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TWI371844B - Semiconductor device and method for manufacturing the same - Google Patents

Semiconductor device and method for manufacturing the same

Info

Publication number
TWI371844B
TWI371844B TW097141351A TW97141351A TWI371844B TW I371844 B TWI371844 B TW I371844B TW 097141351 A TW097141351 A TW 097141351A TW 97141351 A TW97141351 A TW 97141351A TW I371844 B TWI371844 B TW I371844B
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
semiconductor device
semiconductor
Prior art date
Application number
TW097141351A
Other languages
Chinese (zh)
Other versions
TW200929496A (en
Inventor
Masaki Haneda
Michie Sunayama
Noriyoshi Shimizu
Nobuyuki Ohtsuka
Yoshiyuki Nakao
Takahiro Tabira
Original Assignee
Fujitsu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Semiconductor Ltd filed Critical Fujitsu Semiconductor Ltd
Publication of TW200929496A publication Critical patent/TW200929496A/en
Application granted granted Critical
Publication of TWI371844B publication Critical patent/TWI371844B/en

Links

TW097141351A 2007-11-14 2008-10-28 Semiconductor device and method for manufacturing the same TWI371844B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007295778 2007-11-14
JP2008163798A JP5309722B2 (en) 2007-11-14 2008-06-23 Semiconductor device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200929496A TW200929496A (en) 2009-07-01
TWI371844B true TWI371844B (en) 2012-09-01

Family

ID=40710924

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097141351A TWI371844B (en) 2007-11-14 2008-10-28 Semiconductor device and method for manufacturing the same

Country Status (3)

Country Link
JP (1) JP5309722B2 (en)
CN (1) CN101436579B (en)
TW (1) TWI371844B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482712B (en) * 2009-07-27 2015-05-01 Memjet Technology Ltd Printhead integrated circuit configured for backside electrical connection
JP5616605B2 (en) * 2009-10-16 2014-10-29 株式会社アルバック Method for forming copper thin film
JPWO2013125449A1 (en) * 2012-02-22 2015-07-30 東京エレクトロン株式会社 Semiconductor device manufacturing method, storage medium, and semiconductor device
CN103700619B (en) * 2013-12-17 2016-05-18 上海交通大学 Copper-connection is electroplated fill method
JP6041219B2 (en) * 2014-08-27 2016-12-07 日立金属株式会社 Sputtering target
KR102579880B1 (en) * 2016-05-12 2023-09-18 삼성전자주식회사 Interposer, semiconductor package, and method of fabricating interposer
CN113363152A (en) * 2020-03-06 2021-09-07 长鑫存储技术有限公司 Semiconductor structure and manufacturing method thereof
US11488905B2 (en) * 2020-12-08 2022-11-01 Nanya Technology Corporation Semiconductor device structure with manganese-containing conductive plug and method for forming the same
US11581258B2 (en) * 2021-01-13 2023-02-14 Nanya Technology Corporation Semiconductor device structure with manganese-containing interconnect structure and method for forming the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006080234A (en) * 2004-09-08 2006-03-23 Renesas Technology Corp Semiconductor device and its fabrication process
US7867906B2 (en) * 2005-06-22 2011-01-11 Nec Corporation Semiconductor device and method for manufacturing same
JP2007109687A (en) * 2005-10-11 2007-04-26 Sony Corp Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JP5309722B2 (en) 2013-10-09
CN101436579A (en) 2009-05-20
JP2009141315A (en) 2009-06-25
TW200929496A (en) 2009-07-01
CN101436579B (en) 2013-03-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees