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TWI366740B - - Google Patents

Info

Publication number
TWI366740B
TWI366740B TW094123785A TW94123785A TWI366740B TW I366740 B TWI366740 B TW I366740B TW 094123785 A TW094123785 A TW 094123785A TW 94123785 A TW94123785 A TW 94123785A TW I366740 B TWI366740 B TW I366740B
Authority
TW
Taiwan
Application number
TW094123785A
Other languages
Chinese (zh)
Other versions
TW200608139A (en
Inventor
Shouji Minegishi
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200608139A publication Critical patent/TW200608139A/zh
Application granted granted Critical
Publication of TWI366740B publication Critical patent/TWI366740B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polyethers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW094123785A 2004-07-15 2005-07-13 Photocurable/thermosetting resin composition and cured product thereof TW200608139A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004208058 2004-07-15

Publications (2)

Publication Number Publication Date
TW200608139A TW200608139A (en) 2006-03-01
TWI366740B true TWI366740B (fr) 2012-06-21

Family

ID=35785111

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123785A TW200608139A (en) 2004-07-15 2005-07-13 Photocurable/thermosetting resin composition and cured product thereof

Country Status (4)

Country Link
JP (1) JP4994036B2 (fr)
CN (1) CN100569825C (fr)
TW (1) TW200608139A (fr)
WO (1) WO2006008995A1 (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4683182B2 (ja) * 2004-09-28 2011-05-11 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法
JP4635935B2 (ja) * 2006-03-29 2011-02-23 Ｊｓｒ株式会社 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子
WO2008029816A1 (fr) * 2006-09-04 2008-03-13 Nec Corporation Composition de résine photosensible, procédé de contrôle d'indice de réfraction, et guide d'ondes optique et composant optique l'utilisant
JP4939301B2 (ja) * 2007-05-17 2012-05-23 日東電工株式会社 光導波路
JP5298653B2 (ja) * 2007-07-06 2013-09-25 Ｊｓｒ株式会社 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子
JP4849362B2 (ja) * 2008-03-14 2012-01-11 ナガセケムテックス株式会社 感放射線性樹脂組成物
JP5542360B2 (ja) * 2009-03-30 2014-07-09 太陽ホールディングス株式会社 プリント配線板
WO2011001713A1 (fr) * 2009-06-29 2011-01-06 積水化学工業株式会社 Bande de protection pour placage
JP5537864B2 (ja) * 2009-08-19 2014-07-02 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5575436B2 (ja) * 2009-09-01 2014-08-20 太陽ホールディングス株式会社 アルカリ現像性の光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5526740B2 (ja) * 2009-11-30 2014-06-18 日立化成株式会社 光導波路形成用樹脂組成物及びこれを用いた光導波路形成用樹脂フィルム、並びにこれらを用いた光導波路
JP5724298B2 (ja) * 2010-10-29 2015-05-27 大日本印刷株式会社 ガスバリア性フィルムの製造方法及びガスバリア層の形成方法
CN102746785B (zh) * 2011-04-19 2014-12-17 比亚迪股份有限公司 一种双重固化涂料组合物及其固化方法
JP2013165164A (ja) * 2012-02-10 2013-08-22 Taiyo Ink Mfg Ltd 配線回路、配線基板及び配線基板の製造方法
JP6090655B2 (ja) * 2013-02-12 2017-03-08 パナソニックＩｐマネジメント株式会社 光導波路用ドライフィルム、それを用いた光導波路及び光電気複合配線板、並びに光電気複合配線板の製造方法
CN107077067B (zh) * 2014-09-24 2021-04-13 旭化成株式会社 感光性树脂组合物、感光性树脂层压体、树脂图案的制造方法、固化膜和显示装置
CN109071923B (zh) * 2016-04-25 2021-08-24 株式会社钟化 热固化性树脂组合物、固化膜及其制造方法、以及带固化膜的柔性印刷基板及其制造方法
JP6815750B2 (ja) * 2016-05-17 2021-01-20 株式会社カネカ 熱硬化性樹脂組成物の製造方法及びその利用
JP7348177B2 (ja) * 2018-06-29 2023-09-20 株式会社カネカ パターン印刷用レジスト組成物及びパターン形成方法
JP2019204974A (ja) * 2019-08-21 2019-11-28 住友ベークライト株式会社 有機樹脂基板の製造方法、有機樹脂基板および半導体装置
CN113174040B (zh) * 2021-04-27 2022-05-17 杭州福斯特电子材料有限公司 一种光聚合单体，及其组成的高分辨率高附着ldi干膜抗蚀剂
CN115955791A (zh) * 2023-03-15 2023-04-11 深圳明阳电路科技股份有限公司 一种用于mini-led类PCB的制备方法
CN119916643A (zh) * 2025-01-24 2025-05-02 杭州福斯特电子材料有限公司 感光树脂组合物、感光干膜、固化膜和线路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446073A (en) * 1993-03-31 1995-08-29 Fusion Systems Corporation Photopolymerization process employing a charge transfer complex without a photoinitiator
JPH07188383A (ja) * 1993-12-27 1995-07-25 Hitachi Chem Co Ltd エポキシ樹脂組成物およびこれを用いたカラーフィルタ保護膜用樹脂組成物
US5789757A (en) * 1996-09-10 1998-08-04 The Dexter Corporation Malemide containing formulations and uses therefor
JP2002502056A (ja) * 1998-01-30 2002-01-22 ファースト・ケミカル・コーポレイション マレイミドを含む光重合組成物およびその使用方法
DE60103529T2 (de) * 2000-03-29 2005-06-02 Kanagawa University, Yokohama Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit
JP2003195501A (ja) * 2001-12-26 2003-07-09 Fujifilm Arch Co Ltd ポジ型感光性樹脂組成物
JP4087650B2 (ja) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
CN1984938A (zh) 2007-06-20
JPWO2006008995A1 (ja) 2008-05-01
CN100569825C (zh) 2009-12-16
WO2006008995A1 (fr) 2006-01-26
JP4994036B2 (ja) 2012-08-08
TW200608139A (en) 2006-03-01

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