[go: up one dir, main page]

TWI555996B - Hall sensor and lens module - Google Patents

Hall sensor and lens module Download PDF

Info

Publication number
TWI555996B
TWI555996B TW104131017A TW104131017A TWI555996B TW I555996 B TWI555996 B TW I555996B TW 104131017 A TW104131017 A TW 104131017A TW 104131017 A TW104131017 A TW 104131017A TW I555996 B TWI555996 B TW I555996B
Authority
TW
Taiwan
Prior art keywords
sealing member
external terminal
height
external
hall element
Prior art date
Application number
TW104131017A
Other languages
English (en)
Chinese (zh)
Other versions
TW201617638A (zh
Inventor
福中敏昭
Original Assignee
旭化成微電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭化成微電子股份有限公司 filed Critical 旭化成微電子股份有限公司
Publication of TW201617638A publication Critical patent/TW201617638A/zh
Application granted granted Critical
Publication of TWI555996B publication Critical patent/TWI555996B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Magnetic Variables (AREA)
TW104131017A 2014-09-22 2015-09-18 Hall sensor and lens module TWI555996B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014192610 2014-09-22

Publications (2)

Publication Number Publication Date
TW201617638A TW201617638A (zh) 2016-05-16
TWI555996B true TWI555996B (zh) 2016-11-01

Family

ID=55580677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131017A TWI555996B (zh) 2014-09-22 2015-09-18 Hall sensor and lens module

Country Status (4)

Country Link
JP (1) JP6392882B2 (ja)
CN (1) CN207067372U (ja)
TW (1) TWI555996B (ja)
WO (1) WO2016047130A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10128434B2 (en) * 2016-12-09 2018-11-13 Rohm Co., Ltd. Hall element module
JP6928463B2 (ja) * 2016-12-09 2021-09-01 ローム株式会社 ホール素子モジュール
JP6780675B2 (ja) * 2017-07-24 2020-11-04 株式会社デンソー 半導体装置及び半導体装置の製造方法
WO2019021766A1 (ja) * 2017-07-24 2019-01-31 株式会社デンソー 半導体装置及び半導体装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4936148A (en) * 1988-10-17 1990-06-26 Anent Systems Corporation Hall effect pressure transducer
CN1369905A (zh) * 2001-02-16 2002-09-18 安普生科技股份有限公司 高准确度及灵敏度霍尔感测元件及集成电路的封装方法
TW201219815A (en) * 2010-10-04 2012-05-16 Qualcomm Inc Locating a device using a reference point to align location information
TW201305586A (zh) * 2011-06-16 2013-02-01 Bosch Gmbh Robert 霍爾感測器與操作霍爾感測器的方法
TW201436314A (zh) * 2012-10-26 2014-09-16 旭化成微電子股份有限公司 磁性感測器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5372456A (en) * 1976-12-10 1978-06-27 Hitachi Ltd Glass sealing semiconductor device
JPS56126948A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Highly integrated semiconductor
JPH10233533A (ja) * 1997-02-21 1998-09-02 Nichia Chem Ind Ltd 発光装置の形成方法及び形成装置
JP3119247B2 (ja) * 1998-08-20 2000-12-18 日本電気株式会社 Ｉｃパッケージ
JP2005337866A (ja) * 2004-05-26 2005-12-08 Asahi Kasei Corp 磁性体検出器及び半導体パッケージ
JP5196107B2 (ja) * 2007-03-29 2013-05-15 日亜化学工業株式会社 発光装置
JP5895054B2 (ja) * 2012-06-07 2016-03-30 旭化成エレクトロニクス株式会社 位置検出装置
WO2014091714A1 (ja) * 2012-12-14 2014-06-19 旭化成エレクトロニクス株式会社 磁気センサ及び磁気センサ装置、磁気センサの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4936148A (en) * 1988-10-17 1990-06-26 Anent Systems Corporation Hall effect pressure transducer
CN1369905A (zh) * 2001-02-16 2002-09-18 安普生科技股份有限公司 高准确度及灵敏度霍尔感测元件及集成电路的封装方法
TW201219815A (en) * 2010-10-04 2012-05-16 Qualcomm Inc Locating a device using a reference point to align location information
TW201305586A (zh) * 2011-06-16 2013-02-01 Bosch Gmbh Robert 霍爾感測器與操作霍爾感測器的方法
TW201436314A (zh) * 2012-10-26 2014-09-16 旭化成微電子股份有限公司 磁性感測器

Also Published As

Publication number Publication date
WO2016047130A1 (ja) 2016-03-31
JPWO2016047130A1 (ja) 2017-04-27
TW201617638A (zh) 2016-05-16
JP6392882B2 (ja) 2018-09-19
CN207067372U (zh) 2018-03-02

Similar Documents

Publication Publication Date Title
CN105185900B (zh) 霍尔传感器
CN108155157B (zh) 包括引线框的集成电路封装体
JP6480622B2 (ja) ホールセンサ
TWI555996B (zh) Hall sensor and lens module
JP2023033385A (ja) 半導体装置
JP2022048197A (ja) 半導体装置
CN107768513A (zh) 半导体器件和半导体器件的安装结构
TW201436314A (zh) 磁性感測器
KR101868760B1 (ko) 홀 센서의 제조 방법 및 홀 센서와 렌즈 모듈
JP7009157B2 (ja) 半導体装置
JP7208725B2 (ja) 半導体装置
JP6608666B2 (ja) ホール素子及びホールセンサ、レンズモジュール
CN108028314B (zh) 霍尔元件和霍尔传感器、镜头模块
JP6553416B2 (ja) ホールセンサ
JP6842236B2 (ja) 磁気センサモジュール
JP2018074067A (ja) 半導体装置
JP6697262B2 (ja) 磁気センサモジュール
WO2012098595A1 (ja) 配線基板およびそれを用いた半導体装置
JP2018066722A (ja) 半導体装置
JP2018074066A (ja) 半導体装置