TW580578B - System and method for testing integrated circuit devices - Google Patents
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- TW580578B TW580578B TW89121386A TW89121386A TW580578B TW 580578 B TW580578 B TW 580578B TW 89121386 A TW89121386 A TW 89121386A TW 89121386 A TW89121386 A TW 89121386A TW 580578 B TW580578 B TW 580578B
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/48—Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
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Abstract
Description
580578 五、發明說明(l) 明領域 本發明係關於積體電路元件的測試系統和方法。更具 體而言,本發明係關於一種系統和方法,容許積體電路元 件可在代表積體電路元件要使用的應用環境(例如個人電 腦或PC )之環境内測試。 發明背景 電路元 ’各積 類別之 用上使 記憶晶 別之規 測試和 各記憶 件操作 準和存 來證明 用途上 試,在 1或0 ) 更新故 方法不 統使用 殊指令 典型 測試的主 符合廠商 通常 例,為記 廠商所定 知測試, 在記憶晶 。參數測 、漏電流 習知 晶片是否 行的大多 例如記憶 的串音或 但習知測 憶晶片在 常pc操作 上,積體 體。例如 所定元件 在商業應 憶晶片。 該晶片類 諸如圖型 片内練習 試證明組 、電壓位 測試是用 在其所欲 數習知測 電池滯在 鏈結)和 试系統和 實際應系 中所見特 體電路元 規格。 用之前要 片不但要 袼,而且 參數測試 電池以證 參數,諸 取時間。 矣且件功能 容易失效 檢測例如 、敕體故 障等方面 易檢知行 時會發生 或存取順 售或使用之前’要嚴格 件要測試,以確定是否 經測試的積體電路元件 經測試以確定是否符合 還要典型上通過其他習 。記憶晶片圖型測試是 明其功能之有組織方法 如功率消耗、備用電流 ,以試圖透示受試測的 。雖然,也·说憶晶片進 固边1、> , ,對記憶晶片進 硬體故障( 參數故障、欢畑1 W , 障(例如在記憶電池棒 ,有不同程度的成f 為故障。行為故障丈580578 V. Description of the Invention (l) Field of the Invention The present invention relates to a test system and method for integrated circuit components. More specifically, the present invention relates to a system and method that allows integrated circuit components to be tested in an environment that represents the application environment in which the integrated circuit components are to be used, such as a personal computer or a PC. BACKGROUND OF THE INVENTION Circuit elements are used in various product categories to test the memory crystal type and the operation and storage of each memory element to prove the use of the test, at 1 or 0) update so the method does not uniformly use the main instruction typical test compliance Manufacturers usually use the memory test to record the known test of the manufacturer. Parameter measurement, leakage current It is common to know whether the chip works mostly, such as memory crosstalk, but it is known that the memory chip is integrated in normal PC operation. For example, the specified components are in commercial memory chips. The chip type such as the on-chip practice test certification group, the voltage level test is used in its desired number (the battery is stuck in the chain), and the test system and the actual application are the special circuit element specifications. Before using the film, it is not only necessary, but also the parameter test battery to verify the parameters and take time.矣 And the function of the component is easy to fail detection. For example, it is easy to detect when the car body is faulty, etc. It will occur during storage or access. Prior to the sale or use, it is necessary to test the components strictly to determine whether the tested integrated circuit components are tested to determine whether Conformity also typically passes other exercises. The memory chip pattern test is an organized method to demonstrate its functions, such as power consumption and standby current, in an attempt to show the test under test. Although it is also said that the memory chip enters the fixed edge 1, >, the memory chip enters the hardware failure (parameter failure, 1W, failure) (for example, in the memory battery rod, there is a different degree of f failure. Behavior Failure
^80578^ 80578
試 > 五、發明說明(2)Test > V. Description of Invention (2)
作 X 2二本二和方法很難檢知此種故障,因為採用的測 ^ ^ " 不5己憶晶片在其指定應用下的行為。事實上 通過餐♦/貝J碑的記憶晶片,從未在實際應用環境内操 積體$路兀件尤其是積體電路記憶元件的測試系統和 缺L ,為前案技術所公知。例如,美國專利第5,794, 175 ^揭,半,體元件之測試設備,可以並行測試大陣列的半 。體S己憶晶片。產生測試圖型,隨即寫入記憶晶片並讀出 從記憶晶片讀出的資料實際值,與預期值的比較,可以 疋記憶晶片是否故障。 , 美國專利第5, 95 9, 9 1 4號揭示一種裝置,含有控制器 型可轉移測試資料來往於記憶元件。控制器可產生資料圖 寫入記憶元件,並可從這些記憶元件回頭讀出資料。 、=些記憶元件回頭讀出的資料,再與寫入此等記憶元件 的資料比較,而關於二組資料間不符所示誤差的資訊, 可餘存或輸出。 美 迷度之 ’並寫 ’與原 何差異 指示。 » 國專利4, 965, 799號揭示DRAM晶片功能和最大操作 測試方法和裝置。在此方法中,產生資料位元圖型 入記憶元件之記憶電池内。儲存並隨後讀出的圖型 先產生的圖型比較,若閱讀圖型和產生圖型間有任 ,則可例如由一系列的發光二極體(LED)提供適當 美國專利4, 379, 259號揭示許多積體電路記憶晶片同 巧過程和系統。更具體而言’此專利係關於一種方法It is difficult to detect this kind of failure with the X 2 binary method, because the test adopted is not the behavior of the chip under its specified application. As a matter of fact, the memory chip of Messrs./Beijing Tablet has never operated the integrated circuit, especially the test system and integrated circuit memory components of the integrated circuit, in the actual application environment, which is well known in the previous case. For example, U.S. Patent No. 5,794,175 discloses a half-body device testing device that can test half-large arrays in parallel. Body S has recalled the wafer. Generate a test pattern, then write to the memory chip and read out the actual value of the data read from the memory chip, and compare it with the expected value to determine whether the memory chip is faulty. US Patent No. 5,95 9, 9 1 4 discloses a device containing a controller-type transferable test data to and from a memory element. The controller can generate data graphs and write to the memory elements, and can read data back from these memory elements. The data read back by some memory elements are compared with the data written in these memory elements, and the information about the discrepancy between the two sets of data can be saved or output. ‘And write’ instructions for what ’s different from beauty. »National Patent No. 4,965,799 discloses DRAM chip function and maximum operation test method and device. In this method, a data bit pattern is generated and stored in a memory battery of a memory element. Stored and subsequently read out the pattern comparison. If there is a choice between reading the pattern and generating the pattern, a suitable series of light emitting diodes (LEDs) can be used, for example, to provide a suitable US patent 4,379, 259 No. reveals many coincidence processes and systems of integrated circuit memory chips. More specifically, this patent is about a method
580578 五、發明說明(3) ---- ,把許多個別記憶晶片安裝在許多記憶板之一上,隨即將 各板接至PC驅動卡。圖型測試以及對晶片規袼的 記憶晶片上進行。 # 雖然此等刖案技藝之積體電路元件測試系統和方法, 可以有效檢測由圖型測試和對元件規格測試的許多常見故 =,但此等習知測試系统和方法不能有效檢測行為故障, 用環境容易與ί測試特定元件最終使用時的實際應 衣兄有別。例如,夂測試的元件可能通過全部習知測試 {在真實世界」操作條件下(例如在W i n d 〇 w s ®組立時) 可能失效。580578 V. Description of the invention (3) ----, install many individual memory chips on one of many memory boards, and then connect each board to the PC driver card. Pattern testing is performed on memory chips with chip specifications. # Although these integrated circuit technology test systems and methods can effectively detect many common problems caused by pattern testing and component specification tests, these conventional test systems and methods cannot effectively detect behavioral failures. The use environment is easy to distinguish from the actual application of a particular component when it is ultimately used. For example, the elements tested by plutonium may pass all known tests {under real-world "operating conditions (such as when Wiindows® is assembled) and may fail.
« 在例如記憶晶片上進行行為測試的一種可能方法,是 f應=系統(例如PC )直接使用記憶晶片。然而,在應用 封統直接加入受測試的記憶晶片,以此方式進行行為測 詁敍4多種缺點。首先,受測試的記憶晶片一般需儲存測 敕,本身,或其一部份,因而妨礙有效測試記憶晶片的 用f t憶空間。其次,受測試的失效記憶晶片,造成全應 曰Η、 Ϊ解’阻止進一步測試記憶晶片,在測試次一記憶 之則,系統需重新開始。若要測試大量記憶晶片,此 斟,法效率不佳。第三,以此方式難以一個應用系統同 I,夕^記憶元件進行行為測試。第四,在執行測試程式 「=又測試記憶晶片上進行操作的順序,不能真正代表 ^ Μ ί實世界」操作條件下PC所用記憶晶片上所進行的操 當JL古三第五,在應用系統中直接測試記憶晶片,並非常 /、 測試模式操作中得以改變關鍵而標準記憶參數(«One possible method for performing behavioral tests on, for example, a memory chip is to use the memory chip directly in the f (= PC) system. However, in the application system, the tested memory chip is directly added to conduct the behavior measurement in this way. There are four kinds of disadvantages. First, the memory chip under test generally needs to store the test cell, itself, or a part of it, which prevents the effective testing of the memory chip's memory space. Secondly, the failed memory chip under test caused the full response and failure to prevent further testing of the memory chip. When the next memory is tested, the system needs to be restarted. To test a large number of memory chips, this method is not efficient. Third, in this way, it is difficult for an application system to conduct behavior tests with the memory elements. Fourth, the sequence of operations performed on the execution of the test program "= and test memory chip, can not really represent ^ Μ ί the real world" operating conditions on the memory chip used by the PC JL ancient third fifth, in the application system Test the memory chip directly in the test mode, and change the key and standard memory parameters in the test mode operation (
D0UJ/〇 五、發明說明(4) 例如裝備時間、占 因此,亟需有一播:V〇L、V0H等)的可行性。 件在最終使用的實際應用^ ^方法,可在代表積體電路元 此外,亟需有Γ 、衣兄内測試内積體電路元件。 件在元件規格範圍内種二::方法’可供測試積體電路元 起的條件下操作的能力 所要應用環境内使用時會引 統和方法,_ a w例如°己隐晶片的積體電路元件之測試系 測試)和行‘測;3中兼備習知測試方法(例如圖案 可有效測試出元件故障。 統和方法^ ί 5包含記憶晶片㈣積體電路元件之測試系 中的信號巧2 ζ道試,70件要經行為測試,其中將應用系統 子組件i1兴ί到受測試元件,或連接於受測試元件的電 同樣操作條;ΐ:;件可在最後使用時的實際應用環境之 ,其中^3而s ’本發明提供一種積體電路元件測試方法 件,、測A二至應用系統中元件的信號,也發射至受測試元 太=:70件對信號的响應,隨後將响應加以比較。 至連=ίί供一種積體電路元件測試方法,其中發射 連接於受測試-、Ϊ中兀件的第一控制器之信號,也發射至 响應,隨後將=庙的第二控制、器,測定二控制器對信號的 k後將响應加以比較。 其中ΐ ΐ:亦ΐ供一種積體電路元件之測試系統和方法, 〒又測成疋件經習知測試和行為測試。D0UJ / 〇 V. Description of the invention (4) For example, equipment time, accounting So it is urgently necessary to have a broadcast: VOL, V0H, etc.). The practical application of the device in the final use ^ ^ method can be used to represent integrated circuit elements. In addition, there is an urgent need to test the internal integrated circuit elements with Γ and the elder brother. There are two kinds of components within the scope of component specifications: Method "can be used to test the ability of the integrated circuit element to operate under the conditions required by the application environment will introduce the system and methods, _ aw for example ° integrated circuit components The test system is the test) and the test; both of the conventional test methods (such as patterns can effectively test the component failure. System and method ^ 5 5 signal in the test system including memory chip integrated circuit components 2 ζ In the road test, 70 items are subject to behavioral tests. Among them, the application system sub-assembly i1 is used to test the component, or the same operation strip connected to the component under test; ΐ :; Among them, ^ 3 and s' The present invention provides a test method for integrated circuit components, which measures the signals from A to the components in the application system, and also transmits to the tested Yuanta =: 70 pieces of response to the signal, and then The response is compared. Zhilian = ί For a method of testing integrated circuit components, in which a signal from a first controller connected to a component under test is tested and transmitted to the response, and then Second control, The device measures the k of the two controllers and compares the responses. Among them, ΐ ΐ: also provides a test system and method for integrated circuit components, and 测 is measured as a conventional test and behavior test.
m I麵 第8頁 580578 五、發明說明(5) 本發明又提供一種積體電路元件之測試系統,包括受 測試元件;操作元件在應用系統和把元件連接至應用系統 内其他組件的系統接線内操作;一組測試組件,連接於受 測試元件,此組測試組件用來把系統接線攜帶的信號導引 受測試元件;以及比較器,用來比較受測試元件和應用系 統内元件對信號的响應。 本發明又提供一種積體電路元件之測試系統,包括受 測試元件,連接於測試控制器;操作元件,在連接於系統 控制器的應用系統内操作;系統接線,把系統控制器連接 到可提供系統控制器輸入的應用系統其他組件;測試組件 ,適於把系統接線攜帶的信號副本導引至測試控制器;以 及比較器,用來把測試控制器和系統控制器對信號的响應 加以比較。 圖式簡單說明 為更加瞭解本發明,更為明白表示如何付諸實施,參 照附圖說明如下,附圖中: 第1圖為積體電路記憶元件典型習知測試系統之簡圖 第2A圖為記憶應用系統若干組件之簡圖; 第2B圖為行為測試系統基本建築之簡圖; 第2C圖為典型PC應用系統若干組件之簡圖; 第3圖為本發明較佳具體例之簡圖; 第4A圖為本發明另一較佳具體例之簡圖; 第4B圖為第4A圖使用二電路板實施之簡圖;m I surface page 8 580578 V. Description of the invention (5) The present invention also provides a test system for integrated circuit components, including the tested components; operating elements in the application system and system wiring connecting the components to other components in the application system Internal operation; a set of test components connected to the component under test, this set of test components is used to guide the signal carried by the system wiring to the component under test; and a comparator is used to compare the component under test with the component response. The present invention also provides a test system for integrated circuit elements, which includes a tested element connected to a test controller; an operating element that operates in an application system connected to the system controller; and a system wiring that connects the system controller to an available Other components of the application system input by the system controller; test components suitable for directing a copy of the signal carried by the system wiring to the test controller; and comparators for comparing the response of the test controller and the system controller to the signal . BRIEF DESCRIPTION OF THE DRAWINGS To better understand the present invention and how to put it into practice, it will be described with reference to the accompanying drawings, in which: Figure 1 is a simplified diagram of a typical conventional test system for integrated circuit memory elements. Figure 2A is Figure 2B is a schematic diagram of some components of a memory application system; Figure 2B is a simplified diagram of the basic building of a behavior test system; Figure 2C is a simplified diagram of some components of a typical PC application system; Figure 3 is a simplified diagram of a preferred embodiment of the present invention; Figure 4A is a simplified diagram of another preferred embodiment of the present invention; Figure 4B is a simplified diagram of Figure 4A implemented using two circuit boards;
第9頁 580578 五、發明說明(6) 第5圖為本發明另一較佳具體例之簡圖; 第6圖為記憶晶片測試方法中所進行步驟之流程圖; 第7 A和7B圖為記憶晶片經行為測試的方法中另一具體 例之步驟流程圖; 第8圖為本發明各種具體例内記憶匯流排分接配置和 裝置; 第9圖為使用參數控制元件的本發明具體之簡圖; 第1 0圖為複數受測試元件並行測試的本發明變化具體 例之簡圖, 第1 1 A、1 1 B、1 1 C、1 1 D圖為供應至測試組件的應用信 號儲存在記憶元件内的系統之本發明變化具體例簡圖。 較佳具體例之詳細說明 為澄清起見,在詳述本發明之前,參見第1和2A圖說 明典型習知記憶元件測試系統和應用系統。 參見第1圖,表示積體電路記憶元件之習知測試系統 1 0。系統1 0包含測試圖型發生器1 2,可發生測試圖型,用 於測試在受測試記憶元件1 4 (以下稱DUT )中所用測試圖 型。測試圖型發生器1 2可經由例如位址線、資料線和/或 控制線,連接於一或以上之驅動器和/或邏輯元件1 6。測 試圖型發生器12經由連接於測試圖型發生器12的線所攜帶 信號,提供輸出至成組一或以上驅動器和/或邏輯元件 1 6 ° 例如,測試圖型發生器1 2的輸出,可對應於在DUT 1 4 上進行如下搡作的指令:Page 9 580578 V. Description of the invention (6) Figure 5 is a simplified diagram of another preferred embodiment of the present invention; Figure 6 is a flowchart of the steps performed in the memory chip test method; Figures 7 A and 7B are Figure 8 is a flowchart of the steps of another specific example of the method for testing the behavior of a memory chip; Figure 8 is a memory bus tap configuration and device in various specific examples of the present invention; Figure 9 is a detailed summary of the present invention using parameter control elements Fig. 10 is a simplified diagram of a specific embodiment of the present invention in which a plurality of test elements are tested in parallel. Figs. 1 A, 1 1 B, 1 1 C, 1 1 D are application signals supplied to a test component and stored in Schematic diagram of a specific example of a variation of the system in the memory element of the present invention. Detailed Description of the Preferred Specific Examples For the sake of clarity, before describing the present invention in detail, reference is made to Figures 1 and 2A to illustrate a typical conventional memory element test system and application system. Referring to FIG. 1, a conventional test system for integrated circuit memory elements 10 is shown. The system 10 includes a test pattern generator 12 which can generate a test pattern for testing a test pattern used in a memory element under test 14 (hereinafter referred to as a DUT). The test pattern generator 12 may be connected to one or more drivers and / or logic elements 16 via, for example, address lines, data lines and / or control lines. The test pattern generator 12 provides an output to a group of one or more drivers and / or logic elements via a signal carried by a line connected to the test pattern generator 12 °. For example, the output of the test pattern generator 12 Corresponds to the following operations on DUT 1 4:
第10頁 580578 記憶位址, 記憶位址, 記憶位址, 記憶位址, 器和/或邏 轉變成可與 邏輯元件把 譯成與DUT 轉譯成相對 輯元件把定 化為位址識 ,亦可利用 目的,在於 DUT 14可以 導引至具有 發生器12所 程式規劃, 例如信號數 、裝備時間 和/或邏輯 生的測試圖 五、發明說明(7) 樣本測試演算: (1)從最初到最後 (2 )從最初到最後 (3 )從最初到最後 (4 )從最初到最後 此組一或以上驅動 發生器12提供的輸出, 信號。例如,需要第一 的線性記憶位址數,轉 式(例如把位址識別號 別號)。亦需有第二邏 、行識別號呈現)格式 1 4的一系列位址線攜帶 第一和第二邏輯元件之 1 2的資訊,轉譯成專用 等邏輯元件的輸出即可 ,而把相當於測試圖型 至DUT 14。驅動器可經 時改變特定操作參數( 、下降時間、佔用時間 總之,此組驅動器 測試圖型發生器1 2所發 的格式應用於DUT 14。 响應測試圖型發生 寫0 讀0,寫1 讀1,寫0 讀0 輯元件1 6,把測試圖型 專用DUT 14相容之一組 測試圖型發生器1 2提供 14的定址方法一致的格 應系列之組、列、行識 址參數(例如以組、列 別號,可由連接於DUT DUT 14瞭解。基本上, 把來自測試圖型發生器 瞭解的一系列命令。此 對DUT 14介面的驅動器 提供指令的信號,導引 提供信號至DUT 14,同 值、V〇L、V0H、上升時間 等)。 元件16的功用,在於把 型,以可與DUT 14相容 器1 2所發生的「閱讀」指令,從Page 10 580578 Memory address, memory address, memory address, memory address, device and / or logic are converted into logic elements that can be translated into DUTs and translated into relative elements to be fixed into address identities, also The available purpose is that the DUT 14 can be guided to the program plan with the generator 12, such as the number of signals, equipment time and / or logic test. Figure 5. Description of the invention (7) Sample test calculation: (1) From the initial to the Finally (2) from the first to the last (3) from the first to the last (4) from the first to the last one or more outputs, signals provided by this set of one or more drive generators 12. For example, the first linear memory address number is needed, such as the address identification number. It also needs the second logic and line identification numbers to be presented.) A series of address lines of format 1 4 carry information of 12 of the first and second logic elements, which can be translated into the output of dedicated logic elements, and the equivalent Test pattern to DUT 14. The driver can change specific operating parameters (, fall time, occupation time in a short time). The format issued by this group of driver test pattern generator 12 is applied to DUT 14. The response test pattern occurs write 0 read 0, write 1 read 1, write 0, read 0, edit the component 16, and make the DUT 14 compatible with the test pattern one of the test pattern generators 1 2 provide the group, column, and row addressing parameters of the grid address series with the same 14 addressing method ( For example, the group and column numbers can be understood by connecting to DUT DUT 14. Basically, a series of commands learned from the test pattern generator. This provides a command signal to the driver of the DUT 14 interface, and guides the signal to the DUT. 14, the same value, V0L, V0H, rise time, etc.) The function of element 16 lies in the shape, with the "read" command that can occur with DUT 14-phase container 12 from
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第11頁 580578Page 580578
五、發明說明(8) ___ MT 14讀資料,隨後輸出至資料接收機18。比 試圖型發生器提供所要閱讀的預計資料,盥=器Μ把測 收機1 8内從DUT 1 4閱讀之資料,加以比較了 =存於資料接 凡精於技藝人士均知,比較器2〇可經程式 成適應測試圖型發生器1 2的指令,經成纟且驅 ^或汉计 輯元件16、DUT 14和資料接收機18通二比:15和/或邏 遲。另外,在測試圖型發生器12和比所致的延 其他電子組件,以確保圖型發生3!12接^ 一 a 可插入 收機18儲存的資料在比較中同步°。&供的㈣與資料接 =^測試圖型發生器12和資料接收機18的資料由比較 ==結果兰輸出!j輸出模組21。I出模組21又把 二、。導引至誤差s己載單位22,把所發現的任何誤差圮 2 “二i U出模組2 1亦可把比較結果又導引到顯示器 發i-i 資訊提到視覺顯示器,或透過一組 極:),—或其他輸出元件。若資料接收機以 =誤:測試圖型發生器12指示的預計資料不相當,即 。在:fA見第2A圖,表示典型記憶應用系統25之若干組件 ,2A圖内,典型的記憶應用系統25包括應用系統組件 ’匕含記憶控制器,利用匯流排A28、匯流排B29和匯流 代矣《•連接於目標記憶元件27(即系統記憶)。匯流排A28 信號匯流排(―或以上平行線)’用於把來自包 元株&二制器的應用系統組件26之信號,傳送到目標記憶 匯流排B29代表双向信號匯流排(一或以上之平行5. Description of the invention (8) ___ MT 14 reads the data and then outputs it to the data receiver 18. Compared with the attempted type generator to provide the expected information to be read, the toilet device compares the data read from the DUT 1 4 in the measuring machine 18 to the stored data. 〇 It can be programmed to adapt to the test pattern generator 12's instructions, and it can be programmed and driven ^ or the Chinese instrumentation element 16, DUT 14, and data receiver 18 to make two comparisons: 15 and / or logical delay. In addition, test the pattern generator 12 and the delay caused by other electronic components to ensure that the pattern occurs 3! 12 ^ a a can be inserted The data stored in the receiver 18 is synchronized in the comparison. & The connection between the data and the data = ^ The data of the test pattern generator 12 and the data receiver 18 are compared by the = = result blue output! j output module 21. I out of the module 21 and second. Guide to the error s already loaded unit 22, any errors found 圮 2 "two i U out module 2 1 can also guide the comparison results to the display and send ii information to the visual display, or through a set of poles :), —or other output components. If the data receiver is false: the expected data indicated by the test pattern generator 12 is not equivalent, that is: at: fA see Figure 2A, which shows some components of a typical memory application system 25, In FIG. 2A, a typical memory application system 25 includes application system components including a memory controller, and uses a bus A28, a bus B29, and a bus generation device. • Connected to the target memory element 27 (ie, system memory). Bus A28 Signal bus ("or more parallel lines") is used to transmit the signal from the application system component 26 of the Baoyuan strain & second controller to the target memory bus B29 represents a two-way signal bus (one or more parallel
第12頁 580578 五、發明說明(9) 線),用於把來自包含記憶控制器的應用系統組件2 6之信 號,傳送到目標記憶元件2 7,並把來自目標記憶元件2 7的 信號,傳送到包含記憶控制器的應用系統組件2 6。匯流排 C30代表單向信號匯流排(一或以上平行線),用於把來自 目標記憶元件2 7的信號,傳送到包含記憶控制器的應用系 統組件2 6。於典型記憶應用系統2 5的正常操作過程中,來 自包含記憶控制器的應用系統組件2 6的信號,使用匯流排 A2 8和匯流排B2 9 (例如在記憶元件書寫資料時)發射到目 標記憶元件2 7,而來自目標記憶元件2 7的信號,則使用匯 流排B29和匯流排C30 (例如從記憶元件閱讀資料時),發 射到包含記憶控制器的應用系統組件2 6。 在說明書和申請專利範圍内,應用是指可以使用被測 試組件之系統、產品、設備或元件。若被測試的組件是記 憶晶片,則應用指電腦、用具、PC錄影卡、數位TV、MP3 放映機、照相機、錄音機、副總成、服務機、網路設備、 細胞式電話、資訊用具,或使用記憶晶片之任何其他電子 產品。應用系統為包括應用之硬體和軟體,可為「下架」 或訂製設計品。組件可為單一積體電路晶片,或例如在總 成或印刷電路板上之一組積體電路。此外,組件可為裸矽 模、組成模、套裝積體電路、堆疊積體電路,或例如其任 何元件連接在一起。 本發明要求對受測試的積體電路元件進行行為測試, 可為例如記憶應用系統内的記憶元件。一般而言,對受測 試的元件施加行為測試時,受測試元件經同樣系統互動,Page 12 580578 V. Description of the invention (9) line) is used to transmit the signal from the application system component 26 including the memory controller to the target memory element 27 and the signal from the target memory element 27. Transfer to application system components 2 6 containing memory controller. The bus C30 represents a unidirectional signal bus (one or more parallel lines) for transmitting signals from the target memory element 27 to the application system component 26 including the memory controller. During the normal operation of the typical memory application system 25, the signals from the application system component 26 including the memory controller are transmitted to the target memory using the bus A2 8 and the bus B2 9 (for example, when the memory element writes data). Element 27, and the signal from the target memory element 27 is transmitted to the application system component 26 including the memory controller using bus B29 and bus C30 (for example, when reading data from the memory element). Within the scope of the description and patent application, an application refers to a system, product, device, or component that can use the component under test. If the component being tested is a memory chip, the application refers to a computer, appliance, PC video card, digital TV, MP3 projector, camera, recorder, subassembly, server, network equipment, cell phone, information appliance, or use Any other electronic product of a memory chip. The application system is hardware and software including the application, which can be "off-shelf" or customized designs. The component may be a single integrated circuit chip, or, for example, a set of integrated circuits on an assembly or a printed circuit board. In addition, the components may be a bare silicon die, a component die, a packaged integrated circuit, a stacked integrated circuit, or, for example, any of their components connected together. The present invention requires a behavior test on the integrated circuit element under test, which may be, for example, a memory element in a memory application system. In general, when a behavior test is applied to a component under test, the component under test interacts through the same system.
第13頁 孓、|明說^7 —___ 為党測試元件最終在所需 例如,可嘗試行為測以、%境内使用時會曝光。 殊故障是發生在只有在例 檢測應用特殊故障。應用特 (例如系統、產品、設備或/、應用裱境有關的某些條件下 件,例如溫度、谭度=兀件影响到應用電氣操作之條 、正地面、基礎:,、“丄;;立:和強度、電磁干擾、串音 作時,沒#預期應用功能時)f以特種硬體或軟體應用操 ’組件只有在指定軟體程:安;p 特殊故障。例如 疋件(例如特種品牌的錄影 # =疋=牌的周邊硬體 系統故障,即可歸類為應用特殊故障。,才造成pc等應用 障。每一種應用糸 f仃為測试,以檢測存取行為故 )之:法本身的存取組件(例如記憶晶片 Γ取順序。如果組件不能在此獨特= 如㈣作’則歸類為存取行為故障。因此"且3 習知測試’ a會遭受存取行為故障。例如 同樣記憶位址時才故障,則歸類為存取 j 2參心⑼圖’表示本發明行為測試系統的基本形態 。在弟圖匯流排28、29、30使用分接頭31分接,把 匯流排28、29、30上的信號副本再導引至許多測試組件32 。測試組件32通過連接匯流排34、35、36,與受測試一 33通信。此組連接匯流排34、35、36傳送資料來往於=測Page 13 孓, | Ming said ^ 7 —___ The test component for the party is finally required. For example, you can try to measure the behavior, and it will be exposed when used in% territory. Special faults occur only in special cases of detection applications. Application characteristics (such as systems, products, equipment or / and certain conditions related to the application environment, such as temperature, Tan degrees = elements that affect the electrical operation of the application, the ground, the foundation: ,, "丄 ;; Li: When working with strength, electromagnetic interference, and crosstalk, when no # expected application function) f Special hardware or software applications to operate the component only in the specified software process: Ann; p special failures. For example, software (such as special brands的 视频 # = 疋 = The peripheral hardware system failure of the card can be classified as an application-specific failure. Only application failures such as pcs are caused. Each application 糸 f 仃 is a test to detect access behavior): The access component of the method itself (such as the memory chip's fetch sequence. If the component cannot be unique here = if it works, then it is classified as an access behavior failure. Therefore " and 3 conventional tests' a will suffer from access behavior failure . For example, the failure occurs only when the same memory address is stored, and it is classified as access j 2 reference map, which represents the basic form of the behavior test system of the present invention. Tap 31 is used in the bus 28, 29, and 30 of the digraph bus. Put signals on buses 28, 29, 30 This further directed to many test assembly 32. Test assembly 32 is connected via bus 35, 36, This set of connection busbars 34, 35, a transmission 33 under test with data communication to and from the test =
第14頁 580578 目標記 33越過 位37, 件33的 較結果 同樣方 誤差記 測試過 功能與 流排28、29、30傳送資料來往於目禪 同。 π 匯流排3 4和3 5把目標記憶元件2 7接收 流排2 8、2 9引導至受測試元件3 3。因 標記憶元件2 7時,資料也會被書寫到 2 7接到閱讀指令,目標記憶元件2 7即 流排3 0和/或2 9 ’而輸出資科至記憶 副本可透過分接頭引導引至測試組件 33接到和目標記憶元件27同樣的閱讀 3 2用來提供受測試元件3 3,和提供給 的信號),因此,受測試元件3 3也藉 測試組件32之匯流排36和/或35,而 發明說明^ 甙疋件33,分別與匯 記憶元件27的方式相 測試組件3 2使用 的信號副本,越過匯 此’資料被書寫到目 受測試元件3 3。 當目標記憶元件 利用發射信號越過匯 控制器。此等輸出的 32 〇 由於受測試元件 才曰令(因為測試組件 目標記憶元件2 7同樣 發射信號越過連接於 輸出信號。 測试組件3 2接收 輸出,和受測試元件 件32包括誤差記载單 憶元件2 7與受測試元 閘)加以比較,把比 3 3以目標記憶元件2 7 同。若輸出不同,則 憶元件2 7最好是原先 因為受測試元件3 3的 憶元件2 7越過匯流排2 9和3 0的 匯流排3 5和3 6的輸出。測試組 了例如為邏輯元件,把目標記 輪出(例如使用一系列互斥或 輪出。因此,如果受測試元件 式操作,則各元件的輸出應相 栽單位可以檢知誤差。目標記 適於此項應用的「好」晶片, 目標記憶元件2 7進行比較。如Page 14 580578 The target record 33 crosses the bit 37, the comparison result of the piece 33 is the same. The error record has been tested. The function is the same as that of the flow 28, 29, and 30 for transmitting data to and from Muzen. The π buses 3 4 and 3 5 guide the target memory element 2 7 to the receiving buses 2 8 and 2 9 to the test element 33. When the standard memory element 27 is marked, the data will also be written to 27. Upon receiving the reading instruction, the target memory element 27 will be the streamline 3 0 and / or 2 9 ', and the output of the asset to the memory copy can be guided through the tap. The test component 33 receives the same reading 3 2 as the target memory element 27 to provide the test component 33 and the signals provided to it). Therefore, the test component 33 also uses the bus 36 and / of the test component 32 Or 35, and the invention description ^ glycosides 33, the signal copy used by the test component 3 2 with the sink memory element 27, respectively, the data is written across the sink to the subject test element 33. When the target memory element uses the transmitted signal to cross the sink controller. The 32 of these outputs is ordered only because the tested component (because the target memory component 27 of the test component also transmits signals across the output signal. The test component 3 2 receives the output, and the tested component 32 includes an error log. Memory element 2 7 is compared with the tested element gate), and the ratio 3 3 is the same as the target memory element 2 7. If the outputs are different, the memory element 27 is preferably the output of the memory element 27 which has passed the bus elements 29 and 30 in the test element 3 3. The test group has, for example, logic elements, and turns the target out (for example, using a series of mutual exclusion or rotation out. Therefore, if the tested component is operated in a typed manner, the output of each component should be able to detect errors. For the "good" chip in this application, the target memory element 27 is compared.
580578 五、發明說明(12) 此一來,目標記憶元件2 7可做為參照元件。 測試組件32亦包括連接器、收發機,以及其他邏輯元 件和/或電子組件(例如命令解碼器,双向輸入緩衝器, 用來暫時鎖定双向匯流排,並給予命令解碼器有時間測定 該匯流排上的信號方向,並把信號再導引至受測試元件或 誤差記載單位),方便把到應用系統2 5的匯流排2 8、2 9、 3 0上目標記憶元件2 7之信號,再導引至受測試元件3 3,從 目標記憶元件2 7和受測試元件3 3閱讀輸出信號,並將此等 信號進行比較。 兹參見第2C圖,表示個人電腦(PC)的典型系統建築, 此為可以測試記憶元件的記憶應用系統之一例,假設受測 試記憶原件可實際操作的系統類型。580578 V. Description of the invention (12) In this way, the target memory element 27 can be used as a reference element. The test component 32 also includes connectors, transceivers, and other logic components and / or electronic components (such as a command decoder, a bidirectional input buffer, to temporarily lock the bidirectional bus, and to give the command decoder time to determine the bus Signal direction, and redirect the signal to the tested component or error recording unit), which is convenient for redirecting the signal from the target memory element 2 7 to the application system 2 5 bus 2, 8 9, 2 and 30. Lead to the component under test 3 3, read the output signals from the target memory component 27 and the component under test 3 3, and compare these signals. Refer to Figure 2C, which shows a typical system building of a personal computer (PC). This is an example of a memory application system that can test memory components. It is assumed that the test memory original can actually operate the system type.
此典型形態的記憶應用系統3 8,包括處理機晶片4 0, 利用系統匯流排44連接於記憶控制器/圖控制器插座42 ( 以下稱「系統記憶控制器」)。系統記憶控制器42包括一 或以上控制器晶片,透過記憶匯流排48控制各種連接元件 ,包含系統記憶體4 6。記憶匯流排4 8典型包括多組平行線 ,有些只帶發射至系統記憶體46的信號(一如第2A和2B圖 之匯流排A2 8内),有些只帶從系統記憶體46發射的信號( 一如第2A和2B圖之匯流排C30内),而有些帶有可在双向發 射的信號(一如第2 A和2 B圖之匯流排B 2 9内)。記憶應用系 統3 8亦可包括控制器晶片,經一或以上視頻元件接線5 2 a 、52b控制一或以上之視頻控制器或元件50 (例如利用AGP 匯流排連接於記憶控制器/圖控制器插座42之AGP圖控制The memory application system 38 in this typical form includes a processor chip 40, and is connected to a memory controller / graph controller socket 42 (hereinafter referred to as a "system memory controller") using a system bus 44. The system memory controller 42 includes one or more controller chips, and controls various connection elements through a memory bus 48, including a system memory 46. The memory bus 4 8 typically includes multiple sets of parallel lines, some with only the signals transmitted to the system memory 46 (as in the bus A2 8 in Figures 2A and 2B), and some with only the signals transmitted from the system memory 46 (As in bus C30 in Figures 2A and 2B), and some with signals that can be transmitted in both directions (as in bus B 2 9 in Figures 2 A and 2 B). The memory application system 38 may also include a controller chip, which controls one or more video controllers or components 50 via one or more video component wiring 5 2 a, 52b (for example, using an AGP bus to connect to a memory controller / graphic controller AGP chart control of socket 42
第16頁 580578 五、發明說明(13) 器)°視頻元件接線可單向(例如視頻元件接線52a )或双 向(例如視頻元件接線52b)。 口系統記憶控制器42亦利用插座介面56,接至I / 〇控制 器插座54。、I / 〇控制器插座54包括一或以上之控制器晶片 口透過或以上!/0連線60,與一或以上之週邊元件控制 器或週邊元件58通信。I/O連線60可為單向或双向。 視頻兀件連線52a、52b和I / 0連線6〇各包括單線、一 平行、線(例如匯流排),或可在控制器匯流排42、⑷口 連接το件50、58間無線通信之已知電子組件。 系統記憶控制器42和連接I / 〇控制器插座54,商 以套裝62出售(例如intel® 81 5晶片組)。 … 第3至5圖表示本發明行為測試系統之若干較佳具體例 _ :用來測試實際操作PC中用做系統記憶體46的同型記憔 :牛。如上所冑,PC是本發明可應用的記憶應用系統38: :例。受測試的記憶元件宜以最少妨礙的方式(例如不以 文測試的記憶元件直接取代系統記憶體46 ),暴露於系 記憶體46與記憶應用系統38其他組件間之互動,同時受測 ,的記憶元件又能極接近最終使用的環境方式(即使用類 « =應用系統)操作。此點可以在應用系統組合添加測試 =件/具體而t ’組合硬體組件、電路和軟體).,獲得行 為測试系統進行。 行為測試系統可包括硬體(設備、 々、丨u2 、電路等)…’並設計成分析—或:= = = 。行為測試系統宜設計&,即使在行為測試系統内無受測Page 16 580578 V. Description of the invention (13)) Video component wiring can be unidirectional (such as video component wiring 52a) or bidirectional (such as video component wiring 52b). The port system memory controller 42 also uses a socket interface 56 to connect to the I / O controller socket 54. I / O controller socket 54 includes one or more controller chip ports through or above! The / 0 connection 60 communicates with one or more peripheral component controllers or peripheral components 58. The I / O connection 60 may be unidirectional or bidirectional. Video hardware connections 52a, 52b and I / 0 connections 60 each include a single line, a parallel line (such as a bus), or can be connected to the controller bus 42, port 50, 58 wireless communication Of known electronic components. The system memory controller 42 and the I / O controller socket 54 are sold as a package 62 (eg, Intel® 81 5 chipset). … Figures 3 to 5 show some preferred specific examples of the behavior test system of the present invention. _: Used to test the same type of memory used as the system memory 46 in a practical operating PC: cattle. As noted above, PC is a memory application system 38: to which the present invention is applicable. The tested memory element should be exposed to the interaction between the system memory 46 and other components of the memory application system 38 in the least obstructive manner (for example, the memory element not tested by the text directly replaces the system memory 46). The memory element can be operated very close to the end-use environment (ie using the class «= application system). This point can be added to the application system combination test = piece / specific and t 'combination of hardware components, circuits and software), to obtain the behavior test system. The behavior test system may include hardware (equipment, 々, 丨 u2, circuit, etc.) ... ’and is designed to analyze—or: = = =. Behavioral test systems should be designed & even if there is no test in the behavioral test system
第17頁 580578Page 17 580578
然有完整官能,故應用系統的 或測試結果而受到影响。例如 記憶模組所用行為測試系统的 必須為PC安裝來操作,又因瑕 ’受測試的瑕疵元件最好不造 是行為測試系統用來檢測和指 五、發明說明(l4) 試7G件存在’應用系統也仍 功能不因受測試元件的品質 PC (或主機板)本身不能有 功能,因為受測試記憶模組 藏模組會造成P C故障。此外 成行為測試系統故障;反而 示故障的原因。However, it is fully functional, so the application system or test results are affected. For example, the behavioral test system used for the memory module must be installed and operated by a PC, and because of the defect, 'the defective component to be tested is best not to be made by the behavioral test system. The application system is still not functional. The PC (or motherboard) itself cannot function because of the quality of the component under test, because the module under test will cause the PC to malfunction. In addition, the behavior test system fails; instead, the cause of the failure is shown.
兹參見第3圖’代表行為測試系統的較佳具體例, 表本發明的基本實施,以118概括表示。行為測試系統ii8 係建造在記憶應用系統38上所構成(例如第%圖内),以 提供信號副本由記憶應用系統38内的連線,帶到行為測試 系統118的測試組件119。測試組件119可預先組合入單一 添加測試元件内’連接到記憶應用系統38。Reference is made to Fig. 3, which represents a preferred specific example of a behavioral test system, which illustrates the basic implementation of the present invention, and is generally represented by 118. The behavior test system ii8 is constructed on the memory application system 38 (for example, in Fig.%) To provide a signal copy from the connection in the memory application system 38 to the test component 119 of the behavior test system 118. The test component 119 can be pre-assembled into a single added test element 'and connected to the memory application system 38.
在本發明具體例内,連接系統記憶控制器42與系統記 憶體46的記憶匯流排46,是直接分接。分接連線12〇在i2i 接到記憶匯流排48,分接連線! 2〇最好線數與包括記憶匯 流排48的有源線數(即系統記憶體46不用或不影响系統記 憶體46的操作,而可以忽視的記憶匯流排數)相同,故基 本上’記憶匯流排48攜帶信號即不會在分接連線丨2 〇上複 製。分接連線120亦接到一或以上之收發機122。與分接的 έ己憶匯流排48所攜帶信號的信號位階相容之收發機丨22, 強化分接連線1 2 0攜帶的信號,並將此等信號透過中間連 線124再發射至控制邏輯元件123。收發機122最好具體高 輸入阻抗’把記憶匯流排4 8攜帶的信號降級減到最少。收In the specific example of the present invention, the memory bus 46 connecting the system memory controller 42 and the system memory 46 is directly tapped. The connection 12 is connected to the memory bus 48 at i2i. The connection is connected! 20 The number of best lines is the same as the number of active lines including the memory bus 48 (that is, the number of memory buses that the system memory 46 does not or does not affect the operation of the system memory 46, but can be ignored), so basically 'memory The signals carried by the bus bar 48 will not be duplicated on the drop connection 丨 2. The drop connection 120 is also connected to one or more transceivers 122. A transceiver that is compatible with the signal level of the signal carried by the tapped memory bus 48, strengthens the signals carried by the tap connection 1 2 0, and transmits these signals to the control via the intermediate connection 124 Logic element 123. The transceiver 122 preferably has a high input impedance 'to minimize the degradation of the signals carried by the memory bus 48. Receive
第18頁 58〇578 五、發明說明(15) 發機1 2 2以單向為宜,以防來自測試組件丨丨9的信號干擾記 憶應用系統3 8的組件間之通訊。 當系統記憶控制器42嘗試把資料寫入系統記憶體46内 ’控$邏輯元件1 2 3即把相對應於書寫操作的記憶匯流排 ^ 8所τ信號副本,導引至驅動器丨2 4,造成同樣資料寫至 广測試的記憶元件(DUT) 1 2 5。同理,當系統記憶控制器42 試圖從系統記憶體4 6閱讀資料,相對應於閱讀操作的信號 ,=經驅動器124導引至DUT 125。隨後,從DUT 125閱讀 =貝,即輸出到資料接收機136。從記憶匯流排48攜帶的 、統冗憶體46閱讀的資料,亦導引至控制邏輯元件1 23, 而連2於控制邏輯元件123和資料接收機136的比較器138 ’測疋從二記憶元件(即系統記憶體46和DUT 125 )間讀 的二組資料是否有任何差異。 資料ΐΐ記憶體46有參照元件的作用,因其用來提供預計 = 果,與DUT 125所得資料或結果比較。 Γ25同型體4?好…優良」,完全合格的元件,與二 ’或功能上等效於DUT 125。 把輸Ϊ Ϊ Ϊ器U8測得比較結果,可輸出至微控制器139, 連線14°導引至記憶應用系統38本身,或至另 理機、碩 <列如誤差記載單位、分開的應用系統、微處 沪卡考不器、一組發光二極體(LED)、一或以上之誤差 曰” D (例如視覺指示器、聽覺指示器,盆缸人戈)、. 連接於此等之一或以上的電子組件。 一、且。式),或 參見第4A圖,以168概括表示本發明行為測試系統之Page 18 58〇578 V. Description of the invention (15) It is advisable that the engine 1 2 2 be unidirectional to prevent signals from the test components 丨 9 from interfering with the communication between the components of the memory application system 38. When the system memory controller 42 attempts to write data into the system memory 46 and control the logic element 1 2 3, the memory bus corresponding to the writing operation ^ 8 copy of the τ signal is guided to the drive 2 4 The memory element (DUT) that caused the same data to be written to a wide range of tests 1 2 5. Similarly, when the system memory controller 42 attempts to read data from the system memory 46, the signal corresponding to the reading operation is guided to the DUT 125 via the driver 124. Then, it reads DUT from DUT 125, and outputs it to data receiver 136. The data read from the memory bus 48 and read by the unified memory 46 are also directed to the control logic element 123, and the comparator 138 'connecting the control logic element 123 and the data receiver 136 to test the two memories Are there any differences between the two sets of data read between the components (ie, the system memory 46 and the DUT 125). The data / memory 46 functions as a reference element because it is used to provide predictions and results, compared to the data or results obtained by DUT 125. Γ25 isotype 4? Good ... excellent ", a fully qualified component, and functionally equivalent to DUT 125. The comparison result measured by the input and output unit U8 can be output to the microcontroller 139, and connected to the memory application system 38 by connecting 14 °, or to another processor, the master < column such as the error recording unit, and the separate Application system, micro-Huka test device, a group of light-emitting diodes (LEDs), one or more errors "D (such as visual indicators, auditory indicators, basin-cylinder), etc. Connected to this One or more electronic components. (1, and.)), Or refer to FIG. 4A, and summarize the behavior test system of the present invention with 168.
第19頁 580578 五、發明說明(16) 另一較佳具體例。行為測 應用系統38上所構成,以工先1 二亦:築於現有記憶 /s1 ^ Α Α 1 以便把一或以上的應用系統連線( 例如44、52b、56)攜帶的一或以上信號副本,提供給下述 Ϊί 系統168之測試組件169。測試组件169可預先組 σ ;要接至§己憶應用系統38的信號添加測試元件内◊如前 所述,記憶應用系統38内的各系統連線可單向或双向,而 各系統連線可包括單線、—組平行線,可以在連接元件間 無線通訊用的電子組件。Page 19 580578 V. Description of the invention (16) Another preferred specific example. Constructed on the behavior measurement application system 38, based on the first one or two: built in the existing memory / s1 ^ Α Α 1 to connect one or more application systems (such as 44, 52b, 56) with one or more signals A copy is provided to the test component 169 of the following system 168. The test component 169 can be pre-assembled σ; the signal to be connected to the §Jiyi application system 38 is added to the test element. As previously mentioned, the connection of each system in the memory application system 38 can be unidirectional or bidirectional, and each system is connected. It can include single wire, a group of parallel wires, and electronic components for wireless communication between connected components.
更具體而言’行為測試系統丨6 8起先提供系統匯流排 44所帶信號副本恢復機構而構成。此可藉分接系統匯流排 44為之,例如在17〇連接一系列線,包括分接連線172。第 一分接連線1 72的實際線數,與系統匯流排44内的實際線 數(不用的線可以略而不計)相同,故基本上,系統匯流 排44攜帶的信號會在第一分接連線ι72上複製。第一分接 連線172亦連接於一或以上之收發機174。收發機174最好 具有高度輸入阻抗,使系統匯流排44攜帶的信號降解減到 最少。 同理’對視頻元件連線52b (例如可為AGP匯流排)的 _ 連接,可在176連接第二分接連線178,包括與視頻元件連 線5 2 b同數的有源線數(不用的線可略而不計),故基本上 -’視頻元件連線52b攜帶的信號,在第二分接連線178上複# 製。第二分接連線178也接至一或以上之收發機174。 同理,在1 8 0,第三分接連線1 8 2接到插座介面匯流排 5 6,使插座介面匯流排5 6攜帶的信號,在第三分接連線More specifically, the 'behavior test system' is composed of a signal copy recovery mechanism provided by the system bus 44 first. This can be done by tapping the system bus 44, for example connecting a series of lines at 170, including the tap line 172. The actual number of lines in the first tap connection 1 72 is the same as the actual number of lines in the system bus 44 (unused lines can be omitted), so basically, the signals carried by the system bus 44 will be in the first minute Copy on line ι72. The first drop connection 172 is also connected to one or more transceivers 174. The transceiver 174 preferably has a high input impedance to minimize degradation of signals carried by the system bus 44. Similarly, the _ connection to the video component connection 52b (for example, AGP bus) can be connected to the second drop connection 178 at 176, including the same number of active lines as the video component connection 5 2 b ( Unused lines can be ignored), so basically-the signal carried by the video component connection 52b is duplicated on the second tap connection 178. The second drop connection 178 is also connected to one or more transceivers 174. Similarly, at 180, the third tap connection 1 8 2 is connected to the socket interface bus 56, and the signal carried by the socket interface bus 56 is connected to the third tap
第20頁 580578 五、發明說明(17) 182上複製。第三分接連線182亦接到一或以上之收發機 174 ° 收發機1 7 4以單向為宜,以防來自測試組件1 6 9的信號 干擾記憶應用系統3 8的組件間通信。收發機1 7 4亦強化正 傳送到其他測試組件1 6 9之信號。 基本上,本發明此具體例的行為測試系統之構造,是 將一系列的分接連線接到記憶應用系統3 8的各種連線,尤 其是把分接連線接到記憶應用系統的任何連線,提供連接 於系統記憶體46的系統記憶控制器42之輸入或輸出(記憶 匯流排48除外,並視需要,選定的單向線/只帶系統記憶 控制器42的輸出和沒有需要的連線)。雖然第4A圖只表示 二個分接連線,但分接連線數可因連接於系統記憶控制器 42的實際元件數而異。 藉建立分接連線172、178、182,如今即可拷貝並隨 即再導引系統記憶控制器4 2之輸入和輸出。分接連線1 7 2 、178、182攜帶的信號,被導引通過收發機174。收發機 17 4&與被分接的匯流排44、52b、56攜帶的信號之信號邏輯 位階相容(例如系統匯流排44内所用邏輯可為GTL+,視頻 兀件,線52b内所用邏輯可為PCi,插座介面匯流排56内所 =,輯可為LVTTL),強化分接連線172、178、182攜帶的 信=’並且把此等信號經中間連線183、184、185(分別帶 有为接連線172、178、182攜帶的信號副本)再發射到邏輯 元件1 9 0。 邏輯元件1 90可用場程式閘陣列(EpGA)、離散邏輯元Page 20 580578 V. Description of Invention (17) 182. The third tapping line 182 is also connected to one or more transceivers. 174 ° The transceivers 174 are preferably unidirectional to prevent signals from the test components 1 6 9 from interfering with the communication between the components of the memory application system 38. The transceiver 1 7 4 also strengthens the signals being transmitted to other test components 1 6 9. Basically, the structure of the behavior test system of this specific example of the present invention is to connect a series of tap connections to various connections of the memory application system 38, especially to connect any of the tap connections to the memory application system. Connect to provide the input or output of the system memory controller 42 connected to the system memory 46 (except for the memory bus 48, and if necessary, the selected unidirectional line / only with the output of the system memory controller 42 and no required Connection). Although FIG. 4A shows only two tap connections, the number of tap connections may vary depending on the actual number of components connected to the system memory controller 42. By establishing tap connections 172, 178, 182, the inputs and outputs of the system memory controller 42 can now be copied and then redirected. The signals carried by the tap lines 172, 178, 182 are directed through the transceiver 174. Transceiver 17 4 & is compatible with the logic level of the signal carried by the tapped buses 44, 52b, 56 (for example, the logic used in the system bus 44 may be GTL +, video hardware, and the logic used in the line 52b may be PCi, socket interface bus 56 =, series can be LVTTL), strengthen the letter carried by the tap lines 172, 178, 182 = 'and pass these signals through the intermediate lines 183, 184, 185 (with Copies of the signals carried for the connections 172, 178, 182) are then transmitted to the logic element 190. Logic Element 1 90 Available Field Programmable Gate Array (EpGA), discrete logic element
ΙΗ 第21頁 580578 五、發明說明(18) 件、特定功能積體電路(ASIC)、或任何程式電子元件執行 ,已如所知。邏輯元件190檢查中間接線183、184、185所 帶輸入,並確定任一中間接線183、184、185上的信號是 否指出,指令或資料正發射至系統記憶控制器42。若然, 則邏輯元件190即將中間接線183、184、185上的信號副本 ,分別經測試控制器接線1 9 4、1 9 6、1 9 8發射至測試控制 器 192。 測試控制器1 9 2在功能方面最好等於系統記憶控制器 42,並與記憶應用系統38的系統記憶控制器42之元件正好 同型(即具有同樣貨號和資料碼)。因此,測試控制器1 9 2 的行為方式與記憶應用系統38的系統記憶控制器42正好相 同。系統記憶控制器42和測試控制器1 9 2最好都是「良好 」完全合格的元件。 因此,測試控制器1 9 2可通過測試控制接線1 9 4、1 9 6 、1 98,接收到信號與發射至記憶應用系統38内的系統記 憶控制器4 2之信號在邏輯上一致。測試控制器1 9 2與受測 試記憶元件(DUT)200,經DUT接線202通信。因此,DUT200 可經DUT接線2 0 2接收測試控制器1 9 2的指令,其方式與記 憶應用系統38的系統記憶體46經記憶匯流排48,接收系統 記憶控制器4 2的指令相同。 單向收發機1 7 4和邏輯元件1 9 0組合,可把測試控制器 192和DUT 20 0從記憶應用系統38有效隔離。 如上所述’系統記憶控制器4 2的輸入,可有效導引至 測試控制器1 92。因此,在記憶「書寫」周期中,資料是ΙΗ Page 21 580578 V. Description of the invention (18), specific function integrated circuit (ASIC), or any program electronic component implementation, has been known. The logic element 190 checks the inputs of the intermediate wirings 183, 184, and 185, and determines whether the signal on any of the intermediate wirings 183, 184, and 185 indicates that a command or data is being transmitted to the system memory controller 42. If so, the logic element 190 transmits the signal copies on the intermediate wires 183, 184, and 185 to the test controller 192 via the test controller wires 194, 196, and 198, respectively. The function of the test controller 1 9 2 is preferably equal to the system memory controller 42 and the components of the system memory controller 42 of the memory application system 38 are exactly the same type (ie, have the same article number and data code). Therefore, the test controller 192 behaves exactly the same as the system memory controller 42 of the memory application system 38. The system memory controller 42 and the test controller 192 are preferably "good" fully qualified components. Therefore, the test controller 19 2 can logically agree with the signals transmitted to the system memory controller 42 in the memory application system 38 through the test control wires 19 4, 19 6, and 1 98. The test controller 192 communicates with the test memory element (DUT) 200 via the DUT connection 202. Therefore, the DUT200 can receive the commands from the test controller 192 via the DUT connection 202, in the same way as the system memory 46 of the memory application system 38 receives the commands from the system memory controller 42 via the memory bus 48. The combination of the unidirectional transceiver 174 and the logic element 190 can effectively isolate the test controller 192 and the DUT 200 from the memory application system 38. As described above, the input of the system memory controller 42 can be effectively guided to the test controller 192. Therefore, in the memory "writing" cycle, the data is
第22頁 580578 五、發明說明(19) 以寫到系統記憶體46的相同方式寫到DUT 2 00。在記憶「 閱讀」週期中,若DUT 200已按系統記憶體46同樣方式進 行,則從D U T 2 0 0閱讀的資料應與從系統記憶體4 6閱讀的 資料相同。易言之,如果系統記憶控制器4 2和測試控制器 1 9 2功能一致,且為同型,則系統記憶控制器4 2 (在記憶匯 流排48以外的接線上)的輸出,應與測試控制器丨9 2 (在DUT 接線2 0 2以上的相對應接線上)的輪出相同。由於記憶應用 系統38的接線44、52b、56所帶輸出信號,也拷貝於分接 « 接線172(和183)、178(和184)、182(和185),故邏輯元件 1 9 0能把系統記憶控制器4 2 (在接線1 8 3、1 8 4、1 8 5上)的輸 出,與測試控制器192(在相對應接線194、196、ι98上)的 輸出^以比較。邏輯元件i 90只能把接於系統記憶控制器 42的資料線上輸出,與接於測試控制器i 92的資料線上相 對應輸出加以比較。邏輯元件丨9〇即可把比較結果和任何 其他輸出,例如通過微控制器接線2 〇 6導引至微控制器 做為參玟元件的系統記憶體4 6也最好是已知「良好 DUT完ίΓ。格元件,不是與2〇0同型,便是功能上^等‘ ,控制器2 04即把比較結果提供到記憶應用系統38, 接線I08至輸人週邊元件58,或另一輸出元件, 1 、差5己載單位、分開應用系統、顯示器、一組LED、 人或以誤差指示器(例如視覺指示器、聽覺指示器,其組 e ),或接至一或以上此等元件之電子組件。 /、、、、Page 22 580578 V. Description of the invention (19) It is written to DUT 2 00 in the same way as it is written to system memory 46. During the memory “reading” cycle, if the DUT 200 has been performed in the same way as the system memory 46, the data read from DUT 200 should be the same as the data read from system memory 46. In other words, if the system memory controller 4 2 and the test controller 19 2 have the same function and are of the same type, the output of the system memory controller 4 2 (on the wiring other than the memory bus 48) should be the same as the test control. The output of the device 丨 9 2 (on the corresponding wiring of DUT wiring more than 202) is the same. Since the output signals of the wirings 44, 52b, and 56 of the memory application system 38 are also copied to the tapping «wirings 172 (and 183), 178 (and 184), 182 (and 185), the logic element 190 can The output of the system memory controller 4 2 (on the wiring 1 8 3, 1 8 4, 1 8 5) is compared with the output of the test controller 192 (on the corresponding wiring 194, 196, ι 98) ^. The logic element i 90 can only output the data line connected to the system memory controller 42 and compare the corresponding output with the data line connected to the test controller i 92. The logic element can be used to compare the comparison result with any other output, such as the system memory 4 which is guided to the microcontroller as the reference element through the microcontroller connection 2 06. It is also best to know the "good DUT" After completion, the grid element is either the same type as 2000, or it is functionally equal. The controller 204 provides the comparison result to the memory application system 38, and connects I08 to the input peripheral element 58, or another output element. 1, 1, 5 units, a separate application system, a display, a group of LEDs, or an error indicator (such as visual indicators, auditory indicators, group e), or connected to one or more of these components Electronic components. / ,,,,
580578 五、發明說明(20) 邏輯元件1 9 0亦可經卷+招如 y ^ L ^ 程式規劃,從上述行為測試掇戎 切換成不同的測試模式。你丨1 # 叫镇式 八 例如,其他測試模式可包含名 DUT 200上進行習知測試之楹々 β ^ @ \ 在580578 V. Description of the invention (20) The logic element 190 can also be programmed by volume + strokes such as y ^ L ^ to switch from the above behavior test mode to different test modes.你 丨 1 # Called the township Eight For example, other test modes can include the name of the conventional test on DUT 200 楹 々 β ^ @ \ 在
試0邏輯兀件190本身可泡4、4日杏丨士 双只J 上 」程式規劃產生測試圖型,在圖剞 測試和行為測試模式之間切播 _ t ^ ^ ^ ^ ^ 间切換,對測試控制器1 92响應測 試圖型輸入或應用系統輪人m & 應劂 、尸^獲收#说加以比权,必I拉 強化收發機174所接收的信鲈, 要時 微控制器204可用來控制 左 a t刺選擇邏輯兀件1 9 〇之測試塏 。此外,微控制器2 0 4關於測兮裙4 M丄认 丄& 果式 _ %娜忒模式間切換之功能,可 如以人工控制,或以記憶應用糸站q β 士红、x、证从从 u 心愚用糸統3 8本身通過接於微批 器204的輸出元件58加以控制。 制 行為測試系統168内之測試組件169,包含收發機17 、邏輯元件190、控制器晶片192、DUT 2〇〇、微控制器 ,以及連接此等組件之大部份接線,可安裝在測試板上。4 如前所指出,測試組件119可預組合於添加測試元件, 至記憶應用系統38。即可按上述連接至記憶應用系統之 當接線。另外,本發明上述和第4圖内簡略表示的具體例 ,可如第4B圖示用兩個預製電路板實施。若可得具有類介 組件之二操作應用系統38,則第二應用系統可轉^成添二 測試元件,即以DUT 200取代第二應用系統的系統記憶體 ,在第一應用系統分接適當接線,把系統記憶控制器從二 應用系統接至邏輯元件(並視需要提供收發機或其他電$ 組件),並切斷第二應用系統(如今有效做為測試控制器f 的系統記憶控制器’與第二應用系統的全部其他組件間"^之Test 0 logic element 190 itself can be used on the 4th and 4th days. The program plans to generate test patterns and switch between graph test and behavior test mode. _ T ^ ^ ^ ^ ^ ^ The test controller 1 92 responds to the test pattern input or the application system turns on m & Ying, corpse ^ received # said to compare the weight, I will pull the transceiver 174 to receive the bass, if necessary, the microcontroller 204 can be used to control the test of the left stab selection logic element 190. In addition, the function of the micro controller 2 0 for measuring the skirt 4 M 丄 recognition and fruit mode _% na 忒 mode can be switched manually, such as by manual control, or by using memory application q β 士 红, x, The control unit 384 uses the system 38 to control itself through the output element 58 connected to the micro-batcher 204. The test component 169 in the manufacturing behavior test system 168 includes a transceiver 17, a logic element 190, a controller chip 192, a DUT 2000, a microcontroller, and most of the wiring connecting these components, which can be installed on a test board on. 4 As previously indicated, the test component 119 may be pre-assembled to add a test component to the memory application system 38. You can then connect to the memory application as described above. In addition, the specific examples briefly shown in the above and FIG. 4 of the present invention can be implemented with two prefabricated circuit boards as shown in FIG. 4B. If a second operating application system 38 with a similar component is available, the second application system can be converted into a second test component, that is, the system memory of the second application system is replaced by the DUT 200. Wiring, connect the system memory controller from the second application system to the logic element (and provide a transceiver or other electrical components as needed), and cut off the second application system (now effective as the system memory controller for the test controller f) 'With all other components of the second application system " ^ of
580578 五、發明說明(21) 接線,惟系統記憶控制器至DUT 200的接線除外。邏輯元 件190接至收發機174,和微控制器204,如第4A圖所示。 第二應用系統之系統記憶控制器4 2,基本上有第4 A圖内測 試控制器1 92的作用。第4B圖内所示行為測試系統。比第 4 A圖更為一般行為測試系統之其他實施方式容易,因為測 試控制器和記憶元件安裝座,已裝設在板上。 參見第5圖,本發明另一具體例以218概括表示。此具 體是由本發明參照第3圖的上述具體例擴大,其中第3圖之 行為測試系統11 8已經過修飾,不但使dut 1 2 5可進行行為 測試,而且DUT 1 2 5亦可經圖型測試。在第5圖中,測試組 件119如今亦可包括輸入選擇器22〇,經接線124接收來自 记憶應用系統3 8的輸入。測試圖型發生器2 2 2亦接至輸入 選擇器220。 微控制器139可用來導引輸入選擇器22〇,在圖型測 模式和行為測試模式間切換;具體言之,輸入選擇器22〇 可經控制邏輯和驅動器元件224,分別對DUT 125提供測試 【型’或源自記憶應用系統38之輸入。就此而言,微控 器1 39可例如以人為控制,岑南丨田七也虛m < on 利 ^ t A利用記憶應用系統38本身通 過接於微控制器139的輪出元株ς ^ 几件58加以控制。在二者情況 :拉接於輸入選擇器220的比長.器138,可將μτ 12 收機136)的輸出,與輸入選擇器22〇提供的預期資料 值組比較。 凡精於此道之士均明顯可如 ,^ qQ .r L t ^ J知,本發明各種具體例之行 為測試系統,設計上必須顧刀# & f 摩貝及仃為測試系統各種組件間之580578 V. Description of the invention (21) Wiring, except for the wiring from the system memory controller to the DUT 200. The logic element 190 is connected to the transceiver 174, and the microcontroller 204, as shown in Fig. 4A. The system memory controller 42 of the second application system basically functions as the test controller 192 in Fig. 4A. The behavior test system shown in Figure 4B. Other implementations of the general behavior test system are easier than Figure 4A because the test controller and memory component mount are already mounted on the board. Referring to FIG. 5, another specific example of the present invention is generally shown at 218. This is specifically expanded by the present invention with reference to the above-mentioned specific example in FIG. 3, wherein the behavior test system 11 in FIG. 3 has been modified to not only allow dut 1 2 5 to perform behavior testing, but also DUT 1 2 5 can also be patterned. test. In Figure 5, the test component 119 can now also include an input selector 22o, which receives input from the memory application system 38 via the wiring 124. The test pattern generator 2 2 2 is also connected to the input selector 220. The microcontroller 139 can be used to guide the input selector 22 and switch between the pattern test mode and the behavior test mode. Specifically, the input selector 22 can provide tests for the DUT 125 through the control logic and the driver element 224, respectively. [Type 'or input from memory application system 38. In this regard, the microcontroller 1 39 may be controlled by a person, for example, Cennan, Tian Qiye, and M < on Lee ^ t A utilizes the memory application system 38 itself through a wheel connected to the microcontroller 139. ^ Several pieces 58 to control. In both cases: the specific length puller 138 connected to the input selector 220 can compare the output of μτ 12 receiver 136) with the expected data value set provided by the input selector 22〇. Anyone who is proficient in this way can obviously see, ^ qQ .r L t ^ J know that the behavior test system of various specific examples of the present invention must be designed with the knife # & f Mobe and 仃 as various components of the test system Between
580578 五、發明說明(22) 傳播延遲’以確保要比較的信號組間可進行適當比較。若 行為測試系統的所有組件對一時鐘信號同步,則此舉典型 上有其必要。 、參見第6圖’表示本發明較佳具體例之記憶元件測試 方法步驟’方法在步驟250開始。 # 、5己憶元件之測試方法進行到步驟2 5 2,在此選擇測試 模式。在第6圖所示本發明具體例中,只有圖型測試模式 或行為測試模式可以選擇,而且在指定時間只能選擇一種 模式。然而’技術專家明顯可知在本發明其他具體例中, 方法内可增加其他測試模式,包含進行其他習知測試之模 式。 驟254,如選擇圖型測試模式(例如利用微控制器 圖)、139(第5圖)),方法步驟的流程進行到步驟 255,在此對受測試記憶元件(DUT)施以圖型測試。 2 =測試可繼續特定期限,直到所有發生的測試圖型 :實:過:或直到所有預選擇測試圖型均已實施過。在步 程進行到步驟257,表示記憶元件的測試^法社/ 乂驟/爪 如在步驟254不選擇圖型測試模式,力° 以控制器確定是否已選擇行為測試模式。#步驟258進灯 流程進行到步驟2 6 0,在此進行行為測試,% ^,方法步驟 統的輸入,施加於DUT。在行為測試完成時即源自應用系 限之後,人為控制結束,或發生預特定事如在特定期 ),方法步驟 580578 五、發明說明(23) 流程進行至上述步驟2 5 6。 第々A和7B圖代表行為測試方法之二種變通具體例,其 中在DUT進行行為測試,行為測試可在第6圖的步驟2 60進 行。 先參見第7 A圖,行為測試方法可用行為測試系統,以 具有類似第4A圖行為測試系統的建築進行,在步驟 3 0 0 a開始。 在步驟3 1 0a時’要發射到接於系統記憶體的系統記憶 控制器之全部信號副本(發射到記憶匯流排上的系統記憶 控制器之信號最好除外),經一或以上測試組件再導引至 接於DUT之測試控制器。580578 V. Description of the invention (22) Propagation delay 'to ensure proper comparison between the signal groups to be compared. This is typically necessary if all components of the behavioral test system are synchronized to a clock signal. Referring to FIG. 6 ', which shows a memory element test method step according to a preferred embodiment of the present invention. The method starts at step 250. The test method of #, 5 Jiyi component goes to step 2 5 2 and select the test mode here. In the specific example of the present invention shown in Fig. 6, only the pattern test mode or the behavior test mode can be selected, and only one mode can be selected at a specified time. However, the technical experts clearly know that in other specific examples of the present invention, other test modes can be added to the method, including modes for performing other conventional tests. In step 254, if a pattern test mode is selected (for example, using a microcontroller chart), 139 (figure 5)), the flow of the method steps proceeds to step 255, where a pattern test is performed on the memory device under test (DUT). . 2 = The test can continue for a specific period until all occurrences of the test pattern: Real: Over: or until all pre-selected test patterns have been implemented. When the process proceeds to step 257, the test of the memory element is performed. Method / step / claw If the pattern test mode is not selected in step 254, the controller determines whether the behavior test mode has been selected. # 步骤 258 进 灯 The process proceeds to step 260, where the behavior test is performed,% ^, method step The system's input is applied to the DUT. After the behavior test is completed, which is derived from the application constraints, the human control is ended, or a pre-specified event occurs (such as in a specific period), method step 580578 V. Description of the invention (23) The process proceeds to steps 2 5 6 above. Figures 々A and 7B represent two alternatives to the behavior test method. The behavior test is performed at the DUT. The behavior test can be performed at step 2 60 in Figure 6. Referring first to Figure 7A, the behavior test method can be performed with a behavior test system in a building with a behavior test system similar to Figure 4A, starting at step 3 0 0a. At step 3 10a, a copy of all the signals to be transmitted to the system memory controller connected to the system memory (the signal transmitted to the system memory controller on the memory bus is best excluded), after one or more test components Navigate to the test controller connected to the DUT.
在步驟320a,利用系統記憶控制器發 是從系統記憶控制器輸出的信號,不含輸 )’與測試控制器發射的信號(最好是從^ 不含輸出至DUT),使用邏輯元件加以比較 在步驟330a,把比較結果輸出,例如 直接至一或以上之其他輸出元件或電子組 在步驟340a,若指示行為測試應結 即進行至步驟350a,表示方法結束, 進行至步驟310a,在此重複方法步驟。、 參見第7B圖,本發明行為測試方 30 0b開始。進行行為測試之此行為測 在具有與第5圖行為測試系統218( 118 )類似建築的行為測試系統内。 圖 射的信 出至系 試控制 號(最好 統記憶體 器輸出, 至微控制器,或 件。 ’方法 ’方法 步驟流程 步驟流程 一具體 法具體 行為測 例在步驟 例,可用 試系統In step 320a, the system memory controller is used to send the signal output from the system memory controller, excluding the input) 'and the signal transmitted by the test controller (preferably from ^ does not include the output to the DUT), using logic elements for comparison At step 330a, the comparison result is output, for example, directly to one or more other output elements or electronic groups. At step 340a, if the behavior test is instructed to proceed to step 350a, which indicates the end of the method, proceed to step 310a, and repeat here. Method steps. 7B, the behavior tester 300b of the present invention starts. This behavioral test is performed in a behavioral test system having a building similar to the behavioral test system 218 (118) of FIG. The image is sent to the test control number (preferably the system memory output, to the microcontroller, or the device. ’Method’ method step flow step flow a specific method specific behavior test in the step example, you can test the system
580578 五、發明說明(24) ---- 在步驟310b,扣1 通過一或以上測試纟且件爯、統5己憶體的全部信號副本, 在步驟腦,:2導:至受測試記憶元件⑽”。 _閱讀的資料加以比較體閱讀的資料副本,與從 在步驟310b,資粗 後在步驟320b,從系續:=:統圮憶體和DUT多次,然 ^ ^〇〇nh f統圮憶體或㈣T閱讀資料。 330a在步驟襲,輪出比較結構,—如心圖中之步驟 在步驟340b,苦如一斤& 進行到步驟350b,表^ 3二測試1應結束’方法步驟流程 行到f驟在此重複〉方3驟否’[方法步驟流程進 在應用系統内,於其實際接相#^\順序,一如系统記憶體 第3或5圖之系統心比第作。、 第3和5圖之DUT 125接收的疒节 、統更易構造,但須知 制器型別無關。由於4的二視與:至系統記憶體的控 操作不㈤(由於控制晶片榦出^ ς =設^控制器斑別而 配合之故)’導引至=憶元:輸入間隊抗不 記憶體者不正好相^],因;J3有和二5:性—會與發射裏系統 。例如,控制器與連接記2牛和之5m接至控制器 44- 2- ^ 隐儿件之間阻抗不合,舍造成發 準確性。若測試控制器192行為實質上與系統記憶控 壓號;以:所需電…。與… -.r, DUT., 4A w580578 V. Description of the invention (24) ---- At step 310b, deduction 1 passes one or more test copies and all signal copies of the memory, in step brain: 2nd guide: to the test memory Element ⑽ ". _Compare the read data with the copy of the read data, compared with the copy from step 310b, after step 320b, from the system continuation: =: 圮 圮 memory and DUT multiple times, then ^ ^ 〇〇nh f 圮 memory or ㈣T reading materials. 330a In steps, compare the structure, such as the step in the cardiogram in step 340b, suffering as much as a pound & go to step 350b, Table ^ 2 test 1 should end. The method steps and procedures are repeated until f> Step 3 of the method is not performed. [The method steps and procedures are performed in the application system, and the actual sequence is # ^ \ sequence, as in the system memory in Figure 3 or 5 No.1, No.3 and No.5 of the DUT 125 receiving system is easier to construct, but it must be noted that the type of controller is irrelevant. Because the second view of 4 is: the control operation to the system memory is not good (due to the control chip Out ^ ς = set ^ controller is different and cooperate with it) 'Guided to = Yi Yuan: the input team resists memory It is not exactly the same ^], because J3 has two and 5: sex-will be with the system in the launch. For example, the controller and the connection 2m and 5m connected to the controller 44- 2- ^ impedance difference between the hidden parts If the test controller 192 behavior is essentially the same as the system memory voltage control number; with: the required electricity ... and ... -.r, DUT., 4A w
580578 五、發明說明(25) 制器4 2相同,大約即一如測試控制器1 9 2和系統記憶控制 器42功能相等,並同型(例如具有同樣貨號和資料碼)。 上述例如包含測試試圖發生器、資料接收機和比較器 的系統内有些元件,可使用程式規劃進行所需功能的微處 理機執行,或另外使用上述組合,或使用已知之任何適當 執行方式,在接於記憶元件的邏輯電路内,以狀態機在晶 片上執行。 凡技術專家均明顯可知受測試的記憶元件,可由單一 記憶晶片或複數記憶晶片或記憶模組構成。580578 V. Description of the invention (25) The controller 4 2 is the same, which is about the same as the test controller 192 and the system memory controller 42 and the same type (for example, they have the same article number and data code). The above, for example, some components of a system containing test generators, data receivers, and comparators, can be executed using a microprocessor programmed to perform the required functions, or in addition to the combinations described above, or using any suitable implementation known Connected to the logic circuit of the memory element and executed on the chip by a state machine. It is obvious to any technical expert that the tested memory element may be composed of a single memory chip or a plurality of memory chips or a memory module.
在本發明變化具體例中,預期資料和受測試元件所得 資料之間比較結果(一如第7A圖之步驟32 0a和第7B圖之步 驟320b所進行),亦可記載於誤差記載單位内。 在本發明變化具體例中,第3圖或第5圖之分接記憶匯 流排,改用直接接線至記憶匯流排線,即可將一或以上之 系統記憶模組安裝在板上。安裝在此板上者還有接至控制 器的驅動器、位址、和記憶匯流排之資料線,驅動此等線 上之#號,經電纜(例如LVDS電纜)至一系列的收發機和 或驅動器,把信號導引至測試組件。分接記憶匯流排 如此變通配置和裝置之一,如第8圖所示。 ( 本發明變通具體例中, 性、準確性和範圍,可相對 件,提供變化各種操作參數 具體例中,進行參數測試, 下進行測試,包含在此等範In the modified example of the present invention, the comparison result between the expected data and the data obtained from the component under test (as performed in step 320a of FIG. 7A and step 320b of FIG. 7B) can also be recorded in the error recording unit. In the modified embodiment of the present invention, one or more system memory modules can be installed on the board by tapping the memory bus of Fig. 3 or Fig. 5 directly to the memory bus. Also installed on this board are the data lines connected to the controller's driver, address, and memory bus, driving the ## on these lines, and through a cable (such as an LVDS cable) to a series of transceivers and / or drives To direct the signal to the test component. The tap memory bus is one of such flexible configurations and devices, as shown in Figure 8. (In the specific examples of the present invention, the sex, accuracy, and scope can be compared with the various parameters to provide various operating parameters. In the specific example, the parameter test is performed, and the next test is included in these examples.
對受測試元件實施的測試可靠 於選擇的測試組件和受剛試元 之手段,而進一步改進。在此 因而可在不同操作參數的範圍 圍之極端進行測試。可以採用The test performed on the component under test can be further improved by the selected test component and the means of the test component. Testing can therefore be performed at the extremes of the range of different operating parameters. Can be used
580578 五、發明說明(26) 行為測試系統,容許以分開的測試模式進行參數測試。 例如參見第9圖,已在第5圖的行為測試系統加上參數 控制元件400。參數控制元件400接至DUT 125,以改變許 多操作參數’包含例如VDD、V_、VTT、VREF。參數控制元件 400亦連接於接至DUT 125的驅動器224,以改變許多操作 參數,包含例如就緒/占用時間、驅動器強度、歪斜率、 “號上升/下降時間、VQL、VQH。參數控制元件亦可接 至資料接收機1 36,以改變許多操作參數,包含例如閱讀 選通時機、V1H、V1L。在與測試組件於真實應用系統内所面 臨-致㈣圍β ’改變操作參數,可達成受 延的測試。 在本發明變通具體例中,提供丰 操作的各種電氣操作條件(例如溫声、又仃Μ測試系統 改進施加於受測試元件的測試可、“、、X ,即可進一步 此具體例t,進行行為測試準確性和範圍。在 圍進行測試,包含在此等範圍之極端進=f作條件的範 法可稱為環境測試。 π y試。此測試方 件 ,技術專家均知此等組件之 功能不需利用說明書内特定 〜· rfr? >ΤΊ 巾 % 明害 之特殊組件進行。二,技術專家顯而易知 元件19 0之功進行之Λ丨電子組件進行,而不受到以 單-電子元件所戶%若:制。又-例a,技術專家顯而易 知,在說明書組件:?件之功能可以組合,以便藉較 少數(至少一)電子,卞進仃。580578 V. Description of the Invention (26) The behavior test system allows parameter testing in separate test modes. For example, referring to FIG. 9, a parameter control element 400 has been added to the behavior test system of FIG. The parameter control element 400 is connected to the DUT 125 to change a number of operating parameters' including, for example, VDD, V_, VTT, VREF. The parameter control element 400 is also connected to the driver 224 connected to the DUT 125 to change many operating parameters including, for example, ready / occupancy time, driver strength, skew rate, "number rise / fall time, VQL, VQH. The parameter control element can also be Connected to the data receiver 1 36 to change many operating parameters, including, for example, reading strobe timing, V1H, V1L. Faced with the test component in a real application system-cause the loop β 'to change the operating parameters to achieve delay In the modified embodiment of the present invention, various electrical operating conditions (such as warm sound and sound testing system to improve the test applied to the component under test) can be provided. t, the accuracy and scope of the behavioral test. The tests performed in the surrounding area, including the extreme progress of the range = f can be called the environmental test. π y test. Technical experts know this test The functions of other components do not need to use the special components specified in the manual ~ rfr? ≫ ΤΊ% special components. Second, technical experts can easily understand the components The electronic components are carried out without being subjected to the single-electronic component ownership. Also, for example a, it is obvious to the technical experts that the functions of the components in the instruction manual can be combined so as to borrow less (At least one) electron, 卞 进 卞.
第30頁 在本發明變中,關於行為測試系統之若干組 580578 五、發明說明(27) 在本發明變通 腦,亦可例如視品 電視、MP3放映機, 以微處理機為基本 電子元件、系統或 參見第1 〇圖, 組以上的測試組件 於一或以上之收發 多元件。 在本發明變通 而已從生產線直接 汰之積體電路元件 不符嚴格之一般規 較不嚴重要求之特 測試’並在較特別 操作參數中實施此 能通過行為測試, 特別可用於原先不 供一種方法和系統 以確保在特殊用途 在本發明變通 限於測試記憶應用 DRAM 、 ED0RAM等), 、特殊功能積體電 具體例中’記憶應用系統不限於個人電 遊樂器、錄音機、網路服務機、數位式 照相機、細胞式電話、使用記憶元件 之凡件’或事實上使用記憶元件之任何 盒。 表示本發明變通具體例中之系統,有一 可從應用系統供應以分接信號,並借助 機和/或邏輯元件,可同時並行測試許 具體例中,受測試元件為原先未測試過 剔除’或原先已被廠商歸類為不良或淘 。雖然7G件可能起初即被廠商淘汰,因 格’但此種元件仍適用於所需元件規格 殊用途。因此,對受測試元件實施行為 適合元件所定用途之範圍内,改變各種 等測試’則原先不良或淘汰的元件,可 並發現適於特別用途。因此,行為測試 良或淘汰元件之再歸類,而本發明即提 ,亦可用來測試原先不良或淘汰元件, 下有正常的功能。 具體例中,說a月書内所述系統和方法不 系統中的記憶元件(例如SDRAM、SRAM、 但本發明亦可採用來測试處理機晶片 路(AS I C)晶片、資料通訊元件、組件、Page 30 In the variation of the present invention, there are several groups of behavior test systems 580578 V. Description of the invention (27) In the present invention, the brain can also be changed, for example, video TV, MP3 projectors, microprocessors as the basic electronic components, systems Or refer to FIG. 10, where more than one test component is used in one or more multi-transceiver components. The special test of the integrated circuit elements which have been modified from the production line and which are directly eliminated from the production line does not conform to the strict general requirements and less severe requirements, and is implemented in more specific operating parameters. This can pass the behavior test, and is particularly applicable to a method and The system is used to ensure that the present invention is limited to special applications such as testing memory applications (DRAM, ED0RAM, etc.), and special-function integrated circuits in specific examples. 'Memory application systems are not limited to personal video game instruments, recorders, network servers, digital cameras , Cell phones, anything that uses memory elements' or virtually any box that uses memory elements. Shows that the system in the specific embodiment of the present invention has a tap signal that can be supplied from the application system, and can be tested in parallel by means of machines and / or logic elements. In specific examples, the tested component is the original one that has not been tested and removed. It has been classified by the manufacturer as Bad or Amoy. Although 7G parts may be phased out by manufacturers from the outset, such components are still suitable for the required component specifications and special applications. Therefore, when the test component is implemented to a range suitable for the intended use of the component, various tests such as those that were originally defective or obsolete can be changed and found to be suitable for a particular application. Therefore, the behavior test can be used to classify the good or eliminated components, and the present invention, as mentioned, can also be used to test the original bad or eliminated components, which have normal functions. In a specific example, the system and method described in the a month book are not memory elements in the system (such as SDRAM, SRAM, but the present invention can also be used to test processor IC (AS IC) chips, data communication components, components) ,
