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TWI348231B - Optoelectronic device package and packaging method thereof - Google Patents

Optoelectronic device package and packaging method thereof

Info

Publication number
TWI348231B
TWI348231B TW096131449A TW96131449A TWI348231B TW I348231 B TWI348231 B TW I348231B TW 096131449 A TW096131449 A TW 096131449A TW 96131449 A TW96131449 A TW 96131449A TW I348231 B TWI348231 B TW I348231B
Authority
TW
Taiwan
Prior art keywords
device package
optoelectronic device
packaging method
packaging
optoelectronic
Prior art date
Application number
TW096131449A
Other languages
English (en)
Other versions
TW200830588A (en
Inventor
Jui Ping Weng
Hsiao Wen Lee
Original Assignee
Visera Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Visera Technologies Co Ltd filed Critical Visera Technologies Co Ltd
Publication of TW200830588A publication Critical patent/TW200830588A/zh
Application granted granted Critical
Publication of TWI348231B publication Critical patent/TWI348231B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Photovoltaic Devices (AREA)
  • Electroluminescent Light Sources (AREA)
TW096131449A 2007-01-11 2007-08-24 Optoelectronic device package and packaging method thereof TWI348231B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/652,060 US20080169480A1 (en) 2007-01-11 2007-01-11 Optoelectronic device package and packaging method thereof

Publications (2)

Publication Number Publication Date
TW200830588A TW200830588A (en) 2008-07-16
TWI348231B true TWI348231B (en) 2011-09-01

Family

ID=39617082

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096131449A TWI348231B (en) 2007-01-11 2007-08-24 Optoelectronic device package and packaging method thereof

Country Status (3)

Country Link
US (1) US20080169480A1 (zh)
CN (1) CN101222010B (zh)
TW (1) TWI348231B (zh)

