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EP2025695A4 - EPOXY RESIN COMPOSITION AND CURED EPOXY RESIN - Google Patents

EPOXY RESIN COMPOSITION AND CURED EPOXY RESIN

Info

Publication number
EP2025695A4
EP2025695A4 EP07744791A EP07744791A EP2025695A4 EP 2025695 A4 EP2025695 A4 EP 2025695A4 EP 07744791 A EP07744791 A EP 07744791A EP 07744791 A EP07744791 A EP 07744791A EP 2025695 A4 EP2025695 A4 EP 2025695A4
Authority
EP
European Patent Office
Prior art keywords
epoxy resin
resin composition
cured
cured epoxy
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07744791A
Other languages
German (de)
French (fr)
Other versions
EP2025695A8 (en
EP2025695A1 (en
Inventor
Shinya Tanaka
Yoshitaka Takezawa
Keiji Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Sumitomo Chemical Co Ltd
Original Assignee
Hitachi Ltd
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Sumitomo Chemical Co Ltd filed Critical Hitachi Ltd
Publication of EP2025695A1 publication Critical patent/EP2025695A1/en
Publication of EP2025695A8 publication Critical patent/EP2025695A8/en
Publication of EP2025695A4 publication Critical patent/EP2025695A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
EP07744791A 2006-06-07 2007-06-06 EPOXY RESIN COMPOSITION AND CURED EPOXY RESIN Withdrawn EP2025695A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006158154 2006-06-07
PCT/JP2007/061448 WO2007142262A1 (en) 2006-06-07 2007-06-06 Epoxy resin composition and cured epoxy resin

Publications (3)

Publication Number Publication Date
EP2025695A1 EP2025695A1 (en) 2009-02-18
EP2025695A8 EP2025695A8 (en) 2009-06-17
EP2025695A4 true EP2025695A4 (en) 2012-02-29

Family

ID=38801509

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07744791A Withdrawn EP2025695A4 (en) 2006-06-07 2007-06-06 EPOXY RESIN COMPOSITION AND CURED EPOXY RESIN

Country Status (6)

