TWI265193B - Abrasive for chemical mechanical polishing and method for producing the same - Google Patents
Abrasive for chemical mechanical polishing and method for producing the sameInfo
- Publication number
- TWI265193B TWI265193B TW093130784A TW93130784A TWI265193B TW I265193 B TWI265193 B TW I265193B TW 093130784 A TW093130784 A TW 093130784A TW 93130784 A TW93130784 A TW 93130784A TW I265193 B TWI265193 B TW I265193B
- Authority
- TW
- Taiwan
- Prior art keywords
- shell
- abrasive
- mechanical polishing
- chemical mechanical
- suspension
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- 239000000126 substance Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 239000000725 suspension Substances 0.000 abstract 5
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 abstract 4
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 abstract 4
- 239000002245 particle Substances 0.000 abstract 4
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000003756 stirring Methods 0.000 abstract 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 1
- HSJPMRKMPBAUAU-UHFFFAOYSA-N cerium(3+);trinitrate Chemical compound [Ce+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O HSJPMRKMPBAUAU-UHFFFAOYSA-N 0.000 abstract 1
- 239000008119 colloidal silica Substances 0.000 abstract 1
- 239000007771 core particle Substances 0.000 abstract 1
- 239000010420 shell particle Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000002002 slurry Substances 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
- C09K3/1445—Composite particles, e.g. coated particles the coating consisting exclusively of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030070684A KR100574225B1 (ko) | 2003-10-10 | 2003-10-10 | 실리카에 세리아/실리카가 코팅된 화학적 기계적 연마용연마재 및 그 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200521215A TW200521215A (en) | 2005-07-01 |
| TWI265193B true TWI265193B (en) | 2006-11-01 |
Family
ID=34431688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093130784A TWI265193B (en) | 2003-10-10 | 2004-10-11 | Abrasive for chemical mechanical polishing and method for producing the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100574225B1 (fr) |
| TW (1) | TWI265193B (fr) |
| WO (1) | WO2005035688A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011100935A1 (de) | 2010-06-18 | 2011-12-22 | Everlight Usa, Inc. | Blaue, rote und gelbe Farbstoffverbindungen sowie schwarze Tintenzusammensetzung, die sie enthält |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100614218B1 (ko) * | 2004-06-21 | 2006-08-21 | 고려대학교 산학협력단 | Ｒｆ 플라즈마를 이용하여 이산화규소 나노 입자상에 이산화세륨을 박막증착시키는 방법 및 이로부터 제조된 연마입자 |
| KR101279970B1 (ko) * | 2008-12-31 | 2013-07-05 | 제일모직주식회사 | 금속 배선 연마용 ｃｍｐ 슬러리 조성물 |
| US20120077419A1 (en) * | 2009-06-05 | 2012-03-29 | Basf Se | Raspberry-type metal oxide nanostructures coated with ceo2 nanoparticles for chemical mechanical planarization (cmp) |
| WO2012032466A1 (fr) | 2010-09-08 | 2012-03-15 | Basf Se | Compositions de polissage aqueuses contenant des dioxydes de diazénium n-substitués et/ou des sels d'oxyde de n'-hydroxy-diazénium |
| JP6196155B2 (ja) | 2010-09-08 | 2017-09-13 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 水性研磨剤組成物、並びに電気、機械及び光学デバイス用の基板材料を研磨する方法 |
| SG10201606566SA (en) | 2010-09-08 | 2016-09-29 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films |
| WO2012077063A1 (fr) | 2010-12-10 | 2012-06-14 | Basf Se | Composition de polissage aqueuse et procédé de polissage mécano-chimique de substrats contenant un diélectrique en oxyde de silicium et des films en polysilicium |
| CN102653633B (zh) * | 2011-03-03 | 2013-12-11 | 台湾永光化学工业股份有限公司 | 蓝色、红色及黄色染料化合物及所组成的黑色墨水组合物 |
| CN103814102B (zh) * | 2011-09-20 | 2017-12-05 | 堺化学工业株式会社 | 玻璃研磨用复合颗粒 |
| JP6191608B2 (ja) * | 2012-09-05 | 2017-09-06 | コニカミノルタ株式会社 | 研磨材粒子の製造方法 |
| US20150252237A1 (en) * | 2012-09-19 | 2015-09-10 | Konica Minolta, Inc. | Method for Producing Polishing Material Particles |
| JP2016055351A (ja) * | 2013-02-05 | 2016-04-21 | コニカミノルタ株式会社 | 研磨材スラリー |
| JP2016055352A (ja) * | 2013-02-05 | 2016-04-21 | コニカミノルタ株式会社 | 研磨材スラリー |
| US20150353795A1 (en) * | 2013-02-05 | 2015-12-10 | Konica Minolta, Inc. | Core/Shell-Type Inorganic Particles |
| JP2016056215A (ja) * | 2013-02-05 | 2016-04-21 | コニカミノルタ株式会社 | 研磨材の製造方法 |
| EP2826827B1 (fr) | 2013-07-18 | 2019-06-12 | Basf Se | Composition CMP comprenant des particules abrasives à cérium |
| WO2016069244A1 (fr) * | 2014-10-30 | 2016-05-06 | Applied Materials, Inc. | Nanoparticule à base de boues d'oxyde de cérium |
| JP6510812B2 (ja) * | 2014-12-26 | 2019-05-08 | 花王株式会社 | 酸化珪素膜研磨用研磨粒子 |
| KR101983755B1 (ko) * | 2015-03-31 | 2019-05-29 | 니끼 쇼꾸바이 카세이 가부시키가이샤 | 실리카계 복합 미립자 분산액, 그의 제조 방법 및 실리카계 복합 미립자 분산액을 포함하는 연마용 슬러리 |
| KR102394895B1 (ko) * | 2016-04-22 | 2022-05-04 | 니끼 쇼꾸바이 카세이 가부시키가이샤 | 실리카계 복합 미립자 분산액 및 그 제조방법 |
| JP6648064B2 (ja) * | 2016-04-22 | 2020-02-14 | 日揮触媒化成株式会社 | シリカ系複合微粒子分散液、その製造方法及びシリカ系複合微粒子分散液を含む研磨用砥粒分散液 |
| JP6588050B2 (ja) * | 2016-04-22 | 2019-10-09 | 日揮触媒化成株式会社 | シリカ系複合微粒子を含む研磨用砥粒分散液 |
| JP6829007B2 (ja) * | 2016-05-18 | 2021-02-10 | 日揮触媒化成株式会社 | シリカ系複合微粒子分散液、その製造方法及びシリカ系複合微粒子分散液を含む研磨用スラリー |
| CN109937187B (zh) * | 2016-11-14 | 2022-08-09 | 日挥触媒化成株式会社 | 氧化铈系复合微粒分散液、其制造方法和包含氧化铈系复合微粒分散液的研磨用磨粒分散液 |
| JP6797665B2 (ja) * | 2016-12-20 | 2020-12-09 | 花王株式会社 | 研磨液組成物 |
| CN106675519A (zh) * | 2016-12-21 | 2017-05-17 | 安徽中创电子信息材料有限公司 | 一种无机复合磨料及其制备方法 |
| US10319601B2 (en) | 2017-03-23 | 2019-06-11 | Applied Materials, Inc. | Slurry for polishing of integrated circuit packaging |
| US20190127607A1 (en) | 2017-10-27 | 2019-05-02 | Versum Materials Us, Llc | Composite Particles, Method of Refining and Use Thereof |
| JP7015200B2 (ja) * | 2018-03-29 | 2022-02-02 | 日揮触媒化成株式会社 | セリア系複合微粒子分散液、その製造方法及びセリア系複合微粒子分散液を含む研磨用砥粒分散液 |
| JP2018168063A (ja) * | 2018-07-12 | 2018-11-01 | 日揮触媒化成株式会社 | シリカ系複合粒子分散液の製造方法 |
| US11549034B2 (en) | 2018-08-09 | 2023-01-10 | Versum Materials Us, Llc | Oxide chemical mechanical planarization (CMP) polishing compositions |
| US12359091B2 (en) | 2019-11-26 | 2025-07-15 | Rhodia Operations | Liquid dispersion and powder of cerium based core-shell particles, process for producing the same and uses thereof in polishing |
| CN114591687A (zh) * | 2022-03-18 | 2022-06-07 | 深圳市瑞来稀土材料有限公司 | 一种用于半导体晶圆抛光处理的稀土抛光粉及其制备方法 |
| CN115926746B (zh) * | 2022-10-24 | 2024-06-07 | 国家纳米科学中心 | 纳米铈硅复合氧化物颗粒及其制备方法和用途 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0280309A (ja) * | 1988-09-14 | 1990-03-20 | Toshiba Ceramics Co Ltd | α型窒化けい素粉末の製造方法 |
| US5855841A (en) * | 1991-12-23 | 1999-01-05 | Commonwealth Scientific And Industrial Research Organisation | Process for producing dense ceramic product |
| BR9307095A (pt) * | 1992-09-25 | 1999-03-30 | Minnesota Mining & Mfg | Processo para preparar grãos de abrasivo |
| EP0728123B1 (fr) * | 1993-11-12 | 1999-03-31 | Minnesota Mining And Manufacturing Company | Grain abrasif et son procede de fabrication |
| US6645265B1 (en) * | 2002-07-19 | 2003-11-11 | Saint-Gobain Ceramics And Plastics, Inc. | Polishing formulations for SiO2-based substrates |
-
2003
- 2003-10-10 KR KR1020030070684A patent/KR100574225B1/ko not_active Expired - Fee Related
-
2004
- 2004-10-09 WO PCT/KR2004/002584 patent/WO2005035688A1/fr not_active Ceased
- 2004-10-11 TW TW093130784A patent/TWI265193B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011100935A1 (de) | 2010-06-18 | 2011-12-22 | Everlight Usa, Inc. | Blaue, rote und gelbe Farbstoffverbindungen sowie schwarze Tintenzusammensetzung, die sie enthält |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200521215A (en) | 2005-07-01 |
| KR20050034913A (ko) | 2005-04-15 |
| WO2005035688A1 (fr) | 2005-04-21 |
| KR100574225B1 (ko) | 2006-04-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |