JP2008201629A - Manufacturing method of electrooptical device, separating method of substrate, and substrate separating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method and manufacturing device causing no fine crack when a substrate is separated. <P>SOLUTION: The manufacturing method of the electrooptical device includes a scribing step of forming a scribe line 12s on an outer surface of the substrate 12 opposed to a separated substrate 11 along a separate line 11t of the separated substrate 11 and a separating step of separating the opposed substrate 12 by simultaneously applying pressure to both sides along the separate line 11t while avoiding just above the separate line 11t of the separated substrate 11. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electro-optical device manufacturing method, a substrate cutting method, and a substrate cutting device, and more particularly to a processing technique suitable for separating a substrate structure formed by stacking a pair of substrates.

  Generally, as a method of dividing a substrate made of glass, ceramics, etc., a linear scratch (scribe line) is applied to the surface of the substrate (scribing stage), and from the surface side opposite to the surface on which the scribe line is formed. There is known a method (scribe / break method) in which a substrate is divided (break stage) by applying stress along the scribe line. This scribing / breaking method is used, for example, in a structure dividing process for dividing a substrate structure corresponding to each liquid crystal panel from a large-sized substrate structure formed by bonding a pair of glass substrates in a manufacturing process of a liquid crystal panel. It has been.

As an apparatus for using the scribe / break method, an apparatus capable of simultaneously cutting a glass substrate or the like for a liquid crystal panel at a plurality of locations is known. Such an apparatus is described in, for example, the following Patent Document 1, but in this document, a plurality of tip portions (pressing tip edges) used for simultaneously cutting the glass substrate at a plurality of adjacent locations are disclosed. An integral blade is disclosed.
JP-A-11-43338

  By the way, in the structure dividing step performed at the time of manufacturing an electro-optical device such as the above-described liquid crystal panel, when dividing a glass substrate by a scribe / break method, after dividing one glass substrate, It is necessary to further divide the other substrate at a position corresponding to the dividing line.

  For example, as shown in FIG. 5, a scribe line 11s is formed with a super steel chip or the like on the surface of one glass substrate 11 constituting the substrate structure 10, and on the surface of the other glass substrate 12 as shown in FIG. The blade 13 is pressed and pressurized, and the glass substrate 11 is cut along the scribe line 11s to form a cut line 11t. Then, as shown in FIG. 7, the same scribe line 12s as above is formed on the surface of the other glass substrate 12, and the glass substrate 11 is pressed with a blade 13 from the surface of the glass substrate 11 as shown in FIG. The substrate 12 is divided from the scribe line 12s to form a dividing line 12t.

  However, in the structure dividing step, the pressing tip edge 13a of the blade 13 abuts on the already divided dividing line 11t of the glass substrate 11 at the break stage shown in FIG. There has been a problem that fine cracks are formed at the edge (corner) of the sectional surface. This fine crack causes damage to the surface of the substrate constituting the substrate structure after the structure dividing step, and also causes reduction in strength (crack due to impact) of the substrate constituting the substrate structure. It also becomes.

  In particular, in recent liquid crystal panels and other electro-optical devices, the scratches on the surface of the glass substrate are likely to be fatal in terms of display quality with the progress of high definition screens. In addition, since the glass substrate has become significantly thinner as the apparatus becomes thinner, the strength reduction greatly affects the securing of impact resistance. Therefore, in any case, fine cracks cause a significant decrease in product yield.

  Therefore, the present invention solves the above-described problems, and an object of the present invention is to provide a manufacturing method and a manufacturing apparatus in which minute cracks are not generated when a substrate is divided.

  In view of such circumstances, the method of manufacturing the electro-optical device according to the present invention includes a scribing step of inserting a scribe line along the dividing line of the divided substrate on the outer surface of the substrate facing the divided substrate, and the dividing The method further includes a cutting step of cutting the opposing substrates by simultaneously applying stress to both sides along the cutting line while avoiding the cutting line of the formed substrate.

  According to this invention, while avoiding the dividing line of the divided substrate, by simultaneously applying stress to both sides along the dividing line, the opposing substrate can be divided without applying stress on the dividing line. Therefore, it is possible to prevent the occurrence of fine cracks at the edge of the dividing line. Therefore, it is possible to avoid generation of surface scratches and reduction in substrate strength due to fine cracks in the divided substrate.

  In this invention, it is preferable to use the braid | blade provided with the at least 2 press front-end edge which adjoins and was comprised so that the both sides could be simultaneously pressed across the said parting line in the said parting process. According to this, by using a blade provided with two adjacent pressing tip edges that are parallel to each other, an action of applying stress simultaneously by contacting both sides of the dividing line while avoiding the dividing line is performed in advance. It can be realized easily and appropriately by the shape of the two pressing tip edges of the set blade. In particular, by providing at least two pressing tip edges integrally, relative positioning work between pressing tip edges is unnecessary compared to using two separate blades to apply stress to both sides of the dividing line simultaneously. In addition, since the degree of freedom of the blade shape is increased, the complexity of handling such as the optimization of the blade shape can be avoided, and the stress application mode can be improved.

  Next, in the method for dividing a substrate according to the present invention, a scribe line is placed along the dividing line of the divided substrate on the outer surface of the substrate opposed to the divided substrate, and the opposing substrate along the scribe line. In the method for dividing the substrate, in which the opposing substrate is divided by applying a stress to the substrate, the stress is simultaneously applied to both sides along the dividing line while avoiding the dividing line of the divided substrate. The opposing substrate is divided.

  According to this invention, while avoiding the dividing line of the divided substrate, by simultaneously applying stress to both sides along the dividing line, the opposing substrate is divided without applying stress on the dividing line. Therefore, it is possible to prevent the occurrence of fine cracks at the edge portion of the dividing line of the divided substrate. Therefore, it is possible to avoid generation of surface scratches and reduction in substrate strength due to fine cracks in the divided substrate.

  Next, a substrate cutting apparatus according to the present invention is a substrate cutting apparatus for cutting a substrate by applying a stress to a substrate structure in which a pair of substrates are overlapped, in one of the substrate structures. A blade configured to be able to simultaneously press both sides of the dividing line across the dividing line previously formed on the substrate, a position control mechanism for positioning the blade on the dividing line, and the blade on the one substrate A pressurizing mechanism that presses both sides along the parting line simultaneously while avoiding the parting line by pressing.

  According to the present invention, while avoiding the cutting line of one substrate and simultaneously applying stress to both sides along the cutting line, the other substrate is cut without applying stress to the cutting line of one substrate. Therefore, it is possible to prevent the occurrence of fine cracks at the edge portion of the dividing line of one substrate. Therefore, it is possible to avoid the occurrence of surface scratches and a decrease in substrate strength due to fine cracks in the divided substrate.

  In the present invention, it is preferable that the blade includes two adjacent pressing tip edges that are adjacent to each other and are configured to be capable of simultaneously pressing both sides of the blade across the dividing line. According to this, by using a blade provided with two adjacent pressing tip edges that are parallel to each other, an action of applying stress simultaneously by contacting both sides of the dividing line while avoiding the dividing line is performed in advance. It can be realized easily and appropriately by the shape of the two pressing tip edges of the set blade.

  Further, in the present invention, each of the blades includes at least two pressing tip edges that are adjacent and parallel to each other to apply a stress to the substrate linearly, and the spacing between the pressing tip edges is 0.5 mm to 4 mm. It is characterized by being within a range of 0.0 mm. According to this, along the dividing line while avoiding the dividing line formed in advance on one substrate of the substrate structure in which the pair of substrates are overlapped by the blade having the at least two pressing tip edges. By applying stress to both sides simultaneously, the other substrate can be divided, and it is possible to prevent the occurrence of fine cracks at the edge of the dividing line of one substrate.

  In particular, since the distance between the pressing tip edges is set within a range of 0.5 to 4.0 mm, stress can be applied to a region close to the breaking line while reliably avoiding the breaking line. The substrate can be easily and appropriately divided. If it is below the above range, depending on the meandering condition of the dividing line, stress is applied to the edge part of the dividing line, and the possibility of generating fine cracks increases. In addition, if the above range is exceeded, the stress application position is separated from the dividing line, so that stress cannot be applied intensively to the desired position on the other substrate, and the failure of the dividing, the deviation of the dividing position, the meandering of the dividing line Alternatively, there is an increased risk of inferior separation such as fraud of the section. The distance is particularly preferably in the range of 2.0 to 3.0 mm. The above range of the distance is extremely effective when a glass substrate having a thickness of 0.2 to 1.2 mm is divided. In particular, as will be described later, it is very effective when a very thin glass substrate having a thickness of 0.2 to 0.6 mm is divided.

[Division method of substrate]
Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 are schematic explanatory views schematically showing states before and after the division of the substrate dividing method according to the embodiment of the present invention. This embodiment is a cutting method using a blade, and in particular, one glass substrate 11 is pressed by a blade 23 against a substrate structure 10 formed by superposing two glass substrates 11 and 12 as two substrates. Thus, the other glass substrate 12 is divided.

  The blade 23 has a shape extending in a direction perpendicular to the drawing sheet from the cross section shown in the figure, and two adjacent and parallel pressing tip edges 23a and 23b are integrally formed at the tip. At the pressing tip edges 23a and 23b, the apex angle θ is set in the range of 60 to 120 degrees, preferably in the range of 80 to 100 degrees. Further, the distance G between the vertices is set in the range of 0.5 to 4.0 mm, preferably in the range of 2.0 to 3.0 mm.

  The blade 23 can be formed of a resin material such as bakelite, nylon resin, or fluororesin such as tetrafluoroethylene, but is not particularly limited to the resin material. It is preferable that the blade 23 has a rigidity sufficient to keep the deformation so that the gap G does not become less than 0.5 mm when applying necessary stress in the break stage described later. It is desirable to have sufficient rigidity to be maintained. Actually, the above-mentioned conditions can be satisfied by being made of the hard resin as described above.

  In the present embodiment, a pair of glass substrates 11 and 12 are overlapped to constitute a substrate structure 10. The substrate structure 10 may simply be formed by laminating glass substrates 11 and 12, or may be bonded to each other via an adhesive or the like. In the case of constituting a panel of an electro-optical device to be described later, the glass substrates 11 and 12 are bonded together through a sealing material or the like.

  In the situation shown in FIG. 1, in the said substrate structure 10, the glass substrate 11 has already been parted and the parting line 11t is formed. Actually, as in the example shown in FIGS. 5 and 6, a scribe line 11s is formed on the surface (the upper surface in the drawing) of the glass substrate 11, and stress is applied along the scribe line 11s from the glass substrate 12 side. The glass substrate 11 is divided. A scribe line 12s is formed on the surface (lower surface in the drawing) of the glass substrate 12 at a position corresponding to the dividing line 11t (specifically, a position directly below the dividing line 11t).

  The scribe lines 11 s and 12 s are known scribe devices, for example, a chip made of super steel, diamond, or other hard material, a rotating blade wheel, or a laser device such as a carbon dioxide laser when a laser scribe method is used. Formed by.

  As shown in FIG. 2, the blade 23 is positioned so that the two pressing tip edges 23a and 23b are in contact with both sides of the dividing line 11t while avoiding the dividing line 11t of the glass substrate 11. In this positioning state, the pressing tip portions 23a and 23b simultaneously press the glass substrate 11 (break stage). And by this pressurization state, the glass substrate 12 is parted along the scribe line 12s, and the parting line 12t is formed. At this time, since the blade 23 does not contact the dividing line 11t of the glass substrate 11 and does not apply stress to the edge part of the dividing line 11t, a fine crack is formed at the edge part (corner on the surface side) of the dividing line 11t. Can be prevented.

  The fine crack is not a vertical crack extending from the scribe line 11s in the thickness direction of the glass substrate 11, but a horizontal crack extending from the edge portion of the dividing line 11t along the surface of the glass substrate 11. The horizontal crack causes particles to be generated from the edge portion in a later process, thereby causing fine scratches on the surface of the glass substrate and causing display quality to deteriorate. Further, since the strength of the glass substrate is lowered by the horizontal crack, it also causes the impact resistance of the product to deteriorate. In particular, in the case of an extremely thin glass substrate having a thickness of 0.2 to 0.6 mm, the impact resistance is significantly lowered due to the horizontal crack, and therefore this embodiment is extremely useful.

  Further, the effect of preventing the formation of fine cracks at the edge portion of the dividing line 11t in the breaking stage is that the blade 23 applies the stress to both sides of the dividing line 11t of the glass substrate 11 simultaneously. It is considered that slight deformation due to stress is also caused by slightly separating the pressing tip edges 23a and 23b. That is, when the blade 23 is compressed and deformed in the vertical direction, the blade 23 is deformed in a direction that spreads outward as a whole, but the pressing tip edges 23a and 23b are separated from each other by this deformation. Accordingly, the pressing tip portions 23a and 23b that are in contact with both sides of the dividing line 11t of the glass substrate 11 also apply stress in the direction in which the substrate parts on both sides of the dividing line 11t are separated from each other due to compression deformation of the blade 23. It seems that the occurrence of fine cracks can be prevented by pressing the edges of the disconnection 11t.

  In the present embodiment, the distance G between the pressing tip edges 23a and 23b of the blade 23 is set within a range of 0.5 to 4.0 mm, so that it is about 0.2 to 1.2 mm (particularly 0.2 Stress can be simultaneously applied to both sides of the cutting line 11t while reliably avoiding the cutting line 11t provided on the glass substrate 11 having a thickness of about 0.6 mm. Moreover, since stress can be applied from both side positions very close to the dividing line 11t, the stress can be concentrated and applied to the position corresponding to the dividing line 11t of the glass substrate 12 easily and reliably. The glass substrate 12 can be divided.

  In addition, although the said embodiment demonstrated the case where a board | substrate is a glass substrate, if it is other board | substrates, such as a ceramics board | substrate other than a glass board | substrate, it will be the same method as the above, although there is a difference in a parting condition etc. It is possible to divide by.

[Substrate cutting device]
3 and 4 are schematic configuration diagrams showing the main part of the substrate cutting apparatus 20. FIG. 3 shows a front view of the main part, and FIG. 4 shows a side view of the main part. The substrate cutting device 20 is installed on a support table 21 that supports the substrate structure 10, a blade holder 22 that holds the blade 23, and a blade holder 22 that is installed facing the support surface of the support table 21. A guide shaft 24 that guides in the direction, a drive shaft 25 that drives the blade holder 22 up and down, a cylinder 26 that is a drive source of the drive shaft 25, and guides the guide shaft 24 and supports the drive shaft 25. And a frame 27.

  In the apparatus 20, the drive shaft 25 is driven by the cylinder 26, so that the blade 23 held by the blade holder 22 descends from the illustrated position and comes into contact with the substrate structure 10 so as to apply a predetermined stress. It has become. Here, the structure including the blade holder 22, the guide shaft 24, the drive shaft 25, the cylinder 26, and the frame 27 constitutes a pressure mechanism for applying stress to the substrate or the substrate structure via the blade 23. However, the pressurizing mechanism is not limited to the above configuration, for example, an electric motor can be used as a drive source instead of a cylinder, and a crank mechanism or a feed screw mechanism can be used as a transmission mechanism instead of a drive shaft. .

  The frame 27 is connected to a positioning mechanism 28 schematically shown by a broken line in the drawing. The positioning mechanism 28 positions the blade 23 at a predetermined portion of the substrate structure 10. In the case of this embodiment, the positioning mechanism 28 relatively moves the support base 21 and the blade holder 22 in the illustrated horizontal direction, and positions the blade 23 at a position on the dividing line 11 t of the glass substrate 11. When such positioning is completed, the blade 23 is lowered by the drive mechanism described above, and the glass substrate 12 is divided in the manner shown in FIGS.

[Structure cutting process]
In the present embodiment, the structure dividing step for dividing the substrate structure 10 including the break stage of the glass substrate 12 described above can be performed in the same procedure as shown in FIGS. Here, the steps shown in FIGS. 1 and 2 correspond to the steps shown in FIGS.

  However, in the structure cutting step shown in FIGS. 5 to 8, the scribing stage of the glass substrate 11 (FIG. 5), the breaking stage of the glass substrate 11 (FIG. 6), the scribing stage of the glass substrate 12 (FIG. 7), and the glass substrate 12 The steps are performed in the order of the breaking step (FIG. 8). For example, the scribing step of the glass substrate 11, the scribing step of the glass substrate 12, the breaking step of the glass substrate 11, and the breaking step of the glass substrate 12 are performed. Each step may be carried out at the same time, and further, the scribing steps of the glass substrate 11 and the glass substrate 12 may be carried out simultaneously in parallel.

  5 to 8, the posture of the substrate structure 10 is turned upside down in the middle, but instead of turning the substrate structure 10 upside down in the middle, FIGS. 7 and 7 corresponding to the steps of FIGS. In the step shown in FIG. 8, a scribe or break operation may be performed from the upside down side of the step shown in FIGS. For example, in the break stage for the glass substrate 11, the blade 13 having the usual single pressing tip edge shown in FIGS. 5 and 6 is applied from the upper side in the figure, but in the subsequent break stage of the glass substrate 12, the substrate Instead of changing the posture of the structure 10, the blade 23 is applied to the substrate structure 10 from the side opposite to the blade 13 (the lower side in the drawing).

