TWI368534B - Gas abatement - Google Patents
Gas abatementInfo
- Publication number
- TWI368534B TWI368534B TW094126469A TW94126469A TWI368534B TW I368534 B TWI368534 B TW I368534B TW 094126469 A TW094126469 A TW 094126469A TW 94126469 A TW94126469 A TW 94126469A TW I368534 B TWI368534 B TW I368534B
- Authority
- TW
- Taiwan
- Prior art keywords
- effluent stream
- combustion chamber
- nozzle
- effluent
- stream
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/46—Removing components of defined structure
- B01D53/68—Halogens or halogen compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/30—Controlling by gas-analysis apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/204—Inorganic halogen compounds
- B01D2257/2047—Hydrofluoric acid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Biomedical Technology (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Environmental & Geological Engineering (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Incineration Of Waste (AREA)
- Treating Waste Gases (AREA)
- Glass Compositions (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Gas Separation By Absorption (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0417378.7A GB0417378D0 (en) | 2004-08-04 | 2004-08-04 | Gas abatement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200628214A TW200628214A (en) | 2006-08-16 |
| TWI368534B true TWI368534B (en) | 2012-07-21 |
Family
ID=32982521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094126469A TWI368534B (en) | 2004-08-04 | 2005-08-04 | Gas abatement |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7494633B2 (zh) |
| EP (1) | EP1773474B1 (zh) |
| JP (1) | JP4885855B2 (zh) |
| KR (1) | KR101133812B1 (zh) |
| CN (1) | CN100548445C (zh) |
| AT (1) | ATE465798T1 (zh) |
| DE (1) | DE602005020938D1 (zh) |
| GB (1) | GB0417378D0 (zh) |
| TW (1) | TWI368534B (zh) |
| WO (1) | WO2006013355A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI633926B (zh) * | 2013-06-10 | 2018-09-01 | 英商愛德華有限公司 | 流程氣體減量裝置及方法 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0706544D0 (en) * | 2007-04-04 | 2007-05-09 | Boc Group Plc | Combustive destruction of noxious substances |
| JP5660888B2 (ja) * | 2007-05-25 | 2015-01-28 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 除害システムの効率的な運転のための方法及び装置 |
| WO2009055750A1 (en) * | 2007-10-26 | 2009-04-30 | Applied Materials, Inc. | Methods and apparatus for smart abatement using an improved fuel circuit |
| JP5659491B2 (ja) * | 2009-01-30 | 2015-01-28 | セントラル硝子株式会社 | フッ素ガス発生装置を含む半導体製造設備 |
| GB0902221D0 (en) * | 2009-02-11 | 2009-03-25 | Edwards Ltd | Pilot |
| GB201106314D0 (en) | 2011-04-14 | 2011-06-01 | Edwards Ltd | Plasma torch |
| GB2504468B (en) * | 2012-07-27 | 2017-03-22 | Edwards Ltd | Burner Nozzle Reciprocating Scraper Arrangement for Reducing Effluent Gas Deposits |
| CN105121957B (zh) * | 2013-04-25 | 2018-03-30 | 爱德华兹有限公司 | 辐射燃烧器 |
| GB2516267B (en) * | 2013-07-17 | 2016-08-17 | Edwards Ltd | Head assembly |
| US9259683B2 (en) | 2014-01-22 | 2016-02-16 | Micron Technology, Inc. | Methods and apparatus for treating fluorinated greenhouse gases in gas streams |
| GB2540544B (en) * | 2015-07-20 | 2020-04-15 | Edwards Ltd | Inlet assembly |
| TWI763761B (zh) | 2017-01-06 | 2022-05-11 | 美商艾爾茲塔公司 | 用於改善廢氣減量之系統及方法 |
| JP7252718B2 (ja) * | 2018-06-14 | 2023-04-05 | エドワーズ株式会社 | 除害装置、及びインレットノズル |
| GB2579197B (en) * | 2018-11-22 | 2021-06-09 | Edwards Ltd | Abatement method |
| GB2588775A (en) * | 2019-11-05 | 2021-05-12 | Edwards Ltd | Optimising operating conditions in an abatement apparatus |
| GB2588906A (en) | 2019-11-13 | 2021-05-19 | Edwards Ltd | Gas purged valve |
| GB2599898B (en) | 2020-10-07 | 2024-11-20 | Edwards Ltd | Burner Liner |
| GB2600691A (en) | 2020-11-02 | 2022-05-11 | Edwards Ltd | Plasma abatement |
| GB2605448A (en) | 2021-04-01 | 2022-10-05 | Edwards Ltd | Plasma torch device component monitoring |
| GB2605447A (en) | 2021-04-01 | 2022-10-05 | Edwards Ltd | Plasma torch device component monitoring |
