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TWI367899B - Epoxy resin curing agent and epoxy resin composition - Google Patents

Epoxy resin curing agent and epoxy resin composition

Info

Publication number
TWI367899B
TWI367899B TW094118984A TW94118984A TWI367899B TW I367899 B TWI367899 B TW I367899B TW 094118984 A TW094118984 A TW 094118984A TW 94118984 A TW94118984 A TW 94118984A TW I367899 B TWI367899 B TW I367899B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
curing agent
resin composition
resin curing
composition
Prior art date
Application number
TW094118984A
Other languages
English (en)
Other versions
TW200617054A (en
Inventor
Atsushi Okoshi
Ryuji Ideno
Takao Ota
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of TW200617054A publication Critical patent/TW200617054A/zh
Application granted granted Critical
Publication of TWI367899B publication Critical patent/TWI367899B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW094118984A 2004-06-10 2005-06-09 Epoxy resin curing agent and epoxy resin composition TWI367899B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004172751 2004-06-10
JP2004371439 2004-12-22

Publications (2)

Publication Number Publication Date
TW200617054A TW200617054A (en) 2006-06-01
TWI367899B true TWI367899B (en) 2012-07-11

Family

ID=35503019

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118984A TWI367899B (en) 2004-06-10 2005-06-09 Epoxy resin curing agent and epoxy resin composition

Country Status (7)

Country Link
US (1) US8703010B2 (zh)
EP (1) EP1754734B1 (zh)
JP (1) JP4872667B2 (zh)
KR (1) KR101102124B1 (zh)
DE (1) DE602005019880D1 (zh)
TW (1) TWI367899B (zh)
WO (1) WO2005121202A1 (zh)

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* Cited by examiner, † Cited by third party
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JP2006182961A (ja) * 2004-12-28 2006-07-13 Stanley Electric Co Ltd 熱硬化性透明樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード
JP4808056B2 (ja) * 2006-03-17 2011-11-02 スタンレー電気株式会社 熱硬化性樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード
KR101391488B1 (ko) 2006-08-09 2014-05-07 미츠비시 가스 가가쿠 가부시키가이샤 산무수물 에스테르와 그 조성물, 열경화성 수지 조성물 및그 경화물
JP5298468B2 (ja) * 2006-09-26 2013-09-25 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP2008081596A (ja) * 2006-09-27 2008-04-10 Mitsubishi Gas Chem Co Inc 透明樹脂組成物
WO2008059856A1 (fr) 2006-11-15 2008-05-22 Hitachi Chemical Co., Ltd. Composition de résine thermodurcissable pour réfléchir la lumière, procédé de fabrication de la composition de résine, et substrat de montage d'éléments semi-conducteurs optiques et dispositif semi-conducteur optique utilisant la composition de résine
JP5663874B2 (ja) * 2007-09-27 2015-02-04 三菱瓦斯化学株式会社 エポキシ樹脂組成物、その硬化物及び発光ダイオード
JP4586925B2 (ja) * 2008-01-09 2010-11-24 日立化成工業株式会社 熱硬化性樹脂組成物、エポキシ樹脂成形材料、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
TWI483962B (zh) 2008-01-09 2015-05-11 日立化成股份有限公司 轉移成型用組成物、光半導體元件搭載用基板及其製造方法以及光半導體裝置
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
JP5640319B2 (ja) * 2008-03-11 2014-12-17 日立化成株式会社 熱硬化性樹脂用硬化剤、熱硬化性樹脂組成物、硬化物及び半導体装置
JP5683073B2 (ja) * 2009-01-20 2015-03-11 三菱化学株式会社 太陽電池封止材用エポキシ樹脂組成物及び太陽電池
US9028911B2 (en) * 2009-08-10 2015-05-12 Mitsubishi Gas Chemical Company, Inc. Thermosetting resin composition for surface protection layers
JP5783444B2 (ja) * 2011-03-14 2015-09-24 三菱瓦斯化学株式会社 液状シクロヘキサントリカルボン酸無水物の保存方法
JP5831173B2 (ja) * 2011-11-29 2015-12-09 三菱瓦斯化学株式会社 安定化および再生方法
JP6327472B2 (ja) * 2012-12-28 2018-05-23 三菱瓦斯化学株式会社 プリプレグ及びフィルム
EP3133108B1 (en) * 2014-04-15 2023-08-02 Mitsubishi Gas Chemical Company, Inc. Fiber-reinforced composite material
US9985579B2 (en) 2016-04-12 2018-05-29 Preformed Line Products Co. Mounting assembly for mounting a solar panel
JP6686742B2 (ja) * 2016-06-30 2020-04-22 三菱瓦斯化学株式会社 半硬化物及びその製造方法、並びに最終硬化物
JP6884726B2 (ja) * 2018-04-05 2021-06-09 信越化学工業株式会社 光半導体装置用ダイアタッチ材

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4198340A (en) * 1979-03-20 1980-04-15 Dainippon Ink & Chemicals, Inc. Process for stereoisomerization of cis-3-methyl-Δ4 -tetrahydro-cis,cis-phthalic anhydride
US5399608A (en) * 1989-10-20 1995-03-21 General Electric Company Highly dense thermoplastic molding compositions
JP3074850B2 (ja) * 1991-09-20 2000-08-07 ジェイエスアール株式会社 保護膜材料
US5412108A (en) * 1994-01-05 1995-05-02 Amoco Corporation Method for preparing 1,2,4-cyclohexanetricarboxylic acid and anhydride
JP3994428B2 (ja) * 1998-11-10 2007-10-17 Ｊｓｒ株式会社 硬化性組成物
ATE250112T1 (de) * 1999-05-05 2003-10-15 Du Pont Beschichtungszusammensetzungen enthaltend hochstrukturierte makromoleküle
JP2000344868A (ja) 1999-06-03 2000-12-12 Tonen Chem Corp エポキシ樹脂組成物
JP2001114868A (ja) * 1999-10-14 2001-04-24 Tonen Chem Corp エポキシ樹脂組成物及びそれを用いた絶縁封止材料
JP2002097251A (ja) * 2000-09-21 2002-04-02 New Japan Chem Co Ltd グリシジル基含有脂環式化合物、その製造方法並びにそれを用いたエポキシ樹脂組成物
TWI227374B (en) * 2001-01-24 2005-02-01 Sumitomo Chemical Co Colored photosensitive composition, method for making a color pattern and the use thereof
JP2003026763A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2004203792A (ja) 2002-12-26 2004-07-22 New Japan Chem Co Ltd ４−クロロホルミル−シクロヘキサン−１，２−ジカルボン酸無水物及びその製造方法。
EP1493766B1 (en) 2003-06-30 2006-06-07 Mitsubishi Gas Chemical Company, Inc. Heat-curable resin composition and use thereof
JP4536437B2 (ja) 2003-06-30 2010-09-01 三菱瓦斯化学株式会社 熱硬化性樹脂組成物及びその用途
JP4826256B2 (ja) * 2003-11-20 2011-11-30 三菱瓦斯化学株式会社 液状シクロヘキサントリカルボン酸無水物

Also Published As

Publication number Publication date
EP1754734B1 (en) 2010-03-10
TW200617054A (en) 2006-06-01
US20080306223A1 (en) 2008-12-11
KR101102124B1 (ko) 2012-01-02
JP4872667B2 (ja) 2012-02-08
EP1754734A4 (en) 2009-02-11
WO2005121202A1 (ja) 2005-12-22
KR20070043933A (ko) 2007-04-26
US8703010B2 (en) 2014-04-22
DE602005019880D1 (de) 2010-04-22
JPWO2005121202A1 (ja) 2008-04-10
EP1754734A1 (en) 2007-02-21

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