Country Link
US (1) US20090105388A1 (en)
EP (1) EP2025695A4 (en)
KR (1) KR20090028571A (en)
CN (1) CN101466757A (en)
TW (1) TW200804449A (en)
WO (1) WO2007142262A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008266594A (en) * 2007-03-26 2008-11-06 Sumitomo Chemical Co Ltd Epoxy resin composition
JP2008239679A (en) * 2007-03-26 2008-10-09 Sumitomo Chemical Co Ltd Epoxy resin composition
US20100063182A1 (en) * 2007-04-19 2010-03-11 Shinya Tanaka Epoxy composition
US8546399B2 (en) * 2009-05-26 2013-10-01 Abbvie Inc. Apoptosis inducing agents for the treatment of cancer and immune and autoimmune diseases
EP2474539B1 (en) * 2009-09-03 2013-11-27 Sumitomo Chemical Company, Limited Diepoxy compound, process for producing same, and composition containing the diepoxy compound
CN105754129A (en) * 2009-09-29 2016-07-13 日立化成株式会社 Multilayer Resin Sheet And Method For Producing The Same, Method For Producing Cured Multilayer Resin Sheet, And Highly Thermally Conductive Resin Sheet Laminate And Method For Producing The Same
CN103755921B (en) * 2009-09-29 2017-06-23 日立化成工业株式会社 Resin combination, resin sheet and resin cured matter and its manufacture method
JP5662695B2 (en) * 2010-04-30 2015-02-04 本州化学工業株式会社 Novel diepoxy compounds
WO2012002546A1 (en) * 2010-07-02 2012-01-05 日立化成工業株式会社 B stage sheet, metal foil with applied resin, metal substrate and led substrate
WO2012132691A1 (en) * 2011-03-28 2012-10-04 日立化成工業株式会社 Multilayer resin sheet, resin sheet laminate, cured multilayer resin sheet and method for producing same, multilayer resin sheet with metal foil, and semiconductor device
FR2974119B1 (en) * 2011-04-13 2013-04-05 Commissariat Energie Atomique PROCESS FOR THE PRODUCTION OF CERAMIC OR METAL COMPONENTS BY PIM, BASED ON THE USE OF INORGANIC FIBERS OR NANOFIBERS
JP5649126B2 (en) * 2011-08-04 2015-01-07 株式会社日立製作所 Epoxy resin composition for casting and electric device using the same
CN103030928B (en) * 2011-09-28 2016-02-10 深圳光启高等理工研究院 A kind of Metamaterial dielectric substrate and working method thereof
JP6123277B2 (en) * 2011-12-28 2017-05-10 日立化成株式会社 RESIN COMPOSITION, RESIN COMPOSITION SHEET, AND METHOD FOR PRODUCING RESIN COMPOSITION SHEET, RESIN COMPOSITION SHEET WITH METAL FILMS, B STAGE SHEET, RESIN COMPOSITION SHEET WITH SEMI-HARDENED METAL FILMS, METAL BASE WIRING BOARD MATERIAL, METAL BASE WIRING BOARD , LED light source member, and power semiconductor device
WO2014084555A1 (en) 2012-11-30 2014-06-05 엘지이노텍 주식회사 Epoxy resin composition, and printed circuit board comprising insulation layer using epoxy resin composition
KR101984791B1 (en) 2012-12-12 2019-09-03 엘지이노텍 주식회사 Epoxy resin composite, prepreg and printed circuit board using the same
KR101973686B1 (en) 2012-12-12 2019-08-26 엘지이노텍 주식회사 Epoxy resin composite and printed circuit board using the same
KR102012311B1 (en) 2012-12-12 2019-08-20 엘지이노텍 주식회사 Resin composite and printed circuit board using the same
KR101973685B1 (en) 2012-12-12 2019-08-26 엘지이노텍 주식회사 Epoxy resin composite and printed circuit board using the same
KR102034228B1 (en) * 2012-12-14 2019-10-18 엘지이노텍 주식회사 Epoxy resin composite, prepreg and printed circuit board using the same
JP6514462B2 (en) * 2013-10-01 2019-05-15 日東電工株式会社 Soft magnetic resin composition and soft magnetic film
US20210115208A1 (en) * 2018-04-27 2021-04-22 Toray Industries, Inc. Prepreg and carbon fiber reinforced material
EP3851474B1 (en) * 2018-09-10 2023-07-19 Resonac Corporation Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0611844B2 (en) * 1985-03-26 1994-02-16 株式会社東芝 Composition for electrical equipment insulation
TW197458B (en) * 1991-02-14 1993-01-01 Ciba Geigy Ag
JPH06191833A (en) 1992-06-02 1994-07-12 Sumitomo Chem Co Ltd Alpha-alumina
JP3440498B2 (en) 1992-06-02 2003-08-25 住友化学工業株式会社 α-alumina
JPH083365A (en) * 1994-06-20 1996-01-09 Sumitomo Chem Co Ltd Molding resin composition
JP3937494B2 (en) 1997-02-24 2007-06-27 住友化学株式会社 Alumina-filled resin or rubber composition
JP2004010762A (en) * 2002-06-07 2004-01-15 Hitachi Ltd Epoxy resin, epoxy resin composition, epoxy resin cured product, and method for producing them
JP4745625B2 (en) * 2003-06-19 2011-08-10 住友化学株式会社 Epoxy compound and epoxy resin cured product
DE602004028614D1 (en) * 2003-06-19 2010-09-23 Sumitomo Chemical Co EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT
TWI354002B (en) * 2003-12-24 2011-12-11 Sumitomo Chemical Co Epoxy compounds and cured epoxy resin obtained by
JP4619770B2 (en) 2003-12-24 2011-01-26 住友化学株式会社 Epoxy compound and cured epoxy resin obtained by curing the epoxy compound

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2007142262A1 *

Also Published As

Publication number Publication date
EP2025695A8 (en) 2009-06-17
US20090105388A1 (en) 2009-04-23
TW200804449A (en) 2008-01-16
WO2007142262A1 (en) 2007-12-13
KR20090028571A (en) 2009-03-18
CN101466757A (en) 2009-06-24
EP2025695A1 (en) 2009-02-18

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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AX Request for extension of the european patent

Extension state: AL BA HR MK RS

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: HITACHI, LTD.

Owner name: SUMITOMO CHEMICAL COMPANY, LIMITED

A4 Supplementary search report drawn up and despatched

Effective date: 20120130

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 1/03 20060101ALI20120124BHEP

Ipc: C08G 59/50 20060101ALI20120124BHEP

Ipc: C08K 3/22 20060101ALI20120124BHEP

Ipc: C08G 59/22 20060101ALI20120124BHEP

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