TW202111048A - Adhesive sheet, intermediate laminate, method for manufacturing intermediate laminate, and method for manufacturing finished laminate - Google Patents
Adhesive sheet, intermediate laminate, method for manufacturing intermediate laminate, and method for manufacturing finished laminate Download PDFInfo
- Publication number
- TW202111048A TW202111048A TW109120266A TW109120266A TW202111048A TW 202111048 A TW202111048 A TW 202111048A TW 109120266 A TW109120266 A TW 109120266A TW 109120266 A TW109120266 A TW 109120266A TW 202111048 A TW202111048 A TW 202111048A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- state
- adhesive composition
- adhesive layer
- wavelength
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 404
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 390
- 238000004519 manufacturing process Methods 0.000 title claims description 90
- 238000000034 method Methods 0.000 title claims description 23
- 239000012790 adhesive layer Substances 0.000 claims abstract description 180
- 239000000203 mixture Substances 0.000 claims abstract description 167
- 230000008859 change Effects 0.000 claims abstract description 64
- 238000002834 transmittance Methods 0.000 claims description 115
- 229920000642 polymer Polymers 0.000 claims description 71
- 239000002253 acid Substances 0.000 claims description 48
- 230000004936 stimulating effect Effects 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 45
- 238000006243 chemical reaction Methods 0.000 claims description 41
- 150000001875 compounds Chemical class 0.000 claims description 41
- 239000003999 initiator Substances 0.000 claims description 35
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 21
- 231100000344 non-irritating Toxicity 0.000 claims description 16
- 238000003860 storage Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 abstract description 24
- 230000007423 decrease Effects 0.000 abstract description 4
- 230000002427 irreversible effect Effects 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 81
- 239000000178 monomer Substances 0.000 description 64
- 239000003431 cross linking reagent Substances 0.000 description 42
- 229920002554 vinyl polymer Polymers 0.000 description 41
- -1 polyethylene terephthalate Polymers 0.000 description 35
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 33
- 238000002156 mixing Methods 0.000 description 29
- 239000004848 polyfunctional curative Substances 0.000 description 26
- 238000002360 preparation method Methods 0.000 description 23
- 238000013329 compounding Methods 0.000 description 22
- 238000004132 cross linking Methods 0.000 description 17
- 125000000524 functional group Chemical group 0.000 description 17
- 238000001723 curing Methods 0.000 description 16
- 229920000058 polyacrylate Polymers 0.000 description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 15
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- 125000000217 alkyl group Chemical group 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- 239000003505 polymerization initiator Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 10
- 230000003014 reinforcing effect Effects 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 230000000638 stimulation Effects 0.000 description 10
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 9
- 239000012948 isocyanate Substances 0.000 description 9
- 150000002513 isocyanates Chemical class 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 125000004386 diacrylate group Chemical group 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000000049 pigment Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 7
- 239000002202 Polyethylene glycol Substances 0.000 description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 229920001223 polyethylene glycol Polymers 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 238000004040 coloring Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- 230000032683 aging Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical class OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 4
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 125000005375 organosiloxane group Chemical group 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 3
- 150000004010 onium ions Chemical class 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 3
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- MZNSQRLUUXWLSB-UHFFFAOYSA-N 2-ethenyl-1h-pyrrole Chemical compound C=CC1=CC=CN1 MZNSQRLUUXWLSB-UHFFFAOYSA-N 0.000 description 2
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000003759 ester based solvent Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229920002457 flexible plastic Polymers 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- YIWGJFPJRAEKMK-UHFFFAOYSA-N 1-(2H-benzotriazol-5-yl)-3-methyl-8-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carbonyl]-1,3,8-triazaspiro[4.5]decane-2,4-dione Chemical group CN1C(=O)N(c2ccc3n[nH]nc3c2)C2(CCN(CC2)C(=O)c2cnc(NCc3cccc(OC(F)(F)F)c3)nc2)C1=O YIWGJFPJRAEKMK-UHFFFAOYSA-N 0.000 description 1
- HASUCEDGKYJBDC-UHFFFAOYSA-N 1-[3-[[bis(oxiran-2-ylmethyl)amino]methyl]cyclohexyl]-n,n-bis(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC1CC(CN(CC2OC2)CC2OC2)CCC1)CC1CO1 HASUCEDGKYJBDC-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- BFYSJBXFEVRVII-UHFFFAOYSA-N 1-prop-1-enylpyrrolidin-2-one Chemical compound CC=CN1CCCC1=O BFYSJBXFEVRVII-UHFFFAOYSA-N 0.000 description 1
- WLRIOEJDMDJFIK-UHFFFAOYSA-N 12-methyltridecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCOC(=O)C=C WLRIOEJDMDJFIK-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- 125000000143 2-carboxyethyl group Chemical group [H]OC(=O)C([H])([H])C([H])([H])* 0.000 description 1
- ZDHWTWWXCXEGIC-UHFFFAOYSA-N 2-ethenylpyrimidine Chemical compound C=CC1=NC=CC=N1 ZDHWTWWXCXEGIC-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- VNGLVZLEUDIDQH-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;2-methyloxirane Chemical compound CC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 VNGLVZLEUDIDQH-UHFFFAOYSA-N 0.000 description 1
- WPSWDCBWMRJJED-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;oxirane Chemical compound C1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WPSWDCBWMRJJED-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- PGFKZWFWBYNKGP-UHFFFAOYSA-N 5-ethenyl-2,3-dihydrofuran Chemical compound C=CC1=CCCO1 PGFKZWFWBYNKGP-UHFFFAOYSA-N 0.000 description 1
- OCIFJWVZZUDMRL-UHFFFAOYSA-N 6-hydroxyhexyl prop-2-enoate Chemical compound OCCCCCCOC(=O)C=C OCIFJWVZZUDMRL-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- XPOALFWLMRPVGK-UHFFFAOYSA-N C(C1=CC=CC=C1)OC(C1=CC=CC=C1)(C1=CC=CC=C1)C1=CCC(C=C1)(N(C)C)N(C)C Chemical compound C(C1=CC=CC=C1)OC(C1=CC=CC=C1)(C1=CC=CC=C1)C1=CCC(C=C1)(N(C)C)N(C)C XPOALFWLMRPVGK-UHFFFAOYSA-N 0.000 description 1
- YWRSUCYXMVUTBG-UHFFFAOYSA-N CC(=O)C.CC(=O)C.CC(=O)C.CC(=O)C.[Fe] Chemical compound CC(=O)C.CC(=O)C.CC(=O)C.CC(=O)C.[Fe] YWRSUCYXMVUTBG-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- AEKNYBWUEYNWMJ-QWOOXDRHSA-N Pramiconazole Chemical compound O=C1N(C(C)C)CCN1C1=CC=C(N2CCN(CC2)C=2C=CC(OC[C@@H]3O[C@](CN4N=CN=C4)(CO3)C=3C(=CC(F)=CC=3)F)=CC=2)C=C1 AEKNYBWUEYNWMJ-QWOOXDRHSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N Resorcinol Natural products OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- KJVBXWVJBJIKCU-UHFFFAOYSA-N [hydroxy(2-hydroxyethoxy)phosphoryl] prop-2-enoate Chemical compound OCCOP(O)(=O)OC(=O)C=C KJVBXWVJBJIKCU-UHFFFAOYSA-N 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 102000011759 adducin Human genes 0.000 description 1
- 108010076723 adducin Proteins 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 150000008431 aliphatic amides Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229940037003 alum Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000005410 aryl sulfonium group Chemical group 0.000 description 1
- 239000007869 azo polymerization initiator Substances 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- BVFSYZFXJYAPQJ-UHFFFAOYSA-N butyl(oxo)tin Chemical compound CCCC[Sn]=O BVFSYZFXJYAPQJ-UHFFFAOYSA-N 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- OMRRUNXAWXNVFW-UHFFFAOYSA-N fluoridochlorine Chemical compound ClF OMRRUNXAWXNVFW-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 235000013847 iso-butane Nutrition 0.000 description 1
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- MMCOUVMKNAHQOY-UHFFFAOYSA-L oxido carbonate Chemical compound [O-]OC([O-])=O MMCOUVMKNAHQOY-UHFFFAOYSA-L 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- AZJPTIGZZTZIDR-UHFFFAOYSA-L rose bengal Chemical compound [K+].[K+].[O-]C(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C1=C2C=C(I)C(=O)C(I)=C2OC2=C(I)C([O-])=C(I)C=C21 AZJPTIGZZTZIDR-UHFFFAOYSA-L 0.000 description 1
- 229930187593 rose bengal Natural products 0.000 description 1
- 229940081623 rose bengal Drugs 0.000 description 1
- STRXNPAVPKGJQR-UHFFFAOYSA-N rose bengal A Natural products O1C(=O)C(C(=CC=C2Cl)Cl)=C2C21C1=CC(I)=C(O)C(I)=C1OC1=C(I)C(O)=C(I)C=C21 STRXNPAVPKGJQR-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N sec-butylidene Natural products CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N tetraisopropyl titanate Substances CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- RRLMGCBZYFFRED-UHFFFAOYSA-N undecyl prop-2-enoate Chemical compound CCCCCCCCCCCOC(=O)C=C RRLMGCBZYFFRED-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本發明係關於一種黏著片材、中間積層體、中間積層體之製造方法及製品積層體之製造方法,詳細而言,係關於一種黏著片材、使用該黏著片材而獲得之中間積層體、製造該中間積層體之方法、及使用該中間積層體而獲得之製品積層體之製造方法。The present invention relates to an adhesive sheet, an intermediate laminate, a method for manufacturing an intermediate laminate, and a method for manufacturing a product laminate. In detail, it relates to an adhesive sheet, an intermediate laminate obtained by using the adhesive sheet, A method of manufacturing the intermediate laminate, and a method of manufacturing a product laminate obtained by using the intermediate laminate.
先前,就表面保護及耐衝擊性賦予之觀點而言,已知於電子元件之表面貼附補強膜。Previously, from the viewpoint of surface protection and impact resistance imparting, it has been known to attach a reinforcing film to the surface of an electronic component.
作為此種補強膜,已知有具備包含光硬化性組合物之黏著劑層,藉由於與被黏著體接著後使黏著劑層光硬化而使與被黏著體之接著力上升的補強膜(例如參照專利文獻1)。As such a reinforcing film, there is known a reinforcing film provided with an adhesive layer containing a photocurable composition, which increases the adhesive force with the adherend by light-curing the adhesive layer after being bonded to the adherend (for example, Refer to Patent Document 1).
若將此種補強膜貼附於被黏著體,則於使黏著劑層光硬化之前,接著力較小,因而容易二次加工,另一方面,於使黏著劑層光硬化之後,接著力變高,因而能夠對被黏著體進行補強。 [先前技術文獻] [專利文獻]If this kind of reinforcing film is attached to the adherend, the adhesive force is small before the adhesive layer is light-cured, so secondary processing is easy. On the other hand, after the adhesive layer is light-cured, the adhesive force becomes High, so it can reinforce the adherend. [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本專利第6467551號公報[Patent Document 1] Japanese Patent No. 6467551
[發明所欲解決之問題][The problem to be solved by the invention]
另一方面,存在不欲使此種補強膜之全部殘留而使補強膜之一部分剝離之要求。On the other hand, there is a demand that it is not desired to leave all of the reinforcing film and to peel off a part of the reinforcing film.
於此種情形時,對欲使之殘留之部分(以下稱為殘留部分)照射光,對欲剝離之部分(以下稱為剝離部分)不照射光。如此,殘留部分之接著力較強,因而能夠直接殘留,剝離部分之接著力較低,因而能夠剝離。In this case, light is irradiated to the portion to be left (hereinafter referred to as the residual portion), and light is not irradiated to the portion to be peeled (hereinafter referred to as the peeled portion). In this way, the adhesive force of the remaining part is strong, so it can remain directly, and the adhesive force of the peeled part is low, so it can be peeled off.
另一方面,於將剝離部分剝離時,首先,將殘留部分與剝離部分之邊界切斷,以剝離部分之邊緣為起點將剝離部分剝離,但由於以目視無法區別殘留部分與剝離部分,故而存在無法視覺上判別上述邊界之不良情況。On the other hand, when peeling off the peeled part, firstly, the boundary between the remaining part and the peeled part is cut off, and the peeled part is peeled from the edge of the peeled part as a starting point. However, the residual part and the peeled part cannot be distinguished visually. It is impossible to visually distinguish the above-mentioned boundary defects.
本發明在於提供一種藉由於貼附於被黏著體後對任意部分賦予外部刺激,而能夠僅將任意部分殘留或去除之黏著片材、使用該黏著片材而獲得之中間積層體、製造該中間積層體之方法、及使用該中間積層體而獲得之製品積層體之製造方法。 [解決問題之技術手段]The present invention is to provide an adhesive sheet that can leave or remove only an arbitrary part by applying external stimuli to an arbitrary part after being attached to an adherend, an intermediate laminate obtained by using the adhesive sheet, and manufacture the intermediate A method of a laminate, and a method of manufacturing a product laminate obtained by using the intermediate laminate. [Technical means to solve the problem]
本發明[1]係一種黏著片材,其具備基材及配置於上述基材之一面之黏著層;且上述黏著層包含黏著性組合物,該黏著性組合物於波長550 nm下之可見光透過率可藉由外部刺激而降低,且可藉由上述外部刺激而向黏著力較高之狀態與黏著力較低之狀態不可逆地進行狀態變化。The present invention [1] is an adhesive sheet comprising a substrate and an adhesive layer disposed on one surface of the substrate; and the adhesive layer includes an adhesive composition that transmits visible light at a wavelength of 550 nm The rate can be reduced by external stimuli, and the above-mentioned external stimuli can irreversibly change state to a state with higher adhesion and a state with lower adhesion.
本發明[2]包含如上述[1]中記載之黏著片材,其中上述外部刺激為活性能量束照射。The present invention [2] includes the adhesive sheet as described in [1] above, wherein the external stimulus is active energy beam irradiation.
本發明[3]包含如上述[1]或[2]中記載之黏著片材,其中上述黏著層包含第1黏著性組合物,該第1黏著性組合物於波長550 nm下之可見光透過率可藉由活性能量束照射而降低,且可藉由活性能量束照射而自黏著力較高之狀態向黏著力較低之狀態不可逆地進行狀態變化;上述第1黏著性組合物包含聚合物、第1光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑。The present invention [3] includes the adhesive sheet as described in [1] or [2], wherein the adhesive layer comprises a first adhesive composition, and the visible light transmittance of the first adhesive composition at a wavelength of 550 nm It can be reduced by active energy beam irradiation, and the state can be irreversibly changed from a state with high adhesive force to a state with low adhesive force by active energy beam irradiation; the first adhesive composition includes a polymer, The first light hardener, a photopolymerization initiator, a compound that develops color by reaction with an acid, and a photoacid generator.
本發明[4]包含如上述[3]中記載之黏著片材,其中狀態變化前之黏著層於25℃下之剪切儲存彈性模數G'為6×104
Pa以上9×104
Pa以下,狀態變化後之黏著層3於25℃下之剪切儲存彈性模數G'為2.00×106
Pa以上5.00×106
Pa以下。The present invention [4] includes the adhesive sheet as described in [3] above, wherein the shear storage elastic modulus G'of the adhesive layer before the state change at 25°C is 6×10 4 Pa or more and 9×10 4 Pa Hereinafter, the shear storage elastic modulus G'of the
本發明[5]包含如上述[1]或[2]中記載之黏著片材,其中上述黏著層包含第2黏著性組合物,該第2黏著性組合物於波長550 nm下之可見光透過率可藉由活性能量束照射而降低,且可藉由活性能量束照射而自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化;上述第2黏著性組合物包含聚合物、第2光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑。The present invention [5] includes the adhesive sheet as described in [1] or [2], wherein the adhesive layer comprises a second adhesive composition, and the visible light transmittance of the second adhesive composition at a wavelength of 550 nm It can be reduced by active energy beam irradiation, and the state can be irreversibly changed from a state with low adhesive force to a state with high adhesive force by active energy beam irradiation; the second adhesive composition described above includes a polymer, The second light hardener, a photopolymerization initiator, a compound that develops color by reaction with an acid, and a photoacid generator.
本發明[6]包含如上述[5]中記載之黏著片材,其中狀態變化前之上述黏著層於25℃下之剪切儲存彈性模數G'為1×104 Pa以上1.2×105 Pa以下,狀態變化後之上述黏著層於25℃下之剪切儲存彈性模數G'為1.5×105 Pa以上2.0×106 Pa以下。The present invention [6] includes the adhesive sheet as described in [5] above, wherein the shear storage elastic modulus G'of the adhesive layer at 25°C before the state change is 1×10 4 Pa or more and 1.2×10 5 Below Pa, the shear storage elastic modulus G'of the adhesive layer at 25°C after the state change is 1.5×10 5 Pa or more and 2.0×10 6 Pa or less.
本發明[7]係一種中間積層體,其具備:具有基材及配置於上述基材之一面之黏著層的黏著片材、以及配置於上述黏著片材之一面的被黏著體;且上述黏著層包含黏著性組合物,該黏著性組合物於波長550 nm下之可見光透過率可藉由外部刺激而降低且可藉由上述外部刺激而向黏著力較高之狀態與黏著力較低之狀態不可逆地進行狀態變化;上述黏著層具備:包含黏著力較高之狀態之黏著性組合物之高黏著區域、及包含黏著力較低之狀態之黏著性組合物之低黏著區域;上述高黏著區域及上述低黏著區域中之任一者於波長550 nm下之可見光透過率小於另一者。The present invention [7] is an intermediate laminate comprising: an adhesive sheet having a substrate and an adhesive layer arranged on one side of the substrate, and an adherend arranged on one side of the adhesive sheet; and the above-mentioned adhesive The layer contains an adhesive composition, the visible light transmittance of the adhesive composition at a wavelength of 550 nm can be reduced by external stimuli and can be moved to a state of higher adhesive force and a state of lower adhesive force by the external stimulus. The state changes irreversibly; the above-mentioned adhesive layer has: a high-adhesive area including an adhesive composition in a state with a higher adhesive force, and a low-adhesion area including an adhesive composition in a state with a lower adhesive force; the above-mentioned high-adhesion area And the visible light transmittance of any one of the aforementioned low adhesion regions at a wavelength of 550 nm is less than the other.
本發明[8]包含如上述[7]中記載之中間積層體,其中上述黏著層包含第1黏著性組合物,該第1黏著性組合物於波長550 nm下之可見光透過率可藉由活性能量束照射而降低,且可藉由活性能量束照射而自黏著力較高之狀態向黏著力較低之狀態不可逆地進行狀態變化,上述高黏著區域包含狀態變化前之上述第1黏著性組合物;上述低黏著區域包含狀態變化後之上述第1黏著性組合物,上述低黏著區域之波長550 nm下之可見光透過率小於上述高黏著區域之波長550 nm下之可見光透過率。The present invention [8] includes the intermediate laminate as described in [7] above, wherein the adhesive layer includes a first adhesive composition whose visible light transmittance at a wavelength of 550 nm can be activated by The energy beam is irradiated, and the state can be changed irreversibly from a state with high adhesive force to a state with low adhesive force by irradiation with active energy beam. The high-adhesion area includes the first adhesive combination before the state change The low adhesion area includes the first adhesive composition after the state change, the visible light transmittance at a wavelength of 550 nm in the low adhesion area is less than the visible light transmittance at a wavelength of 550 nm in the high adhesion area.
本發明[9]包含如上述[7]中記載之中間積層體,其中上述黏著層包含第2黏著性組合物,該第2黏著性組合物於波長550 nm下之可見光透過率可藉由活性能量束照射而降低,且可藉由活性能量束照射而自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化,且上述低黏著區域包含狀態變化前之上述第2黏著性組合物;上述高黏著區域包含狀態變化後之上述第2黏著性組合物,上述高黏著區域之波長550 nm下之可見光透過率小於上述低黏著區域之波長550 nm下之可見光透過率。The present invention [9] includes the intermediate laminate as described in [7] above, wherein the adhesive layer includes a second adhesive composition whose visible light transmittance at a wavelength of 550 nm can be activated by The energy beam is irradiated to decrease, and the state can be changed irreversibly from the state of low adhesive force to the state of high adhesive force by the irradiation of active energy beam, and the low-adhesion area includes the second adhesiveness before the state change The composition; the high-adhesion area includes the second adhesive composition after the state change, the visible light transmittance of the high-adhesion area at a wavelength of 550 nm is less than the visible light transmittance of the low-adhesion area at a wavelength of 550 nm.
本發明[10]係一種中間積層體之製造方法,該方法包括如下步驟:準備具備基材及黏著層之黏著片材,上述黏著層配置於上述基材之一面,且包含黏著性組合物,該黏著性組合物於波長550 nm下之可見光透過率可藉由外部刺激而降低且可藉由上述外部刺激而向黏著力較高之狀態與黏著力較低之狀態不可逆地進行狀態變化;於上述黏著片材之一面配置被黏著體;及對上述黏著層之一部分賦予上述外部刺激,於上述黏著層形成被賦予上述外部刺激之刺激部分、及未被賦予上述外部刺激之非刺激部分,藉此上述刺激部分及上述非刺激部分中之任一者成為黏著力較高之狀態之高黏著區域,另一者成為黏著力較低之狀態之低黏著區域,且,上述刺激部分於波長550 nm下之可見光透過率小於上述非刺激部分於波長550 nm下之可見光透過率。The present invention [10] is a method for manufacturing an intermediate laminate. The method includes the following steps: preparing an adhesive sheet having a substrate and an adhesive layer, the adhesive layer is disposed on one side of the substrate and includes an adhesive composition, The visible light transmittance of the adhesive composition at a wavelength of 550 nm can be reduced by external stimuli and can be irreversibly changed to a state with higher adhesive force and a state with lower adhesive force by the external stimulus; An adherend is arranged on one side of the adhesive sheet; and the external stimulus is applied to a part of the adhesive layer, and a stimulus part provided with the external stimulus and a non-irritated part not provided with the external stimulus are formed on the adhesive layer, by Either one of the above-mentioned stimulating part and the above-mentioned non-stimulating part becomes a high-adhesion area with a high adhesive force, and the other becomes a low-adhesive area with a low adhesive force, and the above-mentioned stimulating part is at a wavelength of 550 nm The visible light transmittance below is lower than the visible light transmittance of the non-irritating part at a wavelength of 550 nm.
本發明[11]包含如上述[10]中記載之中間積層體之製造方法,其中上述黏著層包含第1黏著性組合物,該第1黏著性組合物於波長550 nm下之可見光透過率可藉由外部刺激而降低,且可藉由上述外部刺激而自黏著力較高之狀態向黏著力較低之狀態不可逆地進行狀態變化,上述刺激部分成為上述低黏著區域,且上述非刺激部分成為上述高黏著區域。The present invention [11] includes the method for manufacturing an intermediate laminate as described in [10] above, wherein the adhesive layer includes a first adhesive composition whose visible light transmittance at a wavelength of 550 nm can be It is reduced by external stimuli, and the state can be irreversibly changed from a state with high adhesive force to a state with low adhesive force by the external stimulus, the stimulating part becomes the low adhesion area, and the non-irritating part becomes The above-mentioned high adhesion area.
本發明[12]包含如上述[10]中記載之中間積層體之製造方法,其中上述黏著層包含第2黏著性組合物,該第2黏著性組合物於波長550 nm下之可見光透過率可藉由外部刺激而降低,且可藉由上述外部刺激而自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化,上述刺激部分成為上述高黏著區域,且上述非刺激部分成為上述低黏著區域。The present invention [12] includes the method for manufacturing an intermediate laminate as described in [10] above, wherein the adhesive layer includes a second adhesive composition, and the visible light transmittance of the second adhesive composition at a wavelength of 550 nm can be It is reduced by external stimuli, and the state can be irreversibly changed from a state with low adhesive force to a state with high adhesive force due to the external stimulus, the stimulating part becomes the high adhesion area, and the non-irritating part becomes The above low adhesion area.
本發明[13]包含一種製品積層體之製造方法,該方法包括如下步驟:準備藉由如上述[10]至[12]中任一項中記載之中間積層體之製造方法所製造的中間積層體;及將上述黏著層中之上述低黏著區域除去。 [發明之效果]The present invention [13] includes a method for manufacturing a product laminate, the method comprising the steps of preparing an intermediate laminate produced by the method for manufacturing an intermediate laminate as described in any one of [10] to [12] above Body; and the above-mentioned low-adhesion area in the above-mentioned adhesive layer is removed. [Effects of Invention]
本發明之黏著片材具備黏著層,且黏著層包含黏著性組合物,該黏著性組合物於波長550 nm下之可見光透過率可藉由外部刺激而降低,且可藉由外部刺激而向黏著力較高之狀態與黏著力較低之狀態不可逆地進行狀態變化。The adhesive sheet of the present invention has an adhesive layer, and the adhesive layer contains an adhesive composition. The visible light transmittance of the adhesive composition at a wavelength of 550 nm can be reduced by external stimuli and can be adhered by external stimuli. The state of higher force and the state of lower adhesive force irreversibly change state.
若對該黏著片材之一部分賦予外部刺激,則被賦予外部刺激之部分於波長550 nm下之可見光透過率降低,並且黏著力產生變化(黏著力變高或變低)。If an external stimulus is applied to a part of the adhesive sheet, the visible light transmittance at a wavelength of 550 nm of the part to which the external stimulus is applied decreases, and the adhesive force changes (the adhesive force becomes higher or lower).
即,被賦予外部刺激之部分與未被賦予外部刺激之部分,其黏著力互不相同,且於波長550 nm下之可見光透過率互不相同。That is, the adhesive force of the part given external stimulus and the part not given external stimulus is different from each other, and the visible light transmittance at a wavelength of 550 nm is different from each other.
由於被賦予外部刺激之部分與未被賦予外部刺激之部分於波長550 nm下之可見光透過率不同,故而視覺上能夠容易地判別被賦予外部刺激之部分與未被賦予外部刺激之部分之邊界,其結果為,能夠容易地除去被賦予外部刺激之部分與未被賦予外部刺激之部分中黏著力相對較低之部分。Since the visible light transmittance at a wavelength of 550 nm is different between the part given external stimulus and the part not given external stimulus, the boundary between the part given external stimulus and the part not given external stimulus can be easily distinguished visually. As a result, it is possible to easily remove the relatively low adhesive force of the part to which the external stimulus is applied and the part to which the external stimulus is not applied.
於本發明之中間積層體中,黏著層具備黏著力較高之狀態之高黏著區域、及黏著力較低之狀態之低黏著區域,且高黏著區域及低黏著區域中之任一者於波長550 nm下之可見光透過率小於另一者。In the intermediate layered body of the present invention, the adhesive layer has a high-adhesive area in a state with higher adhesive force and a low-adhesion area in a state with lower adhesive force, and any one of the high-adhesion area and the low-adhesion area is at a wavelength The visible light transmittance at 550 nm is less than the other.
藉此,視覺上能夠容易地判別高黏著區域與低黏著區域之邊界,其結果為,能夠容易地除去低黏著區域。Thereby, the boundary between the high-adhesion area and the low-adhesion area can be easily distinguished visually, and as a result, the low-adhesion area can be easily removed.
本發明之中間積層體之製造方法包括如下步驟:對黏著層之一部分賦予外部刺激,於黏著層形成被賦予外部刺激之刺激部分、及未被賦予外部刺激之非刺激部分,藉此刺激部分及非刺激部分中之任一者成為黏著力較高之狀態之高黏著區域,另一者成為黏著力較低之狀態之低黏著區域,且刺激部分於波長550 nm下之可見光透過率小於非刺激部分於波長550 nm下之可見光透過率。The manufacturing method of the intermediate laminate of the present invention includes the steps of: imparting an external stimulus to a part of the adhesive layer, forming a stimulating part to which the external stimulus is imparted and a non-stimulating part to which the external stimulus is not imparted on the adhesive layer, whereby the stimulating part and Either one of the non-irritating parts becomes a high-adhesion area with a higher adhesive force, and the other becomes a low-adhesive area with a lower adhesive force, and the visible light transmittance of the stimulated part at a wavelength of 550 nm is lower than that of the non-irritating part Part of the visible light transmittance at a wavelength of 550 nm.
藉此,能夠製造具備具有黏著力互不相同並且波長550 nm下之可見光透過率不同之高黏著區域及低黏著區域之黏著層的中間積層體。Thereby, it is possible to manufacture an intermediate laminated body having an adhesive layer having a high-adhesion area and a low-adhesion area with different adhesion forces and different visible light transmittance at a wavelength of 550 nm.
本發明之製品積層體之製造方法具備如下步驟:將藉由本發明之中間積層體之製造方法而製造之中間積層體中的黏著層之低黏著區域除去。The manufacturing method of the product laminate of the present invention includes the step of removing the low-adhesion area of the adhesive layer in the intermediate laminate manufactured by the manufacturing method of the intermediate laminate of the present invention.
由於低黏著區域之黏著力較低,故而能夠容易地將低黏著區域與對應之基材一起自中間積層體除去。另一方面,能夠使高黏著區域殘留於中間積層體,並與對應之基材一起用於被黏著體之補強。Since the adhesive force of the low-adhesion area is low, the low-adhesion area and the corresponding base material can be easily removed from the intermediate laminate. On the other hand, it is possible to leave the high-adhesion area in the intermediate laminate and use it together with the corresponding base material to reinforce the adherend.
參照圖1說明本發明之黏著片材之一實施形態。An embodiment of the adhesive sheet of the present invention will be described with reference to FIG. 1.
1.黏著片材
如圖1所示,黏著片材1具備具有特定厚度之膜形狀(包含薄片形狀),向與厚度方向正交之方向(面方向)延伸,且具有平坦之上表面及平坦之下表面。1. Adhesive sheet
As shown in FIG. 1, the
具體而言,黏著片材1具備基材2、及配置於基材2之一面之黏著層3。Specifically, the
以下,針對構成黏著片材1之各層進行說明。Hereinafter, each layer constituting the
1-1.基材
基材2為黏著片材1之下層。基材2為確保黏著片材1之機械強度之支持層(支持材)。又,基材2於中間積層體5(後文所述)中為用以對被黏著體6(後文所述)進行補強之補強材。又,基材2具有向面方向延伸之膜形狀,且具有平坦之平面及平坦之下表面。1-1. Substrate
The
基材2包含可撓性之塑膠材料。The
作為此種塑膠材料,可列舉:例如聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等聚酯樹脂、例如聚甲基丙烯酸酯等(甲基)丙烯酸樹脂(丙烯酸系樹脂及/或甲基丙烯酸樹脂)、例如聚乙烯、聚丙烯、環烯烴聚合物(COP)等聚烯烴樹脂、例如聚碳酸酯樹脂、例如聚醚碸樹脂、例如聚芳酯樹脂、例如三聚氰胺樹脂、例如聚醯胺樹脂、例如聚醯亞胺樹脂、例如纖維素樹脂、例如聚苯乙烯樹脂、例如降𦯉烯樹脂之合成樹脂等。Examples of such plastic materials include polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate, such as polymethacrylate. (Meth) acrylic resins (acrylic resins and/or methacrylic resins), such as polyolefin resins such as polyethylene, polypropylene, cycloolefin polymer (COP), such as polycarbonate resins, such as polyether sulfite resins, For example, polyarylate resins, such as melamine resins, such as polyamide resins, such as polyimide resins, such as cellulose resins, such as polystyrene resins, synthetic resins such as norene resins, and the like.
於自基材2側照射活性能量束(具體而言,紫外線)使黏著層3硬化之情形時,較佳為基材2具有對活性能量束(具體而言,紫外線)之透明性,詳細情況於後文進行敍述。When an active energy beam (specifically, ultraviolet rays) is irradiated from the side of the
所謂具有透明性,具體而言,意指全光線透過率(JIS K 7375-2008)例如為85%以上,較佳為90%以上。The term “transparency” specifically means that the total light transmittance (JIS K 7375-2008) is, for example, 85% or more, and preferably 90% or more.
就兼顧對活性能量束(具體而言,紫外線)之透明性及機械強度之觀點而言,作為塑膠材料,較佳為可列舉聚酯樹脂,更佳為可列舉聚對苯二甲酸乙二酯(PET)。From the viewpoint of taking into account both the transparency to active energy beams (specifically, ultraviolet rays) and mechanical strength, as the plastic material, a polyester resin is preferable, and polyethylene terephthalate is more preferable. (PET).
基材2之厚度例如為4 μm以上,就對被黏著體6(後文所述)進行補強之觀點而言,較佳為20 μm以上,更佳為30 μm以上,進而較佳為45 μm以上,又,例如為500 μm以下,就可撓性及操作性之觀點而言,較佳為300 μm以下,更佳為200 μm以下,進而較佳為100 μm以下。The thickness of the
1-2.黏著層
黏著層3配置於基材2之一面之整個面,黏著層3為黏著片材1之上層。1-2. Adhesive layer
The
黏著層3為用以使黏著片材1與被黏著體6接著之感壓接著層。又,黏著層3具有向面方向延伸之膜形狀,且具有平坦之平面及平坦之下表面。The
黏著層3包含黏著性組合物,該黏著性組合物於波長550 nm下之可見光透過率可藉由外部刺激而降低,且可藉由外部刺激而向黏著力較高之狀態與黏著力較低之狀態不可逆地進行狀態變化。The
即,黏著性組合物於波長550 nm下之可見光透過率可藉由相同之外部刺激而降低,且,可向黏著力較高之狀態與黏著力較低之狀態不可逆地進行狀態變化。That is, the visible light transmittance of the adhesive composition at a wavelength of 550 nm can be reduced by the same external stimulus, and the state can be irreversibly changed to a state with higher adhesive force and a state with lower adhesive force.
作為外部刺激,例如可列舉電子束照射、紫外線照射等活性能量束照射,例如可列舉加熱等,較佳為可列舉活性能量束照射,更佳為可列舉紫外線照射。Examples of the external stimulus include active energy beam irradiation such as electron beam irradiation and ultraviolet irradiation. Examples include heating, etc., preferably active energy beam irradiation, and more preferably ultraviolet irradiation.
若外部刺激為活性能量束照射,則於後文所述之第5步驟中能夠對任意部分局部地照射活性能量束。If the external stimulus is active energy beam irradiation, it is possible to locally irradiate the active energy beam to any part in the fifth step described later.
於外部刺激為活性能量束照射之情形時,作為黏著性組合物,可列舉波長550 nm下之可見光透過率可藉由活性能量束照射而降低、且可藉由活性能量束照射而自黏著力較高之狀態向黏著力較低之狀態不可逆地進行狀態變化的第1黏著性組合物,及波長550 nm下之可見光透過率可藉由活性能量束照射而降低且可藉由活性能量束照射而自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化的第2黏著性組合物。When the external stimulus is irradiated with an active energy beam, as an adhesive composition, the visible light transmittance at a wavelength of 550 nm can be reduced by the active energy beam irradiation, and the self-adhesive force can be obtained by the active energy beam irradiation The first adhesive composition that irreversibly changes the state from a higher state to a state with a lower adhesive force, and the visible light transmittance at a wavelength of 550 nm can be reduced by active energy beam irradiation and can be irradiated by active energy beam A second adhesive composition that irreversibly changes its state from a state with low adhesive force to a state with high adhesive force.
第1黏著性組合物包含聚合物、第1光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑。The first adhesive composition includes a polymer, a first light curing agent, a photopolymerization initiator, a compound that develops color by reaction with an acid, and a photoacid generator.
詳細而言,第1黏著性組合物包含作為基質之聚合物,又,為了可藉由活性能量束照射而自黏著力較高之狀態向黏著力較低之狀態不可逆地進行狀態變化,而包含第1光硬化劑、及光聚合起始劑,又,為了可藉由活性能量束照射而降低波長550 nm下之可見光透過率,而包含藉由與酸之反應而顯色之化合物、及光酸產生劑。In detail, the first adhesive composition includes a polymer as a matrix, and in order to be able to irreversibly change the state from a state with a high adhesive force to a state with a low adhesive force by the irradiation of an active energy beam, it includes The first photohardener and photopolymerization initiator, in order to reduce the transmittance of visible light at a wavelength of 550 nm by active energy beam irradiation, include a compound that develops color by reaction with an acid, and light Acid generator.
作為聚合物,例如可列舉丙烯酸系聚合物、聚矽氧系聚合物、胺基甲酸酯系聚合物、橡膠系聚合物等,就控制光學透明性、接著性、及儲存彈性模數之觀點而言,可列舉丙烯酸系聚合物。Examples of polymers include acrylic polymers, silicone polymers, urethane polymers, rubber polymers, etc., from the viewpoint of controlling optical transparency, adhesiveness, and storage elastic modulus Specifically, acrylic polymers can be cited.
丙烯酸系聚合物可藉由包含(甲基)丙烯酸烷基酯作為主成分之單體成分之聚合而獲得。The acrylic polymer can be obtained by polymerization of monomer components containing alkyl (meth)acrylate as the main component.
(甲基)丙烯酸烷基酯為丙烯酸酯及/或甲基丙烯酸酯,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸異三(十二烷基)酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸異十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸異十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等直鏈狀或支鏈狀之(甲基)丙烯酸C1-20烷基酯等,較佳為(甲基)丙烯酸甲酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯,更佳為甲基丙烯酸甲酯、丙烯酸丁酯、丙烯酸2-乙基己酯。Alkyl (meth)acrylate is acrylate and/or methacrylate, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, (meth)acrylate )Butyl acrylate, isopropyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, tertiary butyl (meth)acrylate, amyl (meth)acrylate , Isoamyl (meth)acrylate, neopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (methyl) )Octyl acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, (meth)acrylate Base) undecyl acrylate, dodecyl (meth)acrylate, isotri(dodecyl) (meth)acrylate, tetradecyl (meth)acrylate, (meth) Isotetradecyl acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate Ester, isostearyl (meth)acrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate and other linear or branched (meth)acrylic acid C1 -20 alkyl ester, etc., preferably methyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, more preferably methyl methacrylate, butyl acrylate , 2-Ethylhexyl acrylate.
(甲基)丙烯酸烷基酯可單獨使用或2種以上併用。The alkyl (meth)acrylate may be used alone or in combination of two or more kinds.
作為(甲基)丙烯酸烷基酯,就調整玻璃轉移溫度及剪切儲存彈性模數G'之觀點而言,較佳為可列舉甲基丙烯酸甲酯與(甲基)丙烯酸C4-12烷基酯之併用、(甲基)丙烯酸丁酯之單獨使用,更佳為可列舉甲基丙烯酸甲酯與丙烯酸2-乙基己酯之併用、丙烯酸丁酯之單獨使用。As the alkyl (meth)acrylate, from the viewpoint of adjusting the glass transition temperature and the shear storage elastic modulus G', preferably methyl methacrylate and (meth)acrylic C4-12 alkyl The combined use of esters and the use of butyl (meth)acrylate alone, more preferably the combined use of methyl methacrylate and 2-ethylhexyl acrylate, and the use of butyl acrylate alone.
作為(甲基)丙烯酸烷基酯,於併用甲基丙烯酸甲酯與(甲基)丙烯酸C4-12烷基酯之情形時,相對於甲基丙烯酸甲酯及(甲基)丙烯酸C4-12烷基酯之總量100質量份,甲基丙烯酸甲酯之調配比率例如為5質量份以上,又,例如為20質量份以下,又,(甲基)丙烯酸C4-12烷基酯之調配比率例如為80質量份以上,又,例如為95質量份以下。As the alkyl (meth)acrylate, when methyl methacrylate and C4-12 alkyl (meth)acrylate are used in combination, compared to methyl methacrylate and C4-12 (meth)acrylate The total amount of base ester is 100 parts by mass, the blending ratio of methyl methacrylate is, for example, 5 parts by mass or more, and, for example, 20 parts by mass or less, and the blending ratio of C4-12 alkyl (meth)acrylate is, for example, It is 80 parts by mass or more, and, for example, 95 parts by mass or less.
關於(甲基)丙烯酸烷基酯之調配比率,相對於單體成分,例如為50質量%以上,較佳為60質量%以上,又,例如為97質量%以下,較佳為80質量%以下。Regarding the blending ratio of the alkyl (meth)acrylate, relative to the monomer components, it is, for example, 50% by mass or more, preferably 60% by mass or more, and, for example, 97% by mass or less, preferably 80% by mass or less .
又,單體成分較佳為包含可與(甲基)丙烯酸烷基酯共聚之含有官能基之乙烯基單體。In addition, the monomer component preferably contains a functional group-containing vinyl monomer copolymerizable with the alkyl (meth)acrylate.
作為含有官能基之乙烯基單體,例如可列舉:含有羥基之乙烯基單體、含有羧基之乙烯基單體、含有氮之乙烯基單體、含有氰基之乙烯基單體、含有縮水甘油基之乙烯基單體、含有磺基之乙烯基單體、含有磷酸基之乙烯基單體、芳香族乙烯基單體、乙烯酯單體、乙烯醚單體等。Examples of functional group-containing vinyl monomers include: hydroxyl-containing vinyl monomers, carboxyl-containing vinyl monomers, nitrogen-containing vinyl monomers, cyano group-containing vinyl monomers, and glycidol-containing vinyl monomers. Vinyl monomers, vinyl monomers containing sulfo groups, vinyl monomers containing phosphoric acid groups, aromatic vinyl monomers, vinyl ester monomers, vinyl ether monomers, etc.
作為含有羥基之乙烯基單體,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸4-(羥甲基)環己基)甲酯等,較佳為可列舉(甲基)丙烯酸2-羥基乙酯,更佳為可列舉丙烯酸2-羥基乙酯。Examples of vinyl monomers containing hydroxyl groups include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and (meth)acrylate. 6-hydroxyhexyl acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, 4-(hydroxymethyl)acrylate (meth) Cyclohexyl)methyl and the like, preferably 2-hydroxyethyl (meth)acrylate, more preferably 2-hydroxyethyl acrylate.
作為含有羧基之乙烯基單體,例如可列舉:(甲基)丙烯酸、(甲基)丙烯酸2-羧基乙酯、羧基戊基(甲基)丙烯酸羧基戊基酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸等,較佳為可列舉(甲基)丙烯酸,更佳為可列舉丙烯酸。Examples of vinyl monomers containing a carboxyl group include (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, and maleic acid. Diacid, fumaric acid, crotonic acid, etc., preferably, (meth)acrylic acid is used, and more preferably, acrylic acid is used.
又,作為含有羧基之乙烯基單體,例如亦可列舉順丁烯二酸酐、衣康酸酐等含酸酐基單體。Moreover, as a vinyl monomer containing a carboxyl group, an acid anhydride group-containing monomers, such as maleic anhydride and itaconic anhydride, can also be mentioned, for example.
作為含有氮之乙烯基單體,例如可列舉:N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基𠰌啉、N-丙烯醯基𠰌啉、N-乙烯基羧酸醯胺類、N-乙烯基己內醯胺等,較佳為可列舉N-乙烯基吡咯啶酮。Examples of nitrogen-containing vinyl monomers include: N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperidone, vinyl Pyridine, vinyl pyrrole, vinyl imidazole, vinyl azole, vinyl oxoline, N-acryloyl oxoline, N-vinyl carboxylic acid amines, N-vinyl caprolactam, etc. Preferably, N-vinylpyrrolidone can be cited.
作為含有氰基之乙烯基單體,例如可列舉(甲基)丙烯腈等。As a vinyl monomer containing a cyano group, (meth)acrylonitrile etc. are mentioned, for example.
作為含有縮水甘油基之乙烯基單體,例如可列舉(甲基)丙烯酸縮水甘油酯等。As a vinyl monomer containing a glycidyl group, glycidyl (meth)acrylate etc. are mentioned, for example.
作為含有磺基之乙烯基單體,例如可列舉苯乙烯磺酸、烯丙基磺酸等。As a vinyl monomer containing a sulfo group, styrene sulfonic acid, allyl sulfonic acid, etc. are mentioned, for example.
作為含有磷酸基之乙烯基單體,例如可列舉丙烯醯基磷酸2-羥基乙酯等。As a vinyl monomer containing a phosphoric acid group, 2-hydroxyethyl acryloyl phosphate etc. are mentioned, for example.
作為芳香族乙烯基單體,例如可列舉苯乙烯、對甲基苯乙烯、鄰甲基苯乙烯、α-甲基苯乙烯等。Examples of the aromatic vinyl monomer include styrene, p-methylstyrene, o-methylstyrene, α-methylstyrene, and the like.
作為乙烯酯單體,例如可列舉乙酸乙烯酯、丙酸乙烯酯等。As a vinyl ester monomer, vinyl acetate, vinyl propionate, etc. are mentioned, for example.
作為乙烯醚單體,例如可列舉甲基乙烯醚等。As a vinyl ether monomer, methyl vinyl ether etc. are mentioned, for example.
含有官能基之乙烯基單體可單獨使用或2種以上併用。於調配交聯劑(後文所述)之情形時,就將交聯結構導入至聚合物中之觀點而言,較佳為可列舉含有羥基之乙烯基單體、含有羧基之乙烯基單體,又,就凝聚力之提昇之觀點而言,較佳為可列舉含有氮之乙烯基單體,更佳為將含有羥基之乙烯基單體及/或含有羧基之乙烯基單體與含有氮之乙烯基單體併用、或單獨使用含有羧基之乙烯基單體。The functional group-containing vinyl monomers can be used alone or in combination of two or more kinds. In the case of formulating a crosslinking agent (described later), from the viewpoint of introducing a crosslinked structure into the polymer, preferably, a vinyl monomer containing a hydroxyl group and a vinyl monomer containing a carboxyl group can be cited Moreover, from the viewpoint of improving cohesive force, it is preferable to include a vinyl monomer containing nitrogen, and it is more preferable to combine a vinyl monomer containing a hydroxyl group and/or a vinyl monomer containing a carboxyl group with a nitrogen-containing vinyl monomer. Vinyl monomers are used in combination, or carboxyl-containing vinyl monomers are used alone.
於將含有羥基之乙烯基單體及/或含有羧基之乙烯基單體與含有氮之乙烯基單體併用之情形時,相對於含有羥基之乙烯基單體及/或含有羧基之乙烯基單體與含有氮之乙烯基單體之總量100質量份,含有羥基之乙烯基單體及/或含有羧基之乙烯基單體之調配比率例如為40質量份以上,又,例如為60質量份以下,又,含有氮之乙烯基單體之調配比率例如為40質量份以上,又,例如為60質量份以下。When a vinyl monomer containing a hydroxyl group and/or a vinyl monomer containing a carboxyl group is used in combination with a vinyl monomer containing a nitrogen, it is compared with a vinyl monomer containing a hydroxyl group and/or a vinyl monomer containing a carboxyl group. The total amount of the monomer and the nitrogen-containing vinyl monomer is 100 parts by mass, and the mixing ratio of the hydroxyl-containing vinyl monomer and/or the carboxyl-containing vinyl monomer is, for example, 40 parts by mass or more, and, for example, 60 parts by mass Hereinafter, the compounding ratio of the nitrogen-containing vinyl monomer is, for example, 40 parts by mass or more, and, for example, 60 parts by mass or less.
含有官能基之乙烯基單體之調配比率相對於單體成分例如為5質量%以上,較佳為10質量%以上,更佳為15質量%以上,又,例如為30質量%以下。The blending ratio of the functional group-containing vinyl monomer relative to the monomer components is, for example, 5% by mass or more, preferably 10% by mass or more, more preferably 15% by mass or more, and, for example, 30% by mass or less.
並且,丙烯酸系聚合物係使上述單體成分聚合而成之聚合物。In addition, the acrylic polymer is a polymer obtained by polymerizing the above-mentioned monomer components.
於使單體成分聚合時,例如調配(甲基)丙烯酸烷基酯、及視需要之含有官能基之乙烯基單體而製備單體成分,並將其例如藉由溶液聚合、塊狀聚合、乳化聚合等公知之聚合方法進行製備。When the monomer components are polymerized, for example, an alkyl (meth)acrylate and, if necessary, a vinyl monomer containing a functional group are prepared to prepare the monomer components, and the monomer components are prepared, for example, by solution polymerization, bulk polymerization, It is prepared by known polymerization methods such as emulsion polymerization.
作為聚合方法,較佳為可列舉溶液聚合。As the polymerization method, preferably, solution polymerization is mentioned.
溶液聚合中,例如於溶劑中調配單體成分、及聚合起始劑而製備單體溶液,其後,對單體溶液進行加熱。In solution polymerization, for example, a monomer component and a polymerization initiator are prepared in a solvent to prepare a monomer solution, and thereafter, the monomer solution is heated.
作為溶劑,例如可列舉有機溶劑等。As a solvent, an organic solvent etc. are mentioned, for example.
作為有機溶劑,例如可列舉甲苯、苯、二甲苯等芳香族烴系溶劑,例如可列舉二乙醚等醚系溶劑,例如可列舉丙酮、甲基乙基酮等酮系溶劑,例如可列舉乙酸乙酯等酯系溶劑,例如可列舉N,N-二甲基甲醯胺等醯胺系溶劑,較佳為可列舉酯系溶劑,更佳為可列舉乙酸乙酯。Examples of organic solvents include aromatic hydrocarbon solvents such as toluene, benzene, and xylene. Examples include ether solvents such as diethyl ether. Examples include ketone solvents such as acetone and methyl ethyl ketone. Examples include ethyl acetate. Ester-based solvents such as esters include, for example, amide-based solvents such as N,N-dimethylformamide, preferably ester-based solvents, and more preferably ethyl acetate.
溶劑可單獨使用或2種以上併用。The solvent can be used alone or in combination of two or more kinds.
溶劑之調配比率相對於單體成分100質量份例如為100質量份以上,較佳為200質量份以上,又,例如為500質量份以下,較佳為300質量份以下。The mixing ratio of the solvent relative to 100 parts by mass of the monomer components is, for example, 100 parts by mass or more, preferably 200 parts by mass or more, and, for example, 500 parts by mass or less, preferably 300 parts by mass or less.
作為聚合起始劑,例如可列舉過氧化物系聚合起始劑、偶氮系聚合起始劑等。Examples of the polymerization initiator include peroxide-based polymerization initiators, azo-based polymerization initiators, and the like.
作為過氧化物系聚合起始劑,例如可列舉:過氧化碳酸酯、過氧化酮、過氧縮酮、過氧化氫、過氧化二烷基、過氧化二醯基、過氧酯等有機過氧化物。Examples of peroxide-based polymerization initiators include organic peroxides such as peroxycarbonate, ketone peroxide, peroxyketal, hydrogen peroxide, dialkyl peroxide, diacyl peroxide, and peroxyester. Oxide.
作為偶氮系聚合起始劑,例如可列舉:2,2'-偶氮雙異丁腈、2,2'-偶氮雙(2-甲基丁腈)、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙異丁酸二甲酯等偶氮化合物。As an azo polymerization initiator, for example, 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis (2,4-Dimethylvaleronitrile),
作為聚合起始劑,較佳為可列舉偶氮系聚合起始劑,更佳為可列舉2,2'-偶氮雙異丁腈。As the polymerization initiator, preferably, an azo-based polymerization initiator is used, and more preferably, 2,2'-azobisisobutyronitrile is used.
聚合起始劑可單獨使用或2種以上併用。The polymerization initiator may be used alone or in combination of two or more kinds.
聚合起始劑之調配比率相對於單體成分100質量份例如為0.05質量份以上,較佳為0.1質量份以上,又,例如為1質量份以下,較佳為0.5質量份以下。The blending ratio of the polymerization initiator relative to 100 parts by mass of the monomer components is, for example, 0.05 parts by mass or more, preferably 0.1 parts by mass or more, and, for example, 1 part by mass or less, preferably 0.5 parts by mass or less.
加熱溫度例如為50℃以上、80℃以下,加熱時間例如為1小時以上、8小時以下。The heating temperature is, for example, 50°C or more and 80°C or less, and the heating time is, for example, 1 hour or more and 8 hours or less.
藉此,使單體成分聚合,而獲得包含丙烯酸系聚合物之丙烯酸系聚合物溶液。Thereby, the monomer components are polymerized, and an acrylic polymer solution containing an acrylic polymer is obtained.
丙烯酸系聚合物溶液之固形物成分濃度例如為20質量%以上,又,例如為80質量%以下。The solid content concentration of the acrylic polymer solution is, for example, 20% by mass or more, and for example, 80% by mass or less.
丙烯酸系聚合物之重量平均分子量例如為100000以上,較佳為300000以上、500000以上,又,例如為5000000以下,較佳為3000000以下,更佳為2000000以下。The weight average molecular weight of the acrylic polymer is, for example, 100,000 or more, preferably 300,000 or more and 500,000 or more, for example, 5,000,000 or less, preferably 3,000,000 or less, and more preferably 2,000,000 or less.
再者,上述之重量平均分子量係藉由GPC(Gel Permeation Chromatograph,凝膠滲透導析儀)進行測定並藉由聚苯乙烯換算所算出之值。In addition, the above-mentioned weight average molecular weight is a value calculated by GPC (Gel Permeation Chromatograph) and calculated by polystyrene conversion.
丙烯酸系聚合物之玻璃轉移溫度(Tg)例如為-100℃以上,較佳為-80℃以上,更佳為-40℃以上,又,例如為-10℃以下,較佳為-5℃以下,更佳為0℃以下。The glass transition temperature (Tg) of the acrylic polymer is, for example, -100°C or higher, preferably -80°C or higher, more preferably -40°C or higher, and, for example, -10°C or lower, preferably -5°C or lower , More preferably below 0°C.
再者,玻璃轉移溫度為文獻或目錄等中所記載之值、或者基於下述式(1)(Fox式)所計算出之值。 1/Tg=W1 /Tg1 +W2 /Tg2 +・・・+Wn /Tgn (1) 於上述式(1)中,Tg表示聚合物(A)之玻璃轉移溫度(單位:K),Tgi (i=1、2、・・・n)表示單體i形成均聚物時之玻璃轉移溫度(單位:K),Wi (i=1、2、・・・n)表示單體i之總單體成分中之質量分率。In addition, the glass transition temperature is a value described in documents, catalogs, etc., or a value calculated based on the following formula (1) (Fox formula). 1/Tg=W 1 /Tg 1 +W 2 /Tg 2 +・・・+W n /Tg n (1) In the above formula (1), Tg represents the glass transition temperature of the polymer (A) (unit: K) , Tg i (i=1, 2,...n) represents the glass transition temperature when monomer i forms a homopolymer (unit: K), W i (i=1, 2,...n) represents the unit The mass fraction of the total monomer components of body i.
於第1黏著性組合物中,聚合物之調配比率相對於聚合物與第1光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑之總量例如為70質量%以上,又,例如為95質量%以下,較佳為85質量%以下。In the first adhesive composition, the blending ratio of the polymer is relative to the total of the polymer, the first photohardener, the photopolymerization initiator, the compound that develops color by reaction with acid, and the photoacid generator The amount is, for example, 70% by mass or more, and for example, 95% by mass or less, and preferably 85% by mass or less.
作為第1光硬化劑,就藉由活性能量束照射使黏著層3之黏著力充分地降低之觀點而言,可列舉官能基數4以上、較佳為5以上並且6以下之多官能(甲基)丙烯酸酯,具體而言,可列舉二-三羥甲基丙烷四(甲基)丙烯酸酯、乙氧化季戊四醇四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯等4官能(甲基)丙烯酸酯,例如可列舉二季戊四醇聚(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯等6官能(甲基)丙烯酸酯,較佳為可列舉6官能(甲基)丙烯酸酯,更佳為可列舉二季戊四醇六丙烯酸酯。As the first light curing agent, from the viewpoint that the adhesive force of the
第1光硬化劑可單獨使用或2種以上併用。The first light hardener may be used alone or in combination of two or more kinds.
又,第1光硬化劑之官能基當量例如為50 g/eq以上,又,例如為500 g/eq以下。In addition, the functional group equivalent of the first light curing agent is, for example, 50 g/eq or more, and, for example, 500 g/eq or less.
第1光硬化劑於25℃下之黏度例如為100 mPa・s以上,較佳為400 mPa・s以上,更佳為1000 mPa・s以上,進而較佳為3000 mPa・s以上,尤佳為4000 mPa・s以上,最佳為5000 mPa・s以上,進而為6000 mPa・s以上,又,通常為8000 mPa・s以下。The viscosity of the first light hardener at 25°C is, for example, 100 mPa·s or more, preferably 400 mPa·s or more, more preferably 1000 mPa·s or more, and still more preferably 3000 mPa·s or more, and particularly preferably 4000 mPa·s or more, preferably 5000 mPa·s or more, further 6000 mPa·s or more, and usually 8000 mPa·s or less.
再者,上述黏度可藉由B型黏度計進行測定,具體而言,可使用東機產業之VISCOMETER(BH型)以測定溫度25℃、轉子3號、轉數10 rpm、測定時間5分鐘之條件進行測定。In addition, the above-mentioned viscosity can be measured with a B-type viscometer. Specifically, Toki Sangyo's VISCOMETER (BH type) can be used to measure the temperature at 25°C, the rotor No. 3, the number of
關於第1光硬化劑之分子量,就相溶性之觀點而言,例如為1500以下,較佳為1000以下,又,例如為100以上。Regarding the molecular weight of the first light curing agent, from the viewpoint of compatibility, it is, for example, 1500 or less, preferably 1000 or less, and, for example, 100 or more.
又,第1光硬化劑較佳為選擇與聚合物相溶者。In addition, it is preferable that the first light curing agent is selected to be compatible with the polymer.
