TW201826434A - Device handler - Google Patents

Abstract

The present invention relates to a device handler and, more specifically, to a device handler which stacks a good-quality device, among devices in a wafer state, on a waffle pack, according to an inspection result. The present invention provides a device handler comprising: a wafer ring loading unit (100) on which a wafer ring (20), having devices (10) the length of each of which is long relative to the width thereof stacked thereon, is loaded; a wafer ring moving table (200) which receives the wafer ring (20) from the wafer ring loading unit (100) and moves the wafer ring (20) having individual devices (10) stacked thereon to a device retrieving position (P0); a pickup tool (500) for picking up the devices (10) from the wafer ring (20) on the wafer ring moving table (200); and a device uploading unit (400) for unloading the devices (10), transferred by the pickup tool (500), by resting same on a waffle pack (30) having a plurality of accommodating recesses (31) for respectively accommodating the devices (10) therein.

Description

   Component processor   

The present invention relates to a component processor, and more particularly, to a component processor that loads a qualified component in a tray among components in a wafer state based on an inspection result.

The so-called element (semiconductor wafer) is an integrated circuit composed of a semiconductor having a higher conductivity than a non-conductor and a lower conductor than a metal such as a metal. The original wafer refers to a thin plate, but now it refers to a semiconductor circuit.

The element is made by integrating elements such as a transistor resistance capacitor on a thin silicon wafer with a length and a width of about 1 cm.

Components, as the basic components of manufacturing modern computers, are the core of performing arithmetic calculations, information memory, and other chip control, supporting the electronics industry.

The above components include CPU, SDRAM (Synchronous Dynamic Random Access Memory), flash memory, etc. Recently, such as COG (Chip On Glass), COF (Chip On Film) as display DDI (Display Drive IC) and the like of driver chips are diversifying.

The components described above are inspected for appearance before shipment to improve reliability, and only qualified components are shipped after screening for unqualified components.

In particular, the component inspection process can be performed multiple times during the component manufacturing process, especially after the components are cut into individual components in the wafer state, and the components can be marked on the basis of the results of each inspection.

Then, as described above, the components that have completed the inspection process are loaded with only qualified components through a sorting device such as a tray for factory shipment or subsequent processes.

On the other hand, in the component manufacturing process described above, an inspection process and a sorting process are added, so the production speed of the components is determined according to the processing speed of the inspection device or the sorting device.

In order to solve the above-mentioned problems, an object of the present invention is to provide a component processor that significantly improves the processing speed of a device that picks up components from a mounting component such as a wafer ring on which a plurality of components are loaded and loads the components on an unloaded component such as a tray. After unloading the components and loading the components, the inspection process related to the loading state can be performed to eliminate the defective products during the loading of the components.

The present invention is made to achieve the object of the present invention as described above. The present invention includes: a wafer ring mounting portion 100 for mounting a wafer ring 20 on which a component 10 is mounted, wherein the length of the component 10 is relatively longer than the width; The ring moving stage 200 receives the wafer ring 20 from the wafer ring mounting portion 100 and moves the wafer ring 20 containing each component 10 to the component lead-out position P0. The picking tool 500 removes the wafer from the wafer ring moving stage 200. The ring 20 picks up the component 10; the component unloading section 400 mounts the component 10 transferred by the picking tool 500 on a tray 30 to unload the component 10, wherein the tray 30 is formed with a plurality of mounting grooves 31 for mounting each component 10.

The component processor may include a first upper image acquisition section 330 that acquires images of the state of one or more components 10 loaded on the wafer ring to execute on the component lead-out position P0 At least one of the mounting state of the component 10 and the above visual inspection is checked.

At this time, the component processor may further include a first upper image acquisition section moving section which, while the pickup tool 500 picks up the component 10 at the component lead-out position P0, The first upper image acquisition section 330 is moved to a region other than the upper part of the component lead-out position P0, and when the pickup tool 500 is moved to the component loading position of the component unloading section 400, the first upper image is acquired The acquisition unit 330 moves to the component derivation position P0.

The picking tool 500 may include: a rotation driving part 510 having a rotation axis in a horizontal direction; a plurality of pickers 530 combined with the rotation axis; and the plurality of pickers 530 being arranged in a circumferential direction of the rotation axis. , And further rotate around the rotation axis, and derive the element 10 from the element derivation position P0.

The component processor may further include a first lower image acquisition section 320 that is disposed on a transport path that transports the component 10 by the pickup tool 500 and acquires the component lead-out position P0 Image of the bottom surface of the picked-up component 10.

The picking tool 500 can be moved by at least one of moving in the X-axis direction, moving in the Y-axis direction, moving in the Z-axis direction, and rotating movement using the Z-axis as a rotation axis, and further based on acquiring from the first upper image The image acquired by one of the section 330 and the first lower image acquisition section 320 positions the component 10 at the component loading position of the component unloading section 400.

At this time, the component processor may further include a first lower image acquisition section moving section, which acquires the image of the bottom surface of the picked-up component 10 during the process of acquiring the image of the bottom surface of the picked-up component 10. The first lower image acquisition section 320 moves in the longitudinal direction of the picked-up element 10.

The component unloading section 400 may include a plurality of mounting sections 410, and the plurality of mounting sections 410 are mounted with a tray 30, and the tray 30 is configured to mount components 10 picked up by the picking tool 500 in categories; the component processor may further It includes a second upper image acquisition section 340, which is used to acquire an image of the state of the component 10 mounted on the tray 30 to perform the mounting state of the component 10 and the upper At least one of the visual inspections.

At this time, the component processor may further include a second upper image acquisition section moving section that loads the component 10 picked up by the pickup tool 500 from the wafer ring 20 on the component processor. During the component loading position of the mounting section 410, the second upper image acquisition section 340 is moved to an area other than the upper part of the component loading position of the mounting section 410, and the pickup tool 500 is led to the component lead-out position P0. When moving, the second upper image acquisition section 340 is moved to the component loading position of the mounting section 410.

The component processor may further include a cleaning section 310 disposed on a transport path of the tray 30 to further remove foreign objects in the empty tray 30 to be transferred to the mounting section 410.

The component unloading section 400 may include: a mounting carrier 450 for stacking and storing the empty tray 30; a plurality of mounting sections 410 for sorting and loading the components 10 picked up by the picking tool 500; an unloading stacker 460 for stacking and storage from a lower portion to an upper direction; Pallet 30 after component loading is completed; a buffer section 420 transports the installed empty tray 30 from the mounting carrier 450 to the mounting section 410, and receives the component loaded tray 30 from the mounting section 410 and transports it to the unloading Stacker 460.

An advantage of the component processor of the present invention is as follows: the processing speed of a device that picks up components from a mounting component such as a wafer ring on which a plurality of components are mounted and loads the components on an unloading component such as a tray, etc. Afterwards, the related inspection process for the loading state is performed, so that the non-conforming products that may occur during the component loading process can be removed.

10‧‧‧ Components

20‧‧‧Chip Ring

30, 30a, 30b, 30c‧‧‧pallets

31‧‧‧Mounting slot

100‧‧‧ Wafer ring mounting section

111‧‧‧ Wafer Ring Carrier

200‧‧‧ Wafer Ring Mobile Station

210‧‧‧ pin

300‧‧‧Pick up tools

310‧‧‧Cleaning Department

320‧‧‧First lower image acquisition department

330‧‧‧First Upper Image Acquisition Department

340‧‧‧Second Upper Image Acquisition Department

400‧‧‧component unloading department

410‧‧‧Mounting Department

410a‧‧‧First installation department

410b‧‧‧Second installation section

410c‧‧‧Third installation department

420‧‧‧Buffer Department

450‧‧‧ Mounting carrier

460‧‧‧Unloading Stacker

462‧‧‧Frame

464‧‧‧ Cover

500‧‧‧Pick up tools

510‧‧‧Rotary drive unit

520‧‧‧rotating arm

530‧‧‧Pickup

P0‧‧‧component export location

FIG. 1 is a plan view showing a component processor according to an embodiment of the present invention; FIG. 2 is a perspective view showing a tray of FIG. 1; FIGS. 3a and 3b are views showing a part of the structure of the component processor of FIG. 1, specifically, FIG. Is a plan view showing the moving path of the picking tool, the first upper image acquisition section and the second upper image acquisition section; FIGS. 4a and 4b are enlarged views showing a cross section of the component processor of FIG. 1, specifically enlarged. A cross-sectional view showing the movement paths of the picking tool, the first upper image acquisition section, and the second upper image acquisition section; FIG. 5 is an enlarged view showing the movement path of the structure of the component processor of FIG. 1; An enlarged view of a moving path of another structure of the component processor; FIG. 7a is a plan view showing the unloading stacker of the component processor of FIG. 1; and FIG. 7b is a sectional view showing the unloading stacker of FIG. 7a.

Hereinafter, the component processor of the present invention will be described with reference to the drawings.

As shown in FIG. 1 to FIG. 6, the component processor of the present invention includes: a wafer ring mounting portion 100 that mounts a wafer ring 20 that loads a plurality of components 10 having a length longer than a width; a wafer ring moving stage 200, receiving the wafer ring 20 from the wafer ring mounting portion 100, and moving the wafer ring 20 containing each component 10 to the component lead-out position P0; the picking tool 500 picks up the component 10 from the wafer ring 20 on the wafer ring moving stage 200; The component unloading section 400 unloads the components 10 by mounting the components 10 transferred by the picking tool 500 on a tray 30 in which a plurality of mounting grooves 31 for mounting the components 10 are formed.

The wafer mounting section 100 may have various structures as a structure in which a plurality of wafers 20 to which a plurality of elements 10 are attached are mounted.

Here, the element 10 is an element having a relatively longer length than a width, and may be an element 10 that completes a semiconductor process and a sawing process.

In particular, the element 10 is not only the element 10 after the packaging process after the semiconductor process is completed, but also the wafer-level element that is completed by the semiconductor process and the sawing process.

For example, the element 10 is an IC chip such as COG (Chip On Glass, Chip On Film) or DDI (Display Drive IC) as a display driving chip, and an LED element 10 is implemented. The component may be a component 10 in which a wafer performs a so-called semiconductor process and a dicing process (and a test process and a sort process).

Then, the component 10 is transported in a state of being loaded on the wafer ring 20 after the sawing process.

On the other hand, the wafer ring 20 may have various structures as a structure for mounting the element 10 having a relatively longer length than a width.

For example, the wafer ring 20 as a structure for adhering and carrying a plurality of components 10 may have various structures, and may include: a first bonding ring that is bonded to an adhesive tape on the surface, and then each component 10 is adhered thereon; a second bonding ring A tension is applied to the outer diameter direction of the adhesive tape bonded to the first coupling ring, so that the tape is deformed toward the outer diameter direction to finely space each element 10.

Here, of course, the wafer ring 20 may be bonded by an adhesive tape and a bonding ring, wherein the surface of the adhesive tape is tacky to adhere the element 10 thereon, and the one bonding ring is bonded to the adhesive tape.

As shown in FIG. 2, the tray 30 forms a plurality of mounting grooves 31 to which the component 10 can be mounted, and can have various shapes such as a rectangle.

Preferably, the depth of the mounting groove 31 is greater than the height of the component 10, so that the component 10 is not damaged when the tray 30 is stacked up and down.

The wafer ring mounting portion 100 includes a carrier mounting portion on which a wafer ring carrier is mounted, the wafer ring carrier is provided with a plurality of wafer rings 20, and the plurality of wafer rings 20 are provided with a component 10 to be led out; a wafer moving tool enables a wafer The ring 20 moves to exchange the second wafer ring 20 with the first wafer ring 20, where the first wafer ring 20 is to be led out of the component 10 between the wafer ring carrier and the wafer ring moving stage 200, and the second wafer ring 20 completes the component 10 Export.

For example, the wafer moving tool may be constituted by a clamping device and a linear drive device, or may be constituted by a linear drive device and a pusher for linearly moving a pusher, etc., and may have various structures.

The wafer ring carrier is a structure for loading a plurality of wafer rings 20. The wafer ring carriers 20 can be stacked and loaded, and the wafer ring carriers can be arranged up and down to sequentially lead out the stacked wafer rings 20, wherein a plurality of wafer rings 20 are adhered. There are multiple elements 10 to be derived.

Then, the wafer ring mounting portion 100 may include a wafer buffer portion (not shown) to temporarily store the second wafer ring 20 and then move the wafer ring 20 from the wafer ring before the first wafer ring 20 of the component 10 to be led out reaches the wafer ring moving stage 200. The stage 200 receives the second wafer ring 20 from which the component has been derived, and then transfers the second wafer ring 20 to the empty position of the wafer ring carrier after the transfer of the first wafer ring 20 to the wafer ring moving stage 200 is completed.

As the structure for temporarily storing the wafer ring 20, the wafer buffer section (not shown) may be any structure as long as the structure can support the wafer ring 20.

The wafer ring moving stage 200 is a structure that moves the wafer ring 20 derived from the wafer ring carrier 111 to the pick-up tool 500 to derive the component lead-out position P0 of the component 10, and can have various structures, as shown in FIG. 1, which can be moved XY or XY- Θ moves. Here, X-Y refers to an orthogonal coordinate axis with the horizontal plane of the wafer ring 20 as a reference, and Θ refers to a rotation centered on the Z axis.

In addition, the wafer ring moving stage 200 can also move in the up-down direction (that is, the Z-axis direction).

As shown in FIG. 4a, when the wafer ring moving stage 200 moves the wafer ring 20 to the component lead-out position P0, one or more needle pins 210 may be further provided below the component lead-out position P0, and the needle pins 210 are moved to the upper side. The tape of the wafer ring 20 is pressed to easily pick up the component 10.

Here, the number of the pins 210 may be different according to the size of the element 10.

At this time, in a case where the pin 210 is moved along the component lead-out position P0, a device for moving is needed, which increases manufacturing costs. Accordingly, it is preferable that the pin 210 is fixed, thereby fixing the component lead-out position. P0 is the best.

The picking tool 500 may have various structures as a structure for picking up the element 10 from the wafer ring 20 on the wafer ring moving stage 200.

On the other hand, the picking tool 500 may include a suction head (not shown in the figure), and the suction head moves up and down (moves in the Z direction) while generating a vacuum pressure to suck and pick up the component 10.

At this time, the picking tool 500 may have various structures, specifically, the length may be changed, or the picking tool 500 may be moved linearly as a whole.

In an embodiment, as shown in FIG. 1 to FIG. 5, the pickup tool 500 may include: a rotation driving unit 510 having a rotation axis in a horizontal direction; and a plurality of rotation driving units 510 coupled to the rotation axis and arranged along the rotation direction of the rotation axis. Rotating arms 520; pickers 530 respectively coupled to the plurality of rotating arms 520 and picking up the element 10.

The rotation driving unit 510 has a structure in which a rotation arm 520 coupled to the rotation shaft is rotationally driven as a rotation shaft having a horizontal direction, and may be any structure as long as it is a rotation driving device.

For example, the rotation drive unit 510 may be a structure having a horizontal rotation shaft in which a plurality of pickups 530 are coupled, and may include a rotation motor.

On the other hand, the rotary driving part 510 preferably has a pneumatic rotary joint, and the picker 530 coupled to the rotary arm 520 picks up the element 10 through the vacuum. According to this, the pneumatic rotary joint may transfer the vacuum pressure to the pickup 530 Rotate the shaft while transmitting air pressure.

Here, the structure in which the plurality of pickers 530 are rotated by the rotation axis is preferably parallel to the upper surface of the wafer ring 20 or the upper surface of the tray 30, that is, perpendicular to the Z axis.

In particular, the rotation axis may be perpendicular to the Z axis, that is, parallel to the X axis or the Y axis, and preferably parallel to the X axis.

Then, the rotation shaft can perform various rotations according to the control of the rotation direction of the pickup 530, specifically, unidirectional or bidirectional rotation, and the like.

The structure in which the rotation arm 520 is combined with the rotation shaft to rotate and support the picker 530 may be any structure as long as it can support the picker 530.

Here, the rotating arm 520 is an optional structure and is not an essential structure.

As for the structure of the picker 530, the picker 530 is combined with the rotation axis and is arranged in the circumferential direction of the rotation axis, and then the picker 530 is rotated around the rotation axis, and the component 10 can be derived at the component lead-out position P0, and can be any A structure.

For example, the picker 530 is combined with the rotation axis in a radial direction, and the picker 530 is arranged in the circumferential direction of the rotation axis, and further rotates around the rotation axis, and the picker 530 may have various structures.

For another example, the picker 530 is combined with the rotation axis in a parallel direction, and the picker 530 is arranged in the circumferential direction of the rotation axis, and further rotates around the rotation axis, and the picker 530 may have various structures.

The picker 530 picks up the element 10 from the wafer ring 20 by vacuum pressure.

For example, the picker 530 may include: an air pressure connection portion that receives air pressure from the outside; and an air pressure pickup element 10 provided at an end through the air pressure connection portion or a pickup head that releases the pickup.

In addition, the plurality of pickers 530 are connected to the rotation shaft, and thus may include a rotation support member (not shown in the figure).

The rotation supporting member (not shown) is a structure that supports a plurality of pickups 530 in combination with a plurality of pickups 530 and may have various structures.

In addition, the picker 530 may be moved up and down by an up-and-down driving device provided on the rotating arm 520.

In addition, for the picker 530, in order to regularly perform component picking and placement, it is preferable that n pickers 50 may be provided so that the picker 530 forms an equal angle with the rotation axis as a center, and more preferably, 2n pickups may be provided. (N is a natural number greater than 1).

Then, for the plurality of pickups 530, it is necessary to dispose the plurality of pickups 530 linearly to the upper surface of the wafer ring 20 or the upper surface of the tray 30, so that the plurality of pickups 530 can easily perform pickup and loading of the component 10.

Accordingly, the plurality of pickups 530 can move linearly in the radial direction with respect to the rotation axis, and can move linearly in the radial direction by the radial direction moving portion (not shown).

On the other hand, the picking tool 500 may include a second rotation driving portion. When the rotation axis of the pickup 530 is referred to as a first rotation axis, the second rotation driving portion has a second rotation axis perpendicular to the first rotation axis, and The second rotation axis is a center rotation rotation driving unit 510.

The second rotation driving unit has a second rotation shaft and rotates the second rotation shaft, and may be constituted by a rotation motor.

Then, the second rotation driving portion may perform at least one of an X-axis movement and a Y-axis movement by a linear moving portion.

On the other hand, preferably, the second rotation axis passes through the rotation centers of the plurality of pickers 530 to flexibly correct errors in the Θ direction of the element 10 picked up by the pickers 530, that is, the rotation using the Z axis as the rotation axis Angle error.

As shown in FIG. 1, the picking tool 500 of the first embodiment having the above-mentioned structure picks up the component 10 at the component lead-out position P0 on the wafer ring 20, and then moves to a tray 30 spaced from the wafer ring 20 and can be further loaded at the loading position Loading element 10.

At this time, as shown in FIG. 3a to FIG. 3b, a first upper image acquisition section 330 may be provided above the component lead-out position P0, and the first upper image acquisition section 330 acquires the status of one or more components 10 mounted on the wafer ring 20. The image can further perform at least one of the mounting state of the component 10 and the above visual inspection.

The structure of the first upper image acquisition section 330 is used to acquire images of the state of one or more components 10 mounted on the wafer ring 20, and further, at least one of the mounting state of the components 10 and the above visual inspection can be performed, and Various structures are possible.

The first upper image acquisition unit 330 may be a structure that acquires an image of the element 10 mounted on the wafer ring 20, and may have various structures such as a scanner and a camera.

Then, the first upper image acquisition section 330 can be flexibly applied to grasp the position of the component 10 to be picked up by the picker 530, check the upper surface of the component 10, and the like.

At this time, for the first upper image acquisition section 330, the first upper image acquisition section 330 is moved to a position other than the element export position P0 by the first upper image acquisition section moving section while the pickup 500 picks up the component 10 from the element export position P0. In other regions, when the pickup tool 500 is moved to the component loading position of the component unloading section 400, the first upper image acquisition section 330 may be moved to the component lead-out position P0.

With regard to the structure of the moving portion of the first upper image acquisition section, in order for the first upper image acquisition section 330 to acquire the image on the component 10 to be picked up on the component lead-out position P0 without being disturbed by the picking tool 300, the first The upper image acquisition section 330 moves from the upper part of the component export position P0 to an area other than that position or may move from an area other than the component export position P0 to the component export position P0, and the first upper image acquisition section moving part may have Various structures.

The present invention has the advantage that, while the pickup tool 500 derives the component 10 at the component lead-out position P0 of the wafer ring table 200, the first upper image acquisition section 330, which was once located on one side of the area other than the component lead-out position P0, moves to The mounting portion 410 is used to load the component 10 picked up by the picking tool 500 on the tray 30. In this case, the first upper image acquisition portion 330 is moved to the upper portion of the component lead-out position P0 of the wafer ring 20, so that the first upper image can be imaged. The acquisition unit 330 is disposed closer to the wafer ring stage 200 than before, and can acquire the mounting state of the component 10 mounted on the wafer ring 20 and a high-resolution image on the component 10.

On the other hand, the first upper image acquisition unit 330 is a structure that acquires the image on the element 10 at a position close to the upper portion of the wafer ring table 200, and it is also preferable that low-angle illumination can also be arranged.

In addition, a first lower image acquisition section 320 may be further provided on the transport path for transporting the component 10 by the pickup tool 500 to acquire an image of the bottom surface of the component 10 picked up at the component lead-out position P0.

The first lower image acquisition section 320 may have various structures as a structure provided on the transport path where the pickup tool 500 transports the component 10 and acquiring an image of the bottom surface of the component 10 picked up at the component lead-out position P0.

The first lower image acquisition unit 320 may be a structure that acquires an image of the bottom surface of the component 10 picked up by the pickup 530 at the component lead-out position P0, and may be various structures such as a scanner and a camera.

The first lower image acquisition section 320 can move in the longitudinal direction of the element 10 picked up by the first lower image acquisition section moving section during the process of acquiring an image of the bottom surface of the picked-up component 10.

The first lower image acquisition section moving section, as a structure that moves the first lower image acquisition section 320 in the length direction of the element 10, may have various structures, where the element 10 is acquired by the first lower image acquisition section 320 Of the bottom image of the object.

In more detail, as shown in FIG. 5, the first lower image acquisition section moving section moves the first lower image acquisition section 320 in the length direction (arrow direction) of the element 10 and makes the first lower section The image acquisition unit 320 can sequentially acquire images in the longitudinal direction for the bottom surface of one element 10.

The advantages of the present invention are as follows: the length of the picked-up component 10 is relatively longer than the width, so that the first lower image acquisition section 320 is moved in the length direction of the picked-up component 10 and acquires an image, and the component 10 can be obtained at a close distance High-resolution image of the bottom surface.

According to this, the picking tool 500 can move in the X-axis direction, the Y-axis direction, and the Z-axis direction based on the arrangement direction of the component lead-out position P0 and the loading position, and further based on the first upper image acquisition section 330 and the first lower portion. One of the images acquired by the image acquisition section 320 positions the component 10 at the component loading position of the component unloading section 400.

In addition, the picking tool 500 can be rotated based on the arrangement direction of the component lead-out position P0 and the loading position. For example, the pickup tool 500 can be rotated using the Z-axis direction as a second rotation axis.

That is, the present invention analyzes an image acquired by the first upper image acquisition section 330 or the first lower image acquisition section 320, and moves the pickup tool 500 with at least one of XYZ movement and horizontal rotation movement to make the component 10 It is located at a loading position set in advance on the tray 30 of the mounting portion 410, and the picked-up component 10 can be mounted at an accurate loading position of the tray 30 of the mounting portion 410.

As shown in FIGS. 1 to 5, the component unloading section 400 is a structure for unloading the component 10 by mounting the component 10 transferred by the picking tool 500 on the tray 30, and may have various structures, in which the tray 30 is formed with a plurality of components 10 Multiple mounting slots 31.

For example, the component unloading section 400 may include a tray mounting section that mounts an empty tray 30 to a plurality of mounting sections 410 and a plurality of mounting sections 410 that mount a tray 30 that sortly loads the components 10 picked up by the picking tool 500 A tray unloading unit that derives and unloads the completed component loading tray 30; a buffer unit 420 that transports the empty tray 30 from the tray mounting unit to the mounting unit 410 and receives the component 30 loaded tray from the mounting unit 410 to the tray unloading unit.

Here, the component unloading section 400 includes a pair of carriers for loading trays without distinguishing between the tray mounting section and the tray unloading section, and can perform supply of empty trays, loading of full trays, and the like.

The tray mounting portion may include a mounting carrier 450 for stacking and storing the empty trays 30.

The tray mounting portion has a structure in which the hole tray 30 is led out from the mounting carrier 450 to be transmitted to the plurality of mounting portions 410 and may have various structures.

For example, the tray mounting portion may transport the empty tray 30 to the plurality of mounting portions 410 by a guide rail method.

The plurality of mounting portions 410 may be composed of a first mounting portion 410a, a second mounting portion 410b, and a third mounting portion 410c. The first mounting portion 410a and the second mounting portion 410b are mounted based on the first upper image acquisition portion 330 or the first lower portion The image acquired by the external image acquisition unit 320 is classified as a component 10 that is a qualified product, and the third mounting portion 410c mounts a tray 30c on which the component 10 that is not classified as a qualified product is mounted.

The first mounting portion 410 a and the second mounting portion 410 b may have a structure in which the trays 30 a and 30 b on which the components 10 judged to be qualified are mounted, wherein the components 10 are components that have been inspected from the pick-up tool 500.

The present invention has the advantage that a plurality of mounting portions 410 are constituted by the first mounting portion 410a and the second mounting portion 410b on which the components 10 classified as qualified products are loaded, and the component loading from the tray 30a of the first mounting portion 410a is completed. While the tray mounting section is mounting the empty tray 30, the component loading process can be performed in the second mounting section 410b, so that the process can be prevented from being delayed due to the exchange of the tray 30 between the tray mounting section or the tray unloading section.

A second upper image acquisition section 340 may be further provided on the upper portions of the first mounting portion 410a and the second mounting portion 410b. The second upper image acquisition portion 340 is used to acquire an image of the state of the component 10 mounted on the tray 30, and further, The upper part of the part 410 performs one of the mounting state of the component 10 and the visual inspection above.

For the structure of the second upper image acquisition section 340, an image of the state of the component 10 mounted on the tray 30 is acquired, and at least one of the mounting state of the component 10 and the above visual inspection can be performed on the upper portion of the mounting section 410, and the second The upper image acquisition section 340 may have various structures.

The second upper image acquisition unit 340 may be a structure that acquires an image of the state of the component 10 mounted on the tray 30 on the upper portion of the mounting unit 410, and may have various structures such as a scanner and a camera.

Preferably, the second upper image acquisition section 340 is disposed on the upper part of the mounting sections 410a and 410b, wherein the mounting sections 410a and 410b are provided with the trays 30a and 30b, and the trays 30a and 30b are provided with the first upper image acquisition section 330 and the first The component 10 classified as a qualified product in the visual inspection performed by the lower image acquisition section 320.

Here, the second upper image acquisition section 340 may perform at least one of the mounting state of the loaded component 10 and the visual inspection on the component 10 at the loading position.

At this time, while the component 10 picked up by the picking tool 500 on the wafer ring 20 is loaded at the component loading position of the mounting portion 410, the second upper image acquisition portion 340 is moved to a position other than the mounting portion 410 by the second upper image acquisition portion moving portion. When the pickup tool 500 is moved to the component lead-out position P0 in a region other than the upper part of the component loading position, the second upper image acquisition section 340 can be moved to the component loading position of the mounting section 410.

With regard to the structure of the moving part of the second upper image acquisition section, in order for the second upper image acquisition section 340 to acquire an image of the upper part of the component 10 loaded on the component loading position without being disturbed by the pickup tool 500, the second upper section The image acquisition section 340 moves from an upper part of the component loading position to an area other than the position or from an area other than the upper part of the component loading position to the upper part of the component loading position, and the second upper image acquisition section moving part may have various structures.

In more detail, as shown in FIG. 6, the second upper image acquisition section moving section may cause the second upper image acquisition section 340 to move in a horizontal direction (arrow direction) from an upper portion of the tray 30 mounted on the mounting section 410. The second upper image acquisition unit 340 sequentially acquires the upper images of the plurality of components 10 loaded on the tray 30.

The present invention has the advantage that, while the pickup tool 500 is loading the component 10 at the component loading position of the wafer ring table 200, the second upper image acquisition section 340 that was once located in one side of the area other than the component loading position of the mounting section 410 Move to the component lead-out position P0, so that the pickup tool 500 leads the component 10 from the wafer ring 20, in which case the second upper image acquisition section 340 is moved to the upper part of the mounting section 410, so that the second upper image acquisition section can be made 340 is disposed closer to the mounting portion 410 than before, and can obtain the mounting state of the component 10 and the high-resolution image on the component 10 mounted on the tray 30 of the mounting portion 410.

The trays 30a and 30b in which the mounting portions 410a and 410b of the components 10 classified as qualified products are mounted are exported to the tray unloading unit for storage after the components are loaded.

The tray unloading section may have various structures as a structure for unloading the component-loaded tray 30 from the plurality of mounting sections 410.

For example, the tray unloading section may include an unloading stacker 460 that stacks the trays 30 loaded with the storage elements from the lower part to the upper part.

The unloading stacker 460 may have various structures as a structure for stacking the storage component-loaded trays 30 from the bottom to the upper direction.

For example, as shown in FIG. 7a to FIG. 7b, the unloading stacker 460 may include a frame 462 that opens a lower portion so that the trays 30 derived from the plurality of mounting portions 410 are stacked from a lower portion to an upper direction (Z direction); a cover portion 464 , Covering the upper surface of the uppermost tray 30 without leaving the uppermost surface of the upper tray 30 outside.

The present invention has the advantages of stacking the trays 30 from the lower part to the upper part and having a cover part 464 at the uppermost part, thereby preventing contamination on the upper surface of the tray 30 that may occur during the unloading process of the tray 30 after the components are unloaded.

On the other hand, a buffer section 420 may be provided to receive the component-loaded tray 30 from the mounting section 410 and transport it to the unloading stacker 460.

Regarding the structure of the buffer section 420, the empty tray 30 is received from the mounting carrier 450 to exchange the tray 30 with the plurality of mounting sections 410, and the component 30 received from the plurality of mounting sections 410 is loaded to the unloading stacker 460, The buffer portion 420 has various structures.

At this time, the buffer portion 420 can be moved up and down to exchange the tray 30 with the plurality of mounting portions 410.

On the other hand, a cleaning section 310 may be provided between the buffer section 420 and the plurality of mounting sections 410, and the cleaning section 310 is disposed on the transport path of the tray 30 to remove foreign objects in the empty tray 30 to be transferred to the mounting section 410.

The structure of the cleaning part 310 is provided on the conveyance path of the tray 30 to remove foreign objects in the empty tray 30 to be transferred to the mounting part 410, and may have various structures.

Preferably, the cleaning section 310 is provided on a transport path of the empty tray 30, wherein the empty tray 30 is transported to the first mounting section 410 a and the second mounting section 410 b on which the components 10 classified as qualified products are mounted.

For example, the cleaning section 310 may be provided with a gas passage and one or more nozzles, wherein the gas passage is connected to a gas supply device, and then the air is sprayed onto the empty tray 30 moved to the mounting section 410 in a state of being fixed in the cleaning position, The one or more nozzles receive gas from the gas passage and spray the gas onto the tray 30.

On the other hand, the cleaning part 310 may include a main body covering the upper surface of the tray 30 and forming a cleaning space on an upper portion of the tray 30.

The main body keeps the clean space in a sealed state, and the main body may be connected to a discharge pipe so that foreign objects are discharged from the clean space to the outside together with the gas sprayed through the nozzle.

The above is only a part of the description of the preferred embodiments that can be implemented by the present invention. Therefore, the scope of the present invention must not be limited by the above-mentioned embodiments. The technical ideas of the present invention and the basic technical ideas described above should all be included in the present invention. Within the scope of the invention.

Claims (12)

    A component processor includes a wafer ring mounting portion (100) for mounting a wafer ring (20) on which a component (10) is mounted, wherein the length of the component (10) is relatively longer than the width; a wafer ring moving stage ( 200), receiving the wafer ring (20) from the wafer ring mounting portion (100), and moving the wafer ring (20) containing each of the components (10) to a component lead-out position (P0); A picking tool (500) picks up the component (10) from the wafer ring (20) on the wafer ring moving stage (200); a component unloading section (400) is to be picked up by the picking tool (500) The transferred component (10) is mounted on a tray (30) to unload the component (10), wherein the tray (30) is formed with a plurality of mounting grooves (31) for mounting each of the components (10).         The component processor according to item 1 of the scope of patent application, further comprising: a first upper image acquisition section (330) for acquiring one or more of the components (10) mounted on the wafer ring (20). ) State image to perform at least one of the mounting state of the component (10) and the visual inspection above on the component lead-out position (P0).         The component processor according to item 2 of the scope of patent application, further comprising: a first upper image acquisition section moving section, which picks up the component at the component deriving position (P0) by the picking tool (500) During the period (10), the first upper image acquisition section (330) is moved to an area other than the upper part of the component lead-out position (P0), and the pickup tool (500) is moved to the component unloading section ( 400) in the component loading position, the first upper image acquisition unit (330) is moved to the component lead-out position (P0).         The component processor according to item 3 of the scope of patent application, wherein the picking tool (500) includes: a rotary driving section (510) having a horizontal axis of rotation; a plurality of pickers (530), and The rotation axis is combined, and the plurality of pickers (530) are arranged in a circumferential direction of the rotation axis, and further rotated around the rotation axis, and the component is derived from the component derivation position (P0). (10).         The component processor according to item 4 of the scope of patent application, further comprising: a first lower image acquisition section (320) arranged to transport the component (10) by the pickup tool (500) Path, and acquire an image of the bottom surface of the component (10) picked up at the component export position (P0).         The component processor according to item 5 of the scope of patent application, wherein the picking tool (500) is in the X-axis direction movement, the Y-axis direction movement, the Z-axis direction movement, and the rotation movement with the Z-axis as the rotation axis. Move at least one of the movements, and further, the element (10) is located at the position based on an image acquired by one of the first upper image acquisition section (330) and the first lower image acquisition section (320). The component loading position of the component unloading section (400) is described.         The component processor according to item 5 of the scope of patent application, further comprising: a first lower image acquisition section moving section, in the process of acquiring an image of the bottom surface of the picked-up component (10), The first lower image acquisition section (320) moves in the length direction of the picked-up element (10).         The component processor according to item 1 of the scope of patent application, wherein the component unloading section (400) includes: a plurality of mounting sections (410), and a tray (30) is installed, and the trays (30) are classified and installed by The component (10) picked up by the picking tool (500); the component processor further includes: a second upper image acquisition section (340) for acquiring the component mounted on the tray (30) (10) A state image to perform at least one of the mounting state of the element (10) and the visual inspection above on the mounting portion (410).         The component processor according to item 8 of the scope of patent application, further comprising: a second upper image acquisition section moving section, said component to be picked up by said picking tool (500) from said wafer ring (20) (10) the second upper image acquisition section (340) is moved to an area other than the upper part of the component loading position of the mounting section (410) while being loaded at the component loading position of the mounting section (410), When the picking tool (500) is moved to the component lead-out position (P0), the second upper image acquisition section (340) is moved to the component loading position of the mounting section (410).         The component processor according to item 1 of the scope of patent application, wherein the component unloading section (400) further comprises: a cleaning section (310), which is disposed on a transport path of the tray (30), and further Foreign matter transferred to the empty tray (30) of the mounting portion (410).         The component processor according to item 5 of the scope of patent application, wherein the component unloading section (400) includes: a mounting carrier (450), stacked empty storage trays (30); a plurality of mounting sections (410), classified Loading the component (10) picked up by the picking tool (500); an unloading stacker (460), stacking the tray (30) with the storage component loading completed from the bottom to the upper direction; a buffer section (420) , Transporting the installed empty tray (30) from the mounting carrier (450) to the mounting section (410), receiving the component-loaded tray (30) from the mounting section (410), and transporting Go to the unload stacker (460).         The component processor according to item 11 of the scope of patent application, wherein the plurality of mounting portions (410) include: a first mounting portion and a second mounting portion (410a, 410b); An image (10) determined by at least one of the upper image acquisition section (330) and the first lower image acquisition section (320) as a qualified product.