TWI468103B - A protected film having an anti electromagnetic layer and its manufacturing method thereof - Google Patents

Description

Protective film with anti-electromagnetic wave layer and manufacturing method thereof

The invention relates to a protective film and a manufacturing method thereof, in particular to a protective film with an electromagnetic wave resistant layer and a manufacturing method thereof.

In general, electronic devices, such as notebook computers, are one of the indispensable tools in modern life and have been widely used in everyday life. The manufacture of the electronic device usually requires consideration of the electromagnetic compatibility (EMC) of the electronic device. The electromagnetic compatibility includes Electromagnetic Interference (EMI) properties and Electromagnetic Susceptibility (EMS). nature. Electromagnetic interference is mainly caused by noise interference from the inside to the outside of the electronic equipment; electromagnetic resistance is mainly the tolerance of the electronic equipment to withstand the noise from the outside into the interior. In this way, the electronic device is protected from external electromagnetic interference or interference with other external electronic devices.

In the case of notebook computers, the main focus is on plastic cases. As shown in FIG. 1 , an aluminum foil 92 is usually disposed in the plastic casing 91 before being molded and formed in the plastic casing 91, so that the plastic casing 91 is assembled into the notebook computer. The aluminum foil 92 provides the function of the notebook computer to protect against electromagnetic interference.

However, as shown in Fig. 1, since the plastic casing 91 still has to reserve a portion of space 93 for housing other electronic components or for assembly, for example, for accommodating wireless connectors, 3G network cards, Bluetooth or antennas, etc. element. In order to prevent the aluminum foil 92 from affecting the transmission of the electronic component signals, the aluminum foil 92 usually needs to be partially cut according to the shape of the space 93 of the notebook computer, so that the aluminum foil 92 can be accurately set on the plastic. In the casing 91, this will cause complexity in the process, and the poor precision of the cutting process may also cause disadvantages of poor anti-magnetic wave effect; further, since the aluminum foil 92 is formed after the plastic casing 91 is formed, The setting is performed manually or mechanically, so that it is also possible that the effect of shielding electromagnetic waves is not good due to the deviation of the position of the aluminum foil 92.

The object of the present invention is to improve the above-mentioned disadvantages, and to provide a protective film having an anti-electromagnetic wave layer, and an anti-electromagnetic wave layer is disposed in the protective film, so that the protective film can be formed on the surface of the plastic object while being molded and formed on the plastic object. Provides anti-electromagnetic effects.

Another object of the present invention is to provide a method for fabricating a protective film having an anti-electromagnetic wave layer, wherein the anti-electromagnetic wave layer is disposed in the protective film by printing to simplify the process complexity of the anti-electromagnetic wave layer and improve the anti-electromagnetic wave layer. The setting accuracy.

The protective film with an anti-electromagnetic wave layer according to the present invention comprises a carrier layer having a release layer, a reinforcement layer, a color layer and a bonding layer laminated on the surface of the carrier layer, characterized in that the release layer And an anti-electromagnetic wave layer is further disposed between the bonding layer; and a bridge layer is disposed between the coloring layer and the bonding layer.

The method for manufacturing a protective film with an electromagnetic wave resistant layer according to the present invention comprises: a release layer setting step of disposing a release layer on a surface of a carrier layer; and a reinforcement layer setting step of the release layer Surface design a reinforcing layer is disposed; a color layer setting step is performed on the surface of the strengthening layer to provide a coloring layer; a bonding layer setting step is to set a bonding layer on the surface of the coloring layer; and an anti-electromagnetic layer is disposed In the step, the step is performed between the release layer setting step and the bonding layer setting step, and an anti-electromagnetic wave layer is disposed between the release layer and the bonding layer by printing.

The above and other features, advantages and advantages of the present invention will become more apparent and understood.

Referring to FIG. 2, the protective film with anti-electromagnetic wave layer of the present invention comprises a carrier layer 1, a release layer 2, a reinforcement layer 3, a color layer 4, and an anti-electromagnetic wave layer 5. And a bonding layer 6.

Referring to FIG. 2, the carrier layer 1 of the present invention may be selected from materials such as polymer, resin or plastic, for example, polyimide (PI) or polyethylene terephthalate. Made of a plastic material such as a polyvinyl terephthalate (PET), the carrier layer 1 has sufficient strength to carry other structural layers. In this embodiment, the carrier layer 1 made of polyethylene terephthalate is selected.

Referring to FIG. 2, the release layer 2 of the present embodiment is disposed on the surface of the carrier layer 1 so that the release layer 2 can be easily detached from the carrier layer 1. The release layer 2 may be made of a material such as a lanthanide resin or a fluorine-based resin. For example, the release layer 2 of the present embodiment is selected to be made of an acrylic resin.

Referring to FIG. 2, the reinforcing layer 3 of the embodiment is disposed on the surface of the release layer 2 to provide protection through the strengthening layer 3 to avoid subsequent Other structural layers were scratched and damaged by external force. The reinforcing layer 3 can be made of a material such as acrylic resin.

Referring to FIG. 2 , the color layer 4 of the embodiment is disposed on the surface of the reinforcing layer 3 , and the color layer 4 is made of ink to provide the color to be presented through the color layer 4 or pattern.

Referring to FIG. 2, the anti-electromagnetic wave layer 5 of the present invention is mainly made of a material that can absorb electromagnetic waves and is electrically conductive at the same time, and can block electromagnetic waves to provide the function of the protective film to protect electromagnetic waves. Therefore, the anti-electromagnetic wave layer 5 only needs to be disposed between the release layer 2 and the bonding layer 6 to generate an anti-electromagnetic wave effect, and is not limited to the set position disclosed in the embodiment. The anti-electromagnetic wave layer 5 is preferably disposed between the color-developing layer 4 and the bonding layer 6 to prevent the anti-electromagnetic wave layer 5 from affecting the coloring effect of the color-developing layer 4. For example, the anti-electromagnetic wave layer 5 of the present embodiment is disposed on the surface of the color-developing layer 4 such that the color-developing layer 4 is interposed between the reinforcing layer 3 and the anti-electromagnetic wave layer 5.

Referring to FIG. 2, the bonding layer 6 of the present invention is disposed on the uppermost layer of the protective film as shown in FIG. 2, so that the protective film can be bonded to a plastic article through the bonding layer 6. Continuing the foregoing embodiment, the present embodiment is disposed on the surface of the anti-electromagnetic wave layer 5 such that the anti-electromagnetic wave layer 5 is interposed between the color-developing layer 4 and the bonding layer 6. The bonding layer 6 can be made of a material such as an adhesive or glue.

For example, as shown in FIG. 3, a bridge layer 7 may be further disposed between the anti-electromagnetic wave layer 5 and the bonding layer 6. The bridging layer 7 can be made of a material of an acrylic resin, a denatured acrylic resin, or a polyurethane (PU) resin.

Thus, the release layer 2, the reinforcement layer 3, the color layer 4, the anti-electromagnetic wave layer 5 and the bonding layer 6 can be carried on the carrier layer 1. Referring to FIG. 4, the protective film of the present invention can be formed by injection molding of a plastic article 8 while being bonded to the plastic through the bonding layer 6 through In-Mold Decoration (IMD). The surface of the object 8 is disposed through the release layer 2 so that the carrier layer 1 can be easily peeled off, and the electromagnetic object layer 8 is provided through the anti-electromagnetic wave layer 5 to provide electromagnetic wave interference protection. Therefore, it is possible to avoid the disadvantages of complicated process and poor positioning accuracy caused by the conventional method of anti-electromagnetic wave processing after the plastic object is formed, and the aluminum foil must be cut and additionally disposed on the plastic object.

The aforementioned protective film having an electromagnetic wave resistant layer is obtained by the following method.

Referring to FIG. 5, the manufacturing method of the anti-electromagnetic layer protective film according to the first embodiment of the present invention comprises a release layer setting step A; a strengthening layer setting step B; and a color layer setting step C; Anti-electromagnetic layer setting step D; and a bonding layer setting step E. As described above, the anti-electromagnetic wave layer 5 only needs to be disposed between the release layer 2 and the bonding layer 6 to generate an anti-electromagnetic wave effect. Therefore, in the same manner, the anti-electromagnetic wave layer setting step D only needs to be performed between the release layer setting step A and the bonding layer setting step E to form the anti-electromagnetic wave layer 5 as described above in the protective film. It is not limited to the order of execution of this embodiment.

Referring to Figures 2 and 5, the release layer setting step A of the present invention provides a release layer 2 on the surface of a carrier layer 1. For example, in this embodiment, the surface of the carrier layer 1 having a thickness of 50 μm is selected to form a release layer 2 having a thickness of 1 to 2 μm in a coating manner, so that the release layer 2 can be easily It is peeled off from the carrier layer 1. For example, the thickness of the release layer 2 of the present embodiment is selected to be 1 μm.

Referring to FIGS. 2 and 5, the reinforcing layer setting step B of the present invention is provided with a reinforcing layer 3 on the surface of the release layer 2. For example, in the present embodiment, the reinforcing layer 3 having a thickness of 6 to 7 μm is formed by coating on the surface of the release layer 2 described above. For example, in the present embodiment, the reinforcing layer 3 having a coating thickness of 6 μm is selected.

Referring to FIGS. 2 and 5, the coloring layer setting step C of the present invention is provided with a coloring layer 4 on the surface of the reinforcing layer 3. For example, in the present embodiment, the coloring layer 4 having a thickness of 2 to 3 μm is formed by printing on the surface of the reinforcing layer 3 in a printed manner. For example, in the present embodiment, the coloring layer 4 having a thickness of 2 μm is selected.

Referring to FIGS. 2 and 5, the anti-electromagnetic layer setting step D of the present invention performs this step between the release layer setting step A and the bonding layer setting step E, and is printed on the release layer 2 and An anti-electromagnetic wave layer 5 is disposed between the bonding layers 6. More specifically, in the present embodiment, the anti-electromagnetic wave layer 5 having a thickness of 1 to 3 μm is formed by printing on the surface of the coloring layer 4. Since the anti-electromagnetic wave layer 5 is disposed in a printing manner with high precision, the anti-electromagnetic wave layer 5 can be directly formed by printing at a specific position where the anti-electromagnetic wave layer 5 is to be disposed, so that the anti-electromagnetic wave layer 5 can be avoided. The location of other electronic components. Therefore, the present invention can greatly simplify the process of setting the anti-electromagnetic wave layer, and the aluminum foil can be disposed in the plastic object without the conventional method, and has the disadvantages of complicated process and poor positioning accuracy.

Please refer to the second and fifth figures, the bonding layer setting step E of the present invention. A bonding layer 6 is provided as the uppermost layer of the pellicle structure. Continuing the above example, the bonding layer 6 is provided on the surface of the anti-electromagnetic wave layer 5 in this embodiment. More specifically, in this embodiment, the bonding layer 6 having a thickness of 2 to 3 μm is printed on the surface of the anti-electromagnetic wave layer 5 in a printed manner. For example, glue is used as the bonding layer 6 to provide a bonding ability.

In addition, referring to FIG. 6, the manufacturing method of the anti-electromagnetic layer protective film according to the second embodiment of the present invention preferably further includes a bridge layer setting step F, and the step is performed in the color layer setting step C. This is performed between the bonding layer setting step E. For example, the bridging layer setting step F of the second embodiment is selected after the anti-electromagnetic layer setting step D is completed, the step is performed first, and finally the bonding layer setting step E is performed. More specifically, in this embodiment, the surface of the anti-electromagnetic wave layer 5 is selected to be 0.5 to 1.5 μm in a printed manner, preferably a bridge layer 7 of 1 μm, and then the bonding layer 6 is disposed on the bridging layer 7 The surface.

The present invention provides the anti-electromagnetic wave layer 5 in the protective film, so that the protective film of the present invention can provide an anti-electromagnetic wave effect, and the protective film of the present invention is formed on the surface of the plastic object by the in-mold decoration technology while forming the plastic object. Provides better electromagnetic wave resistance and simplifies the process.

In the present invention, the anti-electromagnetic wave layer 5 is formed by printing, and the anti-electromagnetic wave layer 5 is not required to be cut, so that the setting precision of the anti-electromagnetic wave layer 5 can be improved, thereby preventing the anti-electromagnetic wave layer 5 from being poorly cut. The disadvantage of causing poor anti-electromagnetic effects.

While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of the invention is defined by the scope of the appended claims.

〔this invention〕

1‧‧‧bearing layer

2‧‧‧ release layer

3‧‧‧ Strengthening layer

4‧‧‧Color layer

5‧‧‧Anti-electromagnetic layer

6‧‧‧Combination layer

7‧‧‧ Pontoon

8‧‧‧Plastic objects

[technical technology]

91‧‧‧ plastic case

92‧‧‧Aluminum foil

93‧‧‧ Space

Fig. 1: Schematic diagram of the use of aluminum foil as an anti-electromagnetic wave layer for plastic objects.

Fig. 2 is a cross-sectional view showing a protective film having an electromagnetic wave resistant layer of the present invention.

Fig. 3 is a cross-sectional view showing a protective film having an electromagnetic wave resistant layer according to another embodiment of the present invention.

Fig. 4 is a schematic view showing the application of the anti-electromagnetic layer protective film of the present invention to the in-mold decoration technology.

Fig. 5 is a flow chart showing a method of fabricating a protective film having an electromagnetic wave resistant layer according to a first embodiment of the present invention.

Figure 6 is a flow chart showing a method of fabricating a protective film having an electromagnetic wave resistant layer according to a second embodiment of the present invention.

1. . . Carrying layer

2. . . Release layer

3. . . Strengthening layer

4. . . Color layer

5. . . Anti-electromagnetic layer

6. . . Bonding layer

Claims (6)

A protective film with an anti-electromagnetic wave layer comprises a carrier layer, and a surface of the carrier layer is laminated with a release layer, a reinforcement layer, a color layer and a bonding layer, wherein the release layer and the bonding layer are An anti-electromagnetic wave layer is additionally disposed; and a bridge layer is disposed between the coloring layer and the bonding layer. The anti-electromagnetic layer protective film according to claim 1, wherein the anti-electromagnetic layer is disposed between the color layer and the bonding layer. The anti-electromagnetic layer protective film according to the first aspect of the patent application, wherein the anti-electromagnetic wave layer is made of a material that can absorb electromagnetic waves and is electrically conductive at the same time. A method for manufacturing a protective film with an anti-electromagnetic wave layer, comprising: a release layer setting step, wherein a release layer is disposed on a surface of a carrier layer; and a reinforcement layer setting step is disposed on a surface of the release layer a reinforcing layer; a color layer setting step, wherein a color layer is disposed on the surface of the strengthening layer; a bonding layer setting step is disposed on the surface of the color layer to provide a bonding layer; and an anti-electromagnetic layer setting step This step is performed between the release layer setting step and the bonding layer setting step, and an anti-electromagnetic wave layer is disposed between the release layer and the bonding layer by printing. The method for fabricating a protective film having an anti-electromagnetic wave layer according to claim 4, wherein the anti-electromagnetic layer setting step is performed between the coloring layer setting step and the bonding layer setting step. The method for manufacturing a protective film with an anti-electromagnetic wave layer according to the fourth aspect of the patent application, further comprising a step of disposing a bridge layer, wherein the step of setting the color layer and the step of setting the bonding layer are performed to A bridge layer is provided on the surface of the color layer.