of Pa. If the storage elastic modulus E'(M) of the coating portion I is adjusted to the above range, the above-mentioned effects can be obtained. In addition, if the storage elastic modulus G'(S) of the adhesive material layer is less than 1.0 ×10 4 With Pa, sufficient formability can be imparted to the adhesive layer. From this point of view, it is preferable that the storage elastic modulus E'(M) of the covering portion I is within the above range and the storage elastic modulus G'(S) of the adhesive layer is less than 1.0×10 4 The state of Pa, which is preferably set to 5.0×10 1 Pa or more or 5.0×10 3 The state of Pa or less, preferably 1.0×10 2 Pa or more or 1.0×10 3 A state below Pa. Accordingly, it is more preferable to heat the adhesive sheet laminate so that the storage elastic modulus E'(M) of the covering portion I is in the above range and the storage elastic modulus G'(S) of the adhesive layer is 5.0×10 1 Pa or more and less than 1.0×10 4 Pa, or 5.0×10 1 Pa or more and 5.0×10 3 The state of Pa or less is more preferably set to 1.0×10 2 Pa or more and less than 1.0×10 4 Pa, or 1.0×10 2 Pa or more and 5.0×10 3 In the state of less than Pa, it is best to set it as 1.0×10 2 Pa or more and 1.0×10 3 A state below Pa. Here, the storage elastic modulus G'(S) of the adhesive material layer can be adjusted by adjusting the heating temperature according to the composition, gel fraction, weight average molecular weight, etc. of the composition constituting the adhesive material layer. However, it is not limited to this method. Furthermore, it is especially preferable to heat the adhesive sheet laminate so that the value of the loss tangent tanδ of the adhesive layer becomes 1.0 or more. In addition, the loss tangent tanδ will be described below. If the value of the loss tangent tanδ of the adhesive material layer is 1.0 or more, it is preferable because it has a degree of flexibility that can be formed. From this point of view, it is particularly preferable to heat the adhesive sheet laminate so that the value of the loss tangent tanδ of the adhesive layer becomes 1.0 or more, more preferably 1.5 or more or 20 or less, and still more preferably To make it 3.0 or more or 10 or less. But the upper limit is not limited to this. In this manufacturing method 1, it is preferable to heat the adhesive sheet laminated body so that the surface temperature of the coating part I may become 70-180 degreeC. When the surface temperature of the covering portion I is 70° C. or higher, the adhesive material layer is sufficiently softened and the covering portion I can be sufficiently deformed. It is preferable because of the disadvantages such as the decomposition of the adhesive material layer. From this viewpoint, it is preferable to heat the above-mentioned adhesive sheet laminate so that the surface temperature of the covering portion I becomes 70 to 180°C, more preferably 75°C or higher or 150°C or lower, and more preferably It becomes 80 degreeC or more or 120 degreeC or less. As a method of heating the adhesive sheet laminate, for example, a method of heating the adhesive sheet laminate between upper and lower heating plates equipped with a heating body such as an electric heater inside and heating from the upper and lower sides, or a method of directly sandwiching the adhesive sheet laminate The method of holding, the method of using a heating roller, the method of immersing it in hot water, etc. However, it is not limited to these methods. (Shaping and cooling step) In this step, the heated adhesive sheet laminate is formed as described above, and cooling is performed while the adhesive sheet laminate is being formed. That is, the pressure-sensitive adhesive sheet layered body in which the pressure-sensitive adhesive layer and the covering portion I are integrated is directly formed. As a result, the covering portion I is formed by the die, and the adhesive material layer is also formed through the covering portion I. In this step, cooling may be performed after molding the heated adhesive sheet laminate, or cooling may be performed simultaneously with molding. For example, by pressing with a cooled mold, forming and cooling can be performed at the same time and finished at the same time. Thereby, the present manufacturing method 1 can be continuously implemented as described below. As the molding method, the molding method is not particularly limited as long as the pressure-sensitive adhesive sheet laminate can be integrally formed with a concavo-convex shape. For example, press forming, vacuum forming, air pressure forming, forming by roll, compression forming, forming by lamination, etc. are mentioned. Among them, press forming is particularly preferred from the viewpoint of formability and workability. The material of the mold is not particularly limited. For example, resin-based materials such as polysiloxane and fluororesin, metal-based materials such as stainless steel and aluminum, and the like can be mentioned. Among them, since high-precision formability is required for the concavo-convex forming of the adherend, a metal-based mold capable of controlling the temperature during forming is particularly preferred. As the cooling method of the mold, a conventional cooling method can be adopted. For example, water cooling or a cooling method using compressed air is exemplified. For the mold, for example, as shown in FIG. 2, a specific concave-convex shape is preliminarily arranged on the inner wall surface of at least one of the open and closed pair of molds, for example, provided with the surface of the adherend of the adhesive layer. The concavo-convex shape conforming to the concave portion, convex portion, or concave-convex portion, and the above concave-convex shape can be transferred to the adhesive sheet by subjecting the adhesive sheet laminate to pressure forming, vacuum forming, air pressure forming or roll forming using the mold The material is laminated and shaped. In this step, preferably as described above, the storage elastic modulus E' (MS) of the covering portion I in the adhesive sheet laminate is 1.0×10 6 ~2.0×10 9 It begins to take shape in the state of Pa. Here, "starting molding" means, for example, in the case of molding using a mold, the mold is closed, and the pressure-sensitive adhesive sheet laminate is started to be pressed by the mold. If the storage elastic modulus E'(MS) of the covering part I is 1.0×10 6 ~2.0×10 9 In the range of Pa, the covering portion I can be deformed to an extent suitable for forming, and the surface of the adhesive material layer can be formed into a desired concavo-convex shape with high precision. From this viewpoint, the storage elastic modulus E'(MS) in the covering portion I is preferably 1.0×10 6 ~2.0×10 9 In the state of Pa, the forming of the adhesive sheet laminate is started, and it is more preferably 5.0×10 6 Pa or more or 1.0×10 9 Forming is started at a state of Pa or less, preferably 1.0×10 7 Pa or more or 5.0×10 8 Forming starts at a state below Pa. Accordingly, it is more preferable that the storage elastic modulus E'(MS) of the covering portion I be 1.0×10 6 ~1.0×10 9 Pa, or 1.0×10 6 ~5.0×10 8 In the state of Pa, the forming of the adhesive sheet laminate is started, and it is more preferably 5.0×10 6 ~1.0×10 9 Pa, or 5.0×10 6 ~5.0×10 8 It starts to form in the state of Pa, the best is 1.0×10 7 ~1.0×10 9 Pa, or 1.0×10 7 ~5.0×10 8 It begins to take shape in the state of Pa. Furthermore, it is more preferable that the storage elastic modulus E'(MS) in the coating portion I is 1.0×10 6 ~2.0×10 9 Pa, and the storage elastic modulus G'(SS) of the adhesive layer is less than 1.0×10 4 In the state of Pa, the forming of the adhesive sheet laminate is started. If the molding is started in a state where the storage elastic modulus E' (MS) of the coating part I is in the above-mentioned range, the above-mentioned effects can be obtained. In addition to this, if the storage elastic modulus G' ( SS) less than 1.0×10 4 When molding is started in the state of Pa, the molding can be performed in a state in which the adhesive layer has more sufficient formability. From this viewpoint, it is further preferable that the storage elastic modulus E'(MS) of the coating portion I is in the above-mentioned range and the storage elastic modulus G'(SS) of the adhesive material layer is less than 1.0×10 4 Forming starts in the state of Pa, and it is more preferable that the G'(SS) is 5.0×10 1 Pa or more or 5.0×10 3 Forming is started in a state of less than Pa, more preferably 1.0×10 2 Pa or more or 1.0×10 3 Forming starts at a state below Pa. Accordingly, it is more preferable that the storage elastic modulus E'(MS) of the coating portion I is in the above-mentioned range, and the storage elastic modulus G'(SS) of the adhesive layer is 5.0×10 1 Pa or more and less than 1.0×10 4 Pa, or 5.0×10 1 Pa or more and 5.0×10 3 Forming is started in a state of Pa or less, and more preferably, it is 1.0×10 2 Pa or more and less than 1.0×10 4 Pa, or 1.0×10 2 Pa or more and 5.0×10 3 Forming starts at a state of less than Pa, preferably 1.0×10 2 Pa or more and 1.0×10 3 Forming starts at a state below Pa. Moreover, it is preferable to start shaping|molding in the state which the surface temperature of the said coating part I is 70-180 degreeC. When the surface temperature of the covering portion I is 70° C. or higher, the adhesive material layer is sufficiently softened and the covering portion I can be sufficiently deformed. It is preferable because of the disadvantages such as decomposition of the adhesive material layer caused by heat. Therefore, it is preferable to start molding in a state where the surface temperature of the coating portion I is 70 to 180°C, more preferably 75°C or higher or 150°C or lower, and still more preferably 80°C or higher or 120°C ℃ or lower. On the other hand, in this step, it is preferable that the storage elastic modulus E'(MF) of the covering portion I is 5.0×10 7 ~1.0×10 10 The forming is completed in the state of Pa. Here, "finishing the molding" means ending the application of the molding pressure to the adhesive sheet laminate, and in the case of mold molding, it means opening the mold. If the storage elastic modulus E' (MF) of the above-mentioned covering part I is 5.0×10 7 Pa or more and 1.0×10 10 The range below Pa is preferable because the shape stability after molding is excellent. From this viewpoint, it is preferable that the storage elastic modulus E'(MF) in the above-mentioned covering portion I is 5.0×10 7 ~1.0×10 10 Finish the forming in the state of Pa, which is more preferably 1.0×10 8 Pa or more or 8.0×10 9 The molding is completed in a state of less than Pa, more preferably 1.0×10 9 Pa or more or 5.0×10 9 The molding is completed in a state of less than Pa. Accordingly, in this step, it is more preferable that the storage elastic modulus E'(MF) of the covering portion I is 5.0×10 7 ~8.0×10 9 Pa, or 5.0×10 7 ~5.0×10 9 The forming is completed in the state of Pa, among which, it is preferably 1.0×10 8 ~8.0×10 9 Pa, or 1.0×10 8 ~5.0×10 9 Finish the forming in the state of Pa, the best is 1.0×10 9 ~8.0×10 9 Pa, or 1.0×10 9 ~5.0×10 9 The forming is completed in the state of Pa. Furthermore, it is more preferable that the storage elastic modulus E'(MF) of the coating portion I is in the above-mentioned range, and the storage elastic modulus G'(SF) of the adhesive layer is 1.0×10 4 The molding is completed in a state of Pa or more. If the molding is completed in a state where the storage elastic modulus E' (MF) of the coating portion I is in the above-mentioned range, the above-mentioned effects can be obtained. In addition, if the storage elastic modulus G' of the adhesive layer is (SS) is 1.0×10 4 When the molding is completed in a state of Pa or higher, the shape of the formed adhesive layer can be maintained. From this viewpoint, it is preferable that the storage elastic modulus E'(MF) of the coating portion I is in the above-mentioned range, and the storage elastic modulus G'(SF) of the adhesive material layer is 1.0×10 4 The molding is completed in a state of Pa or higher, and it is further preferable that the storage elastic modulus G'(SF) of the adhesive layer is 5.0×10 4 Pa or more or 5.0×10 7 The molding is completed in a state of Pa or less, and more preferably, it is 1.0×10 4 Pa or more or 1.0×10 7 The molding is completed in a state of less than Pa. Moreover, it is preferable to complete|finish shaping|molding in the state which the surface temperature of the said coating part I became less than 50 degreeC. For example, in the case of press molding, it is preferable to open the mold in a state where the surface temperature does not reach 50°C. If the surface temperature of the covering part I is less than 50°C, and the storage elastic modulus E' (MS) of the covering part I is 5.0×10 7 ~1.0×10 10 The range of Pa is preferable because deformation when the molded body is taken out after molding, or warpage due to thermal shrinkage of the covering portion I can be suppressed. From this point of view, it is preferable to finish the molding in a state where the surface temperature of the coating portion I is less than 50°C, and it is preferable to finish the molding in a state where the surface temperature is 0°C or higher or 45°C or lower. The molding is completed in a state of 10°C or higher or 40°C or lower. Furthermore, it is preferable that the storage elastic modulus E' (MS) of the covering portion I at the start of the molding and the storage elastic modulus E' (MF) of the covering portion I at the end of the molding satisfy the following relational expression (1) . (1)・・E'(MF)/E'(MS)≧1.3 Here, if the storage elastic modulus E'(MS) of the above-mentioned coating portion I and the above-mentioned storage elastic modulus of the coating portion I at the end of molding E'(MF) satisfies the above-mentioned relational expression (1), is soft enough to be able to be formed at the beginning of forming, and has a hardness of such a degree that the formed shape can be maintained after the forming is completed, so it is preferable. From this viewpoint, E'(MF)/E'(MS)≧1.3 is preferable, and 100≧E'(MF)/E'(MS) or E'(MF)/E' is more preferable. (MS)≧3.0, particularly preferably 50≧E'(MF)/E'(MS) or E'(MF)/E'(MS)≧5.0. However, the upper limit of E'(MF)/E'(MS) is not limited to this. Moreover, it is preferable that the storage elastic modulus E' (MF) of the coating portion I at the completion of the molding and the storage elastic modulus G' (SF) of the adhesive layer at the completion of the molding satisfy the following relational expression (2) . (2)・・E'(MF)/G'(SF)≦1.0×10 7 Here, if the storage elastic modulus E' (MF) of the covering portion I at the completion of the forming and the storage elastic modulus G' (SF) of the adhesive layer at the completion of the forming satisfy the above-mentioned relational expression (2), then The formed adhesive material layer can maintain the shape. From this viewpoint, it is preferable that E'(MF)/G'(SF)≦1.0×10 7 , which is more preferably 1.0≦E'(MF)/G'(SF) or E'(MF)/G'(SF)≦5.0×10 6 , which is more preferably 1.0×10 1 ≦E'(MF)/G'(SF) or E'(MF)/G'(SF)≦1.0×10 6 . Although there are repetitions, in the present manufacturing method 1, the mold may be press-molded and cooled after the mold is opened, or the mold may be cooled in advance and cooled simultaneously with the press-molding. If the mold is cooled in advance in this way, and the cooling is performed simultaneously with the press molding, the molding and cooling can be completed at the same time. Thereby, the shaped adhesive sheet laminate can be conveyed to the next step immediately after the completion of forming and cooling, so that the shaped adhesive sheet laminate can be continuously produced. In the case of cooling at the same time as the molding of the mold, the surface temperature of the mold is preferably 0 to 50°C. If the surface temperature of the mold is 50°C or lower, the shape of the adhesive sheet laminate can be fixed in a short time, the obtained molded body can be obtained with high precision, and warpage accompanying thermal shrinkage during cooling after molding can be suppressed. It is better from this point of view. Therefore, the surface temperature of the mold is preferably 0 to 50°C, more preferably 10°C or higher or 40°C or lower, and more preferably 15°C or higher or 30°C or lower. In addition, the conditions of press-molding, such as press pressure and press time, are not specifically limited, What is necessary is just to adjust suitably according to the size and shape to be molded, the material to be used, and the like. (Others) The shaped pressure-sensitive adhesive sheet laminate obtained in the above-mentioned forming and cooling steps can be directly wound up, heat-treated, or cut into a specific size and shape. At the time of cutting, the method of cutting using a Thomson blade, a rotary cutter, etc. is mentioned, for example. In this manufacturing method 1, it is preferable to manufacture a shaping|molding adhesive sheet laminated body continuously. For example, the adhesive sheet laminate may be conveyed to a heating unit such as a heater, and the conveyance may be stopped for a predetermined time in the heating unit to heat, or the heated adhesive sheet laminate may be conveyed to molding after being heated while conveying. A unit, such as a forming die, in the forming unit, for example, pressurized by a cooled die, cooled at the same time as forming, and then transported to the next unit as necessary to continuously manufacture a shaped adhesive sheet Laminated body. <The present manufacturing method 2> As an example of the embodiment of the present invention, there is proposed a method for manufacturing a shaped adhesive sheet laminate (referred to as "the present manufacturing method 2"), the shaped adhesive sheet laminate system having an adhesive material. Layer and the coating part I formed by laminating one surface of the adhesive material layer in a peelable manner, and forming concave parts, convex parts or concave and convex parts on one surface of the adhesive material (referred to as "the surface concave-convex part of the adhesive material layer") The characteristics of the manufacturing method include heating an adhesive sheet laminate having an adhesive material layer and a covering portion I formed by peeling the adhesive material layer on one surface of the adhesive material layer, using A method of manufacturing a shaped adhesive sheet laminate by molding the heated adhesive sheet laminate with a mold, heating the adhesive sheet laminate, and starting in a state where the surface temperature of the coating portion I is 70 to 180° C. After molding, after the surface temperature of the coating portion I became less than 60° C., the shaped pressure-sensitive adhesive sheet laminate was taken out from the mold. According to the present manufacturing method 2, by heating the adhesive sheet laminate, molding is started in a state where the surface temperature of the covering portion I is 70 to 180° C., and after the surface temperature of the covering portion I becomes less than 60° C., it is removed from the mold. By taking out the shaped adhesive sheet laminate, for example, on the surface of the adhesive layer, a concavo-convex shape corresponding to the concavo-convex portion on the surface of the adherend can be formed with high precision. This manufacturing method 2 is a manufacturing method including the steps of heating the adhesive sheet laminate described below (heating step), molding the heated adhesive sheet laminate, and cooling (forming, cooling step). The present manufacturing method 2 may include other steps as long as the above-mentioned heating step and the above-mentioned forming and cooling steps are included. For example, if necessary, steps such as a heat treatment step, a conveying step, a slitting step, and a cutting step are included. But it is not limited to these steps. (Adhesive sheet laminate) The adhesive sheet laminate serving as the starting member in the present manufacturing method 2 may include an adhesive layer and a coating portion 1 formed by releasably laminated on one surface of the adhesive layer, Other components may also be provided. For example, as shown in FIG. 1, it is possible to exemplify a coating portion I including an adhesive layer, laminated on one of the front and back sides of the adhesive layer in a releasable manner, and laminated on the adhesive in a releasable manner. The adhesive sheet laminate of the covering portion II formed from the other side of the front and back surfaces of the material layer. However, whether or not the covering portion II is provided is optional, and a configuration in which the covering portion II is not laminated may be adopted. In addition, the details of the adhesive sheet laminate are as described above. (Heating process) In this process, the said adhesive sheet laminated body is heated so that the surface temperature of the coating part I may become 70-180 degreeC. When the surface temperature of the covering portion I is 70° C. or higher, the adhesive material layer is sufficiently softened and the covering portion I can be sufficiently deformed. It is preferable because of the disadvantages such as the decomposition of the adhesive material layer. From this viewpoint, it is preferable to heat the above-mentioned adhesive sheet laminate so that the surface temperature of the covering portion I becomes 70 to 180°C, more preferably 75°C or higher or 150°C or lower, and more preferably It becomes 80 degreeC or more or 120 degreeC or less. Accordingly, it is more preferable to heat the adhesive sheet laminate so that the surface temperature of the covering portion I becomes 70 to 150°C, or 70 to 120°C, and more preferably 75 to 150°C, or 75 to 120°C. 120°C, preferably 80 to 150°C, or 80 to 120°C. As a method of heating the adhesive sheet laminate, for example, a method of heating the adhesive sheet laminate between upper and lower heating plates equipped with a heating body such as an electric heater inside and heating from the upper and lower sides, or a method of directly sandwiching the adhesive sheet laminate The method of holding, the method of using a heating roller, the method of immersing it in hot water, etc. However, it is not limited to these methods. (Forming and Cooling Step) In this step, it is preferable to start the forming of the adhesive sheet laminate in a state where the surface temperature of the coating portion I is heated to 70 to 180° C. as described above. That is, it is preferable to shape|mold directly the adhesive sheet laminated body of the state which laminated|stacked the adhesive material layer and the coating part I integrally. Thereby, the adhesive material layer can be formed through the covering portion I at the same time as the covering portion I is formed. In this step, cooling may be performed after molding the heated adhesive sheet laminate, or cooling may be performed simultaneously with molding. For example, by pressing with a cooled mold, forming and cooling can be performed at the same time and finished at the same time. Thereby, the present manufacturing method 2 can be continuously implemented as described below. As the molding method, the molding method is not particularly limited as long as the pressure-sensitive adhesive sheet laminate can be integrally formed with a concavo-convex shape. For example, press forming, vacuum forming, air pressure forming, forming by rolls (roll forming), compression forming, forming by lamination, etc. are mentioned. Among them, press forming is particularly preferred from the viewpoint of formability and workability. When molding is performed using a mold, the material of the mold is not particularly limited. For example, resin-based materials such as polysiloxane and fluororesin, metal-based materials such as stainless steel and aluminum, and the like can be mentioned. Among them, since high-precision formability is required for the concavo-convex forming of the adherend, a metal-based mold capable of controlling the temperature during forming is particularly preferred. As the cooling method of the mold, a conventional cooling method can be used. For example, water cooling or a cooling method using compressed air is exemplified. For the mold, for example, as shown in FIG. 2, a specific concave-convex shape is preliminarily arranged on the inner wall surface of at least one of the open and closed pair of molds, for example, provided with the surface of the adherend of the adhesive layer. The concavo-convex shape conforming to the concave portion, convex portion, or concave-convex portion, and the above concave-convex shape can be transferred to the adhesive sheet by subjecting the adhesive sheet laminate to pressure forming, vacuum forming, air pressure forming or roll forming using the mold The material is laminated and shaped. As mentioned above, it is preferable to start shaping|molding in the state where the surface temperature of the said coating part I is 70-180 degreeC. When the surface temperature of the covering portion I is 70° C. or higher, the adhesive material layer is sufficiently softened and the covering portion I can be sufficiently deformed. It is preferable because of the disadvantages such as decomposition of the adhesive material layer caused by heat. Therefore, it is preferable to start molding in a state where the surface temperature of the coating portion I is 70 to 180°C, more preferably 75°C or higher or 150°C or lower, and still more preferably 80°C or higher or 120°C ℃ or lower. On the other hand, in this step, it is preferable to complete the molding in a state where the surface temperature of the coating portion I is less than 60°C. For example, in the case of press molding, it is preferable to open the mold in a state where the surface temperature does not reach 60°C. Here, "finishing the molding" means ending the application of the molding pressure to the adhesive sheet laminate, and in the case of mold molding, it means opening the mold. If the surface temperature of the covering portion I is less than 60° C., deformation when the molded body is taken out after molding is suppressed, or warping due to thermal shrinkage of the covering portion I can be suppressed, which is preferable. From this point of view, it is preferable to finish the molding in a state where the surface temperature of the coating portion I is less than 60°C, and it is preferable to finish the molding in a state where the surface temperature is 0°C or higher or 50°C or lower, and among them The molding is completed in a state of 10°C or higher or 40°C or lower. Although there are repetitions, in the present manufacturing method 2, the mold may be press-molded and cooled after the mold is opened, or the mold may be cooled in advance, and the cooling may be performed simultaneously with the press-molding. If the mold is cooled in advance in this way, and the cooling is performed simultaneously with the press molding, the molding and cooling can be completed at the same time. Thereby, the shaped adhesive sheet laminate can be conveyed to the next step immediately after the completion of forming and cooling, so that the shaped adhesive sheet laminate can be continuously produced. In the case of cooling at the same time as the molding of the mold, the surface temperature of the mold is preferably less than 60°C. If the surface temperature of the mold does not reach 60°C, the shape of the adhesive sheet laminate can be fixed in a short time, the obtained molded body can be obtained with good precision, and warpage accompanying thermal shrinkage during cooling after molding can be suppressed, It is better from this point of view. Therefore, the surface temperature of the mold is preferably lower than 60°C, more preferably 0°C or higher or 50°C or lower, and more preferably 10°C or higher or 40°C or lower. Moreover, 10-100 degreeC is preferable, and 20 degreeC or more or 90 degreeC or less is further more preferable among the difference of the surface temperature of the coating part I at the time of shaping|molding start and completion|finish of shaping|molding. Since the difference in the surface temperature of the coating portion I is 10 to 100° C., for example, when the uneven shape is transferred to the pressure-sensitive adhesive sheet layered body for shaping, the pressure-sensitive adhesive sheet can be shaped immediately after completion of shaping and cooling. Since the laminated body is conveyed to the next step, the shaped pressure-sensitive adhesive sheet laminated body can be continuously produced. In addition, the conditions of press-molding, such as press pressure and press time, are not specifically limited, What is necessary is just to adjust suitably according to the size and shape to be molded, the material to be used, and the like. (Others) The shaped pressure-sensitive adhesive sheet laminate obtained in the above-mentioned forming and cooling steps can be directly wound up, heat-treated, or cut into a specific size and shape. At the time of cutting, the method of cutting using a Thomson blade, a rotary cutter, etc. is mentioned, for example. In the present manufacturing method 2, it is preferable to continuously manufacture the shaped pressure-sensitive adhesive sheet laminate. For example, the adhesive sheet laminate may be conveyed to a heating unit such as a heater, and the conveyance may be stopped for a predetermined time in the heating unit to heat, or the heated adhesive sheet laminate may be conveyed to molding after being heated while conveying. A unit, such as a forming die, in the forming unit, for example, pressurized by a cooled die, cooled at the same time as forming, and then transported to the next unit as necessary to continuously manufacture a shaped adhesive sheet Laminated body. <Application> Here, an example of the utilization application of this shaping|molding adhesive sheet laminated body 1 is demonstrated. In recent years, with the generalization of mobile phones, smart phones, tablet terminals, etc., there have been many cases of damage to the image display portion due to user errors, such as dropping them. Especially when the image display device is of the touch panel type, not only does it become difficult to observe the display due to damage, but also the touch panel operation itself cannot be performed due to physical obstacles or water infiltration, or it becomes the cause of failure. . Therefore, there is a case in which maintenance, ie, repair, is performed only by replacing the image display unit. In the maintenance of the image display device, the adhesive sheet is also used when installing a new image display part. Generally, in many cases, the repair operator performs manual work, and the repair operator must be skilled. That is, if an unskilled person is not in use, when the image display part is mounted via an adhesive sheet, air may enter the inside, or the adhesive may be pushed out. On the other hand, when the present shaping adhesive sheet laminate 1 is used, since it is possible to preliminarily provide a highly precise step shape, etc., for example, the adhesive layer is preliminarily provided with a shape corresponding to the model of the image display device. The level difference shape can greatly simplify the maintenance operation, and it can be carried out without the need for skilled repair operators. As described above, the adhesive sheet laminate of the present invention can be usefully used for maintenance of image display devices. <Description of Statements> In this specification, when it is expressed as "X to Y" (X and Y are arbitrary numbers), unless otherwise specified, it means "more than X and less than Y", and also Include the meaning of "preferably larger than X" or "preferably smaller than Y". In addition, when it is expressed as "more than X" (X is an arbitrary number) or "less than Y" (Y is an arbitrary number), it also includes "preferably greater than X" or "preferably less than Y" meaning. In the present invention, the boundary between the sheet and the film is not determined, and it is not necessary to distinguish between the two in the context of the present invention, so in the present invention, the case of "film" also includes "sheet", The term "sheet" also includes "film". EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the Examples. [Group 1 of Examples and Comparative Examples] <Coating Part 1-I> Among Examples 1-1 to 1-3 and Comparative Example 1-1 (hereinafter also collectively referred to as “Group 1 of Examples and Comparative Examples”) The following covering parts 1-A to 1-D were used for the covering part 1-I of the adhesive sheet laminate. Table 1 shows the values of the respective storage elastic moduli.