TWI647080B - Breaking method of brittle substrate - Google Patents

Abstract

The object of the present invention is to prevent the brittle substrate from being broken unexpectedly in the process of providing a component on the brittle substrate, and to cut the brittle substrate by using a narrow area between the components as a boundary.

In the present invention, the blade point 51 slides on the surface SF1 of the brittle substrate 4 to cause plastic deformation, thereby forming a groove line TL having a groove shape. Just below the trench line TL, the fragile substrates 4 are continuously connected. Next, a member 11 is provided on the surface SF1. The member 11 has a portion separated from each other via the trench line TL. Next, a crack in the brittle substrate 4 is extended along the groove line TL in the thickness direction to form a crack line CL. Through the crack line CL, immediately below the trench line TL, the fragile substrate 4 is continuously connected and disconnected in a direction crossing the trench line TL. The brittle substrate 4 is cut along the crack line CL.

Description

Breaking method of brittle substrate

The present invention relates to a method for breaking a fragile substrate.

In the manufacture of electrical devices such as flat display panels or solar cell flat panels, it is often necessary to break brittle substrates such as glass substrates. First, a scribe line is formed on the substrate, and then the substrate is divided along the scribe line. For example, according to Japanese Patent Application Laid-Open No. 9-188534, a method for forming a scribing line by a glass milling wheel is disclosed. The glass is rolled on the substrate by a milling cutter, and a groove is formed on the substrate by plastic deformation. At the same time, a vertical crack is formed directly below the groove. Thereafter, stress is applied in a so-called breaking step. The crack is completely advanced in the thickness direction by the breaking step, thereby breaking the substrate.

The process of cutting the substrate is often performed immediately after the process of forming a scribe on the substrate. However, there is also proposed a process of providing a plurality of members on a substrate between a step of forming a scribing line and a breaking step.

For example, according to the technology of International Publication No. 2002/104078, in the method of manufacturing an organic EL display, a scribe line is formed on a glass substrate in each area that becomes each organic EL display before a sealing cover is installed. Therefore, when a scribe is formed on the glass substrate after the sealing cover is provided, the problematic contact between the sealing cover and the glass milling cutter can be avoided.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 9-188534

[Patent Document 2] International Publication No. 2002/104078

According to the above-mentioned prior art, a step of providing a sealing cover (member) on a glass substrate (brittle substrate) is performed after forming a scribe line. Therefore, if this technique is used, a brittle substrate can be divided using a narrow area between members as a boundary. On the other hand, since a vertical crack already exists in the process of providing a sealing cap on a brittle substrate, it is easy to unexpectedly occur that the vertical crack further expands in the thickness direction. Therefore, the brittle substrate that should be integrated in this process may be broken unexpectedly.

The present invention has been made in view of the above problems, and an object thereof is to provide a method for preventing a brittle substrate from being broken unexpectedly in a process of installing a member on a brittle substrate, and breaking a brittle substrate using a narrow area between members as a boundary. Breaking method of brittle substrate.

The cutting method of the brittle substrate of the present invention includes the following steps: preparing a brittle substrate having a surface and having a thickness direction perpendicular to the surface; pressing a blade tip on the surface of the brittle substrate; and pressing the blade through the pressing step. The blade tip slides on the surface of the fragile substrate, thereby plastically deforming on the surface of the fragile substrate to form a groove line having a groove shape. The step of forming the groove line may be performed as follows: a state in which the brittle substrate is continuously connected in a direction crossing the groove line, that is, a crack-free state, is provided directly below the groove line. Furthermore, the method for breaking a fragile substrate of the present invention further includes a step of providing a member on the surface after the step of forming the groove line. The member has a portion separated from each other on the surface via the groove line. The method for breaking a fragile substrate of the present invention further includes a step of forming a crack line by extending the crack of the fragile substrate along the groove line in the thickness direction after the step of disposing the component. Through the crack line, the fragile substrate is continuously connected and disconnected immediately below the groove line in a direction crossing the groove line. The method for cutting a brittle substrate of the present invention further includes a step of cutting the brittle substrate along the crack line.

In addition, the above-mentioned "pressing the blade tip against the surface" means pressing the blade tip at any position on the "surface", so it can also mean pressing the blade tip on the edge of the "surface".

According to the present invention, as a line defining a position for breaking a brittle substrate, a groove line having no cracks is formed directly below it. The crack line used as a direct opportunity for breaking is formed by extending the crack to align itself along the groove line. Thus, the brittle substrate after the formation of the trench line and before the formation of the crack line not only specifies the position to be broken by the trench line, but also because the crack line has not yet been formed, it is in a state where no break is easily generated. By performing the step of providing a member on the fragile substrate in this stable state, it is possible to prevent the fragile substrate from being unexpectedly broken during this step. In addition, since this step is performed after the groove line is formed, the movement of the blade tip for forming the groove line is not hindered by the member. Thereby, the arrangement of the groove lines and the arrangement of the members can be freely determined from each other. Therefore, a structure in which a trench line passes through a narrow area between members can be obtained. Thereafter, a crack line is formed using a trench line, and then the brittle substrate is cut along it, whereby the brittle substrate can be cut using the narrow region between the members as a boundary. As described above, the brittle substrate can be prevented from being broken unexpectedly in the step of providing the member on the brittle substrate, and the brittle substrate can be broken by using the narrow area between the members as a boundary.

4‧‧‧ glass substrate (brittle substrate)

4a‧‧‧ substrate

4b‧‧‧ substrate

11‧‧‧Laminated timber (component)

11a‧‧‧part

11b‧‧‧part

12‧‧‧ Components

12a‧‧‧part

12b‧‧‧part

50‧‧‧ cutting appliances

51‧‧‧Blade

51v‧‧‧ blade

52‧‧‧Handle

AL‧‧‧Auxiliary line

AX‧‧‧axis direction

CL‧‧‧ crack line

DA‧‧‧ Direction

DB‧‧‧ Direction

DC‧‧‧ direction

DT‧‧‧thickness direction

ED1‧‧‧ side (first side)

ED2‧‧‧ side (second side)

ED3‧‧‧side

ED4‧‧‧Edge

FB‧‧‧External Force

IIA-IIA‧‧‧line

IIB-IIB‧‧‧line

IIC-IIC‧‧‧line

IID-IID‧‧‧line

IIE-IIE‧‧‧line

N1‧‧‧ position (1st position)

N2‧‧‧ position (2nd position)

N3‧‧‧Location

N4‧‧‧Location

PP‧‧‧ protrusion

PPv‧‧‧ protrusion

PS‧‧‧Side

PSv‧‧‧ Side

SC‧‧‧ cone

SD1‧‧‧Top (first side)

SD2‧‧‧ side (second side)

SD3‧‧‧side (3rd side)

SF1‧‧‧upper surface (surface)

SF2‧‧‧ lower surface

S10 ~ S60‧‧‧‧step

TL‧‧‧Trench line

VB‧‧‧ Arrow

XVIIIB‧‧‧Arrow

W‧‧‧ interval

FIG. 1 is a plan view ((A) to (E)) schematically showing a method for cutting a brittle substrate according to Embodiment 1 of the present invention.

FIG. 2 is a schematic cross-sectional view (A) along the line IIA-IIA in FIG. 1 (A), a schematic cross-sectional view (B) along the line IIB-IIB in FIG. 1 (B), and A schematic cross-sectional view of line IIC-IIC (C), a schematic cross-sectional view of line IID-IID (D) along the line 1 (D), and a schematic cross-sectional view of IIE-IIE along the line 1 (E) ( E).

3 is a cross-sectional view (A) schematically showing a configuration of a groove line formed in a method for breaking a brittle substrate according to Embodiment 1 of the present invention, and a cross-sectional view (B) schematically showing a configuration of a crack line.

FIG. 4 is a flowchart schematically showing the structure of a method for cutting a brittle substrate according to Embodiment 1 of the present invention.

Fig. 5 is a side view (A) schematically showing the structure of a device used in a method for breaking a fragile substrate according to Embodiment 2 of the present invention, and a view from an arrow VB of Fig. 5 (A) schematically shows the contents of the device Top view of the structure of the blade tip (B).

FIG. 6 is a plan view ((A) and (B)) schematically showing a method for cutting a brittle substrate according to Embodiment 2 of the present invention.

FIG. 7 is a plan view ((A) and (B)) schematically showing a method for breaking a brittle substrate according to a first modification of the second embodiment of the present invention.

Fig. 8 is a plan view schematically showing a method for breaking a brittle substrate according to a second modification of the second embodiment of the present invention.

FIG. 9 is a plan view schematically showing a method for breaking a brittle substrate according to a third modification of the second embodiment of the present invention.

FIG. 10 is a plan view schematically showing a first step of a method for cutting a brittle substrate according to Embodiment 3 of the present invention.

FIG. 11 is a plan view schematically showing a second step of a method for cutting a brittle substrate according to Embodiment 3 of the present invention.

FIG. 12 is a plan view schematically showing a third step of the method for cutting a brittle substrate according to Embodiment 3 of the present invention.

FIG. 13 is a plan view ((A) and (B)) schematically showing a method for cutting a brittle substrate according to a first modification of the third embodiment of the present invention.

Fig. 14 is a plan view schematically showing a method for breaking a brittle substrate according to a second modification of the third embodiment of the present invention.

15 is a plan view ((A) and (B)) schematically showing a method for cutting a brittle substrate according to Embodiment 4 of the present invention.

