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USD674357S1 - LED package - Google Patents

LED package Download PDF

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Publication number
USD674357S1
USD674357S1 US29/417,100 US201229417100F USD674357S US D674357 S1 USD674357 S1 US D674357S1 US 201229417100 F US201229417100 F US 201229417100F US D674357 S USD674357 S US D674357S
Authority
US
United States
Prior art keywords
led package
view
perspective
led
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/417,100
Inventor
Chen-Hsiu Lin
Yi-Chien Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Technology Corp
Original Assignee
Silitek Electronic Guangzhou Co Ltd
Lite On Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silitek Electronic Guangzhou Co Ltd, Lite On Technology Corp filed Critical Silitek Electronic Guangzhou Co Ltd
Priority to US29/417,100 priority Critical patent/USD674357S1/en
Assigned to LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. reassignment LITE-ON TECHNOLOGY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, YI-CHIEN, LIN, CHEN-HSIU
Application granted granted Critical
Publication of USD674357S1 publication Critical patent/USD674357S1/en
Assigned to LITE-ON ELECTRONICS (GUANGZHOU) LIMITED reassignment LITE-ON ELECTRONICS (GUANGZHOU) LIMITED CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a “LED package” showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a perspective view viewed from another visual angle thereof; and,
FIG. 9 is a perspective view with a LED chip showing the practical usage thereof.
The dashed lines in the drawings are for illustrative purpose only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a “LED package,” as shown and described.
US29/417,100 2012-03-30 2012-03-30 LED package Active USD674357S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/417,100 USD674357S1 (en) 2012-03-30 2012-03-30 LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/417,100 USD674357S1 (en) 2012-03-30 2012-03-30 LED package

Publications (1)

Publication Number Publication Date
USD674357S1 true USD674357S1 (en) 2013-01-15

Family

ID=47471219

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/417,100 Active USD674357S1 (en) 2012-03-30 2012-03-30 LED package

Country Status (1)

Country Link
US (1) USD674357S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD1051444S1 (en) * 2024-08-14 2024-11-12 Xingcheng Wu Light fixture

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
US20100117099A1 (en) * 2008-11-07 2010-05-13 Jacob Chi Wing Leung Multi-chip light emitting diode modules
US20100123144A1 (en) * 2008-11-20 2010-05-20 Everlight Electronics Co., Ltd. Circuit structure of package carrier and multi-chip package
USD624032S1 (en) * 2009-10-16 2010-09-21 Kabushiki Kaisha Toshiba Light-emitting diode
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
USD637565S1 (en) * 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD644190S1 (en) * 2010-09-29 2011-08-30 Kabushiki Kaisha Toshiba Light-emitting diode
USD644191S1 (en) * 2010-09-29 2011-08-30 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
US20110210346A1 (en) * 2010-02-26 2011-09-01 Silitek Electronic (Guangzhou) Co., Ltd. Led module
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
US20110227105A1 (en) * 2010-03-17 2011-09-22 Jon-Fwu Hwu Multi-Layer LED Array Engine
USD646643S1 (en) * 2010-11-02 2011-10-11 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
US20110248289A1 (en) * 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
US8044424B2 (en) * 2005-06-30 2011-10-25 Panasonic Electric Works Co., Ltd. Light-emitting device
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
US20120068198A1 (en) * 2010-09-20 2012-03-22 Cree, Inc. High density multi-chip led devices
US20120074443A1 (en) * 2010-09-29 2012-03-29 Forward Electronics Co., Ltd. LED package structure
US20120086024A1 (en) * 2010-10-07 2012-04-12 Andrews Peter S Multiple configuration light emitting devices and methods
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
US20120193651A1 (en) * 2010-11-22 2012-08-02 Edmond John A Light emitting devices, systems, and methods
US20120193659A1 (en) * 2011-01-31 2012-08-02 Cree, Inc. Structures and substrates for mounting optical elements and methods and devices for providing the same background

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8044424B2 (en) * 2005-06-30 2011-10-25 Panasonic Electric Works Co., Ltd. Light-emitting device
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
US20100117099A1 (en) * 2008-11-07 2010-05-13 Jacob Chi Wing Leung Multi-chip light emitting diode modules
US20100123144A1 (en) * 2008-11-20 2010-05-20 Everlight Electronics Co., Ltd. Circuit structure of package carrier and multi-chip package
USD624032S1 (en) * 2009-10-16 2010-09-21 Kabushiki Kaisha Toshiba Light-emitting diode
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US20110210346A1 (en) * 2010-02-26 2011-09-01 Silitek Electronic (Guangzhou) Co., Ltd. Led module
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
US20110227105A1 (en) * 2010-03-17 2011-09-22 Jon-Fwu Hwu Multi-Layer LED Array Engine
US20110248289A1 (en) * 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
US20120068198A1 (en) * 2010-09-20 2012-03-22 Cree, Inc. High density multi-chip led devices
USD644191S1 (en) * 2010-09-29 2011-08-30 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
USD644190S1 (en) * 2010-09-29 2011-08-30 Kabushiki Kaisha Toshiba Light-emitting diode
US20120074443A1 (en) * 2010-09-29 2012-03-29 Forward Electronics Co., Ltd. LED package structure
US20120086024A1 (en) * 2010-10-07 2012-04-12 Andrews Peter S Multiple configuration light emitting devices and methods
USD637565S1 (en) * 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD646643S1 (en) * 2010-11-02 2011-10-11 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
US20120193651A1 (en) * 2010-11-22 2012-08-02 Edmond John A Light emitting devices, systems, and methods
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
US20120193659A1 (en) * 2011-01-31 2012-08-02 Cree, Inc. Structures and substrates for mounting optical elements and methods and devices for providing the same background

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD920933S1 (en) 2019-11-04 2021-06-01 Putco, Inc. Surface-mount device
USD1051444S1 (en) * 2024-08-14 2024-11-12 Xingcheng Wu Light fixture

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