TW201726814A - Polyxylene resin composition and sealing material for semiconductor light-emitting element - Google Patents

Abstract

A silicone resin composition is provided which is useful in the production of a highly UV-stable cured product of a silicone resin composition. This silicone resin composition includes at least one silicone resin and satisfies conditions (i) to (iii) below. (i) The contained silicon atoms consist essentially of A3 silicon atoms, and A1 silicon atoms and/or A2 silicon atoms, and the ratio of the content of A3 silicon atoms to the total content of the A1 silicon atoms through the A3 silicon atoms is 50-99 mol%. (ii) Side chains binding to the silicon atoms are alkyl groups, alkoxy groups or hydroxyl groups, the molar ratio of the alkoxy groups to the alkyl groups is less than 5 to 100, and the molar ratio of the hydroxyl groups to the alkyl groups is greater than or equal to 10 to 100. (iii) The composition is essentially free of metal catalysts and contains a curing catalyst that does not contain metals, wherein the concentration of the curing catalyst in the composition is less than or equal to 600ppm.

Description

Polyxylene resin composition and sealing material for semiconductor light-emitting element

The present invention relates to a polyoxyxylene resin composition and a sealing material for a semiconductor light-emitting element. More specifically, the present invention relates to a sealing material for a semiconductor light-emitting device comprising a polyoxyxylene resin composition, a cured product of a polyoxyxylene resin composition, and a cured product of a polyoxyxylene resin composition.

In recent years, UV (ultraviolet)-LED has begun to appear on the market. The UV-LED seal is generally made of quartz glass. However, since quartz glass is a high-priced product, there is a problem that the price of the product becomes high and the market competitiveness becomes low. Further, when the UV-LED is sealed using quartz glass, there is a space (sealed space) between the UV-LED and the quartz glass. Due to the difference in refractive index between the space and the surface of the UV-LED, and the difference in refractive index between the space and the surface of the quartz glass is large, the UV light is reflected and the UV light is extracted. The problem of low efficiency. Therefore, it has been proposed to use a cured product of a polyoxymethylene resin composition as a sealing material for a UV-LED.

For example, Patent Document 1 discloses that an ultraviolet transparent polysesquioxane glass having an absorption coefficient of a wavelength of 230 to 850 nm of 5 cm ^-1 or less is used for a sealing material.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-253223

However, the cured product of the above polyoxymethylene resin composition is not sufficient for the transmittance of UV light. Further, the cured product of the polyoxyxene resin composition is more likely to be deteriorated by UV rays than the quartz glass, and the transmittance to UV rays is further lowered due to deterioration. Therefore, when a cured product of a polyoxyxylene resin composition is used as a sealing material for a UV-LED, a cured product of a polyoxymethylene resin composition capable of penetrating UV rays with high transmittance for a long period of time is required.

In the sealing material using the cured product of the polyoxymethylene resin composition, there is a case where the difficulty of deterioration by UV rays is referred to as "UV stability". Further, in the sealing material using the cured product of the polyoxyn resin composition, there is a characteristic that it is hard to be deteriorated by the UV light, and the UV light can be penetrated at a high transmittance for a long period of time is called "high UV stabilization". Sex."

The present invention has been made in view of such circumstances, and provides a hardening of a composition of a polyoxyxylene resin for producing high UV stability. The composition of the polyoxyxylene resin useful on the object is intended. The present invention is also directed to providing a cured product of the polyoxyxene resin composition. Further, the present invention has an object of providing a sealing material for a semiconductor light-emitting element comprising a cured product of the polyoxymethylene resin composition.

The present invention provides the following [1] to [5].

[1] A polyoxyxylene resin composition comprising a polyfluorene oxide resin composition of at least one polyoxyxylene resin and satisfying the requirements of the following (i) to (iii).

(i) The germanium atom system contained is substantially composed of at least one germanium atom and A3 germanium atom selected from the group consisting of an A1 germanium atom and an A2 germanium atom, and is relative to the A1 germanium atom, the A2 germanium atom, and the A3 germanium atom. The total content, the ratio of the content of A3 矽 atoms is 50 mol% or more and 99 mol% or less.

(ii) the side chain to which the above-mentioned ruthenium atom is bonded is an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 or 2 carbon atoms, or a hydroxyl group, and the molybdenum of the alkoxy group is less than 5 with respect to the alkyl group 100. The molar ratio of the hydroxyl group is 10 or more with respect to the alkyl group 100.

(iii) substantially does not contain a metal catalyst, and contains a catalyst for curing which does not contain a metal (the catalyst for curing is an acid catalyst or an alkali catalyst), and a curing catalyst for the composition of the polyoxyxylene resin. The concentration is 600 ppm (mass parts per million) or less. [here,

The A1 矽 atom refers to a combination of one oxygen atom (the oxygen atom is bonded to a ruthenium atom in another structural unit) and one R ¹ and two R ^{2 in a} structural unit represented by the following formula (A1). The ruthenium atom or, in the structural unit represented by the following formula (A1'), is bonded to one bond (the bond is bonded to the oxygen atom bonded to the ruthenium atom in other structural units), 1 One R ¹ and two R ^{2 are} combined with a ruthenium atom.

The A2 矽 atomic system is a structural unit represented by the following formula (A2), and one oxygen atom (the oxygen atom system is bonded to a ruthenium atom in another structural unit), and one bonding point (the bonding system) A ruthenium atom bonded to an oxygen atom bonded to a ruthenium atom in another structural unit, and 1 R ¹ and 1 R ^{2 are} bonded.

The A3 矽 atom is a structure unit represented by the following formula (A3), and two oxygen atoms (the oxygen atom is bonded to a ruthenium atom in another structural unit), and one bond (the bond system) A ruthenium atom bonded to an oxygen atom bonded to a ruthenium atom in another structural unit) and one R ^{1 is} bonded.

R ¹ represents an alkyl group having 1 to 3 carbon atoms, and R ² represents an alkoxy group or a hydroxyl group having 1 or 2 carbon atoms. ]

[2] The polyoxyxylene resin composition of claim 1, which comprises the following polyfluorene oxide resin as the polyfluorene oxide resin.

The first polyoxyl resin:

The ruthenium atom contained therein is substantially composed of at least one ruthenium atom selected from the group consisting of the above A1 矽 atom and the A2 矽 atom, and the A3 矽 atom, and the A1 矽 atom, the A 2 矽 atom, and the A3 described above. The total content of the ruthenium atoms is a polyoxyxylene resin having a ratio of the content of the A3 ruthenium atom of 60 mol% or more and 90 mol% or less and a weight average molecular weight of 1,500 or more and 8,000 or less.

[3] The polyoxyxylene resin composition according to claim 1 or 2, which comprises the following second polyfluorene oxide resin as the above polyfluorene oxide resin.

2nd polyoxyl resin:

The temperature was raised from room temperature to 200 ° C at a temperature increase rate of 5 ° C /min, and the mass reduction rate after maintaining at 500 ° C for 5 hours in the air was less than 5%.

[4] A cured product of the polyoxyxylene resin composition according to any one of [1] to [3].

[5] A sealing material for a semiconductor light-emitting device, which is composed of a cured product of the polyoxyxylene resin composition according to any one of [1] to [3].

According to the present invention, a polyoxyxylene resin composition useful for producing a cured product of a high UV-stabilizing polyoxyxene resin composition can be provided. Further, according to the present invention, a cured product of the polyoxyxene resin composition can be provided. Moreover, according to the present invention, a sealing material for a semiconductor light-emitting element comprising a cured product of the polyoxynoxy resin composition can be provided.

[Polyoxygenated resin composition]

A polyoxyxylene resin composition according to one embodiment of the present invention will be described.

The polyoxyxylene resin composition of the present embodiment is a polyoxyxylene resin composition containing at least one polyoxyxylene resin, and satisfies the requirements of the above (i) to (iii).

The requirements of (i) above are referred to as "requirements (i)", the requirements of (ii) above are referred to as "requirements (ii)", and the requirements of (iii) above are referred to as "requirements (iii)". The respective requirements are explained in the following order.

(Requirement (i))

As mentioned above,

The A1 矽 atomic system is a ruthenium atom in a structural unit represented by the formula (A1) or a ruthenium atom in a structural unit represented by the formula (A1').

The A2 germanium atom is a germanium atom in the structural unit represented by the formula (A2).

The A3 germanium atom is a germanium atom in the structural unit represented by the formula (A3).

R ¹ represents an alkyl group having 1 to 3 carbon atoms, and R ² represents an alkoxy group or a hydroxyl group having 1 or 2 carbon atoms.

Structural unit of formula (A1) structural unit represented by the sum of the R ^1, formula (A1 ') structural unit represented by the sum of the R ^1, formula (A2) represented by the sum of the R ^1, and formula (A3) represented by The R ¹ systems in the structural units may each be the same or different.

In the structural unit represented by the R ^2, and formula (A2) of formula (A1) in the structural unit represented by the R ^2, formula (A1 ') of the structural unit represented by the R ² may each be the same based For the difference.

The two R ² systems in the structural unit represented by the formula (A1) may be the same or different. The two R ² systems in the structural unit represented by the formula (A1') may be the same or different.

In the polyoxyxylene resin, the structural unit represented by the formula (A1) and the structural unit represented by the formula (A1') constitute the terminal of the organopolyoxyalkylene chain. Further, the structural unit represented by the formula (A3) constitutes a branched chain structure composed of an organopolyoxyalkylene chain. That is, the structural unit represented by the formula (A3) forms part of a mesh structure or a ring structure in the polysiloxane resin.

The crucible contained in the polyoxyxylene resin composition of the present embodiment The atomic system consists essentially of at least one deuterium atom and an A3 deuterium atom selected from the group consisting of an A1 germanium atom and an A2 germanium atom.

Here, "substantially composed of at least one germanium atom and A3 germanium atom selected from the group consisting of an A1 germanium atom and an A2 germanium atom" means that among the germanium atoms contained in the polyoxyxene resin composition, 80 Any of the above-mentioned ear is A1矽 atom, A2矽 atom, and A3矽 atom, and it is preferably 90% or more of A1矽 atom, A2矽 atom, and A3矽 atom, and 95% by mole. The above is preferably any of the A1矽 atom, the A2矽 atom, and the A3矽 atom.

In the polyoxyxylene resin composition of the present embodiment, the ratio of the content of the A3 germanium atom to the total content of the A1 germanium atom, the A2 germanium atom, and the A3 germanium atom is preferably 60 mol% or more and 90 mol% or less. It is preferably 65 mol% or more and 85 mol% or less.

(Requirement (ii))

As described above, the ruthenium atom contained in the polyoxyxylene resin composition of the present embodiment is substantially composed of at least one ruthenium atom and A3 ruthenium atom selected from the group consisting of an A1 ruthenium atom and an A2 ruthenium atom. Further, as shown by the structural unit represented by the formula (A1), the structural unit represented by the formula (A1'), the structural unit represented by the formula (A2), and the structural unit represented by the formula (A3), The side chain of the ruthenium atom is an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 or 2 carbon atoms, or a hydroxyl group.

In the polyoxyxylene resin composition of the present embodiment, the molar ratio of the alkoxy group of the side chain is 0.01 with respect to the alkyl group 100 of the side chain. It is preferable that the above is less than 5, and it is preferably 0.1 or more and less than 5.

When the molar ratio of the alkoxy group of the side chain is higher than the above range (less than 5 with respect to the alkyl group 100), the cured product of the polyoxyxylene resin composition of the present embodiment is used as a sealing material for the UV-LED. At this time, it becomes impossible to penetrate UV rays with high transmittance for a long period of time. Further, when the molar ratio of the alkoxy group in the side chain is less than the above range (less than 5 with respect to the alkyl group 100), the viscosity of the polyoxymethylene resin composition becomes high and the workability is lowered.

The alkoxy group and the hydroxy group bonded to the ruthenium atom are functional groups which generate a siloxane bond by a condensation reaction. Alkoxy groups are more susceptible to UV light than hydroxyl groups. Therefore, the cured product of the polyoxymethylene resin composition containing the alkoxy group more than the hydroxyl group is easily reacted because the alkoxy group which is unreacted upon irradiation with the UV light easily absorbs the UV light. As a result, a cured product having low UV stability is obtained.

On the other hand, the polyoxyxylene resin composition of the present embodiment contains a hydroxyl group more than an alkoxy group. Specifically, in the polyoxyxylene resin composition of the present embodiment, the molar ratio of the side chain bonded to the oxime is less than 5 with respect to the alkyl group 100, and the hydroxyl group is 10 with respect to the alkyl group 100. the above. Therefore, even if the cured product of the polyoxyxylene resin composition of the present embodiment contains an unreacted functional group, since many unreacted functional groups are hydroxyl groups, it is difficult to absorb UV rays when irradiated with UV light, and it is difficult to carry out the reaction. As a result, a cured product having high UV stability can be obtained.

In the polyanthracene resin composition of the present embodiment, the molar ratio of the side chain bonded to the ruthenium atom is preferably less than 30, more preferably less than 20, with respect to the alkyl group 100. By the molar ratio of the hydroxyl groups of the side chains When the above range (less than 30 with respect to the alkyl group 100) is formed, the volume shrinkage at the time of curing of the polyoxymethylene resin composition can be suppressed, and the coloring of the UV light can be suppressed.

When an alkoxy group bonded to a ruthenium atom forms a siloxane chain by a condensation reaction, first, an alkoxy group is converted into a hydroxyl group by reacting a ruthenium atom bonded to an alkoxy group with water. Next, by reacting with an oxygen atom of a hydroxyl group of a ruthenium atom, it reacts with other ruthenium atoms to form a decane bond. That is, the alkoxy group bonded to the ruthenium atom and the hydroxyl group exhibit high reactivity due to the hydroxyl group (sterol group), so that a decane bond is easily generated.

Therefore, the polyoxynoxy resin composition of the present embodiment contains a curing catalyst containing no metal at a concentration of 600 ppm (mass parts per million) or less as shown in the requirement (iii) to be described later (the hardening touch) The medium is an acid catalyst or an alkali catalyst. However, since the molar ratio of the side chain bonded to the ruthenium atom is within the above range, a siloxane chain can be generated and further hardened.

The molar ratio of the molar ratio to the alkoxy group of the alkyl group bonded to the fluorene atom in the polyoxyxylene resin composition of the present embodiment, and the molar ratio to the hydroxyl group of the alkyl group can be suitably combined as long as the above range is satisfied. .

The polyoxynoxy resin contained in the polyoxyxylene resin composition of the present embodiment can be synthesized by using an organic ruthenium compound having a functional group capable of generating a decane bond as a starting material in accordance with each of the above structural units. Here, examples of the "functional group capable of generating a decane bond" include a halogen atom, a hydroxyl group, and an alkoxy group. The organic ruthenium compound corresponding to the structural unit represented by the formula (A3) may, for example, be an organic trihalo decane or an organic trialkoxy decane.

The polyoxyxene resin can be synthesized by reacting the organic ruthenium compound of the starting material in a ratio corresponding to the existence ratio of each structural unit by a hydrolysis condensation method. The ratio of the presence of the A3 ruthenium atom contained in the polysiloxane resin can be adjusted by appropriately selecting the organic ruthenium compound of the starting material. The polyoxyxylene resin thus synthesized is commercially available as a polyoxyxylene resin or the like.

(Requirement (iii))

As described above, the polyoxyxylene resin composition of the present embodiment does not substantially contain a metal catalyst, and contains a curing catalyst that does not contain a metal (the curing catalyst is an acid catalyst or an alkali catalyst), and is aggregated. The concentration of the hardening catalyst in the silicone resin composition is 600 ppm (mass parts per million) or less.

The concentration of the curing catalyst contained in the polyoxyxylene resin composition of the present embodiment is preferably 300 ppm or less.

In the polyoxymethylene resin composition, a curing catalyst such as an acidic compound (acid catalyst), a basic compound (base catalyst), or a metal compound (metal catalyst) may be added. As the metal catalyst, a catalyst containing a typical metal such as platinum, ruthenium, tin, zirconium, zinc, or cobalt is known as a metal compound such as aluminum acetylacetonate or the like, and is present in Group 3 of the periodic table. The element between the element and the element of the 11th element is the catalyst of the transition metal. Among these, metal catalysts containing aluminum, platinum or tin are particularly well known.

On the other hand, the polyoxyxylene resin composition of the present embodiment does not substantially contain a metal catalyst, and contains an acid catalyst or an alkali catalyst as a curing catalyst that does not contain a metal. Further, the polyoxynoxy resin of the present embodiment The concentration of the acid catalyst or the alkali catalyst contained in the composition is 600 pm or less, preferably 300 ppm or less.

Further, in the polyanthracene resin composition of the present embodiment, as the acid catalyst and the alkali catalyst, if it is a condensation reaction for promoting an alkoxy group or a hydroxyl group bonded to a ruthenium atom, it may be a Brinell and a Brook base. And any of a Lewis acid and a Lewis base.

In the polyoxyxylene resin composition of the present embodiment, the "substantially not contained" metal catalyst means that the content of the metal catalyst in the polyoxymethylene resin composition is 50 ppm (mass parts per million) or less. The content of the metal catalyst in the polyoxyxene resin composition is preferably as small as possible in the range of "substantially not contained" (50 ppm (mass parts per million) or less). The content of the metal catalyst in the polyoxyxylene resin composition of the present embodiment is preferably 10 ppm or less, and more preferably 5 ppm or less.

The polyoxymethylene resin composition may also contain a solvent in order to make it easy to handle. However, when the polyoxyphthalocene resin composition contains the catalyst for curing, the hardening of the composition of the polyoxymethylene resin is promoted, and in the state in which the solvent contained in the composition of the polyoxyxylene resin remains, there is a polyoxyl When the hardening of the resin composition is completed, the cured product of the polyoxyxylene resin composition contains a solvent. In this case, the solvent is deteriorated by the irradiation of the UV light, the transmittance of the UV light of the cured product of the polyoxymethylene resin composition is lowered, and the UV stability of the cured product of the polyoxyxene resin composition is obtained. Reduce the situation.

On the other hand, the polyoxyxylene resin composition of the present embodiment does not contain the content of the acid catalyst or the alkali catalyst which is a catalyst for curing the metal. When it is small, it is possible to remove the solvent before the hardening of the polyoxymethylene resin composition, and it is possible to suppress the decrease in the transmittance of the UV light of the cured product of the polyoxymethylene resin composition.

Further, the polyoxyxylene resin composition of the present embodiment does not substantially contain a metal catalyst. Therefore, in the cured product of the polyoxyxene resin composition, since the metal constituting the metal catalyst does not absorb UV light, the UV light transmittance of the cured product of the polyoxyxene resin composition is not easily lowered. Therefore, the polyoxyxylene resin composition of the present embodiment is a cured product for producing a polymer composition of high UV stability.

Next, the constitution of the polyoxyxylene resin composition of the present embodiment will be described in detail.

(1st polyoxyl resin)

The polyoxyxylene resin composition of the present embodiment is preferably one containing the first polyfluorene oxide resin.

In the first polyoxynene resin, the ratio of the content of the A3 germanium atom to the total content of the A1 germanium atom, the A2 germanium atom, and the A3 germanium atom is preferably 70 mol% or more and 85 mol% or less.

In the polyoxyxylene resin, the kind and existence ratio of the functional group bonded to the ruthenium atom can be measured by, for example, nuclear magnetic resonance spectroscopy (NMR method). The nuclear magnetic resonance spectroscopy (NMR method) has been described in various literatures and the like, and a dedicated measuring device is also widely available commercially. Specifically, after dissolving the polyoxyxylene resin of the measurement object in a specific solvent, the nuclear magnetic moment in the nucleus is resonated by providing a strong magnetic field and a high-frequency radio wave to the hydrogen nucleus or the ruthenium nucleus in the polyoxynoxy resin. The type and existence ratio of each functional group in the polyoxyxene resin can be measured. The method of measuring the hydrogen nucleus is called ¹ H-NMR, and the method of measuring the ruthenium nucleus is called ²⁹ Si-NMR. The solvent used for the measurement by the nuclear magnetic resonance spectroscopy (NMR method) may be selected from the group consisting of heavy chloroform, heavy dimethyl hydrazine, heavy methanol, heavy acetone, heavy water, and the like, depending on the type of various functional groups in the polyoxyxylene resin.

The ratio of the content of A3 ruthenium atoms can be obtained by dividing the area of the signal to which the A3 矽 atom is found in the ²⁹ Si-NMR measurement by the signal area to which the A1 矽 atom belongs, and the signal to which the A2 矽 atom belongs. The area and the total area of the signal area to which the A3 矽 atom belongs are obtained.

In the structural unit included in the first polyoxyl resin, R ¹ is preferably a methyl group.

When R ² is an alkoxy group, a linear alkoxy group is preferred. The carbon number of the alkoxy group is preferably from 1 to 2. Specifically, a methoxy group or an ethoxy group is preferred.

The first polyoxynoxy resin is preferably an organopolyoxane structure represented by the following formula (1). In the formula (1), R ¹ and R ² have the same meanings as described above. p ¹ , q ¹ , a ¹ and b ¹ represent arbitrary positive numbers.

In the structure of the organopolyoxane represented by the formula (1), R ¹ is an alkyl group having 1 to 3 carbon atoms, and a methyl group is preferred. R ² is an alkoxy group having 1 or 2 carbon atoms or a hydroxyl group. When R ² is an alkoxy group, the alkoxy group is preferably a methoxy group or an ethoxy group.

The existence ratio of each structural unit in the structure of the organopolysiloxane represented by the formula (1) is relative to the number of A2 矽 atoms: x ¹ (= p ¹ + b ¹ × q ¹ ), and the number of A3 矽 atoms The total content of y ¹ (= a ¹ × q ¹ ) is such that the content ratio of A3 矽 atoms (= y ¹ / (x ¹ + y ¹ )) is in the range of 0.6 to 0.9. That is, the ratio of the content of the A3矽 atom to the total content of the A1矽 atom, the A2矽 atom, and the A3矽 atom is 60% by mole or more and 90% by mole or less. The values of p ¹ , q ¹ , a ¹ , and b ¹ may be suitably adjusted so as to be such a range.

Since the first polyfluorene oxide resin has a high ratio of the A3 ruthenium atoms, the first polyfluorene oxide resin can be cured to obtain a polymerized polyoxyalkylene resin having a network structure. When the ratio of the presence of the A3 ruthenium atom is higher than the above range (0.6 to 0.9), the cured resin of the polyfluorene-based resin tends to be cracked, and when it is lower than the above range (0.6 to 0.9), it is aggregated. UV stabilization of hardened materials of oxime resin composition Sex has a lower situation.

The first polyfluorene-containing resin is a polyfluorene-oxygen resin having a polyoxyalkylene structure in which the ratio of the A3 fluorene atom in the above formula (1) is in the above range (0.6 to 0.9), so that the first polyfluorene resin is contained. The cured product of the oxygenated resin composition of the oxygen resin tends to have high UV stability. In the first polyoxyl resin, the content ratio of A3矽 atoms (=y ¹ /(x ¹ +y ¹ )) is preferably in the range of 0.7 to 0.85.

The number of A2 fluorene atoms and A3 fluorene atoms per molecule of the first polyoxyl resin can be adjusted by controlling the molecular weight of the resin having the organic polyoxane structure represented by the above formula (1). In the present embodiment, the sum of the number of A2 ruthenium atoms per molecule of the first polyfluorene oxide resin and the number of A3 ruthenium atoms is preferably 5 or more.

The weight average molecular weight (Mw) of the first polyoxyl resin is 1,500 or more and 8,000 or less. When the weight average molecular weight of the first polyoxyxene resin is too small, the UV stability of the cured product of the polyoxynoxy resin composition of the present embodiment tends to be low. The weight average molecular weight of the first polyoxyl resin can obtain a cured product which is more excellent in UV stability by being within the above range. The weight average molecular weight of the first polyoxyl resin is preferably 2,000 or more and 5,000 or less.

The weight average molecular weight (Mw) of the polyoxyxene resin is generally a value measured by a gel permeation chromatography (GPC) method. Specifically, after dissolving the polyoxyxylene resin in a soluble solvent, the obtained solution is circulated together with the mobile phase solvent to a column using a filler having a plurality of pores, and the molecular weight is in the column. Separated by size, The content of the separated molecular weight component is detected using a differential refractometer, a UV meter, a viscometer, a light scattering detector, or the like as a detector. GPC-specific devices have been widely marketed, and the weight average molecular weight (Mw) is generally measured by standard polystyrene conversion. The weight average molecular weight (Mw) in the present specification is intended to be measured by standard polystyrene conversion.

In the measurement of the weight average molecular weight by the GPC method, the solvent used for dissolving the polyoxyxene resin is preferably the same solvent as the mobile phase solvent used for GPC measurement. Specific examples of the solvent include tetrahydrofuran, chloroform, toluene, hydrazine, dichloromethane, dichloroethane, methanol, ethanol, and isopropyl alcohol. The column string used for GPC measurement is commercially available, and the appropriate column can be used depending on the expected weight average molecular weight.

The first polyoxyn resin can be synthesized by using an organic ruthenium compound having a functional group capable of generating a siloxane bond as a starting material for each of the above-mentioned constituent units of the first polyfluorene oxide resin. Here, the "functional group capable of generating a decane bond" means the same meaning as the above. The organic ruthenium compound corresponding to the structural unit represented by the formula (A3) may, for example, be an organic trihalo decane or an organic trialkoxy decane. The first polyoxyl resin can be synthesized by reacting the organic ruthenium compound of such a starting material in a ratio corresponding to the existence ratio of each structural unit by a hydrolysis condensation method. The polyoxyxylene resin thus synthesized is commercially available as a polyoxyxylene resin or the like.

(2nd polyoxyl resin)

The polyoxyxylene resin composition of the present embodiment preferably contains the second polyfluorene oxide resin, and preferably comprises the first polyfluorene oxide resin and the second polyfluorene oxide resin. The second polyoxyn resin is a polyoxyxylene resin which is heated from room temperature to 200 ° C at a temperature increase rate of 5 ° C /min, and has a mass reduction rate of less than 5% after being kept at 200 ° C for 5 hours in the air. Here, the temperature rising step from the room temperature to 200 ° C at a temperature increase rate of 5 ° C /min is usually carried out in air.

The second polyoxyl resin is one in which the unreacted functional group is small and is thermally stable. Therefore, in the cured product of the polyoxyxylene resin composition containing the second polyoxyl resin, the second polyoxynoxy resin functions as a filler. Therefore, the second polyoxyl resin imparts an increase in the mechanical strength of the cured product of the polyoxymethylene resin composition.

Further, the second polyfluorene oxide resin has a small amount of unreacted functional groups, and is hard to be deteriorated when irradiated with UV light. Therefore, by blending the second polyoxyl resin, the UV stability of the cured product of the polyoxymethylene resin composition can be further enhanced.

The second polyoxyl resin is not particularly limited as long as it is heat-stable, and specifically, a polyoxygen resin having a fine particle structure called a polyoxyethylene rubber powder or a polyoxyn resin powder can be used.

Among the polyanthracene resins having a microparticulate structure, a spherical polyanthracene resin powder composed of a polysilsesquioxane resin having a three-dimensional network structure represented by a (decane) bond (RSiO _3/2 ) It is better. In (RSiO _3/2 ), R is preferably a methyl group.

When the second polyoxyn resin is a spherical polyoxyl resin powder, The average particle diameter of the polyoxyxene resin powder is preferably 0.1 μm or more and 50 μm or less, more preferably 1 μm or more and 30 μm or less, and still more preferably 2 μm or more and 20 μm or less.

When the average particle diameter of the polyoxynene resin powder is within the above range (0.1 μm or more and 50 μm or less), it is easy to suppress the occurrence of peeling at the interface between the cured resin of the polyfluorinated resin and the substrate, and the cured resin of the polyoxynated resin. The white turbidity and the cured polymer of the polyoxygenated resin tend to have reduced light transmittance.

The average particle diameter of the polyoxyxene resin powder can be measured by, for example, a particle size distribution measuring device using "laser diffraction ‧ scattering method" as a measurement principle. This method utilizes a method of measuring the particle size distribution of particles in a variety of directions when a laser beam (monochromatic light) is irradiated to a particle, and the particle size distribution of the particle is measured in various directions, and the light can be diffracted and scattered. The average particle diameter was obtained from the light distribution state. The device that uses "laser diffraction ‧ scattering method" as the measurement principle has been commercially available from many manufacturers.

A commercially available product can be used as the second polyoxyl resin. For example, KMP-710, KMP-590, X-52-854, and X-52-1621 (manufactured by Shin-Etsu Chemical Co., Ltd.), Tospearl 120, Tospearl 130, Tospearl 145, Tospearl 2000B, Tospearl 1110, and Tospearl ( Momentive Performance Co., Ltd., and MSP-N050, MSP-N080, and MSP-S110 (manufactured by Nikko Science Co., Ltd.).

The polyoxyxylene resin composition of the present embodiment contains the first polyoxynoxy resin and the second polyoxyl resin, and these polyoxyxides are dissolved or When the polyoxyxyl resin composition liquid of the solvent is dispersed, the total content of the first polyoxyl resin, the second polyoxyl resin, and the solvent contained in the polyoxymethylene resin composition liquid is preferably 80% by mass or more. More than 90% by mass is preferred.

The content of the content of the second polyoxynoxy resin (resin content of the resin) is preferably 20% by mass or more and 90% by mass or less based on the total content of the first polyoxynoxy resin and the second polyoxynoxy resin. 40% by mass or more and 80% by mass or less is preferable. When the resin content of the second polyxanthene resin is within the above range, there is a tendency that a cured product of a polyoxyxylene resin composition having excellent crack resistance and UV stability can be obtained.

In the present specification, "crack resistance" means that it is difficult to produce cracks in the cured product of the polyoxymethylene resin composition. Further, in the sealing material using the cured product of the polyoxymethylene resin composition, there is a case where cracking is less likely to occur as "high crack resistance".

Here, as a cause of cracking of the cured product of the polyoxyxene resin composition, it is considered that the volume shrinkage at the time of hardening of the composition of the silicone resin, and the heat generated when the cured product is rapidly exposed to a high temperature environment from a low temperature environment Rushing, deterioration of hardened materials caused by UV light, etc. When the polyfluorene oxide resin composition of the present embodiment contains the second polyfluorene oxide resin, the occurrence of cracks due to the above-described causes can be suppressed.

(solvent)

The polyoxyxylene resin composition of the present embodiment may contain a solvent in order to be easily handled.

As a solvent, it has an organic boiling point of 100 ° C or more at normal pressure. The solvent is preferred. Since the organic solvent having a boiling point of less than 100 ° C is easily evaporated, the concentration of the polyoxymethylene resin composition tends to fluctuate, and the polyoxyphthalocene resin composition tends to be difficult to handle. On the other hand, a polyoxyxylene resin composition containing an organic solvent having a boiling point of 100 ° C or more tends to suppress such a problem.

The organic solvent is specifically an ester solvent such as 2-ethoxyethyl acetate (boiling point: 156 ° C); ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoiso Propyl ether, ethylene glycol monobutyl ether, ethylene glycol monohexyl ether, ethylene glycol monoethylhexyl ether, ethylene glycol monophenyl ether, ethylene glycol monobenzyl ether, diethylene glycol monomethyl Ether, diethylene glycol monoethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monoethylhexyl ether, two Ethylene glycol monophenyl ether, diethylene glycol monobenzyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monoisopropyl ether, propylene glycol monobutyl ether, propylene glycol monohexyl ether, propylene glycol single B Hexyl hexyl ether, propylene glycol monophenyl ether, propylene glycol monobenzyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monoisopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monohexyl ether a glycol ether solvent such as dipropylene glycol monoethylhexyl ether, dipropylene glycol monophenyl ether or dipropylene glycol monobenzyl ether; ethylene glycol monoethyl ether Acid ester, ethylene glycol monoisopropyl ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monohexyl ether acetate, ethylene glycol monoethylhexyl ether acetate, ethylene A glycol ester solvent such as an alcohol monophenyl ether acetate or an ethylene glycol monobenzyl ether acetate (for example, a glycol ether solvent added to the above-described glycol ether solvent) is preferred.

(other additives)

The polyoxyxylene resin composition of the present embodiment may further contain a decane coupling agent and other additives.

"Cane Coupling Agent"

The decane coupling agent has an effect of improving the adhesion between the cured polymer resin and the semiconductor light-emitting device or the substrate. As the decane coupling agent, at least one selected from the group consisting of a vinyl group, an epoxy group, a styryl group, a methacryl group, an acryl group, an amine group, a urea group, a thiol group, a thioether group, and an isocyanate group The above-mentioned decane coupling agent is preferred, and a decane coupling agent having an epoxy group or a mercapto group is preferred.

Specific examples of the decane coupling agent include 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, and 3- Glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldiethoxydecane, 3-glycidoxypropyltriethoxydecane, 3-mercaptopropylpropyl Dimethoxy decane, 3- propyl propyl trimethoxy decane, and the like.

When the polyanthracene resin composition of the present embodiment contains a decane coupling agent, the ruthenium atom contained in the decane coupling agent is also detected as a signal of ²⁹ Si-NMR. Therefore, in this specification, when calculating the signal area of the polyoxynene resin composition (as the signal area to which the A1 矽 atom belongs, the signal area to which the A2 矽 atom belongs, and the signal area to which the A3 矽 atom belongs) Also includes the signal of the decane coupling agent.

The content of the decane coupling agent in the polyoxyxylene resin composition of the present embodiment is, for example, 100 in mass relative to the content of the first polyoxyl resin. The total content of the first polyfluorene oxide resin and the second polyfluorene oxide resin is preferably 0.0001 part by mass or more and 1.0 part by mass or less, more preferably 0.001 part by mass or more and 0.1 part by mass or less. When the content of the decane coupling agent is higher than the above range, since the decane coupling agent itself absorbs light, the transparency of the cured resin of the polyoxymethylene resin may be lowered.

The decane coupling agent may be used in combination with the polyoxymethylene resin composition of the present embodiment. Further, the decane coupling agent is attached to the surface of the semiconductor light-emitting device or the substrate by coating or immersion treatment in advance, and thereafter, the polyoxymethylene resin composition of the present embodiment may be formed by infusion or the like to be cured.