FIG. 16 is a schematic view showing a method for breaking a brittle substrate according to Embodiment 5 of the present invention; Views ((A) and (B)).

FIG. 17 is a plan view schematically showing a method for cutting a fragile substrate according to a modification of the fifth embodiment of the present invention.

FIG. 18 is a side view (A) schematically showing the configuration of an apparatus used in a method for breaking a fragile substrate according to Embodiment 6 of the present invention, and a perspective view of an arrow XVIIIB of FIG. 18 (A) schematically shows that the apparatus has Top view of the structure of the blade tip (B).

Hereinafter, embodiments of the present invention will be described based on the drawings. In addition, the same or equivalent parts in the following drawings are denoted by the same reference numerals and the description thereof is not repeated.

(Embodiment 1)

A method of dividing the brittle substrate according to this embodiment will be described below.

1 (A) and 2 (A), first, a glass substrate 4 (brittle substrate) is prepared (FIG. 4: Step S10). The glass substrate 4 includes an upper surface SF1 (front surface) and a lower surface SF2 opposite thereto. The glass substrate 4 includes a thickness direction DT perpendicular to the upper surface SF1. In addition, a cutting tool 50 having a blade tip 51 and a handle 52 is prepared. The tool tip 51 is held by being fixed to a tool holder 52 serving as a holder thereof. A more detailed structure of the cutting tool will be described in Embodiments 2 and 6.

Next, the blade tip 51 is pressed against the upper surface SF1 of the glass substrate 4 (FIG. 4: Step S20). Next, the pressed blade point 51 is slid on the upper surface SF1 of the glass substrate 4 (see the arrow in FIG. 1 (A)).

Referring to FIGS. 1 (B) and 2 (B), the above-mentioned sliding of the blade tip 51 causes plastic deformation on the upper surface SF1 of the glass substrate 4. Thereby, a trench line TL having a trench shape is formed on the upper surface SF1 (FIG. 4: Step S30). Referring to FIG. 3 (A), the process of forming the trench line TL can be performed as follows: obtained directly below the trench line TL, the extending direction of the glass substrate 4 and the trench line TL (the lateral direction of FIG. 1 (B)) The state of continuous connection in the direction of crossing DC is a state without cracks. In the crack-free state, although the trench line TL is formed by plastic deformation, no crack is formed along it. Therefore, even if the glass substrate 4 is simply applied as in the previous breaking process, Even when external forces such as bending moments are applied, a break along the groove line TL will not be easily generated. Therefore, the breaking process along the trench line TL is not performed in a state without a crack line. In order to obtain a crack-free state, the load applied to the blade tip 51 is set to a level where cracks do not occur and a level where plastic deformation occurs.

The crack-free state must be maintained for a necessary period of time (Figure 4: Step S40). To maintain a crack-free state, as long as operations such as applying excessive stress to the glass substrate 4 in the trench line TL are avoided, such as avoiding applying a large external stress that may cause damage to the substrate or heating with a large temperature change can. The glass substrate 4 can be transported to the execution location of the next process while maintaining a crack-free state. Alternatively, the crack-free state may be maintained while the glass substrate 4 is stored until the next step is performed.

Referring to FIGS. 1 (C) and 2 (C), after the trench line TL is formed, a crack-free state is maintained, and a laminated material 11 (member) is provided on the upper surface SF1. The step of providing the laminated material 11 can be performed, for example, by joining previously prepared members or depositing a raw material.

The laminated material 11 has portions 11 a and 11 b which are separated from each other on the upper surface SF1 via a trench line TL. In other words, in the upper surface SF1, the trench lines TL are spaced between the portions 11a and 11b. The portions 11 a and 11 b may be arranged on the upper surface SF1 of the glass substrate 4 with a trench line TL at intervals W. The interval W can be so small that the movement of sliding the blade 51 between the portions 11a and 11b on the surface SF1 cannot be performed. This is because such an operation is not required according to the present embodiment. The reason why the above-mentioned action of the blade point 51 cannot be performed is that the component 11 may collide with the blade point 51 or the handle 52. The interval W can be, for example, 100 μm or less. Each of the portions 11a and 11b may also be very close to the trench line TL.

The laminated material 11 is preferably provided so that the groove line TL on the upper surface SF1 protrudes from between the portions 11a and 11b. In FIG. 1 (C), each of the right end portion and the left end portion of the trench line TL protrudes from a region between the portions 11a and b. Only one end of the trench line TL may protrude.

Alternatively, a laminated material 12 may be provided on the lower surface SF2. The laminated material 12 has portions 12a and 12b separated from each other.

