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TWD125599S1 - Heater for semiconductor manufacturing - Google Patents

Heater for semiconductor manufacturing

Info

Publication number
TWD125599S1
TWD125599S1 TW096301456F TW96301456F TWD125599S1 TW D125599 S1 TWD125599 S1 TW D125599S1 TW 096301456 F TW096301456 F TW 096301456F TW 96301456 F TW96301456 F TW 96301456F TW D125599 S1 TWD125599 S1 TW D125599S1
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
heater
disc
creation
article
Prior art date
Application number
TW096301456F
Other languages
Chinese (zh)
Inventor
小松智仁
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD125599S1 publication Critical patent/TWD125599S1/en

Links

Abstract

【物品用途】;本創作的物品是一種半導體製造用加熱器,配置在半;導體製造用處理室來使用的加熱器。;【創作特點】;如各圖所示,本體為石英製的透明圓盤體,如前、後;視圖所示,在圓盤體的最外周有一圈波浪狀的加熱構;件,且於波浪狀的內側環繞一圈形成一正圓形,並由此;向內以回繞的方式佈滿整個圓盤體,詳細的斷面構成則;如A-A剖面圖所示;綜上所述,確為一深具科技美感;之設計。;[Purpose of the article] The article of this creation is a heater for semiconductor manufacturing, which is used in a processing room for semiconductor manufacturing. [Features of the creation] As shown in the figures, the main body is a transparent disc made of quartz. As shown in the front and rear views, there is a circle of wavy heating components on the outermost periphery of the disc, and it surrounds the inner side of the wavy shape to form a perfect circle, and from there, it is arranged inward in a winding manner to cover the entire disc. The detailed cross-sectional structure is shown in the A-A cross-sectional view. In summary, it is indeed a design with a deep sense of technological beauty.

TW096301456F 2006-09-28 2007-03-14 Heater for semiconductor manufacturing TWD125599S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006026093 2006-09-28

Publications (1)

Publication Number Publication Date
TWD125599S1 true TWD125599S1 (en) 2008-10-21

Family

ID=41128820

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096301456F TWD125599S1 (en) 2006-09-28 2007-03-14 Heater for semiconductor manufacturing

Country Status (2)

Country Link
US (1) USD601521S1 (en)
TW (1) TWD125599S1 (en)

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US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
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US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD705745S1 (en) * 2013-07-08 2014-05-27 Witricity Corporation Printed resonator coil
USD722048S1 (en) 2013-07-08 2015-02-03 Witricity Corporation Printed resonator coil
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core
CA2938308C (en) 2014-01-30 2020-12-22 Jason Stephen Honeyball Watershed protection device and system
USD768843S1 (en) * 2014-11-28 2016-10-11 Draingarde Inc. Catch basin cover
USD786811S1 (en) * 2015-09-15 2017-05-16 Shenzhen coleder opto-electronics co, ltd LED electronic display
DE102015119763A1 (en) * 2015-11-16 2017-05-18 Heraeus Quarzglas Gmbh & Co. Kg infrared Heaters
JP1560719S (en) * 2015-12-01 2016-10-11
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
JP1581406S (en) * 2016-10-14 2017-07-18
JP1651618S (en) * 2019-07-11 2020-01-27
JP1651619S (en) * 2019-07-11 2020-01-27
JP1651623S (en) * 2019-07-18 2020-01-27
USD936187S1 (en) * 2020-02-12 2021-11-16 Applied Materials, Inc. Gas distribution assembly lid
JP1684469S (en) * 2020-09-24 2021-05-10 Ceiling heater for substrate processing equipment
USD1103948S1 (en) 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1071103S1 (en) 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1037778S1 (en) 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1085029S1 (en) 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate

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JP2007189093A (en) * 2006-01-13 2007-07-26 Disco Abrasive Syst Ltd Semiconductor wafer

Also Published As

Publication number Publication date
USD601521S1 (en) 2009-10-06

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