・Coating part 1-A: A film formed by a single-area layer of a biaxially stretched isophthalic acid copolymerized PET film (thickness: 75 μm) containing a release layer (thickness: 2 μm) of a polysiloxane-based compound.・Coated portion 1-B: A release layer (thickness: 38 μm) containing modified polyolefin on a single-layer layer of an unstretched polyolefin film (thickness: 50 μm) containing 4-methylpentene-1 Formed film.・Coated portion 1-C: A film containing a polyolefin film (thickness: 70 μm) containing unstretched polypropylene.・Coating part 1-D: A film formed by biaxially extending a single-area layer of a homopolymer PET film (thickness: 75 μm) containing a release layer (thickness: 2 μm) of a polysiloxane-based compound. <Example 1-1> (Manufacture of double-sided adhesive sheet) As the (meth)acrylic copolymer (1-a), a polymethyl methacrylate macromonomer (Tg: 105 having a number average molecular weight of 2400) was used. °C) 15 parts by mass (18 mol %), 81 parts by mass (75 mol %) of butyl acrylate (Tg: -55 ° C), and 4 parts by mass (7 mol %) of acrylic acid (Tg: 106 ° C) were randomly copolymerized. Acrylic copolymer (1-a-1) (weight average molecular weight: 230,000) 1 kg, glycerol dimethacrylate as crosslinking agent (1-b) (manufactured by NOF Corporation, product name: GMR) (1-b-1) 90 g, and a mixture of 2,4,6-trimethylbenzophenone and 4-methylbenzophenone as the photopolymerization initiator (1-c) (Lanberti Corporation Manufactured, product name: Esacure TZT) (1-c-1) 15 g were mixed uniformly, and the resin composition 1-1 used for the adhesive material layer was produced. The glass transition temperature of the obtained resin composition was -5°C. The obtained resin composition 1-1 was sandwiched by a release-treated PET film (manufactured by Mitsubishi Plastics Corporation, product name: Diafoil MRV-V06, thickness: 100 μm) and two sheets of the covering portion 1-A, and used The laminating machine shaped the resin composition 1-1 into a sheet shape so that the thickness of the resin composition 1-1 was 100 μm, and produced an adhesive sheet laminate 1-1. Furthermore, the release layer side of the coating part 1-A is arrange|positioned so that it may contact with the resin composition 1-1. The obtained adhesive sheet laminate 1-1 was thermoformed by the following process using a vacuum pressure former (manufactured by Daiichi Industrial Co., Ltd., type FKS-0632-20) to produce a shaped adhesive sheet laminate Body 1-1. That is, with an IR heater preheated to 400°C, heating until the surface of the adhesive sheet laminate 1-1 reaches 100°C, and then using a molding die cooled to 25°C, under the condition of a clamping pressure of 8 MPa. Press-molding was performed for 5 seconds to produce a shaped pressure-sensitive adhesive sheet laminate 1-1 in which unevenness was shaped on the surface. <Example 1-2> An adhesive sheet laminate 1-2 and a shaped adhesive sheet were produced in the same manner as in Example 1-1, except that the covering part 1-B was used instead of the covering part 1-A described above. Material laminate 1-2. <Example 1-3> An adhesive sheet laminate 1-3 and a shaped adhesive sheet were produced in the same manner as in Example 1-1, except that the covering part 1-C was used instead of the covering part 1-A described above. Material laminates 1-3. <Comparative Example 1-1> An adhesive sheet laminate 1-4 and a shaped adhesive sheet were produced in the same manner as in Example 1-1, except that the coating portion 1-D was used instead of the coating portion 1-A described above. Material laminates 1-4. <Measurement and Evaluation Methods> The measurement methods and evaluation methods of various physical property values of the samples obtained in Examples 1-1 to 1-3 and Comparative Example 1-1 will be described. (Modulus of Elasticity of Covering Part) The covering parts 1-A to 1-D used in Group 1 of Examples and Comparative Examples were cut into lengths of 50 mm and widths of 4 mm, respectively, and a dynamic viscoelasticity device (IT Meter and Control System) was used. DVA-200 of Co., Ltd.), the measurement is carried out with a gripping distance of 25 mm and a deformation of 1%. The measurement was performed under the conditions of a measurement temperature range of -50°C to 150°C, a frequency of 1 Hz, and a temperature increase rate of 3°C/min. The value of the storage elastic modulus at 100°C of the obtained data is set as E'(MA), and the value of the storage elastic modulus at 30°C is set as E'(MB). (Elastic Modulus of Adhesive Material Layer) The adhesive material layers obtained in Group 1 of Examples and Comparative Examples were stacked to have a thickness of 1 mm, and were measured using a rheometer (MARSII manufactured by Thermo Fisher Scientific). The measurement was performed under the conditions of a measurement temperature range of -50°C to 150°C, a frequency of 1 Hz, and a temperature increase rate of 3°C/min. The value of the storage elastic modulus at 100°C of the obtained data is set as G'(SA), the value of the loss elastic modulus is set as G''(SA), and the storage elastic modulus at 30°C is set to The value of the number is set as G'(SB), the value of loss elastic modulus is set as G''(SB), and the value of G''/G' under each temperature condition is set as the loss tangent of each adhesive material layer tan delta (SA, SB). (Gel fraction) The gel fraction of the adhesive material layer was collected from about 0.05 g of the adhesive material layers obtained in Example and Comparative Example Group 1, respectively, and passed through a SUS wire mesh (#) whose mass (X) was measured in advance. 200) The package is in a bag shape, the mouth of the bag is folded and closed, after measuring the mass (Y) of the package, it is immersed in 100 ml of ethyl acetate, stored in a dark place at 23 ° C for 24 hours, and the package is taken out The adhered ethyl acetate was evaporated by heating at 70° C. for 4.5 hours, the mass (Z) of the dried package was measured, and the obtained mass was substituted into the following formula to obtain. Gel fraction [%]=[(Z-X)/(Y-X)]×100 (Moldability) In order to confirm the moldability, the molding of Example and Comparative Example Group 1 was carried out using the mold described below. test. That is, as shown in Fig. 5, the upper and lower molds for forming are convex molds with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm, and the upper and lower molds are aluminum with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm. flat. For the forming surface of the above-mentioned convex mold, as shown in Fig. 5, a convex portion with a length of 187 mm, a width of 125 mm, and a height of 1 mm is provided in the center, and further, a depth of 25 μm and 50 μm is provided in the forming surface of the convex portion. , 4 forming recesses of 75 μm and 100 μm in a rectangular shape in plan view (length 89 mm, width 58 mm). The coated parts 1-A to 1-D of the shaped adhesive sheet laminates having irregularities formed by the method described in the group 1 of the examples and comparative examples were peeled off, respectively, using a scanning white interference microscope. The height of the concave portion corresponding to the printing level difference and the height of the convex portion corresponding to the display surface were measured by a non-contact method. The height h of the convex part (boundary part between the concave part) of the molded body relative to the depth of 100 μm of the mold was measured, and the transfer rate derived from the following formula was 50% or more, and was evaluated as ○, and those less than 50% were evaluated. is ×. Transfer ratio (%)=h (formed body height)/100 (mold depth)×100 (peeling force) The adhesive sheet laminates produced in Group 1 of Examples and Comparative Examples were cut into lengths of 150 mm and widths of 150 mm. 50 mm, and conduct a 180° peel test at a test speed of 300 mm/min on the interface between the coating parts 1-A to 1-D and the adhesive material layer. The peel force in the environment of 30°C is set as F(C), and the peel force after heating at 100°C for 5 minutes and then naturally cooled to 30°C is set as F(D), and the obtained values are used as the coating respectively. Peeling force of parts 1-A to 1-D. Table 1 shows the evaluation results of the adhesive sheet laminates 1-1 to 1-4 and the shaped adhesive sheet laminates 1-1 to 1-4 obtained in Examples and Comparative Examples. [Table 1] According to the results in Table 1 and FIG. 4 and the test results so far, it was confirmed that, as shown in Examples 1-1 to 1-3, the elastic modulus E' (MB) by storage at 30°C was 5.0×10 7 ~1.0×10 10 Pa and storage elastic modulus E'(MA) at 100°C is 1.0×10 6 ~2.0×10 9 The coating part of Pa is laminated on the adhesive material layer and molded, so that the concave-convex shape can be shaped to the adhesive material layer with high precision. On the other hand, as shown in Comparative Example 1-1, when a biaxially stretched homopolymer PET film, which is generally widely used, is used as a release film, the storage elastic modulus of the covering portion exceeds 2.0× even in a high temperature range. 10 9 Pa, even if thermoforming is performed, sufficient unevenness cannot be formed in the adhesive material layer. It can be seen from this that the elastic modulus E'(MB) at 30°C is 5.0×10 7 ~1.0×10 10 Pa and storage elastic modulus E'(MA) at 100°C is 1.0×10 6 ~2.0×10 9 The coating portion of Pa is laminated on the adhesive layer and molded, and a shaped pressure-sensitive adhesive sheet having irregularities can be obtained favorably. It is also found that: by using, it is preferable to satisfy the condition that the loss tangent tanδ(A) of the adhesive material layer at 100°C is 1.0 or more and satisfy the condition that the loss tangent tanδ(B) of the adhesive material layer at 30°C is less than 1.0 The adhesive sheet laminate under the conditions can achieve higher-precision shaping. Therefore, it was confirmed that by using the above-mentioned adhesive sheet laminate, the unevenness corresponding to the printing level difference of the image display device, which becomes the adherend, can be accurately formed, and there is no gap between the adherend and the adherend. In addition, even in the adherend in which the printed part is designed with a narrow edge, the adhesive material can be well adhered without overflowing, and the shaped adhesive sheet laminate for image display devices can be well adhered. In addition, with regard to the peeling force, the heating and cooling conditions when measuring the peeling force F(D), that is, the conditions of heating at 100° C. for 5 minutes and then naturally cooling to 30° C. are the conditions for producing the shaped pressure-sensitive adhesive sheet laminate. Typical heating and cooling conditions. Since the absolute values of the difference between the peeling force F(C) and the peeling force F(D) in the above-mentioned examples were all 0.1 N/cm or less, it was confirmed that the covering parts 1-A to 1- in the shaping adhesive sheet laminate were The peeling force of D is the same as the peeling force of the covering parts 1-A to 1-D in the adhesive sheet laminate. [Group 2 of Examples and Comparative Examples] <Coating portion 2-I> As Examples 2-1 to 2-4 and Comparative Example 2-1 (hereinafter also collectively referred to as "Group 2 of Examples and Comparative Examples") In the coating part I of the adhesive sheet laminate, the single-area layer of the biaxially stretched isophthalic acid copolymerized PET film (thickness: 75 μm) contains a release layer of polysiloxane (thickness: 2 μm) formed film. The values of the respective storage elastic moduli are shown in Table 2. <Example 2-1> (Manufacture of double-sided adhesive sheet) As the (meth)acrylic copolymer (2-a), a polymethyl methacrylate macromonomer (Tg: 105 having a number average molecular weight of 2400) was used. °C) 15 parts by mass (18 mol %), 81 parts by mass (75 mol %) of butyl acrylate (Tg: -55 ° C), and 4 parts by mass (7 mol %) of acrylic acid (Tg: 106 ° C) were randomly copolymerized. The resulting acrylic copolymer (2-a-1) (weight average molecular weight 230,000) 1 kg, glycerol dimethacrylate as the crosslinking agent (2-b) (manufactured by NOF Corporation, product name: GMR) (2-b-1) 90 g, and a mixture of 2,4,6-trimethylbenzophenone and 4-methylbenzophenone as the photopolymerization initiator (2-c) (Lanberti Corporation Manufactured, product name: Esacure TZT) (2-c-1) 15 g were mixed uniformly, and the resin composition 2-1 used for the adhesive material layer was produced. The glass transition temperature of the obtained resin composition was -5°C. The obtained resin composition 2-1 was sandwiched by a release-treated PET film (manufactured by Mitsubishi Plastics Co., Ltd., product name: Diafoil MRV-V06, thickness: 100 μm) and two sheets of the covering portion 2-1, and used The laminating machine shaped the resin composition 2-1 into a sheet shape so that the thickness of the resin composition 2-1 was 100 μm, and produced an adhesive sheet laminate 2-1. Furthermore, the release layer side of the covering part 2-I is arrange|positioned so that it may contact with the resin composition 2-1. The obtained adhesive sheet laminate 2-1 was thermoformed by the following process using a vacuum pressure forming machine (manufactured by Daiichi Industrial Co., Ltd., type FKS-0632-20) and a mold for forming. Adhesive sheet laminate 2-1. Regarding the molds for forming, as shown in Figure 5, the upper and lower molds are convex molds with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm, and the other upper and lower molds are aluminum plates with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm. . For the forming surface of the above-mentioned convex mold, as shown in Fig. 5, a convex portion with a length of 187 mm, a width of 125 mm, and a height of 1 mm is provided in the center, and further, a depth of 25 μm and 50 μm is provided in the forming surface of the convex portion. , 4 forming recesses of 75 μm and 100 μm in a rectangular shape in plan view (length 89 mm, width 58 mm). By the IR heater preheated to 400 degreeC, it heated until the surface of the covering part 2-I of the adhesive sheet laminated body 2-1 reached 100 degreeC, and it shape|molded. That is, the storage elastic modulus E'(MS) in the covering portion 2-I is 2.1×10 8 Pa and the storage elastic modulus G'(SS) of the adhesive layer is 2.9×10 2 In the state of Pa, using a molding die whose surface temperature was cooled to 30°C, press molding was performed for 5 seconds under the condition of clamping pressure of 8 MPa, and the storage elastic modulus E' (MF) of the covering part 2-I ) is 2.8×10 9 Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×10 4 The mold was opened in the state of Pa, and the shaped pressure-sensitive adhesive sheet laminate 2-1 in which the surface was shaped with irregularities was produced. Furthermore, the ratio E'( MF)/E'(MS) was 13.3. In addition, the ratio E'(MF) of the storage elastic modulus E'(MF) of the covering portion 2-I at the completion of the forming to the storage elastic modulus G'(SF) of the adhesive layer at the completion of the forming is E'(MF)/ G'(SF) is 4.6×10 4 . In addition, the loss tangent tan δ (SS) of the adhesive layer at the beginning of forming was 4.8, and the loss tangent tan δ (SF) of the adhesive layer at the end of forming was 0.6. <Example 2-2> The adhesive sheet laminate 2-1 used in Example 2-1 was heated to the covering portion 2 of the adhesive sheet laminate 2-2 using an IR heater preheated to 400°C The surface of -I reaches 110°C and is shaped. That is, the storage elastic modulus E'(MS) in the covering portion 2-I was 1.3×10 8 Pa and the storage elastic modulus G'(SS) of the adhesive layer is 9.6×10 1 In the state of Pa, using a molding die whose surface temperature was cooled to 30°C, press molding was performed for 5 seconds under the condition of clamping pressure of 8 MPa, and the storage elastic modulus E' (MF) of the covering part 2-I ) is 2.8×10 9 Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×10 4 The mold was opened in the state of Pa, and the shaped pressure-sensitive adhesive sheet laminate 2-2 was produced by forming unevenness on the surface. <Example 2-3> The adhesive sheet laminate 2-1 used in Example 2-1 was heated to the covering portion 2 of the adhesive sheet laminate 2-3 using an IR heater preheated to 400°C The surface of -I reaches 90°C and is shaped. That is, the storage elastic modulus E'(MS) in the covering portion 2-I is 3.5×10 8 Pa and the storage elastic modulus G'(SS) of the adhesive layer is 8.9×10 2 In the state of Pa, using a molding die whose surface temperature was cooled to 30°C, press molding was performed for 5 seconds under the condition of clamping pressure of 8 MPa, and the storage elastic modulus E' (MF) of the covering part 2-I ) is 2.8×10 9 Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×10 4 The mold was opened in the state of Pa, and the shaped pressure-sensitive adhesive sheet laminate 2-3 was produced by forming unevenness on the surface. Furthermore, the ratio E'( MF)/E'(MS) was 8.0. In addition, the ratio E'(MF) of the storage elastic modulus E'(MF) of the covering portion 2-I at the completion of the forming to the storage elastic modulus G'(SF) of the adhesive layer at the completion of the forming is E'(MF)/ G'(SF) is 4.6×10 4 . In addition, the loss tangent tan δ (SS) of the adhesive layer at the beginning of forming was 2.7, and the loss tangent tan δ (SF) of the adhesive layer at the end of forming was 0.6. <Example 2-4> The adhesive sheet laminate 2-1 used in Example 2-1 was heated to the covering portion 2 of the adhesive sheet laminate 2-4 using an IR heater preheated to 400°C The surface of -I reaches 70°C and is shaped. That is, the storage elastic modulus E'(MS) in the covering portion 2-I was 1.9×10 9 Pa and the storage elastic modulus G'(SS) of the adhesive layer is 6.4×10 3 In the state of Pa, using a molding die whose surface temperature was cooled to 25°C, press molding was performed for 5 seconds under the condition of clamping pressure of 8 MPa, and the storage elastic modulus E' (MF) of the covering part 2-I ) is 2.8×10 9 Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×10 4 The mold was opened in the state of Pa, and the shaped pressure-sensitive adhesive sheet laminate 2-4 was produced by forming unevenness on the surface. Furthermore, the ratio E'( MF)/E'(MS) was 1.4. In addition, the ratio E'(MF) of the storage elastic modulus E'(MF) of the covering portion 2-I at the completion of the forming to the storage elastic modulus G'(SF) of the adhesive layer at the completion of the forming is E'(MF)/ G'(SF) is 4.6×10 4 . In addition, the loss tangent tan δ (SS) of the adhesive layer at the beginning of forming was 1.4, and the loss tangent tan δ (SF) of the adhesive layer at the end of forming was 0.6. <Comparative Example 2-1> The adhesive sheet laminate 2-1 used in Example 2-1 was heated to the covering portion 2 of the adhesive sheet laminate 2-5 using an IR heater preheated to 400°C The surface of -I reaches 60°C and is shaped. That is, the storage elastic modulus E'(MS) in the covering portion 2-I is 2.4×10 9 Pa and the storage elastic modulus G'(SS) of the adhesive layer is 1.3×10 4 In the state of Pa, using a molding die whose surface temperature was cooled to 25°C, press molding was performed for 5 seconds under the condition of clamping pressure of 8 MPa, and the storage elastic modulus E' (MF) of the covering part 2-I ) is 2.8×10 9 Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×10 4 The mold was opened in the state of Pa, and the shaped pressure-sensitive adhesive sheet laminate 2-5 in which the surface was shaped with irregularities was produced. Furthermore, the ratio E'( MF)/E'(MS) was 1.2. In addition, the ratio E'(MF) of the storage elastic modulus E'(MF) of the covering portion 2-I at the completion of the forming to the storage elastic modulus G'(SF) of the adhesive layer at the completion of the forming is E'(MF)/ G'(SF) is 4.6×10 4 . In addition, the loss tangent tan δ (SS) of the adhesive layer at the start of forming was 1.1, and the loss tangent tan δ (SF) of the adhesive layer at the end of forming was 0.6. Furthermore, the ratio E'( MF)/E'(MS) was 8.0. In addition, the ratio E'(MF) of the storage elastic modulus E'(MF) of the covering portion 2-I at the completion of the forming to the storage elastic modulus G'(SF) of the adhesive layer at the completion of the forming is E'(MF)/ G'(SF) is 9.7×10 3 . In addition, the loss tangent tan δ (SS) of the adhesive layer at the beginning of forming was 0.6, and the loss tangent tan δ (SF) of the adhesive layer at the end of forming was 0.6. <Measurement and Evaluation Methods> The measurement methods and evaluation methods of various physical property values of the samples obtained in Examples 2-1 to 2-4 and Comparative Example 2-1 will be described. (Modulus of Elasticity of Covered Part) The storage elastic moduli E' (MS) and E' (MF) of the covered part 2-I were cut into lengths of 50 mm and widths of 4 mm, and a dynamic viscoelasticity device (IT Meter and Control DVA-200 of Co., Ltd.), the measurement is carried out with a gripping distance of 25 mm and a deformation of 1%. The measurement was performed under the conditions of a measurement temperature range of -50°C to 150°C, a frequency of 1 Hz, and a temperature increase rate of 3°C/min. The value of the storage elastic modulus at each molding start temperature of Examples and Comparative Examples was set to E' (MS), and the value of the storage elastic modulus at each molding end temperature was set to E' (MF). Furthermore, in Example 2-1, since the temperature at the start of molding is 100°C, the storage elastic modulus E' (MS) of Example 2-1 is the storage elastic modulus E' (MA) at 100°C ). In addition, since the temperature at the end of molding was 30° C. in both Examples and Group 2 of Comparative Examples, the E′ (MF) was the same as the storage elastic modulus at 30° C. for any Example and Group 2 of Comparative Examples. E' (MB) is the same. (Elastic Modulus of Adhesive Material Layer) The adhesive material layers obtained in Group 2 of Examples and Comparative Examples were stacked to have a thickness of 1 mm, and were measured using a rheometer (MARSII manufactured by Thermo Fisher Scientific). The measurement was performed under the conditions of a measurement temperature range of -50°C to 150°C, a frequency of 1 Hz, and a temperature increase rate of 3°C/min. In the obtained data, the value of storage elastic modulus at 100°C is set as G'(SA), the value of loss elastic modulus is set as G''(SA), and the value of storage elastic modulus at 30°C is set as G''(SA). The value of the number is set as G'(SB), the value of loss elastic modulus is set as G''(SB), and the value of G''/G' under each temperature condition is set as the loss tangent of each adhesive material layer tan delta (SA, SB). On the other hand, regarding the storage elastic moduli G'(SA) and G'(SB) of the adhesive material layer, the adhesive material layers obtained in Group 2 of Examples and Comparative Examples were stacked to have a thickness of 1 mm, using The measurement was performed using a rheometer (MARSII manufactured by Thermo Fisher Scientific). The measurement was performed under the conditions of a measurement temperature range of -50°C to 150°C, a frequency of 1 Hz, and a temperature increase rate of 3°C/min. In the obtained data, the value of the storage elastic modulus at the temperature at the start of each forming in Group 2 of Examples and Comparative Examples is set as G'(SS), and the value of the loss elastic modulus is set as G'' (SS), let the value of the storage elastic modulus at each molding end temperature be G'(SF), let the value of the loss elastic modulus be G''(SF), and further, let the value of the storage elastic modulus under each temperature condition be The value of G''/G' is set as the loss tangent tanδ (SS, SF) of each adhesive material layer. (Gel fraction) As for the gel fraction of the adhesive material layer, about 0.05 g of the adhesive material layers obtained in Example and Group 2 of Comparative Example were collected, respectively, and passed through a SUS mesh ( #200) was wrapped in a bag shape, the mouth of the bag was folded and closed, and the mass (Y) of the package was measured, then immersed in 100 ml of ethyl acetate, stored at 23°C for 24 hours in a dark place, and then taken out. The package was heated at 70° C. for 4.5 hours to evaporate the adhering ethyl acetate, the mass (Z) of the dried package was measured, and the obtained mass was obtained by substituting the obtained mass into the following formula. Gel fraction [%]=[(Z-X)/(Y-X)]×100 (Formability) The uneven-shaped shaped pressure-sensitive adhesive sheets obtained in Group 2 of Examples and Comparative Examples were laminated The covering portion I of the body was peeled off, and the heights of the concave portion corresponding to the printing step and the height of the convex portion corresponding to the display surface were measured non-contact using a scanning white interference microscope, respectively. The height h of the convex part (boundary part between the concave part) of the molded body relative to the depth of 100 μm of the mold was measured, and the transfer rate derived from the following formula was 50% or more, and was evaluated as ○, and those less than 50% were evaluated. is ×. Transfer ratio (%)=h (formed body height)/100 (mold depth)×100 (peeling force) The adhesive sheet laminates produced in Group 2 of Examples and Comparative Examples were cut into lengths of 150 mm and widths of 150 mm. 50 mm, and a 180° peel test was performed on the interface between the coating portion 2-I and the adhesive material layer at a test speed of 300 mm/min. The peel force in the environment of 30°C is set as F(C), and the peel force after heating at 100°C for 5 minutes and then naturally cooled to 30°C is set as F(D), and the obtained values are used as the coating respectively. Peeling force of part 2-I. Table 2 shows the evaluation results of the shaped adhesive sheet laminates 2-1 to 2-5 obtained in Examples 2-1 to 2-4 and Comparative Example 2-1. [Table 2] From the results in Table 2 and FIG. 4 and the test results so far, it was confirmed that, as shown in Examples 2-1 to 2-4, by using the storage elastic modulus E of the covering portion 2-I at the beginning of molding '(MS) is 1.0×10 6 ~2.0×10 9 Pa, and the storage elastic modulus E' (MF) of the covering portion 2-I at the end of the molding is 5.0×10 7 ~1.0×10 10 It can be adjusted and formed in the way of Pa, and the concave and convex shape can be formed on the adhesive layer with high precision. On the other hand, as shown in Comparative Example 2-1, the storage elastic modulus E' (MS) of the covering portion 2-I at the start of molding was larger than 2.0×10 9 In the case of Pa, even if thermoforming is performed, sufficient unevenness cannot be formed in the adhesive layer. From this, it can be seen that the storage elastic modulus E'(MS) of the covering portion 2-I at the start of molding is 1.0×10 6 ~2.0×10 9 Pa and the storage elastic modulus E'(MF) of the covering portion 2-I at the end of the molding is 5.0×10 7 ~1.0×10 10 By adjusting and forming in the way of Pa, a shaped adhesive sheet having irregularities can be obtained favorably. It is also found that by further satisfying the condition that the loss tangent tanδ(SS) of the adhesive layer at the beginning of forming is 1.0 or more, and satisfying the condition that the loss tangent tanδ(SF) of the adhesive layer at the end of forming is less than 1.0 The conditions are adjusted and formed, and higher precision forming can be achieved. Therefore, it was confirmed that by using the above-mentioned adhesive sheet laminate, the unevenness corresponding to the printing level difference of the image display device, which becomes the adherend, can be accurately formed, and there is no gap between the adherend and the adherend. In addition, even in the adherend in which the printed part is designed with a narrow edge, the adhesive material can be well adhered without overflowing, and the shaped adhesive sheet laminate for image display devices can be well adhered. In addition, with regard to the peeling force, the heating and cooling conditions when measuring the peeling force F(D), that is, the conditions of heating at 100° C. for 5 minutes and then naturally cooling to 30° C. are the conditions for producing the shaped pressure-sensitive adhesive sheet laminate. Typical heating and cooling conditions. Since the absolute values of the difference between the peeling force F(C) and the peeling force F(D) in the above-mentioned examples were all 0.1 N/cm or less, it was confirmed that the peeling force hardly changed before and after heating. Furthermore, it was found that the storage elastic modulus E' (MS) in the covering portion 2-I was 1.0×10 by heating the adhesive sheet laminate. 6 ~2.0×10 9 The molding starts in the state of Pa, and the storage elastic modulus E' (MF) of the covering part 2-I is 5.0×10 7 ~1.0×10 10 The molding is completed in the state of Pa, and the concavo-convex shape corresponding to the concavo-convex portion on the surface of the adherend can be accurately formed on the surface of the adhesive material layer. [Group 3 of Examples and Comparative Examples] <Coating portion 3-I> As Examples 3-1 to 3-3 and Comparative Examples 3-1 to 3-2 (hereinafter collectively referred to as "Group of Examples and Comparative Examples") In 3"), the covering part 3-I of the adhesive sheet laminate is used for the release layer of the polysiloxane-based compound in the single-area layer of the biaxially stretched isophthalic acid copolymer PET film (thickness: 75 μm). (thickness: 2 μm). Table 3 shows the values of the respective storage elastic moduli. <Example 3-1> (Manufacture of double-sided adhesive sheet) As the (meth)acrylic copolymer (3-a), a polymethyl methacrylate macromonomer (Tg: 105 having a number average molecular weight of 2400) was used. °C) 15 parts by mass (18 mol %), 81 parts by mass (75 mol %) of butyl acrylate (Tg: -55 ° C), and 4 parts by mass (7 mol %) of acrylic acid (Tg: 106 ° C) were randomly copolymerized. The resulting acrylic copolymer (3-a-1) (weight average molecular weight 230,000) 1 kg, glycerol dimethacrylate as a crosslinking agent (3-b) (manufactured by NOF Corporation, product name: GMR) (3-b-1) 90 g, and a mixture of 2,4,6-trimethylbenzophenone and 4-methylbenzophenone as the photopolymerization initiator (3-c) (Lanberti Corporation Manufacturing, product name: Esacure TZT) (3-c-1) 15 g were mixed uniformly, and the resin composition 3-1 used for the adhesive material layer was produced. The glass transition temperature of the obtained resin composition was -5°C. The obtained resin composition 3-1 was sandwiched by a release-treated PET film (manufactured by Mitsubishi Plastics Corporation, product name: Diafoil MRV-V06, thickness: 100 μm) and two sheets of the covering portion 3-1, and used The laminating machine shaped the resin composition 3-1 into a sheet shape so that the thickness of the resin composition 3-1 was 100 μm, and produced an adhesive sheet laminate 3-1. Furthermore, the release layer side of the covering part 3-I is arrange|positioned so that it may contact with the resin composition 3-1. The obtained adhesive sheet laminate 3-1 was thermoformed by the following process using a vacuum pressure former (manufactured by Daiichi Industrial Co., Ltd., type FKS-0632-20) and a molding die to produce a shape. Adhesive sheet laminate 3-1. Regarding the molds for forming, as shown in Figure 5, the upper and lower molds are convex molds with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm, and the other upper and lower molds are aluminum plates with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm. . For the forming surface of the above-mentioned convex mold, as shown in Fig. 5, a convex portion with a length of 187 mm, a width of 125 mm, and a height of 1 mm is provided in the center, and further, a depth of 25 μm and 50 μm is provided in the forming surface of the convex portion. , 4 forming recesses of 75 μm and 100 μm in a rectangular shape in plan view (length 89 mm, width 58 mm). The surface of the covering portion 3-I of the adhesive sheet laminate 3-1 was heated to 100°C by an IR heater preheated to 400°C, and the mold surface temperature was cooled to 30°C using a molding die. The adhesive sheet laminate 3-1 in the heated state was press-molded for 5 seconds under the condition of a clamping pressure of 8 MPa, and then the mold was opened, and the shaped adhesive sheet laminate 3-1 formed by forming concavo-convex on the surface was produced. . <Example 3-2> Using an IR heater preheated to 400° C., the adhesive sheet laminate 3-1 used in Example 3-1 was heated to the covering portion 3 of the adhesive sheet laminate 3-2 When the surface of -I reaches 70°C, the heated adhesive sheet laminate 3-1 is press-molded for 5 seconds under the condition of a clamping pressure of 8 MPa using a molding die that cools the die surface temperature to 30°C. After that, the mold is opened, and the shaped adhesive sheet laminate 3-2 formed by shaping the surface unevenness is produced. <Example 3-3> The adhesive sheet laminate 3-1 used in Example 3-1 was heated to the covering portion 3 of the adhesive sheet laminate 3-3 using an IR heater preheated to 400°C When the surface of -I reaches 100°C, using a molding die whose surface temperature is adjusted to 50°C, the heated adhesive sheet laminate 3-1 is press-molded for 5 seconds under the condition of a clamping pressure of 8 MPa. Then, the mold is opened, and the shaped adhesive sheet laminate 3-3 formed by shaping the surface unevenness is produced. <Comparative Example 3-1> Using an IR heater preheated to 400° C., the adhesive sheet laminate 3-1 used in Example 3-1 was heated to the covering portion 3 of the adhesive sheet laminate 3-5 When the surface of -1 reaches 60°C, the heated adhesive sheet laminate 3-1 is press-molded for 5 seconds under the condition of a clamping pressure of 8 MPa using a molding die that cools the die surface temperature to 30°C. After that, the mold is opened, and the shaped adhesive sheet laminate 3-4 formed by shaping the surface into concavities and convexities is produced. <Comparative Example 3-2> Using an IR heater preheated to 400° C., the adhesive sheet laminate 3-1 used in Example 3-1 was heated to the covering portion 3 of the adhesive sheet laminate 3-5 When the surface of -I reached 100°C, the heated adhesive sheet laminate 3-1 was press-molded for 5 seconds under the condition of a clamping pressure of 8 MPa using a molding die whose surface temperature was adjusted to 80°C. Then, the mold is opened, and the shaped adhesive sheet laminate 3-5 is produced by shaping the surface into concavities and convexities. <Measurement and Evaluation Methods> The measurement methods and evaluation methods of various physical property values of the samples obtained in Examples 3-1 to 3-3 and Comparative Examples 3-1 to 3-2 will be described. (Modulus of elasticity of the covering part) The storage elastic modulus of the covering part 3-I was cut into a length of 50 mm and a width of 4 mm, using a dynamic viscoelasticity device (DVA-200 from IT Meter and Control Co., Ltd.) to clamp Measurements were made with a head spacing of 25 mm and a 1% deformation. The measurement was performed under the conditions of a measurement temperature range of -50°C to 150°C, a frequency of 1 Hz, and a temperature increase rate of 3°C/min. In the obtained data, the value of the storage elastic modulus of the covering portion 3-I at 30° C. is set as E′(MB), and the value of the storage elastic modulus of the covering portion 3-I at 100° C. is set as is E'(MA). (Elastic Modulus of Adhesive Material Layer) The adhesive material layers obtained in Group 3 of Examples and Comparative Examples were stacked to have a thickness of 1 mm, and were measured using a rheometer (MARSII manufactured by Thermo Fisher Scientific). The measurement was performed under the conditions of a measurement temperature range of -50°C to 150°C, a frequency of 1 Hz, and a temperature increase rate of 3°C/min. In the obtained data, the value of storage elastic modulus at 100°C is set as G'(SA), the value of loss elastic modulus is set as G''(SA), and the value of storage elastic modulus at 30°C is set as G''(SA). The value of the number is set as G'(SB), the value of loss elastic modulus is set as G''(SB), and the value of G''/G' under each temperature condition is set as the loss tangent of each adhesive material layer tan delta (SA, SB). (Formability) The coated portion I of the concave-convex shaped pressure-sensitive adhesive sheet laminate obtained in Group 3 of Examples and Comparative Examples was peeled off, and measured in a non-contact manner using a scanning white interference microscope. The height of the concave part of the level difference corresponds to the height of the convex part of the display surface. The height h of the convex part (boundary part between the concave part) of the molded body with respect to the depth of 100 μm of the mold was measured, and the transfer rate derived from the following formula was 50% or more and evaluated as “○”, and it was less than 50%. were rated as "X". Transfer ratio (%)=h (formed body height)/100 (mold depth)×100 (warpage, bending) Form a square with a length of 100 mm, and measure the height of each vertex. The heights of the obtained 4 points were averaged, and this value was used as warpage. Those with a warpage height of less than 10 mm were judged as "○", and those with a height of 10 mm or more were judged as "×". (Peeling force) The adhesive sheet laminate produced in Group 3 of Examples and Comparative Examples was cut into a length of 150 mm and a width of 50 mm, and the interface between the coating portion 3-I and the adhesive layer was tested at a speed of 300 mm/ min to perform a 180° peel test. The peeling force at 30°C was set as F(C), and the peeling force after heating at 100°C for 5 minutes and then cooling to 30°C naturally was set as F(D), and the obtained values were used as the coating respectively. Part 3-I peeling force. Table 3 shows the evaluation results of the shaped pressure-sensitive adhesive sheet laminates 3-1 to 3-5 obtained in Examples 3-1 to 3-3 and Comparative Examples 3-1 to 3-2. [table 3] From the results of Table 3 and the test results so far, it was confirmed that, as shown in Examples 3-1 to 3-3, by starting with the surface temperature of the covering portion 3-I being 70 to 180° C. In the molding, when the surface temperature of the covering portion 3-I becomes less than 60° C., the molding is completed, and the molding is performed by taking out the molded product from the mold, so that the concave-convex shape can be formed on the adhesive layer with high precision. On the other hand, as shown in Comparative Example 3-1, when the temperature of the covering portion 3-I at the start of forming was less than 70° C., even if thermoforming was performed, sufficient unevenness could not be formed on the adhesive layer. In addition, as shown in Comparative Example 3-2, when the surface temperature of the covering portion 3-I is 70° C. or higher when the molding is completed and the molded product is taken out from the mold, the molded product is warped due to thermal shrinkage of the sheet. It is not good to bend or bend. From this, it was found that, in order to form the concavities and convexities with higher accuracy, it is preferable to start the forming in a state where the surface temperature of the covering portion 3-I is 70 to 180° C., and that the surface temperature of the covering portion 3-I becomes less than After reaching 60°C, the molding was completed, and the molding was carried out by taking out the molded product from the mold. Therefore, it was confirmed that by using the above-mentioned adhesive sheet laminate, the unevenness corresponding to the printing level difference of the image display device, which becomes the adherend, can be accurately formed, and there is no gap between the adherend and the adherend. In addition, even in the adherend in which the printed part is designed with a narrow edge, the adhesive material can be well adhered without overflowing, and the shaped adhesive sheet laminate for image display devices can be well adhered. In addition, with regard to the peeling force, the heating and cooling conditions when measuring the peeling force F(D), that is, the conditions of heating at 100° C. for 5 minutes and then naturally cooling to 30° C. are the conditions for producing the shaped pressure-sensitive adhesive sheet laminate. Typical heating and cooling conditions. Since the absolute values of the difference between the peeling force F(C) and the peeling force F(D) in the above-mentioned examples were all 0.1 N/cm or less, it was confirmed that the peeling force hardly changed before and after heating. [Example group 4] The production method of the polyester raw material used in the following Examples 4-1 to 4-5 (hereinafter also collectively referred to as "Example group 4") is as follows. (Manufacturing method of polyester 4-A) 100 parts of dimethyl terephthalate, 70 parts of ethylene glycol, and 0.07 part of calcium acetate monohydrate were placed in a reactor, heated and heated, and methanol was distilled off to remove The transesterification reaction was performed, and after the start of the reaction, the temperature was raised to 230° C. in about four and a half hours, and the transesterification reaction was substantially completed. Next, 0.04 parts of phosphoric acid and 0.035 parts of antimony trioxide were added, and the polymerization was carried out in accordance with a conventional method. That is, the reaction temperature was gradually increased and finally set to 280° C., while the pressure was gradually decreased and finally set to 0.05 mmHg. After 4 hours, the reaction was terminated, and the polyester 4-A was obtained by fragmentation according to a conventional method. The intrinsic viscosity IV of the obtained polyester chips was 0.70 dl/g. (Manufacturing method of polyester 4-B) In the above-mentioned manufacturing method of polyester 4-A, as dicarboxylic acid units, terephthalic acid was set to 78 mol %, and isophthalic acid was set to 22 mol %, Other than that, polyester 4-B was obtained by manufacturing by the same method as polyester A. The intrinsic viscosity IV of the obtained polyester chips was 0.70 dl/g. (Manufacturing method of polyester 4-C) In the manufacture of the above-mentioned polyester 4-A, 6000 ppm of amorphous silica having an average particle size of 3 μm was added to prepare polyester 4-C. (Manufacturing method of polyester 4-D) When manufacturing said polyester 4-A, 6000 ppm of amorphous silica with an average particle diameter of 4 micrometers was added, and polyester 4-D was manufactured. [Example 4-1] Raw materials obtained by mixing the above polyesters 4-B, 4-A, and 4-D in proportions of 65% by weight, 30% by weight, and 5% by weight, respectively, were melted by a melt extruder Extrusion to obtain a single-layer amorphous sheet. Then, the sheet is co-extruded onto a cooled casting drum, and cooled and solidified to obtain a non-aligned sheet. Then, after extending 3.4 times in the machine direction (longitudinal direction) at 80°C, it was further subjected to a preheating step in a drawing machine, and then extended 3.9 times in the direction perpendicular to the machine direction (lateral direction) at 80°C. After biaxial stretching, heat treatment was performed at 185° C. for 3 seconds, followed by relaxation treatment of 6.4% in the width direction to obtain a polyester film with a thickness of 50 μm. The evaluation results are shown in Table 4 below. [Example 4-2], [Example 4-3] A polyester film was obtained in the same manner as in Example 4-1 except that the conditions shown in the following Table 4 were changed. The evaluation results are shown in Table 4 below. [Example 4-4] The above-mentioned polyesters 4-A and 4-C were mixed in proportions of 86% by weight and 14% by weight, respectively, as raw materials for the surface layer, so that polyesters 4-B and 4 The raw materials of -A mixed in the proportions of 45% by weight and 55% by weight, respectively, were used as the raw materials for the intermediate layer. Two kinds of amorphous sheets of 3-layer laminates (surface layer/intermediate layer/surface layer) were obtained by melt extrusion by different melt extruders, respectively. Next, an unaligned sheet is obtained by co-extruding the sheet onto a cooled casting drum and allowing it to cool and solidify. Then, after extending 3.4 times in the machine direction (MD) at 82°C, the preheating step was further carried out in the drawing machine, and then extending 3.9 times in the direction perpendicular to the machine direction (width direction, TD) at 110°C. After biaxial stretching, heat treatment was performed at 210° C. for 3 seconds, followed by relaxation treatment of 2.4% in the width direction to obtain a polyester film with a thickness of 50 μm. The evaluation results are shown in Table 4 below. [Example 4-5] A polyester film was obtained in the same manner as in Example 4-4 except that the conditions shown in the following Table 4 were changed. The evaluation results are shown in Table 4 below. <Measurement and Evaluation Methods> The measurement methods and evaluation methods of various physical property values of the samples obtained in Example Group 4 will be described. (1) Storage Elastic Modulus (E') For the films obtained in Example Group 4, a sample of 30 mm in the longitudinal direction x 5 mm in the width direction was collected so that the longitudinal direction became the machine direction. Next, using a dynamic viscoelasticity device (“DVA-220” manufactured by IT Meter and Control Co., Ltd.), the sample was clamped and fixed by clamps with an interval of 20 mm, and the sample was heated at a rate of 10°C/min from room temperature. The temperature was raised to 200°C, and the storage elastic modulus was measured at a frequency of 10 Hz. From the data obtained, the storage elastic modulus at 100°C was read. (2) Heat shrinkage rate From the center position in the width direction of the film obtained in Example Group 4, the sample was cut into short strips (15 mm wide × 150 mm long) so that the length direction of the sample became the measurement direction, and then The tension-free state was heat-treated at 120° C. for 5 minutes, the length of the sample before and after the heat-treatment was measured, and the thermal shrinkage (%) of the film was calculated by the following formula. Furthermore, in the following formula, a is the length of the sample before heat treatment, and b is the length of the sample after heat treatment. Heat shrinkage ratio (%)=[(a-b)/a]×100 (3) The amount of oligomers on the surface of the film after heat treatment For the films obtained in Example Group 4, the film was heated at 180°C in a nitrogen atmosphere. The polyester film was treated in a hot air circulating oven for 10 minutes. The surface of the polyester film after the heat treatment was brought into contact with DMF (dimethylformamide) for 3 minutes to dissolve the oligomers deposited on the surface. This operation can be adopted as the method described in the dissolution apparatus used in the single-sided dissolution method in the dissolution test, for example, in the voluntary standards for food containers and packaging made of synthetic resin such as polyolefin. Then, if necessary, the concentration of the obtained DMF is adjusted by methods such as dilution, and it is supplied to a liquid chromatograph (Shimadzu LC-2010) to obtain the amount of oligomers in the DMF, and this value is divided by the area of the membrane contacting DMF, As the amount of oligomers on the membrane surface (mg/cm 2 ). The amount of oligomers in DMF was determined from the peak area ratio of the peak area of the standard sample and the peak area of the measurement sample (absolute calibration curve method). The preparation of the standard sample is prepared by accurately weighing the oligomer (cyclic trimer) which has been dispensed in advance, and dissolving it in the accurately weighed DMF. The concentration of the standard sample is preferably in the range of 0.001-0.01 mg/ml. (4) suitability for molding Tg: -55°C) 81 parts by mass (75 mol%) and 4 parts by mass (7 mol%) of acrylic acid (Tg: 106°C) Randomly copolymerized acrylic copolymer (weight average molecular weight 230,000) 1 kg , 90 g of glycerol dimethacrylate (manufactured by NOF Corporation, product name: GMR) (b-1) as a crosslinking agent, and 2,4,6-trimethyldiphenyl as a photopolymerization initiator 15 g of a mixture of ketone and 4-methylbenzophenone (manufactured by Lanberti, product name: Esacure TZT) was uniformly mixed to prepare a resin composition for use in an adhesive sheet. The obtained resin composition was sandwiched up and down with two release films obtained from the polyester films shown in Example Group 4 (the upper and lower combinations were sandwiched by the same release films), and a laminating machine was used. The resin composition was shaped into a sheet shape so that the thickness of the resin composition might be 100 μm to produce an adhesive sheet laminate. Furthermore, the release layer side of a polyester film is arrange|positioned so that it may be in contact with the resin composition. The obtained adhesive sheet laminate system was thermoformed by the following process using a vacuum pressure former (manufactured by Daiichi Industrial Co., Ltd., model FKS-0632-20) to produce a shaped adhesive sheet laminate. That is, with an IR heater preheated to 400°C, heating until the surface of the adhesive sheet laminate reaches 100°C, and then using a molding die cooled to 25°C, under the condition of a clamping pressure of 8 MPa for 5 seconds Press-molding is performed to produce a shaped pressure-sensitive adhesive sheet laminate in which irregularities are formed on the surface. Peel off the polyester film of the concave-convex shaped adhesive sheet laminate, and use a scanning white interference microscope to measure the heights of the concave and convex portions of the shaped adhesive sheet in a non-contact manner. Set to h. The height h of the convex portion of the molded body relative to the depth of 100 μm of the mold was measured, and the transfer rate derived from the following formula was 70% or more, and was evaluated as ○, and the case where it was 50% or more and less than 70% was evaluated as △ , and those less than 50% were evaluated as ×. Transfer ratio (%)=h (formed body height)/100 (mold depth)×100 (5) Appearance of adhesive layer (wrinkles) It was evaluated by the following evaluation methods, respectively. Obtained by the method described in (4) The appearance of the adhesive laminate before press molding. <Evaluation method> ◯: Laminated without wrinkles and maintained a good appearance. ×: The film was wrinkled, and the wrinkle was transferred to the adhesive layer, and it was in a state that it could not be used as a product. [Table 4] [Industrial Applicability] The shaped pressure-sensitive adhesive sheet laminate of the present invention is used to form, for example, personal computers, mobile terminals (PDAs), game consoles, televisions (TVs), car navigation systems, touch panels, handwriting pads, and the like. Such an image display device can be suitably used. Moreover, the adhesive sheet laminated body or coating film of this invention can be used suitably when forming such a shaping|molding adhesive sheet laminated body.