Further referring to FIG. 1 (D) and FIG. 2 (D), after the laminated material 11 is provided, the crack of the glass substrate 4 is extended along the groove line TL in the thickness direction DT. Thereby, the crack line CL is formed in alignment with the trench line TL by itself (FIG. 4: Step S50). Referring to FIG. 3 (B), through the crack line CL, directly below the trench line TL, the glass substrate 4 is continuously connected in a direction DC that intersects with the extending direction of the trench line TL (lateral direction of FIG. 1 (B)). disconnect. Here, the so-called "continuous connection", in other words, the connection without being cut by a crack. In addition, in a state of being continuously connected and disconnected as described above, portions of the glass substrate 4 may be in contact with each other through the cracks of the crack line CL.

The formation of the crack line CL is started by, for example, applying strain to the glass substrate 4 at the end of the trench line TL to release the internal stress near the trench line TL. In the example of FIG. 1 (C), stress is applied to the glass substrate 4 at the right end portion or the left end portion of the trench line TL. As shown in FIG. 1 (C), in the case where the trench line TL protrudes from between the portions 11a and 11b, it is difficult for the portions 11a and 11b to become obstacles when stress is applied. In addition, the details will be described later in the second embodiment. However, there may be those which are more preferably subjected to stress at the both end portions. The application of the stress is performed by, for example, applying external stress by pressing the blade tip against the formed trench line TL again, or by heating by irradiation with laser light or the like.

1 (E) and 2 (E), the glass substrate 4 is divided into substrate pieces 4a and 4b along the crack line CL (FIG. 4: Step S60). That is, a so-called breaking process is performed. The breaking step can be performed, for example, by applying an external force FB to the glass substrate 4 (FIG. 2 (D)). Thereby, the substrate sheet 4a provided with the portions 11a and 12a and the substrate sheet 4b provided with the portions 11b and 12b are obtained.

According to this embodiment, as a line defining a position where the glass substrate 4 is cut, a trench line TL having no cracks immediately below it is formed. The crack line CL used as a direct opportunity for breaking is formed by extending a crack to align itself along the trench line TL. Therefore, the glass substrate 4 after the formation of the trench line TL and before the formation of the crack line CL not only defines the position of the break by the trench line TL, but also because the crack line CL has not yet been formed, it is not easily broken The stable state. Since the step of providing the laminated material 11 on the glass substrate 4 is performed in this stable state, the glass substrate 4 can be prevented from being unexpectedly broken during this step.

In addition, since this step is performed after forming the trench line TL, the movement of the blade edge for forming the trench line TL is not hindered by the laminated material 11. Thereby, the arrangement of the trench lines TL and the arrangement of the laminated material 11 can be determined freely with each other. Therefore, a structure in which the trench line TL passes through a narrow region between the laminated materials 11 can be obtained. Thereafter, a slit line CL is formed using the trench line TL, and then the glass substrate 4 is cut along it, thereby narrowing the narrow area between the laminated materials 11 (the area between the portions 11a and 11b in FIG. 1 (D)). ) Breaks the glass substrate 4 as a boundary.

As described above, the glass substrate 4 is prevented from being broken unexpectedly in the step of providing the laminated material 11 on the glass substrate 4, and the glass substrate 4 can be divided by using the narrow area between the laminated materials 11 as a boundary.

Furthermore, according to this embodiment, the width W between the portions 11a and 11b of the laminated material 11 can be narrowed arbitrarily. Thereby, the portions 11a and 11b can be more densely arranged. Therefore, the glass substrate 4 can be used more effectively.

In addition, this embodiment is particularly advantageous when the laminated material 11 is a material having low heat resistance, for example, a portion made of a synthetic resin is included. The reason is that in this case, if the adverse effect of heat on the laminated material is taken into consideration, a technique of scribes with laser light having a narrow width corresponding to a narrow gap between the laminated materials is used instead of this embodiment. This method has its difficulties.

The formation process of the crack line CL in this embodiment is fundamentally different from a so-called breaking process. The breaking step is a method in which the formed crack is further extended in the thickness direction to completely separate the substrate. On the other hand, the formation process of the crack line CL is a change from a crack-free state obtained by forming the trench line TL to a cracked state. This change is considered to be caused by the internal stress of the open and crack-free state. Considering the state of plastic deformation when the trench line TL is formed, and the state or magnitude of the internal stress generated by the formation of the trench line TL, the rolling using a rotary blade and the use of a blade as in this embodiment Sharp slip The two cases are different when moving the two. When the blade is used to slide, it is easy to produce cracks under the condition of wider scribe lines. Moreover, opening the internal stress requires several opportunities, and it is considered to act as such an opportunity to generate a crack on the trench line TL by using the external stress application as described above. Details of a preferred method for forming the trench line TL and the crack line CL are described in the following second to sixth embodiments.

(Embodiment 2)

First, the cutting edge used in the method for cutting a brittle substrate according to this embodiment will be described below.

5 (A) and (B), the cutting edge 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. The plurality of surfaces include a side surface SD2 (a second surface) and a side surface SD3 (a third surface). The top surface SD1 and the side surfaces SD2 and SD3 (first to third surfaces) face different directions and are adjacent to each other. The cutting edge 51 has a vertex where the top surface SD1, the lateral surfaces SD2, and SD3 meet, and the apex of the cutting edge 51 constitutes the protrusion PP of the cutting edge 51. In addition, the side surfaces SD2 and SD3 have ridgelines constituting the side portion PS of the blade point 51. The side portion PS extends linearly from the protrusion portion PP. Since the side PS is a ridge line as described above, it has a convex shape extending linearly.

The cutting edge 51 is preferably a diamond cutting head. That is, from the point that hardness and surface roughness can be reduced, the cutting edge 51 is preferably made of diamond. More preferably, the blade tip 51 is made of single crystal diamond. Further more preferably, in terms of crystallography, the top surface SD1 is a {001} surface, and the side surfaces SD2 and SD3 are each a {111} surface. In this case, although the side faces SD2 and the side faces SD3 have different orientations, they are crystallographically equivalent crystal planes.

In addition, non-single crystal diamond can be used, for example, polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method. Alternatively, polycrystalline diamond particles sintered from particulate graphite or non-graphite-like carbon and sintering a bonding material not containing an iron group element or the like can be bonded and sintered by a bonding material such as an iron group element.

The tool holder 52 extends in the axial direction AX. The tool tip 51 is preferably attached to the tool holder 52 such that the normal direction of the top surface SD1 is substantially along the axial direction AX.

In order to form the groove line TL using the cutting tool 50 (FIG. 3 (A)), on the upper surface SF1 of the glass substrate 4, the protruding portion PP and the side portion PS of the blade 51 are pressed against the thickness direction DT of the glass substrate 4 . Next, the blade point 51 is slid on the upper surface SF1 substantially along the direction in which the side portion PS is projected on the upper surface SF1. As a result, a groove-shaped trench line TL without vertical cracks is formed on the upper surface SF1. The groove line TL is generated by plastic deformation of the glass substrate 4, but the glass substrate 4 may be slightly cut at this time. However, since such cutting may generate fine fragments, it is preferable to keep it as small as possible.

The groove line TL and the crack line CL (FIG. 3 (B)) may be formed at the same time by the sliding of the blade tip 51, and only the groove line TL may be formed. The crack line CL is a crack extending from the trace of the trench line TL in the thickness direction DT, and extends linearly on the upper surface SF1. According to the method described later, after forming only the trench line TL, a crack line CL can be formed along the trench line TL.

Next, a method for cutting the glass substrate 4 will be described below.

6 (A), in step S10 (FIG. 4), a glass substrate 4 is first prepared. The glass substrate 4 has a flat upper surface SF1. The edge surrounding the upper surface SF1 includes an edge ED1 (first edge) and an edge ED2 (second edge) facing each other. In the example shown in FIG. 6 (A), the edges are rectangular. Therefore, the edges ED1 and ED2 are parallel to each other. In the example shown in FIG. 6 (A), the sides ED1 and ED2 are short sides of a rectangle. The glass substrate 4 has a thickness direction DT perpendicular to the upper surface SF1 (FIG. 5 (A)).

Next, in step S20 (FIG. 4), the blade 51 is pressed to the position N1 on the upper surface SF1. The details of the position N1 will be described later. The pressing of the knife edge 51 is referred to FIG. 5 (A), so that the protruding portion PP of the knife edge 51 is arranged between the edge ED1 and the side portion PS on the upper surface SF1 of the glass substrate 4, and the side portion of the knife edge 51 is disposed. PS is performed so that it may be arrange | positioned between the protrusion part PP and the side ED2.

Next, in step S30 (FIG. 4), a plurality of trench lines TL (five lines in the figure) are formed on the upper surface SF1. The formation of the trench line TL is performed between the position N1 (the first position) and the position N3. Position N2 (second position) is located between positions N1 and N3. Therefore, a trench line TL is formed between the positions N1 and N2 and between the positions N2 and N3.

The positions N1 and N3 may be located apart from the edge of the upper surface SF1 of the glass substrate 4 as shown in FIG. 6 (A), or one or both of them may be located at the edge of the upper surface SF1. The trench line TL to be formed is separated from the edge of the glass substrate 4 in the former case, and is in contact with the edge of the glass substrate 4 in the latter case.

Among the positions N1 and N2, the position N1 is closer to the edge ED1; and among the positions N1 and N2, the position N2 is closer to the edge ED2. In the example shown in FIG. 6 (A), the position N1 is closer to the side ED1 among the edges ED1 and ED2, and the position N2 is closer to the side ED2 among the edges ED1 and ED2, but it may be both the positions N1 and N2. Both are located close to either of the edges ED1 or ED2.

When the trench line TL is formed, in this embodiment, the cutting edge 51 is displaced from the position N1 to the position N2, and further from the position N2 to the position N3. That is, referring to FIG. 5 (A), the cutting edge 51 is displaced in a direction from the side ED1 to the side ED2, that is, the direction DA. The direction DA corresponds to a direction in which an axis AX extending from the tool tip 51 is projected on the upper surface SF1. In this case, the tool tip 51 is dragged on the upper surface SF1 by the tool holder 52.

6 (B), the crack-free state (FIG. 3 (A)) described in the first embodiment is maintained for a desired time. During this period, as step S40 (FIG. 4), the laminated material 11 is provided in the same manner as in the first embodiment. The laminated material 11 is provided so that the groove line TL on the upper surface SF1 protrudes toward the side ED2 from between the portions of the laminated material 11.

Next, in step S50 (FIG. 4), the crack of the glass substrate 4 is moved from the position N2 to the position N1 (see the dotted arrow in the figure) in the thickness direction DT (FIG. 3 (B)) along the groove line TL. Stretch to form a crack line CL. The formation of the crack line CL is started by crossing the auxiliary line AL and the groove line TL at the position N2. For this purpose, the auxiliary line AL is formed after the trench line TL is formed. The auxiliary line AL is a general scribe line accompanied by a crack in the thickness direction DT, and is a strain that releases the internal stress near the trench line TL. The method for forming the auxiliary line AL is not particularly limited, but may be formed using the edge of the upper surface SF1 as a base point as shown in FIG. 6 (B).

In addition, it is more difficult to form the crack line CL in the direction from the position N2 to the position N3 than in the direction from the position N2 to the position N1. In other words, the easiness of stretching of the crack line CL depends on the direction. Sex. Therefore, a crack line CL may be formed between the positions N1 and N2, but may not be formed between the positions N2 and N3. This embodiment is for the purpose of breaking the glass substrate 4 along the positions N1 and N2, and not for the purpose of breaking the glass substrate 4 along the positions N2 and N3. Therefore, it is necessary to form the crack line CL between the positions N1 and N2. On the other hand, the difficulty of forming the crack line CL between the positions N2 and N3 is not a problem.

Next, in step S60 (FIG. 4), the glass substrate 4 is cut along the crack line CL. Specifically, a breaking step is performed. In addition, if the crack line CL is completely advanced in the thickness direction DT when it is formed, the formation of the crack line CL and the disconnection of the glass substrate 4 may occur at the same time. In this case, the breaking step may be omitted.

The glass substrate 4 is divided as described above.

Next, the first to third modification examples of the above-mentioned breaking method will be described below.

Referring to FIG. 7 (A), the first modification relates to a case where the intersection of the auxiliary line AL and the groove line TL is not sufficient as an opportunity to start forming the crack line CL (FIG. 6 (B)). 7 (B), the glass substrate 4 is separated along the auxiliary line AL by applying an external force such as a bending moment to the glass substrate 4. This starts the formation of the crack line CL.

In addition, in FIG. 7 (A), the auxiliary line AL is formed on the upper surface SF1 of the glass substrate 4, but the auxiliary line AL for separating the glass substrate 4 may also be formed on the lower surface SF2 of the glass substrate 4. In this case, the auxiliary line AL and the trench line TL are in a plan layout and cross each other at the position N2, but they are not in direct contact with each other.

Moreover, in the first modification, the strain of the internal stress in the vicinity of the trench line TL is released by separating the glass substrate 4, thereby starting to form the crack line CL. Therefore, the auxiliary line AL itself may be a crack line CL formed by applying a stress to the trench line TL.

Referring to FIG. 8, in a second modification, in step S20 (FIG. 4), the blade tip 51 is pressed to the position N3 on the upper surface SF1 of the glass substrate 4. In step S30 (FIG. 4), when the groove line TL is formed, in this modification, the cutting edge 51 is shifted from the position N3 to the position N2, and then shifted from the position N2 to the position N1. That is, referring to FIG. 5, the blade point 51 is directed from the side FD2 toward the side FD1. Displacement in the DB direction. The direction DB corresponds to a direction opposite to the direction in which the axis AX extending from the tool tip 51 is projected on the upper surface SF1. In this case, the tool tip 52 is pushed on the upper surface SF1 by the tool holder 52.

Referring to FIG. 9, in a third modification, in step S30 (FIG. 4), when the trench line TL is formed, it is pressed at a position N2 with a larger force than the position N1 of the upper surface SF1 of the glass substrate 4.刀尖 51。 Blade 51. Specifically, the position N4 is taken as the position between the positions N1 and N2, and when the groove line TL is formed to reach the position N4, the load of the blade 51 is increased. In other words, compared with the position N1, the load of the trench line TL is increased between the end portions of the trench line TL, that is, between the positions N4 and N3. Thereby, the load other than the terminal portion is reduced, and the crack line CL can be more easily caused to form from the position N2.

According to this embodiment, the crack line CL can be more reliably formed from the trench line TL.

In this embodiment, which is different from Embodiment 3 described later, the auxiliary line AL has not been formed at the time of forming the trench line TL (FIG. 6 (A)). Therefore, the crack-free state can be maintained more stably without being affected by the auxiliary line AL. In addition, when the stability of the crack-free state is not a problem, instead of the state where the auxiliary line AL (FIG. 6 (A)) is not formed, a layer may be provided in the state of FIG. 7 (A) where the auxiliary line AL is formed.材 11。 Material 11.

(Embodiment 3)

A method for cutting a brittle substrate according to this embodiment will be described below with reference to FIGS. 10 to 12.

Referring to FIG. 10, in this embodiment, the auxiliary line AL is formed before the trench line TL is formed. The method of forming the auxiliary line AL itself is the same as that of FIG. 6 (B) (Embodiment 2).

Referring to FIG. 11, step S20 (FIG. 4) is followed by pressing the blade 51 against the upper surface SF1, and then, step S30 (FIG. 4) forms a trench line TL. The method of forming the trench line TL itself is the same as that of FIG. 6 (A) (Embodiment 2). The auxiliary line AL and the groove line TL cross each other at a position N2. Next, as in the second embodiment, step S40 is performed (FIG. 4).

Referring to FIG. 12, next, as step S40 (FIG. 4), a layer is provided in the same manner as in the second embodiment. Building material 11. Next, the glass substrate 4 is separated along the auxiliary line AL by a general breaking process that generates an external force such as a bending moment to the glass substrate 4. Thereby, as step S50 (FIG. 5), the formation of the crack line CL similar to that in the first embodiment (see the dotted arrow in the figure) is started. In addition, in FIG. 10, the auxiliary line AL is formed on the upper surface SF1 of the glass substrate 4, but the auxiliary line AL to separate the glass substrate 4 may be formed on the lower surface SF2 of the glass substrate 4. In this case, the auxiliary line AL and the trench line TL are in a plan layout and cross each other at the position N2, but they are not in direct contact with each other.

The configuration other than the above is substantially the same as the configuration of the second embodiment.

Referring to FIG. 13 (A), in the first modification, the auxiliary line AL is formed on the lower surface SF2 of the glass substrate 4. Next, as in FIG. 8 (Embodiment 2), the trench line TL is formed from the position N3 to the position N1. Referring to FIG. 13 (B), after the laminated material 11 is provided, the glass substrate 4 is separated along the auxiliary line AL by applying an external force such as a bending moment to the glass substrate 4. Thereby, the formation of the crack line CL is started (refer to a dotted arrow in the figure).

Referring to FIG. 14, in the second modification, in step S30 (FIG. 4), when the groove line TL is formed, it is pressed at a position N2 with a larger force than the position N1 of the upper surface SF1 of the glass substrate 4.刀尖 51。 Blade 51. Specifically, the position N4 is taken as the position between the positions N1 and N2, and when the groove line TL is formed to reach the position N4, the load of the blade 51 is increased. In other words, compared with the position N1, the load of the trench line TL is increased between the end portions of the trench line TL, that is, between the positions N4 and N3. Thereby, the load other than the terminal portion is reduced, and the crack line CL can be more easily caused to form from the position N2.

(Embodiment 4)

Referring to FIG. 15 (A), in the method for breaking a brittle substrate according to this embodiment, in step S30 (FIG. 4), a trench line TL is formed from a position N1 to a side ED2 through a position N2.

Referring to FIG. 15 (B), next, as in the second embodiment, a laminated material 11 is provided as step S40 (FIG. 4). Next, a stress is applied between the position N2 and the edge ED2 to release a strain in the vicinity of the trench line TL. As a result, the shape of the crack line along the trench line TL is caused. Success (Figure 4: Step S50).

To apply the stress, specifically, on the upper surface SF1, between the position N2 and the side ED2 (the area between the dotted line and the side ED2 in the figure), the pressed blade point 51 slides. This sliding is performed until the edge ED2 is reached. The blade point 51 is preferably slid in a manner crossing the track of the groove line TL originally formed, and more preferably slid in such a manner as to overlap the track of the groove line TL originally formed. The length of this re-sliding is, for example, about 0.5 mm. In addition, the sliding again may be performed on each of the groove lines TL after forming a plurality of groove lines TL (FIG. 15 (A)), or one groove line may be sequentially performed on each of the groove lines TL. The process of TL formation and sliding again.

As a variation, in order to apply stress between the position N2 and the side ED2, instead of sliding the blade point 51 again, laser light is irradiated between the position N2 and the side ED2 on the upper surface SF1. With the thermal stress thus generated, the strain of the internal stress near the trench line TL can also be released, thereby causing the formation of crack lines to begin.

The configuration other than the above is substantially the same as the configuration of the second embodiment.

(Embodiment 5)

Referring to FIG. 16 (A), in the method for cutting a brittle substrate according to this embodiment, in step S30 (FIG. 4), the blade point 51 is shifted from position N1 to position N2, and then to position N3 to form A trench line TL separated from an edge of the upper surface SF1. The method of forming the trench line TL itself is substantially the same as that of FIG. 6 (A) (Embodiment 2).

16 (B), as in the second embodiment, a laminated material 11 is provided as step S40 (FIG. 4). Next, the same stress is applied as in FIG. 15 (B) (Embodiment 4 or a modification thereof). This causes a crack line to be formed along the trench line TL (FIG. 4: Step S50).

Referring to FIG. 17, as a modification example of the step of FIG. 16 (A), in the formation of the groove line TL, the blade tip 51 may be displaced from the position N3 to the position N2, and then from the position N2 to the position N1.

The configuration other than the above is substantially the same as the configuration of the second embodiment.

(Embodiment 6)

Referring to Figs. 18 (A) and (B), in each of the above embodiments, the blade point 51 (Fig. 5 (A) and (B)), and the blade tip 51v is used. The cutting edge 51v has a conical shape including a vertex and a conical surface SC. The protrusion PPv of the blade point 51v is constituted by a vertex. The side PSv of the blade tip is constituted along a virtual line (dashed line in FIG. 18 (B)) extending from the vertex to the conical surface SC. Thereby, the side portion PSv has a convex shape extending linearly.

In each of the above embodiments, the first and second sides of the edge of the glass substrate are rectangular short sides, but the first and second sides may be rectangular long sides. The shape of the edges is not limited to a rectangular shape, and may be, for example, a square shape. The first and second sides are not limited to those having a straight shape, and may be curved. In each of the above embodiments, the surface of the glass substrate is a flat surface, but the surface of the glass substrate may be curved.

Although a glass substrate is used as a brittle substrate particularly suitable for the above-mentioned breaking method, the brittle substrate is not limited to a glass substrate. The fragile substrate may also be made of glass, such as ceramic, silicon, compound semiconductor, sapphire, or quartz.

The present invention is within the scope of the invention, and various embodiments can be freely combined, and various embodiments can be appropriately changed and omitted.

Claims (5)

A method for breaking a fragile substrate includes the following steps: preparing a fragile substrate having a surface and having a thickness direction perpendicular to the surface; pressing a blade tip on the surface of the fragile substrate; and pressing the blade through the pressing process. The blade tip slides on the surface of the fragile substrate, thereby plastically deforming on the surface of the fragile substrate to form a groove line having a groove shape; wherein the process of forming the groove line is to obtain Directly under the groove line, the brittle substrate is continuously connected in a direction intersecting the groove line, that is, a state without cracks; and the method for breaking the brittle substrate further includes the following steps: After the process of the groove line, a member is provided on the surface; wherein the member has a portion separated from the surface via the groove line; after the step of disposing the member, the brittle substrate is cracked Extending along the groove line in the thickness direction to form a crack line; wherein, by the crack Directly below the trench line, the brittle substrate is continuously connected and disconnected in a direction crossing the trench line; and the method for breaking the brittle substrate further includes the following steps: breaking along the crack line The aforementioned brittle substrate. For example, the method for breaking a fragile substrate according to claim 1, wherein the step of providing the component is performed on the surface so that the groove lines protrude from the separated portions. For example, the method for breaking a brittle substrate according to claim 1, wherein in the step of installing the member, the part is arranged on the surface of the brittle substrate at intervals of 100 μm or less via the groove line. For example, the method for cutting a fragile substrate according to claim 1, wherein in the step of preparing the fragile substrate, the fragile substrate is made of glass. The cutting method of the brittle substrate according to any one of claims 1 to 4, wherein in the step of preparing the brittle substrate, the surface is surrounded by edges including first and second sides facing each other; In the step of sharpening, the blade tip includes a protruding portion and a side portion extending from the protruding portion and having a convex shape, and the step of pressing the blade tip is to place the side portion of the blade edge on the surface of the fragile substrate. It is carried out so as to be arranged between the protrusion and the second side. In the step of forming the groove line, it is formed between the first position and a second position closer to the second side than the first position. The groove line; and the step of forming the crack line is performed by extending a crack of the fragile substrate along the groove line from the second position to the first position in the thickness direction.