| GB2629623B (en) | 2023-05-04 | 2025-07-30 | Edwards Ltd | Plasma foreline |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES373703A1 (es) * | 1968-11-27 | 1972-02-01 | Sulzer Ag | Mejoras introducidas en los mecheros de mufla, con chorro de remolino, con una alimentacion de aceite yno gas central. |
| JPH02126014A (ja) * | 1988-07-29 | 1990-05-15 | Chiyoda Corp | 有毒性ガスの燃焼処理方法及び装置 |
| JPH0277433A (ja) * | 1988-09-14 | 1990-03-16 | Nissan Motor Co Ltd | 硬質保護膜を有する着色樹脂成形体 |
| JPH0344993Y2 (zh) * | 1988-11-21 | 1991-09-24 | ||
| US5123364A (en) * | 1989-11-08 | 1992-06-23 | American Combustion, Inc. | Method and apparatus for co-processing hazardous wastes |
| US5510093A (en) * | 1994-07-25 | 1996-04-23 | Alzeta Corporation | Combustive destruction of halogenated compounds |
| DE19539246A1 (de) * | 1995-10-21 | 1997-04-24 | Asea Brown Boveri | Airblast-Zerstäuberdüse |
| GB9608061D0 (en) * | 1996-04-16 | 1996-06-19 | Boc Group Plc | Removal of noxious substances from gas streams |
| JPH10110926A (ja) * | 1996-08-14 | 1998-04-28 | Nippon Sanso Kk | 燃焼式除害装置 |
| TW342436B (en) * | 1996-08-14 | 1998-10-11 | Nippon Oxygen Co Ltd | Combustion type harm removal apparatus (1) |
| JP4066107B2 (ja) * | 1997-11-21 | 2008-03-26 | 株式会社荏原製作所 | 排ガス処理用燃焼器 |
| US6261524B1 (en) * | 1999-01-12 | 2001-07-17 | Advanced Technology Materials, Inc. | Advanced apparatus for abatement of gaseous pollutants |
| US6126438A (en) * | 1999-06-23 | 2000-10-03 | American Air Liquide | Preheated fuel and oxidant combustion burner |
| US6635228B1 (en) * | 1999-11-01 | 2003-10-21 | Robert R. Moore | Falling film plasma reactor |
| AT408437B (de) * | 2000-02-22 | 2001-11-26 | Holderbank Financ Glarus | Einrichtung zum zerstäuben von flüssigen schmelzen |
| GB0005231D0 (en) * | 2000-03-03 | 2000-04-26 | Boc Group Plc | Abatement of semiconductor processing gases |
| JP4535558B2 (ja) * | 2000-03-31 | 2010-09-01 | 大陽日酸株式会社 | 燃焼式排ガス処理装置 |
| GB0026697D0 (en) * | 2000-11-01 | 2000-12-20 | Boc Group Plc | Removal of noxious substances from gas streams |
| DE50105033D1 (de) * | 2001-08-30 | 2005-02-10 | Das Duennschicht Anlagen Sys | Verfahren und Einrichtung zur Reinigung insbesondere von fluorhaltigen Abgasen in einem Brenner mit räumlicher Trennung der Einspeisung von Gasen |
| US6910431B2 (en) * | 2002-12-30 | 2005-06-28 | The Boc Group, Inc. | Burner-lance and combustion method for heating surfaces susceptible to oxidation or reduction |
-
2004
- 2004-08-04 GB GBGB0417378.7A patent/GB0417378D0/en not_active Ceased
-
2005
- 2005-08-02 JP JP2007524394A patent/JP4885855B2/ja not_active Expired - Lifetime
- 2005-08-02 US US11/659,641 patent/US7494633B2/en active Active
- 2005-08-02 EP EP05768057A patent/EP1773474B1/en not_active Expired - Lifetime
- 2005-08-02 WO PCT/GB2005/003033 patent/WO2006013355A1/en not_active Ceased
- 2005-08-02 DE DE602005020938T patent/DE602005020938D1/de not_active Expired - Lifetime
- 2005-08-02 CN CNB2005800263735A patent/CN100548445C/zh not_active Expired - Lifetime
- 2005-08-02 AT AT05768057T patent/ATE465798T1/de active
- 2005-08-02 KR KR1020077002773A patent/KR101133812B1/ko not_active Expired - Lifetime
- 2005-08-04 TW TW094126469A patent/TWI368534B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI633926B (zh) * | 2013-06-10 | 2018-09-01 | 英商愛德華有限公司 | 流程氣體減量裝置及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070217983A1 (en) | 2007-09-20 |
| WO2006013355A1 (en) | 2006-02-09 |
| EP1773474A1 (en) | 2007-04-18 |
| JP4885855B2 (ja) | 2012-02-29 |
| TW200628214A (en) | 2006-08-16 |
| JP2008509371A (ja) | 2008-03-27 |
| KR101133812B1 (ko) | 2012-04-20 |
| US7494633B2 (en) | 2009-02-24 |
| CN1993170A (zh) | 2007-07-04 |
| ATE465798T1 (de) | 2010-05-15 |
| KR20070038139A (ko) | 2007-04-09 |
| GB0417378D0 (en) | 2004-09-08 |
| DE602005020938D1 (de) | 2010-06-10 |
| EP1773474B1 (en) | 2010-04-28 |
| CN100548445C (zh) | 2009-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |