TWD148142S - Multiple configuration light emitting device package - Google Patents
Multiple configuration light emitting device packageInfo
- Publication number
- TWD148142S TWD148142S TW100303945F TW100303945F TWD148142S TW D148142 S TWD148142 S TW D148142S TW 100303945 F TW100303945 F TW 100303945F TW 100303945 F TW100303945 F TW 100303945F TW D148142 S TWD148142 S TW D148142S
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting diodes
- package
- creation
- mounting surface
- Prior art date
Links
Abstract
【物品用途】;本創作係關於一種表面黏著元件封裝,用於提供多型態發光元件,例如發光二極體,之封裝。;【創作特點】;本創作係關於一種封裝,用於容納多個發光二極體。該封裝可包括一安裝表面,在該表面上,可黏著一或多個發光二極體,且該安裝表面包括一或多個電及/或熱絕緣部分。在封裝內之發光二極體可選擇性地配置以適合在較高電壓或變動電壓之應用。多個配置之發光二極體可配置在該一或多個安裝表面絕緣部分之上。該配置可包含一或多個以串聯、並聯或混合方式聯接之發光二極體。;本創作係關於一種新穎且獨特的外觀設計,其不僅可達成預期的功能,且亦提供一從未見於任何先前技藝中並具有賞心悅目之視覺效果的獨特外觀。[Article Use]; This creation is related to a surface mount component package for providing a package for multiple types of light-emitting components, such as light-emitting diodes. ; [Creation Features]; This creation is related to a package for accommodating multiple light-emitting diodes. The package may include a mounting surface on which one or more light-emitting diodes can be adhered, and the mounting surface includes one or more electrical and/or thermal insulation parts. The light-emitting diodes in the package can be selectively configured to be suitable for applications with higher voltages or variable voltages. Multiple configurations of light-emitting diodes can be configured on the one or more mounting surface insulation parts. The configuration may include one or more light-emitting diodes connected in series, parallel, or a mixed manner. ;This creation is about a novel and unique appearance design, which not only achieves the expected functions, but also provides a unique appearance that has never been seen in any previous technology and has a pleasing visual effect.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/384,476 USD650343S1 (en) | 2011-01-31 | 2011-01-31 | Multiple configuration light emitting device package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD148142S true TWD148142S (en) | 2012-07-11 |
Family
ID=45093043
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100303945F TWD148142S (en) | 2011-01-31 | 2011-07-29 | Multiple configuration light emitting device package |
| TW100303944F TWD148141S (en) | 2011-01-31 | 2011-07-29 | Multiple configuration light emitting device package |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100303944F TWD148141S (en) | 2011-01-31 | 2011-07-29 | Multiple configuration light emitting device package |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD650343S1 (en) |
| TW (2) | TWD148142S (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9627361B2 (en) | 2010-10-07 | 2017-04-18 | Cree, Inc. | Multiple configuration light emitting devices and methods |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD591697S1 (en) * | 2006-08-09 | 2009-05-05 | Cree, Inc. | Lamp package |
| US9666762B2 (en) | 2007-10-31 | 2017-05-30 | Cree, Inc. | Multi-chip light emitter packages and related methods |
| US9172012B2 (en) | 2007-10-31 | 2015-10-27 | Cree, Inc. | Multi-chip light emitter packages and related methods |
| US9082921B2 (en) | 2007-10-31 | 2015-07-14 | Cree, Inc. | Multi-die LED package |
| USD680504S1 (en) * | 2010-07-30 | 2013-04-23 | Nichia Corporation | Light emitting diode |
| USD660257S1 (en) * | 2011-01-31 | 2012-05-22 | Cree, Inc. | Emitter package |
| USD658139S1 (en) * | 2011-01-31 | 2012-04-24 | Cree, Inc. | High-density emitter package |
| USD673126S1 (en) * | 2011-07-08 | 2012-12-25 | Cree, Inc. | LED chip |
| USD691973S1 (en) * | 2011-07-08 | 2013-10-22 | Cree, Inc. | Lamp packages |
| USD674757S1 (en) * | 2011-10-31 | 2013-01-22 | Silitek Electronics (Guangzhou) Co., Ltd. | Package carrier of light emitting diode |
| USD674758S1 (en) * | 2011-10-31 | 2013-01-22 | Silitek Electronic (Guangzhou) Co., Ltd. | Light emitting diode |
| US10043960B2 (en) * | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
| USD675169S1 (en) * | 2011-12-13 | 2013-01-29 | Lextar Electronics Corp. | Multi-chip LED |
| USD674358S1 (en) * | 2012-03-30 | 2013-01-15 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD674357S1 (en) * | 2012-03-30 | 2013-01-15 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD674360S1 (en) * | 2012-03-30 | 2013-01-15 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD674359S1 (en) * | 2012-03-30 | 2013-01-15 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD674363S1 (en) * | 2012-03-30 | 2013-01-15 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD674362S1 (en) * | 2012-03-30 | 2013-01-15 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD703624S1 (en) * | 2012-04-06 | 2014-04-29 | Cree, Inc. | LED-array package |
| USD712849S1 (en) | 2012-05-14 | 2014-09-09 | Cree, Inc. | Light emitting diode (LED) package with multiple anodes and cathodes |
| USD713804S1 (en) | 2012-05-14 | 2014-09-23 | Cree, Inc. | Light emitting diode (LED) package with multiple anodes and cathodes |
| US9515055B2 (en) | 2012-05-14 | 2016-12-06 | Cree, Inc. | Light emitting devices including multiple anodes and cathodes |
| USD698741S1 (en) * | 2012-05-29 | 2014-02-04 | Kabushiki Kaisha Toshiba | Light-emitting diode |
| USD693317S1 (en) * | 2012-05-29 | 2013-11-12 | Kabushiki Kaisha Toshiba | Light-emitting diode |
| US9349929B2 (en) | 2012-05-31 | 2016-05-24 | Cree, Inc. | Light emitter packages, systems, and methods |
| USD749051S1 (en) * | 2012-05-31 | 2016-02-09 | Cree, Inc. | Light emitting diode (LED) package |
| US10439112B2 (en) | 2012-05-31 | 2019-10-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
| USD709464S1 (en) * | 2012-05-31 | 2014-07-22 | Cree, Inc. | Light emitting diode (LED) package |
| USD703348S1 (en) | 2012-07-09 | 2014-04-22 | Cree, Inc. | Lamp package |
| USD711841S1 (en) * | 2012-08-23 | 2014-08-26 | Cree, Inc. | Light emitting diode (LED) package |
| USD753612S1 (en) * | 2012-09-07 | 2016-04-12 | Cree, Inc. | Light emitter device |
| USD735683S1 (en) * | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
| USD718725S1 (en) * | 2013-08-01 | 2014-12-02 | Cree, Inc. | LED package with encapsulant |
| USD758976S1 (en) * | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
| USD746240S1 (en) * | 2013-12-30 | 2015-12-29 | Cree, Inc. | LED package |
| USD741821S1 (en) * | 2014-04-10 | 2015-10-27 | Kingbright Electronics Co., Ltd. | LED component |
| USD790486S1 (en) * | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
| USD826871S1 (en) * | 2014-12-11 | 2018-08-28 | Cree, Inc. | Light emitting diode device |
| USD777122S1 (en) * | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
| USD772181S1 (en) * | 2015-04-02 | 2016-11-22 | Genesis Photonics Inc. | Light emitting diode package substrate |
| USD778848S1 (en) * | 2015-04-07 | 2017-02-14 | Cree, Inc. | Solid state light emitter component |
| USD783547S1 (en) * | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
| JP1618491S (en) * | 2017-11-21 | 2018-11-19 | ||
| JP1628923S (en) * | 2018-04-26 | 2019-04-08 | ||
| USD926714S1 (en) * | 2019-10-30 | 2021-08-03 | Creeled, Inc. | Light emitting diode package |
| USD996377S1 (en) * | 2022-02-17 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
| USD996378S1 (en) | 2022-03-09 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
| US12355013B2 (en) | 2022-04-21 | 2025-07-08 | Creeled, Inc. | Emission height arrangements in light-emitting diode packages and related devices and methods |
| USD1102268S1 (en) * | 2024-06-12 | 2025-11-18 | Creeled, Inc. | Light-emitting diode package |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9070850B2 (en) * | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US8866169B2 (en) * | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
| US7893445B2 (en) * | 2009-11-09 | 2011-02-22 | Cree, Inc. | Solid state emitter package including red and blue emitters |
| KR101619832B1 (en) * | 2009-11-30 | 2016-05-13 | 삼성전자주식회사 | Light emitting diode package, light emitting diode package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof |
| US20110062482A1 (en) * | 2010-01-20 | 2011-03-17 | Bridgelux, Inc. | Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces |
| USD631020S1 (en) * | 2010-04-29 | 2011-01-18 | Edison Opto Corporation | LED package |
| USD637565S1 (en) * | 2010-11-02 | 2011-05-10 | Silitek Electronic (Guangzhou) Co., Ltd. | Light emitting diode |
-
2011
- 2011-01-31 US US29/384,476 patent/USD650343S1/en not_active Expired - Lifetime
- 2011-07-29 TW TW100303945F patent/TWD148142S/en unknown
- 2011-07-29 TW TW100303944F patent/TWD148141S/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9627361B2 (en) | 2010-10-07 | 2017-04-18 | Cree, Inc. | Multiple configuration light emitting devices and methods |
Also Published As
| Publication number | Publication date |
|---|---|
| USD650343S1 (en) | 2011-12-13 |
| TWD148141S (en) | 2012-07-11 |
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