CN100569825C - 光固化性·热固化性树脂组合物及其固化物 - Google Patents
光固化性·热固化性树脂组合物及其固化物 Download PDFInfo
- Publication number
- CN100569825C CN100569825C CNB2005800237251A CN200580023725A CN100569825C CN 100569825 C CN100569825 C CN 100569825C CN B2005800237251 A CNB2005800237251 A CN B2005800237251A CN 200580023725 A CN200580023725 A CN 200580023725A CN 100569825 C CN100569825 C CN 100569825C
- Authority
- CN
- China
- Prior art keywords
- group
- compound
- photocurable
- resin composition
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Polyethers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004208058 | 2004-07-15 | ||
| JP208058/2004 | 2004-07-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1984938A CN1984938A (zh) | 2007-06-20 |
| CN100569825C true CN100569825C (zh) | 2009-12-16 |
Family
ID=35785111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800237251A Expired - Lifetime CN100569825C (zh) | 2004-07-15 | 2005-07-11 | 光固化性·热固化性树脂组合物及其固化物 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4994036B2 (zh) |
| CN (1) | CN100569825C (zh) |
| TW (1) | TW200608139A (zh) |
| WO (1) | WO2006008995A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109071923A (zh) * | 2016-04-25 | 2018-12-21 | 株式会社钟化 | 热固化性树脂组合物、固化膜及其制造方法、以及带固化膜的柔性印刷基板及其制造方法 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4683182B2 (ja) * | 2004-09-28 | 2011-05-11 | 山栄化学株式会社 | 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法 |
| JP4635935B2 (ja) * | 2006-03-29 | 2011-02-23 | Jsr株式会社 | 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子 |
| JPWO2008029816A1 (ja) * | 2006-09-04 | 2010-01-21 | 日本電気株式会社 | 感光性樹脂組成物、屈折率制御方法、およびそれを用いた光導波路並びに光学部品 |
| JP4939301B2 (ja) * | 2007-05-17 | 2012-05-23 | 日東電工株式会社 | 光導波路 |
| JP5298653B2 (ja) * | 2007-07-06 | 2013-09-25 | Jsr株式会社 | 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子 |
| JP4849362B2 (ja) * | 2008-03-14 | 2012-01-11 | ナガセケムテックス株式会社 | 感放射線性樹脂組成物 |
| JP5542360B2 (ja) * | 2009-03-30 | 2014-07-09 | 太陽ホールディングス株式会社 | プリント配線板 |
| JPWO2011001713A1 (ja) * | 2009-06-29 | 2012-12-13 | 積水化学工業株式会社 | めっき保護テープ |
| JP5537864B2 (ja) * | 2009-08-19 | 2014-07-02 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物 |
| JP5575436B2 (ja) * | 2009-09-01 | 2014-08-20 | 太陽ホールディングス株式会社 | アルカリ現像性の光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| JP5526740B2 (ja) * | 2009-11-30 | 2014-06-18 | 日立化成株式会社 | 光導波路形成用樹脂組成物及びこれを用いた光導波路形成用樹脂フィルム、並びにこれらを用いた光導波路 |
| JP5724298B2 (ja) * | 2010-10-29 | 2015-05-27 | 大日本印刷株式会社 | ガスバリア性フィルムの製造方法及びガスバリア層の形成方法 |
| CN102746785B (zh) * | 2011-04-19 | 2014-12-17 | 比亚迪股份有限公司 | 一种双重固化涂料组合物及其固化方法 |
| JP2013165164A (ja) * | 2012-02-10 | 2013-08-22 | Taiyo Ink Mfg Ltd | 配線回路、配線基板及び配線基板の製造方法 |
| JP6090655B2 (ja) | 2013-02-12 | 2017-03-08 | パナソニックIpマネジメント株式会社 | 光導波路用ドライフィルム、それを用いた光導波路及び光電気複合配線板、並びに光電気複合配線板の製造方法 |
| CN107077067B (zh) * | 2014-09-24 | 2021-04-13 | 旭化成株式会社 | 感光性树脂组合物、感光性树脂层压体、树脂图案的制造方法、固化膜和显示装置 |
| JP6815750B2 (ja) * | 2016-05-17 | 2021-01-20 | 株式会社カネカ | 熱硬化性樹脂組成物の製造方法及びその利用 |
| WO2020004396A1 (ja) * | 2018-06-29 | 2020-01-02 | 株式会社カネカ | パターン印刷用レジスト組成物及びパターン形成方法 |
| JP2019204974A (ja) * | 2019-08-21 | 2019-11-28 | 住友ベークライト株式会社 | 有機樹脂基板の製造方法、有機樹脂基板および半導体装置 |
| CN113174040B (zh) * | 2021-04-27 | 2022-05-17 | 杭州福斯特电子材料有限公司 | 一种光聚合单体,及其组成的高分辨率高附着ldi干膜抗蚀剂 |
| CN115955791A (zh) * | 2023-03-15 | 2023-04-11 | 深圳明阳电路科技股份有限公司 | 一种用于mini-led类PCB的制备方法 |
| CN119916643A (zh) * | 2025-01-24 | 2025-05-02 | 杭州福斯特电子材料有限公司 | 感光树脂组合物、感光干膜、固化膜和线路板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1420998A (zh) * | 2000-03-29 | 2003-05-28 | 学校法人神奈川大学 | 光固化性·热固化性树脂组合物、其感光性干薄膜及使用其的图型形成方法 |
| CN1472253A (zh) * | 2002-07-12 | 2004-02-04 | 太阳油墨制造株式会社 | 光固化性·热固化性树脂组合物及其固化物 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446073A (en) * | 1993-03-31 | 1995-08-29 | Fusion Systems Corporation | Photopolymerization process employing a charge transfer complex without a photoinitiator |
| JPH07188383A (ja) * | 1993-12-27 | 1995-07-25 | Hitachi Chem Co Ltd | エポキシ樹脂組成物およびこれを用いたカラーフィルタ保護膜用樹脂組成物 |
| US5789757A (en) * | 1996-09-10 | 1998-08-04 | The Dexter Corporation | Malemide containing formulations and uses therefor |
| WO1999039247A1 (en) * | 1998-01-30 | 1999-08-05 | First Chemical Corporation | Photopolymerization compositions including maleimides and processes for using the same |
| JP2003195501A (ja) * | 2001-12-26 | 2003-07-09 | Fujifilm Arch Co Ltd | ポジ型感光性樹脂組成物 |
-
2005
- 2005-07-11 WO PCT/JP2005/012744 patent/WO2006008995A1/ja not_active Ceased
- 2005-07-11 CN CNB2005800237251A patent/CN100569825C/zh not_active Expired - Lifetime
- 2005-07-11 JP JP2006529026A patent/JP4994036B2/ja not_active Expired - Lifetime
- 2005-07-13 TW TW094123785A patent/TW200608139A/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1420998A (zh) * | 2000-03-29 | 2003-05-28 | 学校法人神奈川大学 | 光固化性·热固化性树脂组合物、其感光性干薄膜及使用其的图型形成方法 |
| CN1472253A (zh) * | 2002-07-12 | 2004-02-04 | 太阳油墨制造株式会社 | 光固化性·热固化性树脂组合物及其固化物 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109071923A (zh) * | 2016-04-25 | 2018-12-21 | 株式会社钟化 | 热固化性树脂组合物、固化膜及其制造方法、以及带固化膜的柔性印刷基板及其制造方法 |
| US10975263B2 (en) | 2016-04-25 | 2021-04-13 | Kaneka Corporation | Thermosetting resin composition, cured film and method for producing same, and flexible printed board with cured film and method for producing same |
| CN109071923B (zh) * | 2016-04-25 | 2021-08-24 | 株式会社钟化 | 热固化性树脂组合物、固化膜及其制造方法、以及带固化膜的柔性印刷基板及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4994036B2 (ja) | 2012-08-08 |
| TWI366740B (zh) | 2012-06-21 |
| WO2006008995A1 (ja) | 2006-01-26 |
| TW200608139A (en) | 2006-03-01 |
| JPWO2006008995A1 (ja) | 2008-05-01 |
| CN1984938A (zh) | 2007-06-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100569825C (zh) | 光固化性·热固化性树脂组合物及其固化物 | |
| CN101320212B (zh) | 光固化性热固化性树脂组合物及使用其得到的印刷电路板 | |
| JP5876925B2 (ja) | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 | |
| KR101423404B1 (ko) | 경화성 수지 조성물 | |
| TWI480293B (zh) | A photohardenable resin and a photohardenable resin composition | |
| JP2009086414A (ja) | 感光性樹脂組成物及びその硬化物 | |
| JP2011026370A (ja) | 光硬化性樹脂組成物 | |
| JP2020166214A (ja) | 感光性樹脂組成物、ドライフィルム、硬化物、および、電子部品 | |
| JP5338009B2 (ja) | 光硬化性熱硬化性樹脂組成物及びその硬化物並びにそれらを用いたプリント配線板 | |
| JP7216480B2 (ja) | 光硬化性熱硬化性樹脂組成物及びドライフィルム及び硬化物ならびにプリント配線板 | |
| CN100519630C (zh) | 活性能量线固化性树脂、含有该树脂的光固化性和热固化性树脂组合物及其固化物 | |
| JP2002296776A (ja) | プリント配線板用光硬化性・熱硬化性樹脂組成物及びプリント配線板 | |
| KR20150128614A (ko) | 경화성 수지 조성물, 드라이 필름 및 프린트 배선판 | |
| WO2011010457A1 (ja) | 光硬化性樹脂組成物 | |
| JP5355845B2 (ja) | 光硬化性樹脂組成物、及びその硬化物。 | |
| JP5660690B2 (ja) | 感光性樹脂組成物及びその硬化物 | |
| JP5113298B2 (ja) | 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線板 | |
| JP4814134B2 (ja) | 硬化性組成物及びその硬化物 | |
| JP4933093B2 (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
| JP4167599B2 (ja) | 硬化性樹脂及びそれを含有する硬化性樹脂組成物 | |
| KR101161901B1 (ko) | 광 경화성ㆍ열 경화성 수지 조성물 및 그의 경화물 | |
| JP4814135B2 (ja) | 硬化性組成物及びその硬化物 | |
| JP4965940B2 (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
| JP2007256742A (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
| JP2004295026A (ja) | 硬化性樹脂組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: TAIYO INK (SUZHOU) Co.,Ltd. Assignor: TAIYO INK MFG. Co.,Ltd. Contract record no.: 2010990000679 Denomination of invention: Active energy line cured resin, optical solidified and thermosetting resin composition containing said resin and its condensate Granted publication date: 20091216 License type: Common License Open date: 20070620 Record date: 20100830 |
|
| C56 | Change in the name or address of the patentee |
Owner name: TAIYO HOLDINGS CO., LTD. Free format text: FORMER NAME: TAIYO INK MANUFACTURING CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: TAIYO HOLDINGS Co.,Ltd. Address before: Tokyo, Japan Patentee before: TAIYO INK MFG. Co.,Ltd. |
|
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: TAIYO INK (SUZHOU) Co.,Ltd. Assignor: TAIYO INK MFG. Co.,Ltd. Contract record no.: 2010990000679 Date of cancellation: 20110302 |
|
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: TAIYO INK (SUZHOU) Co.,Ltd. Assignor: TAIYO HOLDINGS Co.,Ltd. Contract record no.: 2011990000116 Denomination of invention: Active energy line cured resin, optical solidified and thermosetting resin composition containing said resin and its condensate Granted publication date: 20091216 License type: Common License Open date: 20070620 Record date: 20110302 |
|
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: TAIYO INK (SUZHOU) Co.,Ltd. Assignor: TAIYO HOLDINGS Co.,Ltd. Contract record no.: 2011990000116 Date of cancellation: 20250512 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20070620 Assignee: TAIYO INK (SUZHOU) Co.,Ltd. Assignor: TAIYO HOLDINGS Co.,Ltd. Contract record no.: X2025990000228 Denomination of invention: Active energy line cured resin, optical solidified and thermosetting resin composition containing said resin and its condensate Granted publication date: 20091216 License type: Common License Record date: 20250609 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091216 |