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US8220971B2 (en) * 2008-11-21 2012-07-17 Xicato, Inc. Light emitting diode module with three part color matching
TWI481069B (zh) * 2008-11-27 2015-04-11 隆達電子股份有限公司 光學薄膜
DE102008063634B4 (de) * 2008-12-18 2021-03-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtmittel und Projektor mit mindestens einem solchen Leuchtmittel
DE102008064948B4 (de) 2008-12-18 2024-08-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtmittel und Projektor mit mindestens einem solchen Leuchtmittel
TWI389295B (zh) 2009-02-18 2013-03-11 奇力光電科技股份有限公司 發光二極體光源模組
KR100998017B1 (ko) * 2009-02-23 2010-12-03 삼성엘이디 주식회사 발광소자 패키지용 렌즈 및 이를 구비하는 발광소자 패키지
US20100244064A1 (en) * 2009-03-27 2010-09-30 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light source
JP2011040494A (ja) * 2009-08-07 2011-02-24 Koito Mfg Co Ltd 発光モジュール
JP2011040495A (ja) * 2009-08-07 2011-02-24 Koito Mfg Co Ltd 発光モジュール
KR101118533B1 (ko) 2009-09-28 2012-03-12 서울대학교산학협력단 발광장치에 사용되는 복합필름, 발광장치 및 그 제조방법
US20110309393A1 (en) * 2010-06-21 2011-12-22 Micron Technology, Inc. Packaged leds with phosphor films, and associated systems and methods
US8901586B2 (en) * 2010-07-12 2014-12-02 Samsung Electronics Co., Ltd. Light emitting device and method of manufacturing the same
CN101964384A (zh) * 2010-08-19 2011-02-02 深圳市佳比泰电子科技有限公司 一种led荧光粉的涂覆方法
US20120051045A1 (en) 2010-08-27 2012-03-01 Xicato, Inc. Led Based Illumination Module Color Matched To An Arbitrary Light Source
US8198109B2 (en) * 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
US8937324B2 (en) * 2010-08-30 2015-01-20 Bridgelux, Inc. Light-emitting device array with individual cells
US9373606B2 (en) 2010-08-30 2016-06-21 Bridgelux, Inc. Light-emitting device array with individual cells
CN102403435A (zh) * 2010-09-07 2012-04-04 富士迈半导体精密工业（上海）有限公司 发光二极管
KR20120050282A (ko) 2010-11-10 2012-05-18 삼성엘이디 주식회사 발광 소자 패키지 및 그 제조 방법
US20120113621A1 (en) * 2010-11-10 2012-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. Batwing beam based led and backlight module using the same
CN102623607A (zh) * 2011-01-28 2012-08-01 联胜（中国）科技有限公司 发光模块
DE102011102350A1 (de) 2011-05-24 2012-11-29 Osram Opto Semiconductors Gmbh Optisches Element, optoelektronisches Bauelement und Verfahren zur Herstellung dieser
CN103050603B (zh) * 2011-10-17 2016-03-23 展晶科技(深圳)有限公司 Led封装结构的制作方法
DE102012208730A1 (de) 2012-05-24 2013-11-28 Osram Opto Semiconductors Gmbh Optoelektronische Bauelementevorrichtung und Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung
CN103715363A (zh) * 2012-10-08 2014-04-09 东莞万士达液晶显示器有限公司 有机发光二极管封装结构以及于基板上制作凹穴的方法
CN103199199B (zh) * 2013-03-05 2016-06-01 京东方科技集团股份有限公司 一种oled器件封装薄膜、制备方法以及oled器件、封装方法
CN103474423A (zh) * 2013-03-28 2013-12-25 深圳信息职业技术学院 高光效led集成光源及led灯
CN104103774A (zh) * 2013-04-10 2014-10-15 江苏稳润光电有限公司 一种柔性微透镜阵列与oled阵列的集成方法及其产品
CN103426379B (zh) * 2013-09-05 2016-04-06 张金枝 一种高像素密度led显示屏面板及其制作方法
TW201624776A (zh) * 2014-12-18 2016-07-01 Edison Opto Corp Led照明模組
CN105185775B (zh) * 2015-10-14 2018-04-03 淮安吉山光电科技有限公司 一种cob光源出光结构及其应用
DE102017117165B4 (de) * 2017-07-28 2023-04-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils
CN112563382A (zh) * 2019-09-25 2021-03-26 昆山科技大学 白光发光二极管结构及其制造方法
US12173858B2 (en) * 2022-07-21 2024-12-24 Hangzhou Hpwinner Opto Corporation Light emitting diode assembly and plant lighting fixture
TWI866712B (zh) * 2023-12-21 2024-12-11 矽品精密工業股份有限公司 散熱結構及其電子封裝件

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US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
KR20040092512A (ko) * 2003-04-24 2004-11-04 (주)그래픽테크노재팬 방열 기능을 갖는 반사판이 구비된 반도체 발광장치
US7462983B2 (en) * 2003-06-27 2008-12-09 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. White light emitting device
US7279724B2 (en) * 2004-02-25 2007-10-09 Philips Lumileds Lighting Company, Llc Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
KR100576866B1 (ko) * 2004-06-16 2006-05-10 삼성전기주식회사 발광다이오드 및 그 제조방법
JP4747726B2 (ja) * 2004-09-09 2011-08-17 豊田合成株式会社 発光装置
JP2006086176A (ja) * 2004-09-14 2006-03-30 Hitachi Kyowa Engineering Co Ltd Ｌｅｄ用サブマウント及びその製造方法
US7745832B2 (en) * 2004-09-24 2010-06-29 Epistar Corporation Semiconductor light-emitting element assembly with a composite substrate
KR100593935B1 (ko) * 2005-03-24 2006-06-30 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법
US20070126020A1 (en) * 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
JP5073946B2 (ja) * 2005-12-27 2012-11-14 新光電気工業株式会社 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
TW200830588A (en) 2008-07-16
CN101222010A (zh) 2008-07-16
CN101222010B (zh) 2010-06-09
US20080169480A1 (en) 2008-07-17

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees