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TWI635515B - Transparent conductive substrate and method for producing transparent conductive substrate - Google Patents

Transparent conductive substrate and method for producing transparent conductive substrate Download PDF

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Publication number
TWI635515B
TWI635515B TW103129699A TW103129699A TWI635515B TW I635515 B TWI635515 B TW I635515B TW 103129699 A TW103129699 A TW 103129699A TW 103129699 A TW103129699 A TW 103129699A TW I635515 B TWI635515 B TW I635515B
Authority
TW
Taiwan
Prior art keywords
transparent
transparent conductive
substrate
metal oxide
oxide layer
Prior art date
Application number
TW103129699A
Other languages
English (en)
Chinese (zh)
Other versions
TW201523640A (zh
Inventor
川添昭造
Original Assignee
日商洛克技研工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商洛克技研工業股份有限公司 filed Critical 日商洛克技研工業股份有限公司
Publication of TW201523640A publication Critical patent/TW201523640A/zh
Application granted granted Critical
Publication of TWI635515B publication Critical patent/TWI635515B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0094Shielding materials being light-transmitting, e.g. transparent, translucent
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/138Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/16Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169Thin semiconductor films on metallic or insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/244Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/412Transparent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/416Reflective
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554Wear resistance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/584Scratch resistance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/12Photovoltaic modules
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208Touch screens
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Led Device Packages (AREA)
  • Photovoltaic Devices (AREA)
TW103129699A 2013-09-10 2014-08-28 Transparent conductive substrate and method for producing transparent conductive substrate TWI635515B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-187759 2013-09-10
JP2013187759 2013-09-10

Publications (2)

Publication Number Publication Date
TW201523640A TW201523640A (zh) 2015-06-16
TWI635515B true TWI635515B (zh) 2018-09-11

Family

ID=52665316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103129699A TWI635515B (zh) 2013-09-10 2014-08-28 Transparent conductive substrate and method for producing transparent conductive substrate

Country Status (5)

Country Link
JP (1) JP6106756B2 (fr)
KR (1) KR102214745B1 (fr)
CN (1) CN105556618B (fr)
TW (1) TWI635515B (fr)
WO (1) WO2015037182A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017058827A (ja) * 2015-09-15 2017-03-23 株式会社村田製作所 タッチパネル及び電子機器
KR102476036B1 (ko) * 2016-05-09 2022-12-12 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자
JP2018098024A (ja) * 2016-12-13 2018-06-21 パイオニア株式会社 発光装置
CN109986599B (zh) * 2017-12-29 2020-10-02 北京纳米能源与系统研究所 摩擦电光智能皮肤、机械手及机器人
KR102058865B1 (ko) 2018-04-12 2019-12-24 (주)아이엠 초가속 열소재를 이용한 발열 디바이스 및 이의 제조방법
JP7116994B2 (ja) * 2018-06-27 2022-08-12 ロック技研工業株式会社 Itoフィルム及び透明導電性フィルム
US11991871B2 (en) 2018-12-12 2024-05-21 Nitto Denko Corporation Impedance matching film for radio wave absorber, impedance matching film-attached film for radio wave absorber, radio wave absorber, and laminate for radio wave absorber
TWI738433B (zh) * 2020-01-09 2021-09-01 致伸科技股份有限公司 光源模組以及具有光源模組的電子裝置
US20230422628A1 (en) * 2020-10-30 2023-12-28 Kureha Corporation Transparent conductive piezoelectric film and touch panel
CN114501970A (zh) * 2022-02-22 2022-05-13 深圳市乐工新技术有限公司 电磁屏蔽材料、溅射镀膜装置及电磁屏蔽材料的制作方法
CN116345179B (zh) * 2023-05-31 2023-08-18 鹏城实验室 具有对高频通信信号智能调控功能的透明窗及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61205925A (ja) * 1985-03-08 1986-09-12 Fujitsu Ltd 透明電極の処理方法
JP2008242314A (ja) * 2007-03-28 2008-10-09 Fujifilm Corp 光学フィルム、偏光板及び画像表示装置
CN102017012A (zh) * 2008-03-14 2011-04-13 Nano-C公司 用于透明导电用途的碳纳米管-透明导电无机纳米颗粒混杂薄膜
TW201318863A (zh) * 2011-08-11 2013-05-16 Toray Industries 積層體、透明導電性積層體、觸控面板、及積層體之製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433811A (en) * 1987-04-04 1989-02-03 Gunze Kk Transparent conductive film and its manufacture
JP2944668B2 (ja) 1988-07-15 1999-09-06 日東電工株式会社 透明導電性フイルムの製造法
JP2846887B2 (ja) 1989-02-10 1999-01-13 日東電工株式会社 透明導電性積層体
KR950009972B1 (en) * 1991-07-04 1995-09-04 Mitsubishi Electric Corp Cylinder identifying apparatus for a multi-cylinder internal combustion engine
JPH06278244A (ja) * 1993-01-29 1994-10-04 Mitsui Toatsu Chem Inc 積層体
CN100565248C (zh) * 2007-03-29 2009-12-02 郭爱军 新型抗反射导电膜
JP5777611B2 (ja) 2010-05-12 2015-09-09 名阪真空工業株式会社 透明導電性基材
CN103189311B (zh) * 2010-10-29 2015-09-30 东丽株式会社 碳纳米管集合体分散液的制造方法
US20120024362A1 (en) * 2011-05-31 2012-02-02 Primestar Solar, Inc. Refractive index matching of thin film layers for photovoltaic devices and methods of their manufacture
CN102200654A (zh) * 2011-06-07 2011-09-28 南京福莱克斯光电科技有限公司 一体化触摸显示装置及其制作方法
JP5813875B2 (ja) * 2011-08-24 2015-11-17 イノバ ダイナミックス, インコーポレイテッド パターン化された透明導体および関連する製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61205925A (ja) * 1985-03-08 1986-09-12 Fujitsu Ltd 透明電極の処理方法
JP2008242314A (ja) * 2007-03-28 2008-10-09 Fujifilm Corp 光学フィルム、偏光板及び画像表示装置
CN102017012A (zh) * 2008-03-14 2011-04-13 Nano-C公司 用于透明导电用途的碳纳米管-透明导电无机纳米颗粒混杂薄膜
TW201318863A (zh) * 2011-08-11 2013-05-16 Toray Industries 積層體、透明導電性積層體、觸控面板、及積層體之製造方法

Also Published As

Publication number Publication date
JP6106756B2 (ja) 2017-04-05
TW201523640A (zh) 2015-06-16
KR102214745B1 (ko) 2021-02-09
CN105556618B (zh) 2018-04-03
CN105556618A (zh) 2016-05-04
KR20160053941A (ko) 2016-05-13
JPWO2015037182A1 (ja) 2017-03-02
WO2015037182A1 (fr) 2015-03-19

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