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TWI560399B - Attaching method for self-adhesive substrate - Google Patents

Attaching method for self-adhesive substrate

Info

Publication number
TWI560399B
TWI560399B TW103115056A TW103115056A TWI560399B TW I560399 B TWI560399 B TW I560399B TW 103115056 A TW103115056 A TW 103115056A TW 103115056 A TW103115056 A TW 103115056A TW I560399 B TWI560399 B TW I560399B
Authority
TW
Taiwan
Prior art keywords
self
adhesive substrate
attaching method
attaching
adhesive
Prior art date
Application number
TW103115056A
Other languages
Chinese (zh)
Other versions
TW201541019A (en
Inventor
Hung Chang Chen
Original Assignee
Jin Wei Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jin Wei Electronic Co Ltd filed Critical Jin Wei Electronic Co Ltd
Priority to TW103115056A priority Critical patent/TWI560399B/en
Publication of TW201541019A publication Critical patent/TW201541019A/en
Application granted granted Critical
Publication of TWI560399B publication Critical patent/TWI560399B/en

Links

TW103115056A 2014-04-25 2014-04-25 Attaching method for self-adhesive substrate TWI560399B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103115056A TWI560399B (en) 2014-04-25 2014-04-25 Attaching method for self-adhesive substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103115056A TWI560399B (en) 2014-04-25 2014-04-25 Attaching method for self-adhesive substrate

Publications (2)

Publication Number Publication Date
TW201541019A TW201541019A (en) 2015-11-01
TWI560399B true TWI560399B (en) 2016-12-01

Family

ID=55220434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103115056A TWI560399B (en) 2014-04-25 2014-04-25 Attaching method for self-adhesive substrate

Country Status (1)

Country Link
TW (1) TWI560399B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI644054B (en) * 2017-11-24 2018-12-11 佳總興業股份有限公司 Lamp manufacturing process

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM349015U (en) * 2008-08-15 2009-01-11 Tian-Yu Chen Patch-type dot-matrix light-emitting module
TWM394569U (en) * 2010-08-12 2010-12-11 Jin Wei Electronic Co Ltd Thermal conductive self-adhesive wiring substrate
CN201758488U (en) * 2010-08-19 2011-03-09 陈弘昌 A thermally conductive self-adhesive circuit substrate
CN202048541U (en) * 2011-03-17 2011-11-23 天津杰普森科技有限公司 Circuit board assembly structure for SMT (surface mount technology) distribution constant current LED drive power supply
TWM426513U (en) * 2011-08-24 2012-04-11 Jin Wei Electronic Co Ltd Improved heat-conductive self-adhesive circuit substrate
CN202310272U (en) * 2011-08-08 2012-07-04 陈弘昌 Thermally conductive self-adhesive circuit substrate
CN203553611U (en) * 2013-10-22 2014-04-16 镇江贝乐四通电子有限公司 Surface mount packaging of laser diode

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM349015U (en) * 2008-08-15 2009-01-11 Tian-Yu Chen Patch-type dot-matrix light-emitting module
TWM394569U (en) * 2010-08-12 2010-12-11 Jin Wei Electronic Co Ltd Thermal conductive self-adhesive wiring substrate
CN201758488U (en) * 2010-08-19 2011-03-09 陈弘昌 A thermally conductive self-adhesive circuit substrate
CN202048541U (en) * 2011-03-17 2011-11-23 天津杰普森科技有限公司 Circuit board assembly structure for SMT (surface mount technology) distribution constant current LED drive power supply
CN202310272U (en) * 2011-08-08 2012-07-04 陈弘昌 Thermally conductive self-adhesive circuit substrate
TWM426513U (en) * 2011-08-24 2012-04-11 Jin Wei Electronic Co Ltd Improved heat-conductive self-adhesive circuit substrate
CN203553611U (en) * 2013-10-22 2014-04-16 镇江贝乐四通电子有限公司 Surface mount packaging of laser diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI644054B (en) * 2017-11-24 2018-12-11 佳總興業股份有限公司 Lamp manufacturing process

Also Published As

Publication number Publication date
TW201541019A (en) 2015-11-01

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