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TWI367522B - Plasma process electrode and plasma process device - Google Patents

Plasma process electrode and plasma process device

Info

Publication number
TWI367522B
TWI367522B TW097123371A TW97123371A TWI367522B TW I367522 B TWI367522 B TW I367522B TW 097123371 A TW097123371 A TW 097123371A TW 97123371 A TW97123371 A TW 97123371A TW I367522 B TWI367522 B TW I367522B
Authority
TW
Taiwan
Prior art keywords
plasma process
electrode
process device
plasma
process electrode
Prior art date
Application number
TW097123371A
Other languages
Chinese (zh)
Other versions
TW200924026A (en
Inventor
Sumito Sakaguchi
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of TW200924026A publication Critical patent/TW200924026A/en
Application granted granted Critical
Publication of TWI367522B publication Critical patent/TWI367522B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning In General (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Plasma Technology (AREA)
TW097123371A 2007-11-29 2008-06-23 Plasma process electrode and plasma process device TWI367522B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/073061 WO2009069211A1 (en) 2007-11-29 2007-11-29 Plasma process electrode and plasma process device

Publications (2)

Publication Number Publication Date
TW200924026A TW200924026A (en) 2009-06-01
TWI367522B true TWI367522B (en) 2012-07-01

Family

ID=40678127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097123371A TWI367522B (en) 2007-11-29 2008-06-23 Plasma process electrode and plasma process device

Country Status (3)

Country Link
JP (1) JP5035352B2 (en)
TW (1) TWI367522B (en)
WO (1) WO2009069211A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171244A (en) * 2009-01-23 2010-08-05 Fuji Electric Holdings Co Ltd Plasma processing apparatus
KR101612741B1 (en) * 2010-03-08 2016-04-18 주성엔지니어링(주) Gas distributing plate and Apparatus for treating substrate including the same
JP6030867B2 (en) * 2011-06-24 2016-11-24 国立大学法人佐賀大学 Plasma processing equipment
CN103493602B (en) * 2011-07-14 2016-06-08 株式会社岛津制作所 Plasma processing apparatus
CN103266310B (en) * 2013-05-24 2015-05-20 上海和辉光电有限公司 Dispersion plate and coating device with the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04375A (en) * 1990-04-16 1992-01-06 Mitsubishi Heavy Ind Ltd Production of hardened protective film on surface of plastic substrate
JPH0922798A (en) * 1995-07-03 1997-01-21 Anelva Corp High frequency discharge electrode and high frequency plasma substrate processing apparatus
JP4119820B2 (en) * 2003-11-14 2008-07-16 三菱重工業株式会社 Plasma CVD apparatus and method for manufacturing photoelectric conversion apparatus

Also Published As

Publication number Publication date
WO2009069211A1 (en) 2009-06-04
TW200924026A (en) 2009-06-01
JP5035352B2 (en) 2012-09-26
JPWO2009069211A1 (en) 2011-04-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees