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TWI416260B - 正型感光性樹脂組成物 - Google Patents

正型感光性樹脂組成物 Download PDF

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Publication number
TWI416260B
TWI416260B TW97109977A TW97109977A TWI416260B TW I416260 B TWI416260 B TW I416260B TW 97109977 A TW97109977 A TW 97109977A TW 97109977 A TW97109977 A TW 97109977A TW I416260 B TWI416260 B TW I416260B
Authority
TW
Taiwan
Prior art keywords
compound
resin composition
photosensitive resin
group
positive photosensitive
Prior art date
Application number
TW97109977A
Other languages
English (en)
Chinese (zh)
Other versions
TW200903163A (en
Inventor
Kazuto Miyoshi
Daichi Miyazaki
Masao Tomikawa
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW200903163A publication Critical patent/TW200903163A/zh
Application granted granted Critical
Publication of TWI416260B publication Critical patent/TWI416260B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electroluminescent Light Sources (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
TW97109977A 2007-03-30 2008-03-21 正型感光性樹脂組成物 TWI416260B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007091097 2007-03-30

Publications (2)

Publication Number Publication Date
TW200903163A TW200903163A (en) 2009-01-16
TWI416260B true TWI416260B (zh) 2013-11-21

Family

ID=39830554

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97109977A TWI416260B (zh) 2007-03-30 2008-03-21 正型感光性樹脂組成物

Country Status (3)

Country Link
JP (1) JP5212103B2 (ja)
TW (1) TWI416260B (ja)
WO (1) WO2008123053A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5139778B2 (ja) * 2006-11-15 2013-02-06 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びそれを用いたフレキシブルプリント配線板
JP4957467B2 (ja) * 2007-09-04 2012-06-20 東レ株式会社 ジアミン化合物、それを用いた耐熱性樹脂前駆体およびポジ型感光性樹脂組成物
CN102047178B (zh) * 2008-05-29 2014-05-28 旭化成电子材料株式会社 感光性树脂组合物
JP5540483B2 (ja) * 2008-08-29 2014-07-02 Jnc株式会社 熱硬化性組成物、該組成物の製造方法および該組成物の用途
JP5477527B2 (ja) * 2008-09-30 2014-04-23 日産化学工業株式会社 末端官能基含有ポリイミドを含むポジ型感光性樹脂組成物
JP4544370B2 (ja) * 2008-10-28 2010-09-15 Jsr株式会社 感放射線性樹脂組成物、層間絶縁膜及びマイクロレンズ、並びにそれらの製造方法
JP5593676B2 (ja) * 2009-10-22 2014-09-24 ソニー株式会社 表示装置および表示装置の製造方法
JP5610794B2 (ja) * 2010-03-03 2014-10-22 東京応化工業株式会社 ポジ型感光性樹脂組成物及びその硬化物
JP5644476B2 (ja) * 2010-12-22 2014-12-24 東レ株式会社 感光性樹脂組成物、それを用いた硬化膜、半導体装置の製造方法および半導体装置
KR101400186B1 (ko) 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
JP6332022B2 (ja) * 2012-12-20 2018-05-30 東レ株式会社 感光性樹脂組成物、耐熱性樹脂膜の製造方法および表示装置
CN105829967B (zh) * 2013-10-21 2020-02-07 日产化学工业株式会社 正型感光性树脂组合物
JPWO2015118836A1 (ja) * 2014-02-10 2017-03-23 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体を含む樹脂組成物、硬化膜の製造方法及び電子部品
JP6459191B2 (ja) * 2014-03-19 2019-01-30 東レ株式会社 感光性樹脂組成物
GB2572608A (en) 2018-04-03 2019-10-09 Ilika Tech Ltd Laser processing method for thin film structures
WO2020183617A1 (ja) * 2019-03-12 2020-09-17 日立化成株式会社 感光性樹脂組成物、パターン硬化膜及びその製造方法、半導体素子並びに電子デバイス
CN115685681B (zh) * 2021-07-27 2025-05-20 吉林奥来德光电材料股份有限公司 树脂组合物、树脂膜及显示器件
CN114316263B (zh) * 2022-01-17 2023-02-03 深圳职业技术学院 交联型聚酰胺酸酯、其制备方法、包含其的聚酰亚胺组合物及聚酰亚胺树脂膜的制备方法
CN118240212B (zh) * 2023-12-25 2025-10-31 比亚迪股份有限公司 用于电泳形成聚酰亚胺的材料、绝缘材料及电泳涂装方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1910221A (zh) * 2004-01-20 2007-02-07 旭化成电子材料元件株式会社 树脂和树脂组合物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002012761A (ja) * 2000-04-28 2002-01-15 Toray Ind Inc 耐熱性樹脂組成物
JP4438080B2 (ja) * 2000-09-29 2010-03-24 日本ゼオン株式会社 絶縁膜形成用感放射線性樹脂組成物及び有機エレクトロルミネッセンス素子用絶縁膜
JP4082041B2 (ja) * 2001-02-26 2008-04-30 東レ株式会社 ポジ型感光性樹脂前駆体組成物及びそれを用いた電子部品ならびに表示装置
JP4292765B2 (ja) * 2002-08-22 2009-07-08 東レ株式会社 ポジ型感光性樹脂前駆体組成物およびそれを用いた半導体用電子部品ならびに有機電界発光素子用表示装置
JP4483371B2 (ja) * 2003-04-07 2010-06-16 東レ株式会社 感光性樹脂組成物
KR100611152B1 (ko) * 2003-11-27 2006-08-09 삼성에스디아이 주식회사 평판표시장치
JP4514542B2 (ja) * 2004-07-30 2010-07-28 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1910221A (zh) * 2004-01-20 2007-02-07 旭化成电子材料元件株式会社 树脂和树脂组合物

Also Published As

Publication number Publication date
JP5212103B2 (ja) 2013-06-19
WO2008123053A1 (ja) 2008-10-16
TW200903163A (en) 2009-01-16
JPWO2008123053A1 (ja) 2010-07-15

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