第31頁 580578 五、發明說明 箱,或任 發明一般 元件的應 電子組件 電子組件 ,以決定 另外 應用系統 ,將帶有 接線分接 受測試元 或以上測 型且具有 發射之信 信號加以 在本 用對受測 而構成。 發生器, 組件或元 在本 可經修飾 試,不需 發明分接 (28) 何應用系統内之事實上任何型積體電路元件。本 在應用上,是把系統電子組件定位在類似受測試 用系統内操作,分接接線攜帶信號被發射到系統 ,把那些信號副本導引至受測試元件,並將系統 發射的信號,與受測試元件發射的信號加以比較 受測試元件是否作業適當。 ,本發明在應用上,是把系統控制器,或連接於 内的系統電子組件之一或以上其他電子組件定位 發射來往於系統控制器或者一或以上電子組件的 ,把那些信號副本導引至測試控制器,或連接於 件之一或以上測試組件(其中測試控制器或者一 試組件,與系統控制器或者一或以上電子組,同 同樣功能,把系統控制器或者一或以上電子組件 號,與測試控制器或者一或以上測試組件發射之 比較,以確定受測試元件效能是否按預期。 發明變通具體例中,本發明行為測試系統可先利 試元件只進行習知測試的習知測試系統加以改變 例如,第1圖所示前案習知測試系統的測試圖型 可以改用能提供來自應用系統的輸入之一或以上 件,以構成本發明行為測試系統。 發明變通具體例中,本發明行為測試系統和方法 ,使受測試元件可用源自實際應用系統的信號測 在受測試元件正測試中加以操作。例如,按照本 適當系統接線並把該接線上的信號副本導引至受Page 31 580578 V. Inventory box, or any electronic component of the general component of the invention, to determine another application system, use the signal signal with test points or more and have the emission signal for this application. Constructed for the test. Generators, components or components can be modified and tested without the need to invent taps (28) for virtually any type of integrated circuit element in a system. In this application, the electronic components of the system are positioned and operated in a system similar to the one under test. The tap wires carry signals to the system, guide those signal copies to the tested components, and direct the signals emitted by the system to the receiver. The signal emitted by the test element is compared to whether the test element is operating properly. In the application of the present invention, the system controller, or one or more other electronic components connected to the system, is positioned to transmit to and from the system controller or one or more electronic components, and those signal copies are guided to Test controller, or one or more test components connected to it (where the test controller or a test component has the same function as the system controller or one or more electronic groups, the system controller or one or more electronic components are numbered Compared with the test controller or one or more test component emissions, to determine whether the performance of the tested component is as expected. In a specific embodiment of the invention, the behavior test system of the present invention can first test the test component and perform the conventional test only. The system is changed. For example, the test pattern of the previous case conventional test system shown in FIG. 1 can be changed to one or more pieces that can provide input from the application system to form the behavior test system of the present invention. The behavior testing system and method of the present invention enable the tested component to be tested with signals derived from the actual application system. Be in operation by the test element being tested. For example, a suitable system according to the replica and the signal wiring on the wiring guide to a subject
第32頁 580578 五、發明說明(29) --- 測試元件(或控制器,或接於受測試元件之其他組件)的較 _幻 了施加於受測試元件(或控制器,或接於受測 試元件之其他組件)的應用系統内系統接線上之信號,可 改為f f在記憶體或儲存元件内。基本上,應用系統產生 的測試信號,係捕集或記錄在記憶體或儲存元件,供隨後 使用]儲存的測試信號再使用例如驅動器或邏輯元件,施 加於受測試元件。結果,在本發明此等變通具體例中,於 受測試$件在測試之際,應用系統不一定是行為測試系統 的一部份。然而,受測試元件仍經行為測試,一如源自實 際應用系統的信號仍用來測試受測試元件,因而把受測試 元件暴露在代表元件最終在所欲應用環境中使用時所需操 作條件。按照本發明所設計行為測試系統的變通具體例如 第1 1 A、11β、1 1C和11D圖所示,分別為第3、4A、5和9圖 之修飾。在本發明此等變通具體例中,應用系統發生的信 號’利用測試組件從記憶元件41 〇而非所接應用系統接收 。不過,記憶元件4 1 0仍對測試組件1 1 9 (第1 1 A、1 1 Β、1 1 D 圖)、169(第11B圖),提供來自實際應用系統發生之信號 ’要施加於受測試元件125(第11A、11C、11D圖)或測試控 制器1 9 2 (第1 1 β圖),並與受測試元件! 2 5或測試控制器1 9 2 之輸出比較。微控制器139(第11Α、11C、11D圖)、204(第 11B圖)可經I/O接線411接收輸入或提供輸出至其他元件。 在本發明變通具體例中,代表在應用系統内實際信號 的測試信號’可利用模擬元件模式化或模擬,隨後儲存於 記憶體或儲存元件内。儲存之測試信號可例如使用驅動器 «Page 32 580578 V. Description of the invention (29) --- The test element (or controller, or other components connected to the test component) is more or less applied to the test component (or controller, or connected to the test component) The signals on the system wiring in the application system of the test component) can be changed to ff in the memory or storage component. Basically, the test signal generated by the application system is captured or recorded in the memory or storage element for subsequent use. The stored test signal is then applied to the component under test using, for example, a drive or logic element. As a result, in these modified embodiments of the present invention, the application system may not be part of the behavior test system when the tested component is being tested. However, the device under test is still behaviorally tested, as signals from the actual application system are still used to test the device under test, thus exposing the device under test to the operating conditions required to represent the device when it is ultimately used in the intended application environment. Specific modifications of the behavior test system designed in accordance with the present invention are shown in Figures 1 A, 11β, 11C, and 11D, which are modifications of Figures 3, 4A, 5, and 9, respectively. In these variant embodiments of the present invention, the signal generated by the application system is received from the memory element 41 by the test component instead of the connected application system. However, the memory element 4 1 0 still provides test signals 1 1 9 (Fig. 1 A, 1 1 B, 1 1 D), 169 (Fig. 11B), and provides signals generated from the actual application system. Test element 125 (pictures 11A, 11C, 11D) or test controller 1 9 2 (picture 1 1 β), and compare with the test element! Compare the output of 2 5 or test controller 192. The microcontroller 139 (Figure 11A, 11C, 11D), 204 (Figure 11B) can receive input or provide output to other components via the I / O connection 411. In a modified embodiment of the present invention, the test signal 'representing the actual signal in the application system can be patterned or simulated using an analog component, and then stored in a memory or a storage component. Stored test signals can be used, for example, with a drive «
第33頁 580578 五、發明說明(30) 或邏輯元件,施加於受測試元件。 技術專家明顯可知,本案所述系統和方法之其他各種 修飾和採取,可不違本發明,其範圍如申請專利範圍所限 定0 1^· 第34頁 580578 圖式簡单說明 第1圖為積體電路記憶元件典型習知測試系統之簡圖 9 第2 A圖為記憶應用系統若干組件之簡圖; 第2B圖為行為測試系統基本建築之簡圖; 第2C圖為典型PC應用系統若干組件之簡圖; 第3圖為本發明較佳具體例之簡圖; 第4A圖為本發明另一較佳具體例之簡圖; 第4B圖為第4A圖使用二電路板實施之簡圖; _ 第5圖為本發明另一較佳具體例之簡圖; - 第6圖為記憶晶片測試方法中所進行步驟之流程圖; 第7A和7B圖為記憶晶片經行為測試的方法中另一具體 例之步驟流程圖; 第8圖為本發明各種具體例内記憶匯流排分接配置和 裝置; 第9圖為使用參數控制元件的本發明具體之簡圖; 第1 0圖為複數受測試元件並行測試的本發明變化具體 . 例之簡圖; 第1 1 A、1 1 B、1 1 C、1 1 D圖為供應至測試組件的應用信 號儲存在記憶元件内的系統之本發明變化具體例簡圖。Page 33 580578 V. Description of invention (30) or logic element, applied to the component under test. It is obvious to the technical experts that other modifications and adoptions of the system and method described in this case may not violate the present invention, and the scope is as defined by the scope of the patent application. 0 1 ^ · Page 34 580578 Schematic description The first figure is a product A schematic diagram of a typical conventional test system for circuit memory components. Figure 2A is a simplified diagram of some components of a memory application system; Figure 2B is a simplified diagram of the basic building of a behavioral test system; Figure 2C is a diagram of some components of a typical PC application system Schematic diagram; Fig. 3 is a diagram of a preferred embodiment of the present invention; Fig. 4A is a diagram of another preferred embodiment of the present invention; Fig. 4B is a diagram of the implementation of two circuit boards in Fig. 4A; Figure 5 is a simplified diagram of another preferred embodiment of the present invention;-Figure 6 is a flowchart of the steps performed in the memory chip test method; Figures 7A and 7B are another specific method in the memory chip test method The flowchart of the steps of the example; Figure 8 is the memory bus tap configuration and device in various specific examples of the present invention; Figure 9 is a specific simplified diagram of the present invention using parameter control elements; Figure 10 is a plurality of tested elements Parallel testing Specific diagram of the variation of; The first 1 1 A, 1 1 B, 1 1 C, 1 1 D picture shows the test signal supplied to the application component of the system changes stored in the memory element embodiment of the invention is particularly schematic.
第35頁Page 35
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| TW548414B (en) | 2002-01-29 | 2003-08-21 | Via Tech Inc | Automatic integrated circuit overall machine testing system, apparatus and its method |
| US7536181B2 (en) | 2002-02-15 | 2009-05-19 | Telefonaktiebolaget L M Ericsson (Publ) | Platform system for mobile terminals |
| US8079015B2 (en) | 2002-02-15 | 2011-12-13 | Telefonaktiebolaget L M Ericsson (Publ) | Layered architecture for mobile terminals |
| US7415270B2 (en) | 2002-02-15 | 2008-08-19 | Telefonaktiebolaget L M Ericsson (Publ) | Middleware services layer for platform system for mobile terminals |
| US7363033B2 (en) | 2002-02-15 | 2008-04-22 | Telefonaktiebolaget Lm Ericsson (Publ) | Method of and system for testing equipment during manufacturing |
| TW567329B (en) * | 2002-07-30 | 2003-12-21 | Via Tech Inc | Auto system-level test apparatus and method |
| US7350211B2 (en) | 2002-09-23 | 2008-03-25 | Telefonaktiebolaget Lm Ericsson (Publ) | Middleware application environment |
| US7478395B2 (en) | 2002-09-23 | 2009-01-13 | Telefonaktiebolaget L M Ericsson (Publ) | Middleware application message/event model |
| US7149510B2 (en) | 2002-09-23 | 2006-12-12 | Telefonaktiebolaget Lm Ericsson (Publ) | Security access manager in middleware |
| EP1447672B1 (en) * | 2003-02-13 | 2006-10-18 | Matsushita Electric Industrial Co., Ltd. | Assembly for LSI test |
| DE102004021267B4 (en) * | 2004-04-30 | 2008-04-17 | Infineon Technologies Ag | Method for testing a memory module and test arrangement |
| US20070058456A1 (en) * | 2005-09-09 | 2007-03-15 | Rico Srowik | Integrated circuit arrangement |
| US7539912B2 (en) | 2005-12-15 | 2009-05-26 | King Tiger Technology, Inc. | Method and apparatus for testing a fully buffered memory module |
| TWI395960B (en) * | 2006-11-27 | 2013-05-11 | Hon Hai Prec Ind Co Ltd | Device and method for testing data transfer rate |
| US7848899B2 (en) | 2008-06-09 | 2010-12-07 | Kingtiger Technology (Canada) Inc. | Systems and methods for testing integrated circuit devices |
| JP5487770B2 (en) * | 2009-07-21 | 2014-05-07 | ソニー株式会社 | Solid-state imaging device |
| US8356215B2 (en) | 2010-01-19 | 2013-01-15 | Kingtiger Technology (Canada) Inc. | Testing apparatus and method for analyzing a memory module operating within an application system |
| US8918686B2 (en) | 2010-08-18 | 2014-12-23 | Kingtiger Technology (Canada) Inc. | Determining data valid windows in a system and method for testing an integrated circuit device |
| US9003256B2 (en) | 2011-09-06 | 2015-04-07 | Kingtiger Technology (Canada) Inc. | System and method for testing integrated circuits by determining the solid timing window |
| US8724408B2 (en) | 2011-11-29 | 2014-05-13 | Kingtiger Technology (Canada) Inc. | Systems and methods for testing and assembling memory modules |
| US9117552B2 (en) | 2012-08-28 | 2015-08-25 | Kingtiger Technology(Canada), Inc. | Systems and methods for testing memory |
| CN112363875B (en) * | 2020-10-21 | 2023-04-07 | 海光信息技术股份有限公司 | System defect detection method, device, electronic device and storage medium |
| CN119541608B (en) * | 2025-01-22 | 2025-04-25 | 合肥康芯威存储技术有限公司 | A storage device testing system and a storage device testing method |
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| US4001818A (en) * | 1975-10-22 | 1977-01-04 | Storage Technology Corporation | Digital circuit failure detector |
| CA1163721A (en) * | 1980-08-18 | 1984-03-13 | Milan Slamka | Apparatus for the dynamic in-circuit testing of electronic digital circuit elements |
| US6055653A (en) * | 1998-04-27 | 2000-04-25 | Compaq Computer Corporation | Method and apparatus for testing gang memory modules |
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