[Method of manufacturing electro-optical device]
Next, as a specific example to which the above substrate cutting method can be applied, a specific example in which the above substrate cutting apparatus can be used, or a specific example in which the above structure cutting step can be applied, A method for manufacturing the optical device will be described. The electro-optical device can be applied not only to a liquid crystal device (liquid crystal display device) described below but also to an organic luminescence display device, an electrophoretic display device, a field emission display device, and the like. In any case, the present invention can be widely applied when a cell structure used in an arbitrary electro-optical device is constituted by the substrate structure.

  Hereinafter, a method for manufacturing a liquid crystal device will be described as an example of the electro-optical device. 9A to 9F are schematic process explanatory views showing an outline of the manufacturing process of the liquid crystal device. FIG. 10 is a schematic cross-sectional view schematically showing a state when the liquid crystal panel of the liquid crystal device is completed.

  In the present embodiment, a plurality of liquid crystal encapsulating regions 11A arranged vertically and horizontally are set on the glass substrate 11 shown in FIG. 9A, and a large number of electrodes or wirings 111 shown in FIG. Input wiring 113 (see FIG. 10) is formed. The individual electrodes or wirings 111 and the input wirings 113 are each formed to extend in a stripe shape, and are formed in parallel with each other in the liquid crystal sealing region 11A. The electrode or wiring 111 is formed by forming a transparent conductor such as a metal such as aluminum or ITO (indium tin oxide) on the glass substrate 11 by a sputtering method or the like, and then patterning unnecessary portions such as etching using a photolithography method or the like. It is formed by doing. Thereafter, an alignment film 112 made of polyimide resin or the like is formed on the electrode or wiring 111, and a rubbing process is performed as necessary.

  On the other hand, also for the glass substrate 12 shown in FIG. 9B, a plurality of liquid crystal sealing regions 12A corresponding to the liquid crystal sealing region 11A are set, and each region 12A is made of transparent material such as ITO (indium tin oxide). A large number of transparent electrodes 121 (see FIG. 10) made of a conductor are formed. The transparent electrodes 121 are each formed in a stripe shape and patterned in each region in a state of being parallel to each other. Further, an alignment film 122 similar to the above is formed on the transparent electrode 121 and subjected to a rubbing process.

  A sealing material 130 (see FIG. 10) is disposed on the glass substrate 11 formed as described above, and the glass substrate 11 and the glass substrate 12 are disposed through the sealing material 130 as shown in FIG. 9C. Can be pasted together. Then, pressure is applied so that the bonding state becomes a predetermined inter-substrate gap (for example, about 5 to 10 μm), and in this state, heating or light irradiation is applied to cure the sealing material 130. In this way, the original panel 10X which is a substrate structure is formed.

  Next, as shown in FIG. 9D, the original panel 10X is cut into a strip shape (scribe / break) to form a strip-shaped panel 10Y which is also a substrate structure. By using this strip-shaped panel 10Y, a liquid crystal injection port (not shown) of the sealing material 130 is exposed, and the liquid crystal 140 (see FIG. 10) is injected from the liquid crystal injection port. As is well known, the liquid crystal 140 is injected by immersing the liquid crystal injection port in the liquid crystal under reduced pressure, or by dropping the liquid crystal into the liquid crystal injection port and closing the liquid crystal injection port with the liquid crystal. By increasing the ambient pressure toward atmospheric pressure, the liquid crystal is allowed to enter the panel due to a pressure difference between the inside and outside. When the liquid crystal injection is completed, the liquid crystal injection port is sealed to confine the liquid crystal inside the sealing material 130. In addition, as shown in FIG. 9E, the strip-shaped panel 10Y is formed with a substrate overhanging region 11B in which the glass substrate 11 projects outward from the outer edge of the glass substrate 12.

  Next, the strip-shaped panel 10Y shown in FIG. 9 (e) is cut into the individual liquid crystal sealing regions 11A and 12A, and divided into individual panels 10Z that are also substrate structures. In this state, as shown in FIG. 10, the outer edge portion of the glass substrate 110 that is a part of the glass substrate 11 protrudes outward from the outer edge portion of the substrate 120 that is a part of the glass substrate 12, and the substrate extension region 11 </ b> B. It has become. On the surface of the substrate extension region 11B, as shown in FIG. 9F and FIG. 10, an integrated circuit 150 made of a semiconductor chip or the like is conductively connected to the wiring 111 and the input wiring 113. Implemented.

  In the method for manufacturing the liquid crystal device, the structure dividing step described above is applied to the structure dividing step of dividing the strip-like panel 10Y shown in FIG. 9E to separate and form the panel 10Z. Can be applied. Then, in this structure dividing step, after one of the glass substrates 11 and 12 is cut first, the blade 23 is applied from one glass substrate side to cut the other glass substrate. By doing so, the panel 10Z can be separated without generating fine cracks at the edge of the dividing line of one glass substrate as described above.

  However, in the present invention, not only the process of separating and forming the panel 10Z from the strip-shaped panel 10Y, but also the process of separating the structure or the substrate in the process of separating and forming the strip-shaped panel 10Y from the original panel 10X, for example. A method may be used.

  The electro-optical device manufacturing method, the substrate cutting method, and the substrate cutting device according to the present invention are not limited to the illustrated examples described above, and various modifications can be made without departing from the gist of the present invention. Of course, it can be added.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. The schematic front view of the principal part of a board | substrate cutting device. The schematic side view of the principal part of a board | substrate cutting device. The schematic sectional drawing which shows the 1st step of the structure parting process for isolate | separating and forming a substrate structure. The schematic sectional drawing which shows the 2nd step of the structure parting process for isolate | separating and forming a substrate structure. The schematic sectional drawing which shows the 3rd step of the structure parting process for isolate | separating and forming a substrate structure. The schematic sectional drawing which shows the 4th step of the structure parting process for isolate | separating and forming a substrate structure. Schematic process drawing (a)-(f) which shows the manufacturing method of a liquid crystal device. FIG. 2 is a schematic longitudinal sectional view showing a structure of a liquid crystal device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 10X, 10Y, 10Z ... Substrate structure 11, 12, 110, 120 ... Glass substrate, 20 ... Substrate cutting device, 21 ... Support stand, 22 ... Blade holder, 23 ... Blade, 23a, 23b ... Pressing tip edge 24 ... guide shaft, 25 ... drive shaft, 26 ... cylinder, 27 ... frame, 28 ... positioning mechanism, 100 ... liquid crystal device

Claims (6)

A scribing step of placing a scribe line along the dividing line of the divided substrate on the outer surface of the substrate facing the divided substrate;
An electro-optical device manufacturing method comprising: a dividing step of dividing the opposing substrate by simultaneously applying stress to both sides along the dividing line while avoiding the dividing line of the divided substrate. Method.   2. The blade according to claim 1, wherein the cutting step uses a blade including at least two pressing tip edges that are adjacent to each other and are configured to be capable of simultaneously pressing both sides of the cutting line. Manufacturing method of the electro-optical device. Put a scribe line along the dividing line of the divided substrate on the outer surface of the substrate facing the divided substrate,
In the substrate cutting method of dividing the opposing substrate by applying a stress linearly to the opposing substrate along the scribe line,
A method for dividing a substrate, wherein the opposing substrates are divided by simultaneously applying stress to both sides along the dividing line while avoiding the dividing line of the divided substrate. In the substrate cutting apparatus for dividing the substrate by applying stress linearly to the substrate structure formed by laminating a pair of substrates,
A blade configured to be capable of simultaneously pressing both sides of the dividing line across a dividing line previously formed on one of the substrates of the substrate structure;
A position control mechanism for positioning the blade on the dividing line;
A pressing mechanism that simultaneously presses both sides along the dividing line while pressing the blade against the one substrate while avoiding the dividing line;
A substrate cutting apparatus comprising:   6. The substrate cutting according to claim 5, wherein the blade includes at least two pressing tip edges that are adjacent to each other and are configured to be capable of simultaneously pressing both sides of the blade across the dividing line. apparatus.   Each of the blades includes at least two pressing tip edges that are adjacent and parallel to each other to apply a stress linearly to the substrate, and the interval between the pressing tip edges is in a range of 0.5 to 4.0 mm. The substrate cutting device according to claim 4, wherein the substrate cutting device is formed.

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