只要第1光硬化劑與聚合物相溶,則能夠提高未照射活性能量束之黏著層3之黏著力(後文所述)。As long as the first light curing agent is compatible with the polymer, the adhesive force of the
具體而言,只要聚合物之漢森溶解度參數(HSP)與第1光硬化劑之漢森溶解度參數(HSP)之差例如為4以下、較佳為3.5以下,則第1光硬化劑與聚合物相溶,其結果為,能夠提高未照射活性能量束之黏著層3之黏著力(後文所述)。Specifically, as long as the difference between the Hansen solubility parameter (HSP) of the polymer and the Hansen solubility parameter (HSP) of the first light hardener is, for example, 4 or less, preferably 3.5 or less, the first light hardener and the polymer The substances are compatible, and as a result, the adhesive force of the
再者,聚合物之漢森溶解度參數(HSP)係基於構成聚合物之單體之漢森溶解度參數(HSP)而算出。Furthermore, the Hansen solubility parameter (HSP) of the polymer is calculated based on the Hansen solubility parameter (HSP) of the monomers constituting the polymer.
第1光硬化劑之調配比率相對於聚合物100質量份例如為10質量份以上,較佳為20質量份以上,又,例如為50質量份以下,較佳為40質量份以下。The blending ratio of the first light hardener relative to 100 parts by mass of the polymer is, for example, 10 parts by mass or more, preferably 20 parts by mass or more, and, for example, 50 parts by mass or less, and preferably 40 parts by mass or less.
又,第1光硬化劑之調配比率相對於聚合物與第1光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑之總量例如為5質量%以上,較佳為10質量%以上,更佳為20質量%以上,又,例如為30質量%以下。In addition, the compounding ratio of the first light hardener is, for example, 5 relative to the total amount of the polymer, the first light hardener, the photopolymerization initiator, the compound that develops color by reaction with acid, and the photoacid generator. Mass% or more, preferably 10 mass% or more, more preferably 20 mass% or more, and, for example, 30 mass% or less.
光聚合起始劑促進第1光硬化劑之硬化反應,可視第1光硬化劑之種類等適當選擇,例如可列舉1-羥基環己基苯基酮等羥基酮類,例如可列舉2,2-二甲氧基-1,2-二苯乙烷-1-酮等安息香醚類、苯偶醯二甲基縮酮類、胺基酮類、醯基膦氧化物類、二苯甲酮類、含有三氯甲基之三𠯤衍生物等光自由基起始劑等。The photopolymerization initiator promotes the curing reaction of the first photocuring agent, and can be appropriately selected depending on the type of the first photocuring agent. Examples include hydroxyketones such as 1-hydroxycyclohexyl phenyl ketone. Examples include 2,2- Benzoin ethers such as dimethoxy-1,2-diphenylethane-1-one, benzil dimethyl ketals, amino ketals, phosphine oxides, benzophenones, Contains trichloromethyl tertiary derivatives and other photo-radical initiators.
光聚合起始劑可單獨使用或2種以上併用。The photopolymerization initiator can be used alone or in combination of two or more kinds.
此種光聚合起始劑之中,於使用多官能(甲基)丙烯酸酯作為第1光硬化劑之情形時,較佳為採用光自由基起始劑,更佳為羥基酮類。Among such photopolymerization initiators, when a polyfunctional (meth)acrylate is used as the first photohardener, a photoradical initiator is preferably used, and hydroxyketones are more preferred.
光聚合起始劑之光吸收域例如為300 nm以上,又,例如為450 nm以下。The light absorption range of the photopolymerization initiator is, for example, 300 nm or more, and for example, 450 nm or less.
光聚合起始劑之調配比率相對於聚合物100質量份例如為0.01質量份以上,又,例如為1質量份以下,較佳為0.5質量份以下。The compounding ratio of the photopolymerization initiator is, for example, 0.01 parts by mass or more with respect to 100 parts by mass of the polymer, and is, for example, 1 part by mass or less, and preferably 0.5 parts by mass or less.
又,光聚合起始劑之調配比率相對於聚合物與第1光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑之總量例如為0.01質量%以上,又,例如為1質量%以下,較佳為0.5質量%以下,更佳為0.1質量%以下。In addition, the compounding ratio of the photopolymerization initiator relative to the total amount of the polymer, the first photohardener, the photopolymerization initiator, the compound that develops color by reaction with acid, and the photoacid generator is, for example, 0.01 Mass% or more, and, for example, 1 mass% or less, preferably 0.5 mass% or less, and more preferably 0.1 mass% or less.
藉由與酸之反應而顯色之化合物係藉由酸自無色(透明)變為有色之化合物,例如可列舉隱色系色素,例如p,p',p''-三-二甲胺基三苯甲烷等三芳基甲烷系色素、例如4,4-雙-二甲胺基苯基二苯甲基苄醚等二苯甲烷系色素、例如3-二乙胺基-6-甲基-7-氯熒烷等熒烷系色素、例如3-甲基螺二萘并吡喃等螺吡喃系色素、例如玫瑰紅-B-苯胺基內醯胺等玫瑰紅系色素等,較佳為可列舉隱色系色素。The compound that develops color by reaction with acid is a compound that changes from colorless (transparent) to colored by acid, for example, leuco pigments such as p,p',p''-tris-dimethylamino Triarylmethane-based pigments such as triphenylmethane, for example, diphenylmethane-based pigments such as 4,4-bis-dimethylaminophenyl benzhydryl benzyl ether, such as 3-diethylamino-6-methyl-7 -Fluoran-based pigments such as chlorofluorane, spiropyran-based pigments such as 3-methylspirodinaphthopyran, rose bengal pigments such as rose bengal-B-anilinolactam, etc., preferably List leuco pigments.
藉由與酸之反應而顯色之化合物可單獨使用或2種以上併用。The compound that develops color by reaction with acid may be used alone or in combination of two or more kinds.
藉由與酸之反應而顯色之化合物之調配比率相對於聚合物100質量份例如為0.5質量份以上,就因外部刺激而使波長550 nm下之可見光透過率進一步降低之觀點而言,較佳為1.5質量份以上,又,例如為5質量份以下,較佳為2質量份以下。The compounding ratio of the compound that develops color by reaction with acid is, for example, 0.5 parts by mass or more relative to 100 parts by mass of the polymer. From the viewpoint that the visible light transmittance at a wavelength of 550 nm is further reduced due to external stimuli, it is more It is preferably 1.5 parts by mass or more, for example, 5 parts by mass or less, and more preferably 2 parts by mass or less.
又,藉由與酸之反應而顯色之化合物之調配比率相對於聚合物與第1光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑之總量、例如,0.1質量%以上,又,例如為5質量%以下,較佳為1質量%以下。In addition, the compounding ratio of the compound that develops color by reaction with acid is relative to the polymer, first light hardener, photopolymerization initiator, compound that develops color by reaction with acid, and photoacid generator The total amount is, for example, 0.1% by mass or more, for example, 5% by mass or less, and preferably 1% by mass or less.
光酸產生劑係藉由活性能量束照射而產生酸之化合物,例如可列舉鎓化合物等。The photoacid generator is a compound that generates an acid by irradiation with an active energy beam, and examples thereof include onium compounds.
作為鎓化合物,例如可列舉包含錪及鋶等鎓陽離子、及Cl- 、Br- 、I- 、ZnCl3 - 、HSO3 - 、BF4 - 、PF6 - 、AsF6 - 、SbF6 - 、CH3 SO3 - 、CF3 SO3 - 、(C6 F5 )4 B- 、(C4 H9 )4 B- 等陰離子之鹽等。Examples of the onium compound include iodonium and sulfonium and the like comprising a cation and Cl -, Br -, I - , ZnCl 3 -, HSO 3 -, BF 4 -, PF 6 -, AsF 6 -, SbF 6 -, CH 3 SO 3 -, CF 3 SO 3 -, (C 6 F 5) 4 B -, (C 4 H 9) 4 B - anion of the salt such like.
作為此種鎓化合物,較佳為可列舉包含鋶(鎓陽離子)、及(C6 F5 )4 B- (陰離子)之鹽。As such an onium compound preferably include sulfonium comprising (cations), and (C 6 F 5) 4 B - ( anion) of the salt.
又,作為光酸產生劑,亦可使用市售品,例如可列舉CPI-310B(包含鋶及(C6 F5 )4 B- 之鹽,SAN-APRO公司製造)等。Moreover, as a photoacid generator, a commercial item can also be used, for example, CPI-310B (including a salt of arunus and (C 6 F 5 ) 4 B - , manufactured by SAN-APRO) etc. are mentioned.
光酸產生劑可單獨使用或2種以上併用。The photoacid generator can be used alone or in combination of two or more kinds.
光酸產生劑之調配比率相對於聚合物100質量份例如為1質量份以上,又,例如為20質量份以下,較佳為10質量份以下,更佳為5質量份以下。The blending ratio of the photoacid generator relative to 100 parts by mass of the polymer is, for example, 1 part by mass or more, and, for example, 20 parts by mass or less, preferably 10 parts by mass or less, and more preferably 5 parts by mass or less.
又,光酸產生劑之調配比率相對於聚合物與第1光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑之總量例如為0.2質量%以上,又,例如為10質量%以下,較佳為2質量%以下。In addition, the compounding ratio of the photoacid generator is, for example, 0.2 mass relative to the total amount of the polymer, the first light hardener, the photopolymerization initiator, the compound that develops color by the reaction with the acid, and the photoacid generator. % Or more, and, for example, 10% by mass or less, preferably 2% by mass or less.
並且,於製備第1黏著性組合物時,以上述比率調配聚合物(於藉由溶液聚合製備聚合物之情形時,為聚合物溶液)、第1光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑並進行混合。In addition, when preparing the first adhesive composition, the polymer (in the case of preparing the polymer by solution polymerization, the polymer solution), the first photohardener, the photopolymerization initiator, and the The compound that develops color by reaction with acid and the photoacid generator are mixed.
於第1黏著性組合物中,就於聚合物中導入交聯結構之觀點而言,較佳為調配交聯劑。In the first adhesive composition, it is preferable to formulate a crosslinking agent from the viewpoint of introducing a crosslinked structure into the polymer.
作為交聯劑,例如可列舉:異氰酸酯系交聯劑、環氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、碳二醯亞胺系交聯劑、金屬螯合物系交聯劑等,較佳為可列舉異氰酸酯系交聯劑、環氧系交聯劑。Examples of crosslinking agents include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, azoline-based crosslinking agents, aziridine-based crosslinking agents, carbodiimide-based crosslinking agents, and metal chelate. As a compound-based crosslinking agent, etc., preferably, an isocyanate-based crosslinking agent and an epoxy-based crosslinking agent are mentioned.
作為異氰酸酯系交聯劑,可列舉:例如伸丁基二異氰酸酯、六亞甲基二異氰酸酯等脂肪族二異氰酸酯;例如伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛酮二異氰酸酯等脂環族二異氰酸酯;例如2,4-甲苯二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族二異氰酸酯。Examples of the isocyanate-based crosslinking agent include: for example, aliphatic diisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; for example, lipids such as cyclopentyl diisocyanate, cyclohexyl diisocyanate, and isophorone diisocyanate. Cyclic diisocyanates; for example, aromatic diisocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate.
又,作為異氰酸酯系交聯劑,亦可列舉上述異氰酸酯之衍生物(例如異氰尿酸酯改性體、多元醇改性體等)。In addition, as the isocyanate-based crosslinking agent, derivatives of the above-mentioned isocyanate (for example, an isocyanurate modified product, a polyol modified product, etc.) can also be cited.
作為異氰酸酯系交聯劑,亦可使用市售品,例如可列舉:Coronate L(甲苯二異氰酸酯之三羥甲基丙烷加成物,Tosoh製造)、Coronate HL(六亞甲基二異氰酸酯之三羥甲基丙烷加成物,Tosoh製造)、Coronate HX(六亞甲基二異氰酸酯之異氰尿酸酯體)、Takenate D110N(苯二甲基二異氰酸酯之三羥甲基丙烷加成物,三井化學製造)等。As the isocyanate-based crosslinking agent, commercially available products may also be used, for example, Coronaate L (trimethylolpropane adduct of toluene diisocyanate, manufactured by Tosoh), Coronate HL (trihydroxymethyl of hexamethylene diisocyanate) Methylpropane adduct, manufactured by Tosoh), Coronaate HX (isocyanurate of hexamethylene diisocyanate), Takenate D110N (trimethylolpropane adduct of xylylene diisocyanate, Mitsui Chemicals Manufacturing) and so on.
作為環氧系交聯劑,例如可列舉:N,N,N',N'-四縮水甘油基-間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨糖醇聚縮水甘油醚、甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨糖醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、異氰尿酸三縮水甘油酯-三(2-羥基乙基)酯、間苯二酚二縮水甘油醚、雙酚S-二縮水甘油醚等,較佳為可列舉N,N,N',N'-四縮水甘油基-間苯二甲胺。Examples of epoxy-based crosslinking agents include: N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N-di Glycidyl amino methyl) cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene two Alcohol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, three Methylolpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl isocyanurate-tris(2-hydroxyethyl) ester, resorcinol diglycidyl Glyceryl ether, bisphenol S-diglycidyl ether, etc., preferably N,N,N',N'-tetraglycidyl-m-xylylenediamine.
作為環氧系交聯劑,亦可使用市售品,例如可列舉Tetrad C(N,N,N',N'-四縮水甘油基-間苯二甲胺,Mitsubishi Gas Chemical製造)等。As the epoxy-based crosslinking agent, commercially available products may also be used, and examples thereof include Tetrad C (N,N,N',N'-tetraglycidyl-m-xylylenediamine, manufactured by Mitsubishi Gas Chemical).
交聯劑可單獨使用或2種以上併用。The crosslinking agent can be used alone or in combination of two or more kinds.
若於第1黏著性組合物中調配交聯劑,則聚合物中之羥基、羧基等官能基與交聯劑反應,於聚合物中導入交聯結構。If a crosslinking agent is formulated in the first adhesive composition, functional groups such as hydroxyl and carboxyl groups in the polymer react with the crosslinking agent to introduce a crosslinking structure into the polymer.
交聯劑之官能基當量例如為50 g/eq以上,又,例如為500 g/eq以下。The functional group equivalent of the crosslinking agent is, for example, 50 g/eq or more, and, for example, 500 g/eq or less.
關於交聯劑之調配比率,於交聯劑為異氰酸酯系交聯劑之情形時,相對於聚合物100質量份,例如為0.1質量份以上,較佳為1.0質量份以上,更佳為1.5質量份以上,進而較佳為2.0質量份以上,又,例如為10質量份以下,較佳為5質量份以下,更佳為4質量份以下。Regarding the blending ratio of the crosslinking agent, when the crosslinking agent is an isocyanate-based crosslinking agent, relative to 100 parts by mass of the polymer, for example, 0.1 parts by mass or more, preferably 1.0 parts by mass or more, more preferably 1.5 parts by mass Parts or more, more preferably 2.0 parts by mass or more, and, for example, 10 parts by mass or less, preferably 5 parts by mass or less, more preferably 4 parts by mass or less.
又,於交聯劑為環氧系交聯劑之情形時,相對於聚合物100質量份,例如為0.1質量份以上,又,例如為2質量份以下,較佳為1質量份以下,就提昇黏著力之觀點而言,更佳為0.3質量份以下。Furthermore, when the crosslinking agent is an epoxy-based crosslinking agent, relative to 100 parts by mass of the polymer, it is, for example, 0.1 parts by mass or more, and, for example, 2 parts by mass or less, preferably 1 part by mass or less, From the viewpoint of improving the adhesive force, it is more preferably 0.3 parts by mass or less.
又,於第1黏著性組合物中調配交聯劑之情形時,為了促進交聯反應,亦可調配交聯觸媒。In addition, when blending a crosslinking agent in the first adhesive composition, a crosslinking catalyst may be blended in order to promote the crosslinking reaction.
作為交聯觸媒,例如可列舉鈦酸四正丁酯、鈦酸四異丙酯、三乙醯丙酮鐵、氧化丁基錫、二月桂酸二辛基錫等金屬系交聯觸媒等。Examples of the crosslinking catalyst include metal crosslinking catalysts such as tetra-n-butyl titanate, tetraisopropyl titanate, iron triacetone acetone, butyl tin oxide, and dioctyl tin dilaurate.
交聯觸媒可單獨使用或2種以上併用。The crosslinking catalyst can be used alone or in combination of two or more kinds.
交聯觸媒之調配比率相對於聚合物100質量份例如為0.001質量份以上,較佳為0.01質量份以上,又,例如為0.05質量份以下。The blending ratio of the crosslinking catalyst relative to 100 parts by mass of the polymer is, for example, 0.001 parts by mass or more, preferably 0.01 parts by mass or more, and, for example, 0.05 parts by mass or less.
又,於第1黏著性組合物中,可視需要於無損本發明之效果之範圍內例如含有矽烷偶合劑、黏著性賦予劑、塑化劑、軟化劑、抗劣化劑、填充劑、著色劑,就於螢光燈下或自然光下之穩定化之觀點而言,可於無損本發明之效果之範圍內含有紫外線吸收劑,就於螢光燈下或自然光下之穩定化之觀點而言,可於無損本發明之效果之範圍內含有抗氧化劑、界面活性劑、抗靜電劑等添加劑等之各種添加劑。In addition, the first adhesive composition may optionally contain a silane coupling agent, an adhesiveness imparting agent, a plasticizer, a softening agent, an anti-deterioration agent, a filler, and a coloring agent within a range that does not impair the effects of the present invention. From the viewpoint of stabilization under fluorescent lamps or natural light, the ultraviolet absorber may be contained within a range that does not impair the effects of the present invention. From the viewpoint of stabilization under fluorescent lamps or natural light, Various additives such as additives such as antioxidants, surfactants, and antistatic agents are contained within the range that does not impair the effects of the present invention.
藉此,可獲得第1黏著性組合物。Thereby, the first adhesive composition can be obtained.
聚合物之調配比率相對於第1黏著性組合物例如為50質量%以上,較佳為70質量%以上,又,例如為90質量%以下,較佳為80質量%以下。The blending ratio of the polymer relative to the first adhesive composition is, for example, 50% by mass or more, preferably 70% by mass or more, and, for example, 90% by mass or less, preferably 80% by mass or less.
第1光硬化劑之調配比率相對於第1黏著性組合物例如為10質量%以上,較佳為20質量%以上,又,例如為40質量%以下,較佳為30質量%以下。The blending ratio of the first light hardener relative to the first adhesive composition is, for example, 10% by mass or more, preferably 20% by mass or more, and, for example, 40% by mass or less, and preferably 30% by mass or less.
光聚合起始劑之調配比率相對於第1黏著性組合物例如為0.01質量%以上,又,例如為1質量%以下,較佳為0.5質量%以下,更佳為0.1質量%以下。The blending ratio of the photopolymerization initiator relative to the first adhesive composition is, for example, 0.01% by mass or more, and for example, 1% by mass or less, preferably 0.5% by mass or less, and more preferably 0.1% by mass or less.
藉由與酸之反應而顯色之化合物之調配比率相對於第1黏著性組合物例如為0.1質量%以上,又,例如為5質量%以下,較佳為1質量%以下。The compounding ratio of the compound that develops color by reaction with acid is, for example, 0.1% by mass or more relative to the first adhesive composition, for example, 5% by mass or less, and preferably 1% by mass or less.
光酸產生劑之調配比率相對於第1黏著性組合物例如為0.2質量%以上,又,例如為10質量%以下,較佳為2質量%以下。The blending ratio of the photoacid generator relative to the first adhesive composition is, for example, 0.2% by mass or more, and, for example, 10% by mass or less, and preferably 2% by mass or less.
第2黏著性組合物包含上述聚合物、第2光硬化劑、上述光聚合起始劑、上述藉由與酸之反應而顯色之化合物、及上述光酸產生劑。The second adhesive composition includes the above-mentioned polymer, a second light curing agent, the above-mentioned photopolymerization initiator, the above-mentioned compound that develops color by reaction with an acid, and the above-mentioned photoacid generator.
詳細而言,第2黏著性組合物包含作為基質之聚合物,又,為了可藉由活性能量束照射而自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化,而包含第2光硬化劑、及光聚合起始劑,又,為了可藉由活性能量束照射而降低波長550 nm下之可見光透過率,而包含藉由與酸之反應而顯色之化合物、及光酸產生劑。In detail, the second adhesive composition contains a polymer as a matrix, and in order to be able to irreversibly change the state from a state with a low adhesive force to a state with a high adhesive force by the irradiation of an active energy beam, it contains The second photohardener and photopolymerization initiator, in order to reduce the transmittance of visible light at a wavelength of 550 nm by active energy beam irradiation, include a compound that develops color by reaction with an acid, and light Acid generator.
作為聚合物,可列舉與上述第1黏著性組合物中所調配之聚合物相同者,較佳為可列舉丙烯酸系聚合物。The polymer may be the same as the polymer compounded in the above-mentioned first adhesive composition, preferably an acrylic polymer.
聚合物可單獨使用或2種以上併用。The polymer can be used alone or in combination of two or more kinds.
聚合物之調配比率與上述第1黏著性組合物中所調配之聚合物之調配比率相同。The blending ratio of the polymer is the same as the blending ratio of the polymer blended in the above-mentioned first adhesive composition.
關於第2光硬化劑,就藉由活性能量束照射使黏著層3之黏著力充分地提昇之觀點而言,例如可列舉官能基數2以上3以下之多官能(甲基)丙烯酸酯,具體而言,可列舉:聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、聚四亞甲基二醇二(甲基)丙烯酸酯、雙酚A環氧乙烷改性二(甲基)丙烯酸酯、雙酚A環氧丙烷改性二(甲基)丙烯酸酯、烷二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯等2官能(甲基)丙烯酸酯,例如乙氧化異三聚氰酸三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯等3官能(甲基)丙烯酸酯等,較佳為可列舉2官能(甲基)丙烯酸酯,更佳為可列舉聚乙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯。Regarding the second light curing agent, from the viewpoint that the adhesive force of the
第2光硬化劑可單獨使用或2種以上併用。又,藉由併用具有不同之聚合度之聚乙二醇二丙烯酸酯(例如聚合度2以上6以下之聚乙二醇二丙烯酸酯與聚合度10以上16以下之聚乙二醇二丙烯酸酯之併用)作為第2光硬化劑,能夠降低黏著力。The second light hardener can be used alone or in combination of two or more kinds. In addition, by using together polyethylene glycol diacrylates with different degrees of polymerization (for example, polyethylene glycol diacrylate with a degree of polymerization of 2 or more and 6 or less and a polyethylene glycol diacrylate with a degree of polymerization of 10 or more and 16 or less) Used together) as a second light hardener to reduce adhesion.
又,第2光硬化劑之官能基當量例如為50 g/eq以上,又,例如為500 g/eq以下。In addition, the functional group equivalent of the second light curing agent is, for example, 50 g/eq or more, and, for example, 500 g/eq or less.
第2光硬化劑於25℃下之黏度例如為5 mPa・s以上,又,例如為1000 mPa・s以下。The viscosity of the second light hardener at 25°C is, for example, 5 mPa·s or more, and, for example, 1000 mPa·s or less.
關於第2光硬化劑之分子量,就相溶性之觀點而言,例如為200以下,又,例如為1000以上。Regarding the molecular weight of the second light curing agent, from the viewpoint of compatibility, it is, for example, 200 or less, and, for example, 1000 or more.
又,第2光硬化劑較佳為選擇與聚合物不相溶者。In addition, it is preferable that the second light curing agent is selected to be incompatible with the polymer.
只要第2光硬化劑與聚合物不相溶,能夠降低未照射活性能量束之黏著層3之黏著力(後文所述)。As long as the second light curing agent is incompatible with the polymer, the adhesive force of the
具體而言,只要聚合物之漢森溶解度參數(HSP)與第2光硬化劑之漢森溶解度參數(HSP)之差例如為3以上、較佳為4以上,則第2光硬化劑與聚合物不相溶,其結果為,能夠降低未照射活性能量束之黏著層3之黏著力(後文所述)。Specifically, as long as the difference between the Hansen solubility parameter (HSP) of the polymer and the Hansen solubility parameter (HSP) of the second light hardener is, for example, 3 or more, preferably 4 or more, the second light hardener and the polymer The substances are incompatible, and as a result, the adhesive force of the
第2光硬化劑之調配比率與上述第1黏著性組合物中所調配之第1光硬化劑之調配比率相同。The compounding ratio of the second light hardener is the same as the compounding ratio of the first light hardener compounded in the above-mentioned first adhesive composition.
作為光聚合起始劑,可列舉與上述第1黏著性組合物中所調配之光聚合起始劑相同者,於使用多官能(甲基)丙烯酸酯作為第2光硬化劑之情形時,較佳為採用光自由基起始劑,更佳為羥基酮類、安息香醚類。As the photopolymerization initiator, the same as the photopolymerization initiator formulated in the above-mentioned first adhesive composition can be cited. When a polyfunctional (meth)acrylate is used as the second photocuring agent, it is more It is preferable to use a photo-radical initiator, and more preferable are hydroxyketones and benzoin ethers.
光聚合起始劑可單獨使用或2種以上併用。The photopolymerization initiator can be used alone or in combination of two or more kinds.
光聚合起始劑之調配比率與上述第1黏著性組合物中所調配之光聚合起始劑之調配比率相同。The blending ratio of the photopolymerization initiator is the same as the blending ratio of the photopolymerization initiator blended in the above-mentioned first adhesive composition.
作為藉由與酸之反應而顯色之化合物,可列舉與上述第1黏著性組合物中所調配之藉由與酸之反應而顯色之化合物相同者,較佳為可列舉隱色系色素。Examples of the compound that develops color by reaction with acid include the same compound as the compound that develops color by reaction with acid, which is formulated in the first adhesive composition, and preferably includes leuco pigments. .
藉由與酸之反應而顯色之化合物可單獨使用或2種以上併用。The compound that develops color by reaction with acid may be used alone or in combination of two or more kinds.
藉由與酸之反應而顯色之化合物之調配比率與上述第1黏著性組合物中所調配之藉由與酸之反應而顯色之化合物之調配比率相同。The compounding ratio of the compound that develops color by reaction with acid is the same as the compounding ratio of the compound that develops color by reaction with acid prepared in the first adhesive composition.
作為光酸產生劑,可列舉與上述第1黏著性組合物中所調配之光酸產生劑相同者,較佳為可列舉包含鋶(鎓陽離子)、及(C6 F5 )4 B- (陰離子)之鹽。As the photoacid generator include the above-described first adhesive composition was formulated as the photoacid generator are the same, preferably comprises a sulfonium include (cations), and (C 6 F 5) 4 B - ( Anion) salt.
光酸產生劑可單獨使用或2種以上併用。The photoacid generator can be used alone or in combination of two or more kinds.
光酸產生劑之調配比率與上述第1黏著性組合物中所調配之光酸產生劑之調配比率相同。The blending ratio of the photoacid generator is the same as the blending ratio of the photoacid generator blended in the first adhesive composition.
並且,於製備第2黏著性組合物時,以上述比率調配聚合物(於藉由溶液聚合製備聚合物之情形時,為聚合物溶液)、第2光硬化劑、光聚合起始劑、藉由與酸之反應而顯色之化合物、及光酸產生劑並進行混合。In addition, when preparing the second adhesive composition, the polymer (in the case of preparing the polymer by solution polymerization, the polymer solution), the second light curing agent, the photopolymerization initiator, and the The compound that develops color by reaction with acid and the photoacid generator are mixed.
於第2黏著性組合物中,就於聚合物中導入交聯結構之觀點而言,較佳為調配交聯劑。In the second adhesive composition, it is preferable to formulate a crosslinking agent from the viewpoint of introducing a crosslinked structure into the polymer.
作為交聯劑,例如可列舉與上述第1黏著性組合物中所調配之交聯劑相同者,較佳為可列舉異氰酸酯系交聯劑。As a crosslinking agent, the same thing as the crosslinking agent compounded in the said 1st adhesive composition is mentioned, for example, Preferably, an isocyanate type crosslinking agent is mentioned.
交聯劑可單獨使用或2種以上併用。The crosslinking agent can be used alone or in combination of two or more kinds.
交聯劑之調配比率與上述第1黏著性組合物中所調配之交聯劑之調配比率相同。The blending ratio of the crosslinking agent is the same as the blending ratio of the crosslinking agent blended in the above-mentioned first adhesive composition.
又,於第2黏著性組合物中調配交聯劑之情形時,為了促進交聯反應,亦可調配交聯觸媒。In addition, when a crosslinking agent is blended in the second adhesive composition, a crosslinking catalyst may be blended in order to promote the crosslinking reaction.
作為交聯觸媒,可列舉與上述第1黏著性組合物中所調配之交聯觸媒相同者。As the crosslinking catalyst, the same ones as the crosslinking catalyst blended in the above-mentioned first adhesive composition can be cited.
交聯觸媒可單獨使用或2種以上併用。The crosslinking catalyst can be used alone or in combination of two or more kinds.
交聯觸媒之調配比率與上述第1黏著性組合物中所調配之交聯觸媒之調配比率相同。The blending ratio of the cross-linking catalyst is the same as the blending ratio of the cross-linking catalyst blended in the above-mentioned first adhesive composition.
又,於第2黏著性組合物中可視需要於無損本發明之效果之範圍內含有上述第1黏著性組合物中所調配之各種添加劑。In addition, the second adhesive composition may optionally contain various additives formulated in the above-mentioned first adhesive composition within a range that does not impair the effects of the present invention.
藉此,可獲得第2黏著性組合物。Thereby, the second adhesive composition can be obtained.
相對於第2黏著性組合物,聚合物之調配比率、第2光硬化劑之調配比率、光聚合起始劑之調配比率、藉由與酸之反應而顯色之化合物之調配比率及光酸產生劑之調配比率與上述相對於第1黏著性組合物之聚合物之調配比率、第1光硬化劑之調配比率、光聚合起始劑之調配比率、藉由與酸之反應而顯色之化合物之調配比率及光酸產生劑之調配比率相同。Relative to the second adhesive composition, the compounding ratio of the polymer, the compounding ratio of the second light hardener, the compounding ratio of the photopolymerization initiator, the compounding ratio of the compound that develops color by reaction with acid, and the photoacid The compounding ratio of the generator and the above-mentioned compounding ratio of the polymer relative to the first adhesive composition, the compounding ratio of the first light hardener, the compounding ratio of the photopolymerization initiator, the color development by reaction with acid The compounding ratio of the compound and the compounding ratio of the photoacid generator are the same.
即,黏著性組合物(第1黏著性組合物或第2黏著性組合物)於包含聚合物、光聚合起始劑、藉由與酸之反應而顯色之化合物之調配比率、光酸產生劑、以及視需要而調配之交聯劑、交聯觸媒及各種添加劑之方面共通,但第1黏著性組合物包含作為官能基數4以上之多官能(甲基)丙烯酸酯之第1光硬化劑,另一方面,第2黏著性組合物包含作為官能基數3以下之多官能(甲基)丙烯酸酯之第2光硬化劑,該方面有所不同。That is, the adhesive composition (the first adhesive composition or the second adhesive composition) is mixed with a polymer, a photopolymerization initiator, a compound that develops color by reaction with an acid, and photoacid production The crosslinking agent, crosslinking catalyst, and various additives are common to each other as required, but the first adhesive composition contains the first photocuring of polyfunctional (meth)acrylate with 4 or more functional groups. On the other hand, the second adhesive composition contains a second light curing agent as a polyfunctional (meth)acrylate having a functional group number of 3 or less, and this point is different.
即,根據調配第1光硬化劑及第2光硬化劑中之何者,可選擇性地製備第1黏著性組合物或第2黏著性組合物。That is, depending on which of the first light hardener and the second light hardener is blended, the first adhesive composition or the second adhesive composition can be selectively prepared.
並且,藉由後文所述之方法,由第1黏著性組合物或第2黏著性組合物形成黏著層3。In addition, the
黏著層3之厚度就黏著性之觀點而言,例如為5 μm以上,較佳為10 μm以上,更佳為15 μm以上,進而較佳為20 μm以上,又,就操作性之觀點而言,例如為300 μm以下,較佳為100 μm以下,更佳為50 μm以下,進而較佳為40 μm以下,尤佳為30 μm以下。From the viewpoint of adhesion, the thickness of the
2.黏著片材之製造方法
繼而,參照圖2說明製造黏著片材1之方法。2. Manufacturing method of adhesive sheet
Next, a method of manufacturing the
該製造黏著片材1之方法具備準備基材2之第1步驟、及於基材2之一面配置黏著層3之第2步驟。The method of manufacturing the
第1步驟中,如圖2A所示,準備基材2。In the first step, as shown in FIG. 2A, the
第2步驟中,如圖2B所示,於基材2之一面配置黏著層3。In the second step, as shown in FIG. 2B, an
於在基材2之一面配置黏著層3時,例如於基材2之一面塗佈上述第1黏著性組合物或第2黏著性組合物,並視需要將溶劑進行乾燥去除。When disposing the
作為第1黏著性組合物或第2黏著性組合物之塗佈方法,例如可列舉輥式塗佈、接觸輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴塗、浸漬輥塗佈、棒式塗佈、刮塗、氣刀刮塗、淋幕式塗佈、唇板塗佈、模嘴塗佈等。As the coating method of the first adhesive composition or the second adhesive composition, for example, roll coating, touch roll coating, gravure coating, reverse coating, roll brushing, spraying, dipping can be mentioned. Roll coating, bar coating, knife coating, air knife coating, curtain coating, lip coating, die nozzle coating, etc.
作為乾燥條件,乾燥溫度例如為50℃以上,較佳為70℃以上,更佳為100℃以上,又,例如為200℃以下,較佳為180℃以下,更佳為150℃以下,乾燥時間例如為5秒以上,較佳為10秒以上,又,例如為20分鐘以下,較佳為15分鐘以下,更佳為10分鐘以下。As drying conditions, the drying temperature is, for example, 50°C or higher, preferably 70°C or higher, more preferably 100°C or higher, and, for example, 200°C or lower, preferably 180°C or lower, more preferably 150°C or lower, drying time For example, it is 5 seconds or more, preferably 10 seconds or more, and for example, it is 20 minutes or less, preferably 15 minutes or less, and more preferably 10 minutes or less.
藉此,於基材2之一面形成黏著層3,可獲得具備基材2、及配置於基材2之一面之黏著層3之黏著片材1。In this way, the
再者,於第1黏著性組合物或第2黏著性組合物包含交聯劑之情形時,與進行乾燥去除之同時、或於溶劑之乾燥後(於黏著層3之一面積層剝離膜4(後文所述)之後),較佳為藉由老化進行交聯。Furthermore, when the first adhesive composition or the second adhesive composition contains a cross-linking agent, it should be removed simultaneously with the drying or after the solvent is dried (in an area of the
老化條件可視交聯劑之種類適當設定,老化溫度例如為20℃以上,又,例如為160℃以下,較佳為50℃以下,又,老化時間為1分鐘以上,較佳為12小時以上,更佳為1天以上,又,例如為7天以下。The aging conditions can be appropriately set depending on the type of crosslinking agent. The aging temperature is, for example, 20°C or more, and, for example, 160°C or less, preferably 50°C or less, and the aging time is 1 minute or more, preferably 12 hours or more. More preferably, it is 1 day or more, and, for example, it is 7 days or less.
如上所述,黏著片材1之黏著層3由第1黏著性組合物或第2黏著性組合物之任一者形成。As described above, the
第1黏著性組合物波長550 nm下之可見光透過率可藉由活性能量束照射而降低,且,可藉由活性能量束照射而自黏著力較高之狀態向黏著力較低之狀態不可逆地進行狀態變化。The visible light transmittance of the first adhesive composition at a wavelength of 550 nm can be reduced by active energy beam irradiation, and can be irreversibly changed from a state of high adhesive force to a state of low adhesive force by active energy beam irradiation Make status changes.
即,若對由此種第1黏著性組合物所形成之黏著層3照射活性能量束,則自光酸產生劑產生酸,藉由該酸,藉由與酸之反應而顯色之化合物顯色(著色),藉此照射活性能量束後之(狀態變化後之)黏著層3之波長550 nm下之可見光透過率小於照射活性能量束前之(狀態變化前之)黏著層3之波長550 nm下之可見光透過率,且,照射活性能量束後之(狀態變化後之)黏著層3之黏著力小於照射活性能量束前之(狀態變化前之)黏著層3之黏著力。That is, if the
因此,於後文所述之第5步驟中,若對黏著層3之一部分照射活性能量束,則未照射活性能量束之包含第1黏著性組合物之黏著層3成為高黏著區域10,照射過活性能量束之包含第1黏著性組合物之黏著層3成為低黏著區域11。又,低黏著區域11之波長550 nm下之可見光透過率小於高黏著區域10之波長550 nm下之可見光透過率。Therefore, in the fifth step described later, if an active energy beam is irradiated to a part of the
藉此,黏著層3具備波長550 nm下之可見光透過率較大之高黏著區域10、及波長550 nm下之可見光透過率較小之低黏著區域11。Thereby, the
並且,照射活性能量束前之(狀態變化前之)黏著層3之黏著力(高黏著區域10之黏著力)例如為5 N/25 mm以上,較佳為8 N/25 mm以上,更佳為10 N/25 mm以上,進而較佳為12 N/25 mm以上。In addition, the adhesive force of the adhesive layer 3 (the adhesive force of the high-adhesion region 10) before the active energy beam is irradiated (before the state change) is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, more preferably It is 10 N/25 mm or more, more preferably 12 N/25 mm or more.
再者,狀態變化前之黏著層3包含不照射活性能量束、未使其狀態變化之部分(以下相同)。In addition, the
又,照射過活性能量束後之(狀態變化後之)黏著層3之黏著力(低黏著區域11之黏著力)例如為4 N/25 mm以下,較佳為3 N/25 mm以下。Furthermore, the adhesive force of the adhesive layer 3 (adhesive force of the low-adhesion region 11) after the active energy beam is irradiated (after the state change) is, for example, 4 N/25 mm or less, preferably 3 N/25 mm or less.
只要高黏著區域10之黏著力為上述下限以上,則能夠使高黏著區域10於貼合於被黏著體6之狀態下殘留,並與對應之基材2一起用於被黏著體6之補強。As long as the adhesive force of the high-
又,只要低黏著區域11之黏著力為上述上限以下,則能夠使低黏著區域11與對應之基材2一起自中間積層體5容易地除去。Moreover, as long as the adhesive force of the low-
再者,上述黏著力之詳情於後文所述之實施例中進行敍述,可藉由將黏著片材1以25℃貼合於聚醯亞胺膜並以剝離速度300 mm/min進行180度剝離試驗而測得。Furthermore, the details of the above-mentioned adhesive force are described in the examples described later. The
又,照射活性能量束前之(狀態變化前之)黏著層3於25℃下之剪切儲存彈性模數G'例如為6×104
Pa以上,較佳為7×104
Pa以上,又,例如為9×104
Pa以下,較佳為8×104
Pa以下。Furthermore, the shear storage elastic modulus G'of the
又,照射過活性能量束後之(狀態變化後之)黏著層3於25℃下之剪切儲存彈性模數G'例如為2.00×106
Pa以上,較佳為2.50×106
Pa以上,更佳為3.0×106
Pa以上,又,例如為5.00×106
Pa以下。In addition, the shear storage elastic modulus G'of the
再者,上述剪切儲存彈性模數G'可藉由於頻率1 Hz、升溫速度5℃/min、溫度範圍-50℃~150℃之條件下之動態黏彈性測定而測得。Furthermore, the aforementioned shear storage elastic modulus G'can be measured by dynamic viscoelasticity measurement under the conditions of a frequency of 1 Hz, a heating rate of 5°C/min, and a temperature range of -50°C to 150°C.
又,照射活性能量束前之(狀態變化前之)黏著層3之波長550 nm下之可見光透過率例如為85%以上,又,例如為99%以下。In addition, the visible light transmittance at a wavelength of 550 nm of the
又,照射過活性能量束後之(狀態變化後之)黏著層3之波長550 nm下之可見光透過率例如為80%以下,又,例如為30%以上。In addition, the visible light transmittance at a wavelength of 550 nm of the
並且,照射活性能量束前之(狀態變化前之)黏著層3之波長550 nm下之可見光透過率與照射過活性能量束後之(狀態變化後之)黏著層3之波長550 nm下之可見光透過率之差(照射活性能量束前之(狀態變化前之)黏著層3之波長550 nm下之可見光透過率-照射過活性能量束後之(狀態變化後之)黏著層3之波長550 nm下之可見光透過率)例如為5%以上,較佳為10%以上。In addition, the visible light transmittance at the wavelength of 550 nm of the
只要上述差為上述下限以上,則視覺上能夠容易地判別高黏著區域10與低黏著區域11之邊界,其結果為,能夠容易地除去低黏著區域11。As long as the difference is greater than or equal to the lower limit, the boundary between the high-
又,照射活性能量束前之(狀態變化前之)黏著層3之300 nm~700 nm下之平均透過率例如為80%以上,又,例如為99%以下。In addition, the average transmittance at 300 nm to 700 nm of the
又,照射過活性能量束後之(狀態變化後之)黏著層3之300 nm~700 nm下之平均透過率例如為75%以下,又,例如為30%以上。In addition, the average transmittance of the
再者,關於上述透過率之測定方法,於後文所述之實施例中進行詳細說明(以下相同)。In addition, the above-mentioned transmittance measurement method will be described in detail in the examples described later (the same shall apply hereinafter).
又,照射活性能量束前之(狀態變化前之)黏著層3之霧度值例如為3%以下,較佳為1%以下。In addition, the haze value of the
又,照射過活性能量束後之(狀態變化後之)黏著層3之霧度值例如為5%以下,較佳為3%以下。In addition, the haze value of the
另一方面,第2黏著性組合物波長550 nm下之可見光透過率可藉由活性能量束照射而降低,且,可藉由活性能量束照射而自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化。On the other hand, the visible light transmittance of the second adhesive composition at a wavelength of 550 nm can be reduced by irradiation with an active energy beam, and can be irradiated with an active energy beam to increase the adhesive force from a state with a low adhesive force. The state changes irreversibly.
即,若對由此種第2黏著性組合物所形成之黏著層3照射活性能量束照射,則自光酸產生劑產生酸,藉由該酸,藉由與酸之反應而顯色之化合物顯色(著色),藉此,照射過活性能量束後之(狀態變化後之)黏著層3之波長550 nm下之可見光透過率小於照射活性能量束前之(狀態變化前之)黏著層3之波長550 nm下之可見光透過率,且,照射過活性能量束後之(狀態變化後之)黏著層3之黏著力大於照射活性能量束前之(狀態變化前之)黏著層3之黏著力。That is, if the
因此,於後文所述之第5步驟中,若對黏著層3之一部分照射活性能量束照射,則未照射活性能量束之包含第2黏著性組合物之黏著層3成為低黏著區域11,照射過活性能量束之包含第2黏著性組合物之黏著層3成為高黏著區域10。又,高黏著區域10之波長550 nm下之可見光透過率小於低黏著區域11之波長550 nm下之可見光透過率。Therefore, in the fifth step described later, if a part of the
藉此,黏著層3具備波長550 nm下之可見光透過率較小之高黏著區域10、及波長550 nm下之可見光透過率較大之低黏著區域11。Thereby, the
並且,照射活性能量束前之(狀態變化前之)黏著層3之黏著力(低黏著區域11之黏著力)例如為4 N/25 mm以下,較佳為1 N/25 mm以下。In addition, the adhesive force of the adhesive layer 3 (the adhesive force of the low-adhesion region 11) before the active energy beam is irradiated (before the state change) is, for example, 4 N/25 mm or less, preferably 1 N/25 mm or less.
又,照射過活性能量束後之(狀態變化後之)黏著層3之黏著力(高黏著區域10之黏著力)例如為5 N/25 mm以上,較佳為8 N/25 mm以上,更佳為10 N/25 mm以上,進而較佳為12 N/25 mm以上。Furthermore, the adhesive force of the adhesive layer 3 (adhesive force of the high-adhesion region 10) after the active energy beam is irradiated (after the state change) is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, and more It is preferably 10 N/25 mm or more, and more preferably 12 N/25 mm or more.
只要低黏著區域11之黏著力為上述上限以下,則能夠將低黏著區域11與對應之基材2一起自中間積層體5容易地除去。As long as the adhesive force of the low-
又,只要高黏著區域10之黏著力為上述下限以上,則能夠使高黏著區域10於貼合於被黏著體6之狀態下殘留,並與對應之基材2一起用於被黏著體6之補強。In addition, as long as the adhesive force of the high-
又,照射活性能量束前之(狀態變化前之)黏著層3於25℃下之剪切儲存彈性模數G'例如為1×104
Pa以上,較佳為5×104
Pa以上,又,例如為1.2×105
Pa以下,較佳為1×105
Pa以下。In addition, the shear storage elastic modulus G'of the
又,照射過活性能量束後之(狀態變化後之)黏著層3於25℃下之剪切儲存彈性模數G'例如為1.00×105
Pa以上,較佳為1.5×105
Pa以上,又,例如為2.0×106
Pa以下,較佳為1.0×106
Pa以下。In addition, the shear storage elastic modulus G'of the
又,照射活性能量束前之(狀態變化前之)黏著層3之波長550 nm下之可見光透過率例如為85%以上,又,例如為99%以下。In addition, the visible light transmittance at a wavelength of 550 nm of the
又,照射過活性能量束後之(狀態變化後之)黏著層3之波長550 nm下之可見光透過率例如為80%以下,又,例如為30%以上。In addition, the visible light transmittance at a wavelength of 550 nm of the
並且,照射活性能量束前之(狀態變化前之)黏著層3之波長550 nm下之可見光透過率與照射過活性能量束後之(狀態變化後之)黏著層3之波長550 nm下之可見光透過率之差(照射活性能量束前之(狀態變化前之)黏著層3之波長550 nm下之可見光透過率-照射過活性能量束後之(狀態變化後之)黏著層3之波長550 nm下之可見光透過率)例如為5%以上,較佳為10%以上。In addition, the visible light transmittance at the wavelength of 550 nm of the
只要上述差為上述下限以上,則視覺上能夠容易地判別高黏著區域10與低黏著區域11之邊界,其結果為,能夠容易地除去低黏著區域11。As long as the difference is greater than or equal to the lower limit, the boundary between the high-
又,照射活性能量束前之(狀態變化前之)黏著層3之300 nm~700 nm下之平均透過率例如為80%以上,又,例如為99%以下。In addition, the average transmittance at 300 nm to 700 nm of the
又,照射過活性能量束後之(狀態變化後之)黏著層3之300 nm~700 nm下之平均透過率例如為75%以下,又,例如為30%以上。In addition, the average transmittance of the
又,照射活性能量束前之(狀態變化前之)黏著層3之霧度值例如為3%以下,較佳為1%以下。In addition, the haze value of the
又,照射過活性能量束後之(狀態變化後之)黏著層3之霧度值例如為5%以下,較佳為3%以下。In addition, the haze value of the
又,如圖2C所示,黏著片材1亦可視需要於黏著層3之一面積層剝離膜4。In addition, as shown in FIG. 2C, the
於此種情形時,黏著片材1依序具備基材2、黏著層3、及剝離膜4。In this case, the
作為剝離膜4,例如可列舉:聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等可撓性之塑膠膜。Examples of the release film 4 include flexible plastic films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester films.
剝離膜4之厚度例如為3 μm以上,較佳為10 μm以上,又,例如為200 μm以下,較佳為100 μm以下,更佳為50 μm以下。The thickness of the release film 4 is, for example, 3 μm or more, preferably 10 μm or more, and for example, 200 μm or less, preferably 100 μm or less, and more preferably 50 μm or less.
剝離膜4較佳為實施藉由聚矽氧系、氟系、長鏈烷基系、脂肪醯胺系等脫模劑之脫模處理、或藉由二氧化矽粉之脫模處理。The release film 4 is preferably subjected to a mold release treatment with a silicone-based, fluorine-based, long-chain alkyl-based, aliphatic amide-based mold release agent, or a mold release treatment with silica powder.
3.中間積層體
如圖3所示,中間積層體5具備具有特定厚度之膜形狀(包含薄片形狀),向與厚度方向正交之方向(面方向)延伸,且具有平坦之上表面及平坦之下表面。3. Intermediate layered body
As shown in FIG. 3, the
具體而言,中間積層體5具備:黏著片材1,其具備基材2及配置於基材2之一面之黏著層3;及配置於黏著片材1之一面之被黏著體6。Specifically, the
中間積層體5可藉由將上述黏著片材1貼附於被黏著體6而獲得,詳細情況於後文進行敍述。The
又,中間積層體5為製品積層體12(後文所述)之中間零件。In addition, the intermediate
以下,針對各層進行詳細說明。Hereinafter, each layer will be described in detail.
3-1.黏著片材
如上所述,黏著片材1具備基材2、及配置於基材2之一面之黏著層3。3-1. Adhesive sheet
As described above, the
並且,黏著片材1之黏著層3具備包含黏著力較高之狀態之黏著性組合物之高黏著區域10、及包含黏著力較低之狀態之黏著性組合物之低黏著區域11。In addition, the
又,高黏著區域10及低黏著區域11中之任一者其波長550 nm下之可見光透過率小於另一者(換言之,高黏著區域10及低黏著區域11於波長550 nm下之可見光透過率互不相同),詳細情況於後文進行敍述。In addition, the visible light transmittance of any one of the
此種高黏著區域10及低黏著區域11可藉由對黏著層3之一部分賦予外部刺激(具體而言,活性能量束)而獲得,詳細情況於後文進行敍述。Such
3-2.被黏著體
被黏著體6係藉由黏著片材1進行補強之被補強體,例如可列舉光學元件、電子元件及其構成零件等。3-2. Adhesive body
The adhered
再者,於圖3中,被黏著體6具有平板形狀,但被黏著體6之形狀並無特別限定,可視光學元件、電子元件及其構造零件之種類選擇各種形狀。Furthermore, in FIG. 3, the
4.中間積層體之製造方法
關於中間積層體5之製造方法之一實施形態,參照圖4及圖5進行說明。4. Manufacturing method of intermediate laminate
An embodiment of the manufacturing method of the intermediate
該中間積層體5之製造方法包括如下步驟:準備黏著片材1(第3步驟);於黏著片材1之一面配置被黏著體6(第4步驟);及藉由對黏著層3之一部分賦予外部刺激,於黏著層3形成被賦予外部刺激之刺激部分7、及未被賦予外部刺激之非刺激部分8,使刺激部分7及非刺激部分8中之任一者成為黏著力較高之狀態之高黏著區域10,使另一者成為黏著力較低之狀態之低黏著區域11,且,使刺激部分7之波長550 nm下之可見光透過率小於非刺激部分8之波長550 nm下之可見光透過率(第5步驟)。The manufacturing method of the
第5步驟中,刺激部分7及非刺激部分8中一者成為高黏著區域10,另一者成為低黏著區域11,根據黏著層3由第1黏著性組合物或第2黏著性組合物之哪個組合物而形成來決定刺激部分7及非刺激部分8中哪個部分成為高黏著區域10或低黏著區域11。In the fifth step, one of the
因此,分為由第1黏著性組合物形成黏著層3之情形、及由第2黏著性組合物形成黏著層3之情形於以下進行說明。Therefore, it is divided into the case where the
又,以下說明中,針對外部刺激為活性能量束照射之情形進行說明。In addition, in the following description, the case where the external stimulus is irradiation with an active energy beam will be described.
4-1.由第1黏著性組合物形成黏著層之中間積層體之製造方法(製法1)
第1,針對由第1黏著性組合物形成黏著層3之中間積層體5之製造方法(製法1),參照圖4進行說明。4-1. Manufacturing method of an intermediate laminate in which the adhesive layer is formed from the first adhesive composition (Production method 1)
First, the manufacturing method (manufacturing method 1) of the
第3步驟中,如圖4A所示,準備黏著片材1。In the third step, as shown in FIG. 4A, the
繼而,第4步驟中,如圖4B所示,以配置於基材2之一面之黏著層3與被黏著體6接觸之方式將黏著片材1貼合於被黏著體6。Then, in the fourth step, as shown in FIG. 4B, the
繼而,第5步驟中,如圖4C所示,藉由對黏著層3之一部分照射活性能量束,而形成高黏著區域10及低黏著區域11。Then, in the fifth step, as shown in FIG. 4C, a part of the
再者,以下說明中,將黏著片材1於面方向上分割成3個部分,將其中之兩端部分2處作為非刺激部分8(換言之,將黏著片材1於面方向上分割成3個部分,僅將其中之中央部分1處作為刺激部分7)進行說明。In addition, in the following description, the
第5步驟中,於黏著片材1中,對刺激部分7照射活性能量束,不對非刺激部分8照射活性能量束。In the fifth step, in the
具體而言,於刺激部分7不配置遮罩9,於非刺激部分8配置遮斷活性能量束之遮罩9。Specifically, the
若如上所述,對由第1黏著性組合物所形成之黏著層3照射活性能量束,則照射過活性能量束後之黏著層3之黏著力小於照射活性能量束前之黏著層3之黏著力。If the
即,刺激部分7中之黏著層3之黏著力降低,另一方面,非刺激部分8中之黏著層3中未產生黏著力之降低,黏著力保持較強。That is, the adhesive force of the
如此,刺激部分7相對於非刺激部分8黏著力相對變低,因而刺激部分7(具體而言,包含狀態變化後之第1黏著性組合物之黏著層3)成為低黏著區域11,非刺激部分8(具體而言,包含狀態變化前之第1黏著性組合物之黏著層3)成為高黏著區域10。In this way, the adhesive force of the
又,刺激部分7(低黏著區域11)中之黏著層3中,自光酸產生劑產生酸,藉由該酸,藉由與酸之反應而顯色之化合物顯色(著色(具體而言,為黑色))。其結果為,刺激部分7(低黏著區域11)中之黏著層3自無色(透明)變為有色(波長550 nm下之可見光透過率變低)。如此,刺激部分7(低黏著區域11)之波長550 nm下之可見光透過率小於非刺激部分8(高黏著區域10)之波長550 nm下之可見光透過率(具體而言,刺激部分7(低黏著區域11)較非刺激部分8(高黏著區域10)黑),視覺上能夠容易地判別刺激部分7(低黏著區域11)與非刺激部分8(高黏著區域10)之邊界。In addition, in the
藉此,可獲得具備波長550 nm下之可見光透過率較大之高黏著區域10、及波長550 nm下之可見光透過率較小之低黏著區域11之黏著層3。又,可獲得依序具備黏著片材1及被黏著體6(換言之,依序具備基材2、黏著層3及被黏著體6)之中間積層體5。In this way, an
4-2.由第2黏著性組合物形成黏著層之中間積層體之製造方法(製法2)
第2,針對由第2黏著性組合物形成黏著層3之中間積層體5之製造方法(製法2),參照圖5進行說明。4-2. Manufacturing method of an intermediate laminate in which the adhesive layer is formed from the second adhesive composition (manufacturing method 2)
Second, the manufacturing method (manufacturing method 2) of the
第3步驟中,如圖5A所示,準備黏著片材1。In the third step, as shown in FIG. 5A, the
繼而,第4步驟中,如圖5B所示,以配置於基材2之一面之黏著層3與被黏著體6接觸之方式將黏著片材1貼合於被黏著體6。Then, in the fourth step, as shown in FIG. 5B, the
繼而,第5步驟中,如圖5C所示,藉由對黏著層3之一部分照射活性能量束,而形成高黏著區域10及低黏著區域11。Then, in the fifth step, as shown in FIG. 5C, a part of the
再者,以下說明中,將黏著片材1於面方向上分割成3個部分,將其中之2個兩端部分作為刺激部分7(換言之,將黏著片材1於面方向上分割成3個部分,僅將其中之1個中央部分作為非刺激部分8)作為進行說明。Furthermore, in the following description, the
第5步驟中,於黏著片材1中,對刺激部分7照射活性能量束,不對非刺激部分8照射活性能量束。In the fifth step, in the
具體而言,於刺激部分7不配置遮罩9,於非刺激部分8配置遮斷活性能量束之遮罩9。Specifically, the
若如上所述,對由第2黏著性組合物所形成之黏著層3照射活性能量束,則照射過活性能量束後之黏著層3之黏著力大於照射活性能量束前之黏著層3之黏著力。If the
即,刺激部分7中之黏著層3之黏著力提昇,另一方面,非刺激部分8中之黏著層3中未產生黏著力之提昇。That is, the adhesive force of the
如此,刺激部分7相對於非刺激部分8黏著力相對變高,因而刺激部分7(具體而言,包含狀態變化後之第2黏著性組合物之黏著層3)成為高黏著區域10,非刺激部分8(具體而言,包含狀態變化前之第2黏著性組合物之黏著層3)成為低黏著區域11。In this way, the
又,刺激部分7(高黏著區域10)中之黏著層3中,自光酸產生劑產生酸,藉由該酸,藉由與酸之反應而顯色之化合物顯色(著色(具體而言,為黑色))。其結果為,刺激部分7(高黏著區域10)中之黏著層3自無色(透明)變為有色(波長550 nm下之可見光透過率變低)。如此,刺激部分7(高黏著區域10)之波長550 nm下之可見光透過率小於非刺激部分8(低黏著區域11)之波長550 nm下之可見光透過率(具體而言,刺激部分7(高黏著區域10)較非刺激部分8(低黏著區域11)黑),視覺上能夠容易地判別刺激部分7(高黏著區域10)與非刺激部分8(低黏著區域11)之邊界。In addition, in the
藉此,可獲得具備波長550 nm下之可見光透過率較小之高黏著區域10、及波長550 nm下之可見光透過率較大之低黏著區域11之黏著層3。又,可獲得依序具備黏著片材1及被黏著體6(換言之,依序具備基材2、黏著層3及被黏著體6)之中間積層體。Thereby, an
上述製法1及上述製法2中,於刺激部分7於波長550 nm下之可見光透過率小於非刺激部分8於波長550 nm下之可見光透過率(換言之,刺激部分7為有色,非刺激部分8為透明。)的方面共通,另一方面,製法1中,刺激部分7成為低黏著區域11,製法2中,非刺激部分8成為低黏著區域11,該方面有所不同。In the above-mentioned
又,後文所述之製品積層體12之製造方法中,首先製造中間積層體5,其後自其中間積層體5除去低黏著區域11使高黏著區域10殘留,藉此製造製品積層體12(後文所述),若藉由製法1製造中間積層體5,則殘留透明之高黏著區域10,若藉由製法2製造中間積層體5,則殘留有色之高黏著區域10,該方面不同。In the method of manufacturing the
即,可藉由選擇製法1及製法2中之任一者來選擇使有色或透明之高黏著區域10殘留。That is, it is possible to select whether the colored or transparent high-
5.黏著片材、中間積層體及中間積層體之製造方法之作用效果
於黏著片材1中,黏著層3包含黏著性組合物,該黏著性組合物之波長550 nm下之可見光透過率可藉由活性能量束照射而降低,且可藉由活性能量束照射而向黏著力較高之狀態與黏著力較低之狀態不可逆地進行狀態變化。5. The effect of the adhesive sheet, the intermediate laminate and the manufacturing method of the intermediate laminate
In the
若對該黏著片材1之一部分照射活性能量束,則照射過活性能量束之部分於波長550 nm下之可見光透過率降低,並且黏著力產生變化(黏著力變高或變低)。If an active energy beam is irradiated to a part of the
即,照射過活性能量束之部分與未照射活性能量束之部分之黏著力互不相同,並且波長550 nm下之可見光透過率互不相同。That is, the adhesive force of the part irradiated with the active energy beam and the part not irradiated with the active energy beam are different from each other, and the visible light transmittance at a wavelength of 550 nm is different from each other.
由於照射過活性能量束之部分與未照射活性能量束之部分於波長550 nm下之可見光透過率不同,故而視覺上能夠容易地判別照射過活性能量束之部分與未照射活性能量束之部分之邊界,其結果為,能夠容易地除去照射過活性能量束之部分與未照射活性能量束之部分中黏著力相對較低之部分。Since the visible light transmittance of the part irradiated with the active energy beam and the part not irradiated with the active energy beam is different at a wavelength of 550 nm, it is easy to visually distinguish the part irradiated with the active energy beam and the part not irradiated with the active energy beam. As a result of the boundary, it is possible to easily remove the relatively low adhesive force of the part irradiated with the active energy beam and the part not irradiated with the active energy beam.
於中間積層體5中,黏著層3具備黏著力較高之狀態之高黏著區域10、及黏著力較低之狀態之低黏著區域11。In the intermediate
又,高黏著區域10及低黏著區域11中之任一者於波長550 nm下之可見光透過率小於另一者。In addition, the visible light transmittance of any one of the high-
詳細而言,於上述中間積層體5之製造方法中,於由第1黏著性組合物形成黏著層之情形時,低黏著區域11之波長550 nm下之可見光透過率小於高黏著區域10之波長550 nm下之可見光透過率,於由第2黏著性組合物形成黏著層之情形時,高黏著區域10之波長550 nm下之可見光透過率小於低黏著區域11之波長550 nm下之可見光透過率。In detail, in the above-mentioned manufacturing method of the
藉此,視覺上能夠容易地判別高黏著區域10與低黏著區域11之邊界。其結果為,能夠將低黏著區域11與對應之基材2一起自被黏著體6除去,另一方面,能夠使高黏著區域10依然貼合於被黏著體6而殘留,並與對應之基材2一起用於被黏著體6之補強。Thereby, the boundary between the
其結果為,能夠獲得被黏著體6得到補強之製品積層體12(後文所述)。As a result, it is possible to obtain a product laminate 12 (described later) in which the
又,根據該中間積層體5,可藉由利用相同之外部刺激(具體而言,活性能量束照射)形成黏著力互不相同並且波長550 nm下之可見光透過率互不相同之高黏著區域10及低黏著區域11,從而兼具該等。Furthermore, according to the intermediate
又,根據該中間積層體5,並非藉由利用黏著力較高之黏著性組合物形成高黏著區域10並利用黏著力較低之黏著性組合物形成低黏著區域11而兼具高黏著區域10與低黏著區域11,而是可藉由利用相同組成之黏著性組合物形成高黏著區域10及低黏著區域11而兼具該等。Furthermore, according to the intermediate
中間積層體5之製造方法包括如下步驟:藉由對黏著層3之一部分照射活性能量束,於黏著層3形成照射過活性能量束之刺激部分7、及未照射活性能量束之非刺激部分8,從而刺激部分7及非刺激部分8中之任一者成為黏著力較高之狀態之高黏著區域10,另一者成為黏著力較低之狀態之低黏著區域11,且刺激部分7之波長550 nm下之可見光透過率小於非刺激部分8之波長550 nm下之可見光透過率。The manufacturing method of the intermediate
藉此,能夠製造具備具有黏著力互不相同並且波長550 nm下之可見光透過率互不相同之高黏著區域10及低黏著區域11之黏著層3的中間積層體5。Thereby, it is possible to manufacture an
6.製品積層體及製品積層體之製造方法
製品積層體12為最終形態之元件或該元件之構成零件。6. Product layered body and manufacturing method of product layered body
The
繼而,針對製品積層體12之製造方法之一實施形態,參照圖6及圖7進行說明。Next, an embodiment of the method of manufacturing the product layered
製品積層體12可藉由自上述中間積層體5除去低黏著區域11而製造。The
具體而言,製品積層體12可藉由製品積層體之製造方法而製造,該方法具備:準備藉由上述中間積層體5之製造方法而製造之中間積層體5之第6步驟、及將黏著層3中之低黏著區域11除去之第7步驟。Specifically, the product layered
第6步驟中,準備藉由上述中間積層體5之製造方法而製造之中間積層體5,而如上所述,藉由選擇製法1及製法2中任一者,決定殘留之高黏著區域10為有色或透明。In the sixth step, the intermediate
因此,以下分為準備藉由製法1而製造之中間積層體5之情形、及準備藉由製法2而製造之中間積層體5之情形進行說明。Therefore, the following description is divided into a case where the
6-1.準備藉由製法1而製造之中間積層體5之情形
第1,針對準備藉由製法1而製造之中間積層體5之情形的製品積層體12之製造方法,參照圖6進行說明。6-1. Preparation of
第6步驟中,如圖6A所示,藉由利用第1黏著性組合物形成黏著層3之中間積層體5之製造方法(製法1)製造中間積層體5,而準備中間積層體5。In the sixth step, as shown in FIG. 6A, the
第7步驟中,如圖6B所示,自中間積層體5除去低黏著區域11。In the seventh step, as shown in FIG. 6B, the low-
具體而言,例如利用CO2
雷射等,將包含高黏著區域10及與其對應之基材2之殘留部分13、與包含低黏著區域11及與其對應之基材2之去除部分14的邊界切斷,其後,以去除部分14之邊緣為起點而僅將去除部分14剝離。Specifically, for example, a CO 2 laser is used to cut the boundary between the
此時,高黏著區域10(殘留部分13)及低黏著區域11(去除部分14)由於波長550 nm下之可見透光互不相同(具體而言,高黏著區域10(殘留部分13)為透明,低黏著區域11(去除部分14)為有色),故而視覺上能夠容易地判別上述邊界。At this time, the high adhesion area 10 (remaining portion 13) and the low adhesion area 11 (removed portion 14) are different from each other due to the visible light transmission at a wavelength of 550 nm (specifically, the high adhesion area 10 (remaining portion 13) is transparent , The low adhesion area 11 (removed part 14) is colored), so the above boundary can be easily distinguished visually.
並且,由於去除部分14中之低黏著區域11之黏著力降低,故而能夠容易地自中間積層體5將去除部分14剝離。In addition, since the adhesive force of the low-
另一方面,由於殘留部分13中之高黏著區域10之黏著力未降低,具有上述較高之黏著力,故而殘留部分13殘留於中間積層體5。On the other hand, since the adhesive force of the high-
又,由於高黏著區域10具有上述較高之黏著力,故而即便將去除部分14剝離,亦能夠抑制與去除部分14相接之殘留部分13之端部浮升。In addition, since the high-
並且,殘留部分13可直接用於被黏著體6之補強。In addition, the remaining
藉此,可獲得製品積層體12。Thereby, the
於製品積層體12中,殘留部分13由於為透明,故而可較佳地用於要求透明性之光元件及其構成零件。In the
6-2.準備藉由製法2而製造之中間積層體5之情形
第2,針對準備藉由製法2而製造之中間積層體5之情形時之製品積層體12之製造方法,參照圖7進行說明。6-2. Preparation of
第6步驟中,如圖7A所示,藉由利用第2黏著性組合物形成黏著層3之中間積層體5之製造方法(製法2)製造中間積層體5,而準備中間積層體5。In the sixth step, as shown in FIG. 7A, the
第7步驟中,如圖7B所示,自中間積層體5除去低黏著區域11。In the seventh step, as shown in FIG. 7B, the low-
具體而言,例如利用CO2
雷射等將包含高黏著區域10及與其對應之基材2之殘留部分13與包含低黏著區域11及與其對應之基材2之去除部分14之邊界切斷,其後,以去除部分14之邊緣為起點僅將去除部分14剝離。Specifically, for example, a CO 2 laser is used to cut the boundary between the
此時,高黏著區域10(殘留部分13)及低黏著區域11(去除部分14)由於波長550 nm下之可見光透過率互不相同(具體而言,高黏著區域10(殘留部分13)為有色,低黏著區域11(去除部分14)為透明),故而視覺上能夠容易地判別上述邊界。At this time, the high adhesion area 10 (remaining portion 13) and the low adhesion area 11 (removed portion 14) are different from each other due to the visible light transmittance at a wavelength of 550 nm (specifically, the high adhesion area 10 (remaining portion 13) is colored , The low adhesion area 11 (removed part 14) is transparent), so the above boundary can be easily distinguished visually.
並且,由於去除部分14中之低黏著區域11之黏著力降低,故而能夠自中間積層體5容易地將去除部分14剝離。In addition, since the adhesive force of the low-
另一方面,由於殘留部分13中之高黏著區域10之黏著力未降低,具有上述較高之黏著力,故而殘留部分13殘留於中間積層體5。On the other hand, since the adhesive force of the high-
又,由於高黏著區域10具有上述較高之黏著力,故而即便將去除部分14剝離,亦能夠抑制與去除部分14相接之殘留部分13之端部浮升。In addition, since the high-
並且,殘留部分13可直接用於被黏著體6之補強。In addition, the remaining
藉此,可獲得製品積層體12。Thereby, the
於製品積層體12中,殘留部分13由於為有色,故而亦可用作抗反射層。In the
7.製品積層體之製造方法之作用效果
製品積層體12之製造方法具備第7步驟,其係將藉由上述中間積層體之製造方法(藉由第1黏著性組合物形成黏著層3之中間積層體5之製造方法(製法1)或藉由第2黏著性組合物形成黏著層3之中間積層體5之製造方法(製法2))而製造之中間積層體5中的黏著層3之低黏著區域11除去。7. The effect of the manufacturing method of the product laminate
The manufacturing method of the product layered
由於低黏著區域11之黏著力較低,故而能夠容易地將去除部分14自中間積層體5除去。Since the adhesive force of the low-
又,由於高黏著區域10(殘留部分13)及低黏著區域11(去除部分14)於波長550 nm下之可見光透過率互不相同,故而視覺上能夠容易地判別殘留部分13與去除部分14之邊界。其結果為,能夠將去除部分14確實地自被黏著體6除去。In addition, since the visible light transmittance of the high adhesion area 10 (remaining portion 13) and the low adhesion area 11 (removed portion 14) at a wavelength of 550 nm are different from each other, the difference between the remaining
另一方面,殘留部分13可殘留於中間積層體5,以對被黏著體6進行補強。On the other hand, the remaining
又,藉由殘留部分13可賦予適度之剛性,因而操作性提昇。In addition, the
尤其是於被黏著體6為電子元件之情形時,電子元件隨著高度積體化、小型輕量化及構成零件之薄型化,存在電子元件之構成零件之厚度變小之傾向。由於該薄型化,於構成零件之積層界面容易產生起因於應力之彎曲或捲曲。又,由於薄型化,容易產生自重引起之撓曲。Especially when the
即便於此種情形時,根據該黏著片材1,藉由殘留部分13可對電子元件賦予剛性,因而亦能夠抑制應力或自重等引起之彎曲、捲曲、撓曲等,使操作性提昇。Even in this case, according to the
又,於電子元件之製造步驟中,於藉由自動化之裝置進行搬送或加工之情形時,存在電子元件之構成零件與搬送臂及頂銷等構件接觸而導致構成零件破損之情況。In addition, in the manufacturing steps of electronic components, when the components are transported or processed by an automated device, the component parts of the electronic component may come into contact with members such as the transport arm and ejector pins, which may cause the component parts to be damaged.
尤其是高度積體化、小型輕量化及薄型化之元件存在如下情況:於搬送裝置等之接觸或切斷加工時,產生因局部應力之集中引起之破損或尺寸變化。In particular, components with a high degree of integration, small size, light weight, and thin profile may be damaged or dimensional changes caused by the concentration of local stress during the contact or cutting process of a conveyor, etc.
即便於此種情形時,根據該黏著片材1,藉由殘留部分13亦可賦予適度之剛性,並且使應力緩和、分散,從而能夠抑制龜裂、破裂、剝落、尺寸變化等。Even in this case, according to the
8.變化例 上述說明中,針對外部刺激為活性能量束照射之情形進行了說明,但外部刺激亦可為加熱。8. Variations In the above description, the case where the external stimulus is irradiation with an active energy beam has been described, but the external stimulus may also be heating.
於外部刺激為加熱之情形時,黏著層3包含黏著性組合物,該黏著性組合物於波長550 nm下之可見光透過率可藉由加熱而降低,且可藉由加熱而向黏著力較高之狀態與黏著力較低之狀態不可逆地進行狀態變化。When the external stimulus is heating, the
作為此種黏著性組合物,可列舉波長550 nm下之可見光透過率可藉由加熱而降低且可藉由加熱而自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化的第3黏著性組合物。As such an adhesive composition, the visible light transmittance at a wavelength of 550 nm can be reduced by heating, and the state can be irreversibly changed from a state with a low adhesive force to a state with a high adhesive force by heating. The third adhesive composition.
第3黏著性組合物包含上述聚合物、含有有機矽氧烷之成分、上述藉由與酸之反應而顯色之化合物、及熱酸產生劑。The third adhesive composition includes the above-mentioned polymer, an organosiloxane-containing component, the above-mentioned compound that develops color by reaction with an acid, and a thermal acid generator.
作為含有有機矽氧烷之成分,例如可列舉:具有有機矽氧烷骨架之丙烯酸聚合物、胺基甲酸酯系聚合物、聚醚系聚合物、聚酯系聚合物、聚碳酸酯系聚合物、聚丁二烯系聚合物等,就黏著力之控制之觀點而言,較佳為可列舉具有有機矽氧烷骨架之丙烯酸聚合物。Examples of components containing organosiloxane include: acrylic polymers having organosiloxane skeletons, urethane-based polymers, polyether-based polymers, polyester-based polymers, and polycarbonate-based polymers. From the viewpoint of control of adhesive force, acrylic polymers having an organosiloxane skeleton are preferable from the viewpoint of control of adhesive force, polybutadiene-based polymers, and the like.
熱酸產生劑係藉由加熱產生酸之化合物,例如可列舉芳基鋶鹽、芳基錪鹽等。 [實施例]The thermal acid generator is a compound that generates an acid by heating, and examples thereof include aryl sulfonium salts and aryl iodonium salts. [Example]
以下示出實施例及比較例進一步具體地說明本發明。再者,本發明不受實施例及比較例任何限定。又,於以下記載中所使用之調配比率(含有比率)、物性值、參數等具體數值可代替為上述「實施方式」中所記載之與該等對應之調配比率(含有比率)、物性值、參數等相應記載之上限值(以「以下」、「未達」之形式所定義之數值)或下限值(以「以上」、「超過」之形式所定義之數值)。Examples and comparative examples are shown below to further specifically explain the present invention. Furthermore, the present invention is not limited in any way by the examples and comparative examples. In addition, specific numerical values such as the blending ratio (content ratio), physical property values, and parameters used in the following description can be replaced with the blending ratios (content ratio), physical property values, etc. corresponding to those described in the above-mentioned "embodiment". The upper limit value (the value defined in the form of "below" and "not reached") or the lower limit value (the value defined in the form of "above" or "exceeding") shall be recorded accordingly for the parameters.
再者,「份」及「%」只要未特別提及,則為質量基準。Furthermore, "parts" and "%" are quality standards as long as they are not specifically mentioned.
1.成分之詳情 將各實施例及各比較例中所使用之各成分記載於以下。 Takenate D110N:苯二甲基二異氰酸酯之三羥甲基丙烷加成物之75%乙酸乙酯溶液,三井化學製造 Tetrad C:N,N,N',N'-四縮水甘油基-間苯二甲胺(4官能之環氧化合物,Mitsubishi Gas Chemical製造) A-DPH:二季戊四醇六丙烯酸酯;官能基當量96 g/eq APG700:聚丙二醇#700(n=12)二丙烯酸酯;官能基當量404 g/eq A200:聚乙二醇#200(n=4)二丙烯酸酯;官能基當量154 g/eq A600:聚乙二醇#600(n=14)二丙烯酸酯;官能基當量354 g/eq Irgacure 184:1-羥基環己基苯基酮,BASF製造 Irgacure 651:2,2-二甲氧基-1,2-二苯乙烷-1-酮 BLACK ND1:隱色染料,山田化學工業製造 CPI-310B:包含鋶及(C6 F5 )4 B- 之鹽,光酸產生劑,SAN-APRO製造1. Details of components The components used in each example and each comparative example are described below. Takenate D110N: 75% ethyl acetate solution of trimethylolpropane adduct of xylylene diisocyanate, manufactured by Mitsui Chemicals Tetrad C: N,N,N',N'-tetraglycidyl-isophthalene Methylamine (4-functional epoxy compound, manufactured by Mitsubishi Gas Chemical) A-DPH: dipentaerythritol hexaacrylate; functional group equivalent 96 g/eq APG700: polypropylene glycol #700 (n=12) diacrylate; functional group equivalent 404 g/eq A200: polyethylene glycol #200 (n=4) diacrylate; functional group equivalent 154 g/eq A600: polyethylene glycol #600 (n=14) diacrylate; functional group equivalent 354 g /eq Irgacure 184: 1-hydroxycyclohexyl phenyl ketone, manufactured by BASF Irgacure 651: 2,2-dimethoxy-1,2-diphenylethane-1-one BLACK ND1: leuco dye, Yamada Chemical Industry Manufacture of CPI-310B: Contains the salt of alum and (C 6 F 5 ) 4 B - , photoacid generator, manufactured by SAN-APRO
2.聚合物之製備 合成例1 於具備溫度計、攪拌機、回流冷凝管及氮氣導入管之反應容器中投入作為單體之甲基丙烯酸甲酯(MMA)9重量份、丙烯酸2-乙基己酯(2EHA)63重量份、丙烯酸羥乙酯(HEA)13重量份、N-乙烯基吡咯啶酮(NVP)15重量份、作為聚合起始劑之偶氮雙異丁腈0.2重量份、以及作為溶劑之乙酸乙酯233重量份,流入氮氣,一面攪拌一面進行約1小時氮氣置換。其後,加熱至60℃使之反應7小時,而獲得重量平均分子量(Mw)為1200000之丙烯酸系聚合物之溶液。2. Preparation of polymer Synthesis example 1 9 parts by weight of methyl methacrylate (MMA), 63 parts by weight of 2-ethylhexyl acrylate (2EHA), and acrylic acid hydroxy 13 parts by weight of ethyl ester (HEA), 15 parts by weight of N-vinylpyrrolidone (NVP), 0.2 parts by weight of azobisisobutyronitrile as a polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent, Nitrogen gas was introduced, and nitrogen replacement was performed for about 1 hour while stirring. After that, it was heated to 60° C. and reacted for 7 hours to obtain a solution of an acrylic polymer having a weight average molecular weight (Mw) of 1,200,000.
合成例2 於具備溫度計、攪拌機、回流冷凝管及氮氣導入管之反應容器中添加作為單體成分之丙烯酸正丁酯(BA)95份及丙烯酸(AA)5份,一面導入氮氣一面流入氮氣,一面攪拌一面進行2小時氮氣置換。其後,加入作為聚合起始劑之0.2份之2,2'-偶氮雙異丁腈(AIBN),以60℃進行8小時溶液聚合,而獲得重量平均分子量(Mw)為600000之丙烯酸系聚合物之溶液。Synthesis Example 2 Add 95 parts of n-butyl acrylate (BA) and 5 parts of acrylic acid (AA) as monomer components to a reaction vessel equipped with a thermometer, agitator, reflux condenser and nitrogen introduction tube. While introducing nitrogen, flow in nitrogen while stirring. Perform nitrogen replacement for 2 hours. Then, 0.2 parts of 2,2'-azobisisobutyronitrile (AIBN) was added as a polymerization initiator, and solution polymerization was carried out at 60°C for 8 hours to obtain an acrylic acid with a weight average molecular weight (Mw) of 600,000 Polymer solution.
3.黏著性組合物之製備 製備例1(第1黏著性組合物之調整) 於合成例1之丙烯酸系聚合物溶液中添加相對於聚合物之固形物成分100重量份為2.5質量份之作為交聯劑之Takenate D110N(苯二甲基二異氰酸酯之三羥甲基丙烷加成物之75%乙酸乙酯溶液,三井化學製造)、相對於聚合物之固形物成分100重量份為30質量份之作為光硬化劑之A-DPH(二季戊四醇六丙烯酸酯)、相對於聚合物之固形物成分100重量份為0.1質量份之作為光聚合起始劑之Irgacure 184(1-羥基環己基苯基酮,BASF公司製造)、相對於聚合物之固形物成分100重量份為1質量份之作為藉由與酸之反應而顯色之化合物之BLACK ND1(隱色染料)、相對於聚合物之固形物成分100重量份為2質量份之作為光酸產生劑之CP-310B,並均勻地混合,而製備黏著性組合物(第1黏著性組合物)。3. Preparation of adhesive composition Preparation example 1 (adjustment of the first adhesive composition) To the acrylic polymer solution of Synthesis Example 1, 2.5 parts by mass of Takenate D110N (trimethylolpropane addition of xylylene diisocyanate) was added as a crosslinking agent relative to 100 parts by weight of the solid content of the polymer. 75% ethyl acetate solution, manufactured by Mitsui Chemicals), A-DPH (dipentaerythritol hexaacrylate) as a light hardening agent, 30 parts by mass relative to 100 parts by weight of the solid content of the polymer, relative to polymer 100 parts by weight of the solid content is 0.1 parts by mass of Irgacure 184 (1-hydroxycyclohexyl phenyl ketone, manufactured by BASF Corporation) as a photopolymerization initiator, and 1 part by weight relative to 100 parts by weight of the solid content of the polymer Parts of BLACK ND1 (leuco dye) as a compound that develops color by reaction with acid, 2 parts by mass of CP-310B as a photoacid generator relative to 100 parts by weight of the solid content of the polymer, and It mixes uniformly, and prepares an adhesive composition (1st adhesive composition).
製備例2(第2黏著性組合物之調整) 將光硬化劑變更為APG700(聚丙二醇#700(n=12)二丙烯酸酯),除此以外,以與製備例1相同之方式製備黏著性組合物(第2黏著性組合物)。Preparation example 2 (adjustment of the second adhesive composition) Except that the light hardener was changed to APG700 (polypropylene glycol #700 (n=12) diacrylate), an adhesive composition (second adhesive composition) was prepared in the same manner as in Preparation Example 1.
製備例3~製備例10 按照表1之記載變更調配配方,除此以外,以與製備例1相同之方式進行處理,而製造黏著性組合物。Preparation Example 3~Preparation Example 10 Except for changing the preparation formula according to the description in Table 1, the treatment was performed in the same manner as in Preparation Example 1 to produce an adhesive composition.
4.黏著片材之製造 實施例1 於作為基材之聚對苯二甲酸乙二酯膜(厚度75 μm)之上表面,以乾燥後之厚度成為25 μm之方式藉由槽輥塗佈製備例1之黏著性組合物。繼而,以130℃乾燥1分鐘將溶劑去除。藉此,於基材之一面形成黏著層。進而,將剝離膜(表面經聚矽氧脫模處理之厚度25 μm之聚對苯二甲酸乙二酯膜)之脫模處理面貼合於黏著層之一面。其後,於25℃之環境下進行4天之老化處理,進行聚合物與交聯劑之交聯反應。藉此製造黏著片材。4. Manufacture of adhesive sheet Example 1 On the upper surface of a polyethylene terephthalate film (thickness 75 μm) as a substrate, the adhesive composition of Preparation Example 1 was coated by a groove roll so that the thickness after drying became 25 μm. Then, the solvent was removed by drying at 130°C for 1 minute. Thereby, an adhesive layer is formed on one surface of the substrate. Furthermore, the release-treated surface of the release film (a polyethylene terephthalate film with a thickness of 25 μm with the surface subjected to a silicone release treatment) was attached to one surface of the adhesive layer. After that, an aging treatment was carried out for 4 days in an environment of 25° C. to carry out the cross-linking reaction between the polymer and the cross-linking agent. Thus, an adhesive sheet is manufactured.
實施例2~實施例7、比較例1~比較例3 按照表1之記載變更黏著性組合物,除此以外,以與實施例1相同之方式進行處理,而製造黏著片材。Example 2 to Example 7, Comparative Example 1 to Comparative Example 3 Except for changing the adhesive composition according to the description in Table 1, the treatment was performed in the same manner as in Example 1 to produce an adhesive sheet.
5.評價 (透過率) 針對各實施例及各比較例之黏著片材,對照射LED(Light Emitting Diode,發光二極體)(365 nm,4000 mJ/□)前後之550 nm下之透過率、及300 nm~700 nm下之平均透過率進行測定。5. Evaluation (Transmittance) For the adhesive sheet of each embodiment and each comparative example, the transmittance at 550 nm before and after irradiating LED (Light Emitting Diode) (365 nm, 4000 mJ/□), and 300 nm~700 nm The average transmittance below is measured.
其將結果示於表1。The results are shown in Table 1.
(黏著力) 將厚度25 μm之聚醯亞胺膜經由雙面膠帶(日東電工製造之「No.531」)貼附於玻璃板,而獲得測定用聚醯亞胺膜基板。繼而,自各實施例及各比較例之黏著片材將剝離膜去除,使用手壓輥將黏著片材與測定用聚醯亞胺膜基板於25℃下進行貼合,而製備測定用試樣。(Adhesion) A polyimide film with a thickness of 25 μm was attached to a glass plate via a double-sided tape ("No. 531" manufactured by Nitto Denko) to obtain a polyimide film substrate for measurement. Then, the peeling film was removed from the adhesive sheet of each Example and each comparative example, and the adhesive sheet and the polyimide film substrate for measurement were bonded together at 25 degreeC using a hand roller, and the sample for measurement was prepared.
繼而,將該測定用試樣於25℃、相對濕度50%之條件下放置30分鐘,其後對黏著力(UV照射前黏著力)進行測定。Then, the sample for measurement was left for 30 minutes under the conditions of 25° C. and a relative humidity of 50%, and then the adhesive force (adhesive force before UV irradiation) was measured.
以與上述相同之順序另行製備測定用試樣,並將該測定用試樣於25℃、相對濕度50%之條件下放置30分鐘,其後,自黏著片材之基材側照射LED(365 nm,4000 mJ/□),進而於25℃、相對濕度50%之條件下放置30分鐘之後,對黏著力(UV照射後黏著力)進行測定。Separately prepare a measurement sample in the same procedure as above, and place the measurement sample at 25°C and a relative humidity of 50% for 30 minutes. After that, irradiate the substrate side of the adhesive sheet with an LED (365 nm, 4000 mJ/□), and then placed for 30 minutes under the conditions of 25°C and 50% relative humidity, and then the adhesion (adhesion after UV irradiation) was measured.
黏著力之測定係用夾頭保持測定用試樣之端部(黏著片材之端部),以拉伸速度300 mm/min實施補強膜之180°剝離,並測定剝離強度。其將結果示於表1。The adhesion force is measured by holding the end of the test sample (the end of the adhesive sheet) with a chuck, and performing 180° peeling of the reinforcing film at a tensile speed of 300 mm/min, and measuring the peel strength. The results are shown in Table 1.
[表1]
再者,上述發明係作為本發明之例示之實施形態而提供,但其只不過為例示,並非限定性地進行解釋。該技術領域之業者所明瞭之本發明之變化例包含於後述申請專利範圍中。 [產業上之可利用性]In addition, the above-mentioned invention is provided as an exemplary embodiment of the present invention, but this is only an example and is not interpreted in a limited manner. Variations of the present invention as understood by those in the technical field are included in the scope of the patent application described below. [Industrial availability]
本發明之黏著片材可較佳地用作貼合於光學元件或電子元件等各種元件之表面之補強用黏著片材。The adhesive sheet of the present invention can be preferably used as a reinforcing adhesive sheet for bonding to the surface of various components such as optical components or electronic components.
又,本發明之中間積層體、中間積層體之製造方法及製品積層體之製造方法可尤佳地用於光學元件或電子元件等各種元件中。In addition, the intermediate laminate, the manufacturing method of the intermediate laminate, and the manufacturing method of the product laminate of the present invention can be particularly preferably used in various components such as optical components and electronic components.
1:黏著片材 2:基材 3:黏著層 4:剝離膜 5:中間積層體 6:被黏著體 7:刺激部分 8:非刺激部分 9:遮罩 10:高黏著區域 11:低黏著區域 12:製品積層體 13:殘留部分 14:去除部分1: Adhesive sheet 2: Substrate 3: Adhesive layer 4: Peel off the film 5: Intermediate layered body 6: Adhered body 7: stimulation part 8: Non-stimulating part 9: Mask 10: High adhesion area 11: Low adhesion area 12: Product layered body 13: Residual part 14: Remove part
圖1係表示本發明之黏著片材之一實施形態之概略圖。 圖2係表示黏著片材之製造方法之一實施形態之概略圖,圖2A表示準備基材之第1步驟,圖2B表示於基材之一面積層黏著層之第2步驟,圖2C表示於黏著層一面積層剝離膜之步驟。 圖3係表示本發明之中間積層體之一實施形態之概略圖。 圖4係表示黏著層由第1黏著性組合物所形成之情形時的本發明之中間積層體之製造方法之一實施形態的概略圖,圖4A表示準備黏著片材之第3步驟,圖4B表示於黏著片材之一面配置被黏著體之第4步驟,圖4C表示對黏著層之一部分照射活性能量束而形成高黏著區域及低黏著區域之第5步驟。 圖5係表示黏著層由第2黏著性組合物所形成之情形時的本發明之中間積層體之製造方法之一實施形態的概略圖,圖5A表示準備黏著片材之第3步驟,圖5B表示於黏著片材之一面配置被黏著體之第4步驟,圖5C表示對黏著層之一部分照射活性能量束而形成高黏著區域及低黏著區域之第5步驟。 圖6係表示藉由利用第1黏著性組合物形成黏著層之中間積層體之製造方法準備中間積層體之情形時的本發明之製品積層體之製造方法之一實施形態的概略圖,圖6A表示準備中間積層體之第6步驟,圖6B表示將黏著層中之低黏著區域除去之第7步驟。 圖7係表示藉由利用第2黏著性組合物形成黏著層之中間積層體之製造方法準備中間積層體之情形時的本發明之製品積層體之製造方法之一實施形態的概略圖,圖7A表示準備中間積層體之第6步驟,圖7B表示將黏著層中之低黏著區域除去之第7步驟。Fig. 1 is a schematic view showing an embodiment of the adhesive sheet of the present invention. Fig. 2 is a schematic diagram showing an embodiment of the method of manufacturing an adhesive sheet. Fig. 2A shows the first step of preparing the substrate, Fig. 2B shows the second step of layering an adhesive layer on one of the substrates, and Fig. 2C shows the adhesive The step of peeling off the film layer by layer. Fig. 3 is a schematic diagram showing an embodiment of the intermediate laminate of the present invention. Fig. 4 is a schematic diagram showing an embodiment of the method for manufacturing an intermediate laminate of the present invention when the adhesive layer is formed of the first adhesive composition, Fig. 4A shows the third step of preparing an adhesive sheet, and Fig. 4B Shows the fourth step of arranging the adherend on one surface of the adhesive sheet. FIG. 4C shows the fifth step of irradiating a part of the adhesive layer with active energy beams to form high adhesion areas and low adhesion areas. Fig. 5 is a schematic view showing an embodiment of the method for manufacturing an intermediate laminate of the present invention when the adhesive layer is formed of the second adhesive composition, Fig. 5A shows the third step of preparing an adhesive sheet, and Fig. 5B Shows the fourth step of arranging the adherend on one surface of the adhesive sheet. FIG. 5C shows the fifth step of irradiating a part of the adhesive layer with active energy beams to form high adhesion areas and low adhesion areas. 6 is a schematic diagram showing one embodiment of the production method of the product laminate of the present invention when the intermediate laminate is prepared by the production method of the intermediate laminate using the first adhesive composition to form the adhesive layer, FIG. 6A It shows the sixth step of preparing the intermediate laminate, and FIG. 6B shows the seventh step of removing the low adhesion area in the adhesive layer. 7 is a schematic diagram showing one embodiment of the production method of the product laminate of the present invention when the intermediate laminate is prepared by the production method of the intermediate laminate using the second adhesive composition to form the adhesive layer, FIG. 7A It shows the sixth step of preparing the intermediate laminate, and FIG. 7B shows the seventh step of removing the low adhesion area in the adhesion layer.
1:黏著片材 1: Adhesive sheet
2:基材 2: Substrate
3:黏著層 3: Adhesive layer
Claims (13)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-115679 | 2019-06-21 | ||
| JP2019115679 | 2019-06-21 | ||
| JP2020-099938 | 2020-06-09 | ||
| JP2020099938A JP2021001311A (en) | 2019-06-21 | 2020-06-09 | Pressure sensitive adhesive sheet, intermediate laminate, manufacturing method of intermediate laminate and manufacturing method of product laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202111048A true TW202111048A (en) | 2021-03-16 |
Family
ID=73995371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109120266A TW202111048A (en) | 2019-06-21 | 2020-06-16 | Adhesive sheet, intermediate laminate, method for manufacturing intermediate laminate, and method for manufacturing finished laminate |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2021001311A (en) |
| KR (1) | KR20220023973A (en) |
| CN (1) | CN113993960A (en) |
| TW (1) | TW202111048A (en) |
| WO (1) | WO2020255849A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7706230B2 (en) * | 2019-10-18 | 2025-07-11 | 日東電工株式会社 | Adhesive sheet and intermediate laminate |
| JP7107455B1 (en) * | 2022-01-05 | 2022-07-27 | 大日本印刷株式会社 | Adhesive tape for semiconductor processing |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH613087B (en) * | 1978-05-10 | Bulova Watch Co Inc | THERMOELECTRIC WRISTWATCH. | |
| DE3639266A1 (en) * | 1985-12-27 | 1987-07-02 | Fsk K K | ADHESIVE FILM |
| JPS62153377A (en) * | 1985-12-27 | 1987-07-08 | F S K Kk | Pressure-sensitive adhesive sheet |
| JP4611463B2 (en) * | 1997-09-08 | 2011-01-12 | 積水化学工業株式会社 | Curing type adhesive sheet |
| JP4084676B2 (en) * | 2002-09-05 | 2008-04-30 | 積水化学工業株式会社 | Manufacturing method of semiconductor chip |
| JP6751238B2 (en) * | 2015-02-09 | 2020-09-02 | 株式会社スリーボンド | Method of curing photocurable resin composition and cured product |
| CN111876092B (en) | 2017-09-28 | 2022-05-27 | 日东电工株式会社 | Reinforced film |
| KR102019639B1 (en) * | 2017-12-28 | 2019-09-06 | 닛토덴코 가부시키가이샤 | Manufacturing method of laminate |
| JP2020033400A (en) * | 2018-08-27 | 2020-03-05 | 日東電工株式会社 | Laminate |
-
2020
- 2020-06-09 JP JP2020099938A patent/JP2021001311A/en active Pending
- 2020-06-11 KR KR1020217040207A patent/KR20220023973A/en not_active Withdrawn
- 2020-06-11 CN CN202080044219.5A patent/CN113993960A/en active Pending
- 2020-06-11 WO PCT/JP2020/022997 patent/WO2020255849A1/en not_active Ceased
- 2020-06-16 TW TW109120266A patent/TW202111048A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN113993960A (en) | 2022-01-28 |
| WO2020255849A1 (en) | 2020-12-24 |
| JP2021001311A (en) | 2021-01-07 |
| KR20220023973A (en) | 2022-03-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111675982B (en) | Enhanced film | |
| CN110862775A (en) | Laminate | |
| CN110862778A (en) | Laminate | |
| TW202111048A (en) | Adhesive sheet, intermediate laminate, method for manufacturing intermediate laminate, and method for manufacturing finished laminate | |
| WO2020188985A1 (en) | Adhesive sheet, production method for adhesive sheet, production method for intermediate laminate, and intermediate laminate | |
| WO2020188984A1 (en) | Adhesive, production method for intermediate laminate, and intermediate laminate | |
| CN113423575B (en) | Equipment with reinforced film, manufacturing method thereof, and reinforcement method | |
| WO2020188986A1 (en) | Pressure-sensitive adhesive sheet, method for producing pressure-sensitive adhesive sheet, method for producing intermediate laminate, and intermediate laminate | |
| WO2021075401A1 (en) | Adhesive sheet and intermediate laminate | |
| CN113382858B (en) | Intermediate laminated body, manufacturing method of intermediate laminated body, and manufacturing method of product laminated body | |
| JP7313238B2 (en) | Adhesive, method for producing intermediate laminate, and intermediate laminate | |
| CN118369392A (en) | Adhesive composition and adhesive sheet | |
| TW202045649A (en) | Pressure-sensitive adhesive sheet | |
| TWI781371B (en) | Adhesive sheet, method for producing adhesive sheet, method for producing intermediate laminate, and intermediate laminate | |
| JP7706230B2 (en) | Adhesive sheet and intermediate laminate | |
| JP7503890B2 (en) | Laminates and Reinforcement Films |