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TWI689565B - 半導體晶片之製造方法 - Google Patents

半導體晶片之製造方法 Download PDF

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Publication number
TWI689565B
TWI689565B TW105104257A TW105104257A TWI689565B TW I689565 B TWI689565 B TW I689565B TW 105104257 A TW105104257 A TW 105104257A TW 105104257 A TW105104257 A TW 105104257A TW I689565 B TWI689565 B TW I689565B
Authority
TW
Taiwan
Prior art keywords
wafer
semiconductor wafer
adhesive layer
dicing tape
hardening
Prior art date
Application number
TW105104257A
Other languages
English (en)
Chinese (zh)
Other versions
TW201639938A (zh
Inventor
上田洸造
畠井宗宏
麻生隆浩
利根川亨
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW201639938A publication Critical patent/TW201639938A/zh
Application granted granted Critical
Publication of TWI689565B publication Critical patent/TWI689565B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW105104257A 2015-02-09 2016-02-15 半導體晶片之製造方法 TWI689565B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP2015-023394 2015-02-09
JP2015023392 2015-02-09
JPJP2015-023392 2015-02-09
JP2015023394 2015-02-09

Publications (2)

Publication Number Publication Date
TW201639938A TW201639938A (zh) 2016-11-16
TWI689565B true TWI689565B (zh) 2020-04-01

Family

ID=56615245

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105104257A TWI689565B (zh) 2015-02-09 2016-02-15 半導體晶片之製造方法

Country Status (4)

Country Link
JP (1) JPWO2016129577A1 (fr)
KR (2) KR102652507B1 (fr)
TW (1) TWI689565B (fr)
WO (1) WO2016129577A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102053843B1 (ko) * 2016-11-08 2019-12-09 주식회사 엘지화학 음극 및 상기 음극의 제조방법
JP6871573B2 (ja) * 2017-09-15 2021-05-12 協立化学産業株式会社 チップの表面加工方法及びゲル状組成物
JP2021061347A (ja) * 2019-10-08 2021-04-15 積水化学工業株式会社 半導体加工用テープ及び半導体パッケージの製造方法
CN114382712A (zh) * 2021-12-16 2022-04-22 西安电子工程研究所 一种实现风机快速、全面防盐雾处理的方法
WO2025169707A1 (fr) * 2024-02-06 2025-08-14 株式会社レゾナック Feuille de protection et procédé de production de dispositif à semi-conducteur

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064329A (ja) * 2001-08-30 2003-03-05 Nitto Denko Corp エネルギー線硬化型熱剥離性粘着シート、これを用いた切断片の製造方法、及びその切断片
JP2004281526A (ja) * 2003-03-13 2004-10-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754830A (en) * 1971-10-21 1973-08-28 Science Spectrum Scattering cell employing electrostatic means for supporting a particle
JPH0778793A (ja) 1993-06-21 1995-03-20 Toshiba Corp 半導体ウェーハの研削加工方法
KR0156695B1 (ko) * 1994-06-28 1999-01-15 윤종용 공기조화기의 운전제어방법
JP3330851B2 (ja) * 1997-07-01 2002-09-30 リンテック株式会社 ウエハ研削方法
JP4635436B2 (ja) * 2003-12-26 2011-02-23 パナソニック株式会社 チップ形電子部品の製造方法
JP2008060151A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
JP2010150432A (ja) * 2008-12-25 2010-07-08 Furukawa Electric Co Ltd:The マスキング用剥離性粘着テープ
JP5513866B2 (ja) * 2009-12-11 2014-06-04 リンテック株式会社 電子部品加工用粘着シート
JP2012031417A (ja) * 2011-09-05 2012-02-16 Mitsubishi Plastics Inc 離型フィルム付中間膜用粘着シート及び透明積層体
JP5117630B1 (ja) * 2012-07-06 2013-01-16 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープおよびそれを用いた半導体ウェハの製造方法
CN104755576B (zh) * 2012-11-05 2016-12-07 琳得科株式会社 粘合片材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064329A (ja) * 2001-08-30 2003-03-05 Nitto Denko Corp エネルギー線硬化型熱剥離性粘着シート、これを用いた切断片の製造方法、及びその切断片
JP2004281526A (ja) * 2003-03-13 2004-10-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
KR20230147744A (ko) 2023-10-23
KR102652507B1 (ko) 2024-03-28
TW201639938A (zh) 2016-11-16
WO2016129577A1 (fr) 2016-08-18
KR20170110565A (ko) 2017-10-11
JPWO2016129577A1 (ja) 2017-11-16

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