Other Additives

Examples of the other additives include a polyfluorene oxide resin, a polyfluorene oxide oligomer, a polyfluorene oxide compound, and the like which are different from the first polyfluorene oxide resin and the second polyfluorene oxide resin. Specific examples of the other additives include polyfluorene oxide compounds for general upgrading which are commercially available. The polyoxyxylene resin composition of the present embodiment can impart flexibility to the cured polysulfonated resin by including the polyoxyl compound for modification. The polyfluorene compound for reforming may, for example, be a polymer having a structure of a dialkyl siloxane having R ₂ SiO _2/2 (here, R is an alkyl group) as a main chain, an oligomer, or the like. .

When the polyoxyxylene resin composition of the present embodiment contains a polyfluorene oxide compound, the germanium atom contained in the polyoxynitride compound is also detected as a signal of ²⁹ Si-NMR. Therefore, in this specification, when calculating the signal area of the polyoxynene resin composition (as the signal area to which the A1 矽 atom belongs, the signal area to which the A2 矽 atom belongs, and the signal area to which the A3 矽 atom belongs) Also includes the signal of polyoxyl compounds.

The content of the polyxanthoxy compound in the polyoxyxylene resin composition of the present embodiment is 100 parts by mass or more based on the content of the first polyoxynoxy resin or the first polyoxyl resin and the second polyoxyl resin. The content of 100 parts by mass is preferably 0.1 parts by mass or more and 20 parts by mass or less, preferably 0.5 parts by mass or more and 10 parts by mass or less. When the content of the polyoxyxene compound is more than the above range, the transparency of the cured product of the polyoxyxene resin composition may be impaired.

As another example of the above-mentioned additive, for example, an antifoaming agent for suppressing bubbles generated during mixing of the polyfluorene oxide resin composition can be mentioned.

The polyoxyxylene resin composition of the present embodiment can be obtained by mixing, the above-mentioned polyoxyxylene resin, an organic solvent or the like by a known method which is usually carried out.

[The cured product of the polyoxyl resin composition]

A cured product of a polyoxyxylene resin composition according to one embodiment of the present invention will be described.

By curing the polyoxyxylene resin composition of the present embodiment at, for example, 120 ° C or more and 200 ° C or less, a cured product of the polyoxyxylene resin composition can be obtained (hereinafter, also referred to as "cured material of the present embodiment") ). The curing time is preferably from 1 hour to 100 hours, more preferably from 5 hours to 70 hours, and even more preferably from 5 hours to 50 hours.

The cured product of the present embodiment can be obtained by curing the polyoxyxylene resin composition of the present embodiment at, for example, 160 ° C for 10 hours. The hardened material thus obtained is based on, for example, a hardness of D70 measured by JIS K6253-3:2012.

Since the cured product of the present embodiment is excellent in UV stability, it is useful as a sealing material for semiconductor light-emitting elements (LEDs), photodiodes, CCDs, CMOS, etc., and is particularly useful as a UV-LED seal for emitting UV light. material.

As described above, the polyoxyxylene resin composition of the present embodiment is a cured product of a polyoxyxylene resin composition for producing high UV stability.

[Seal material for semiconductor light-emitting element]

A sealing material for a semiconductor light-emitting device according to one embodiment of the present invention will be described.

Since the sealing material for a semiconductor light-emitting device of the present embodiment is composed of a cured product of the polyoxymethylene resin composition of the present embodiment, it can be used as a sealing material for a semiconductor light-emitting device having high UV stability.

[Examples]

Hereinafter, the present invention will be more specifically described by the embodiments, but the present invention is not limited by the embodiments.

In the present embodiment, the type of the ruthenium atom and the ratio of the substituents in the composition of the polyfluorene oxide resin were measured by a solution of ¹ H-NMR method, solution ²⁹ Si-NMR method or solid ²⁹ Si-NMR method. Further, the molecular weight measurement of the polyoxyxylene resin was carried out by the GPC method. The conditions in each measurement method are as follows.

<Solution ¹ H-NMR measurement conditions>

Device name: ECA-500 made by JEOL RESONANCE

Observation core: ¹ H

Observation frequency: 500.16MHz

Measuring temperature: room temperature

Measuring solvent: DMSO-d6

Pulse width: 6.60μ sec (45°)

Pulse repetition time: 7.0 sec

Cumulative number: 16 times

Sample concentration (sample / measurement solvent): 300mg / 0.6ml

<Solution ²⁹ Si-NMR measurement conditions>

Device name: 400-MR manufactured by Agilent

Observation core: ²⁹ Si

Observation frequency: 79.42MHz

Measuring temperature: room temperature

Measuring solvent: CDCl ₃

Pulse width: 8.40μ sec (45°)

Pulse repetition time: 15.0sec

Cumulative number: 4000 times

Sample concentration (sample / measurement solvent): 300mg / 0.6ml

<Solid ²⁹ Si-NMR measurement method>

Device name: AVANCE300 400-MR made by Bruker

Observation core: ²⁹ Si

Observation frequency: 59.6MHz

Measuring temperature: room temperature

Measurement method: DDMAS method

Reference material: hexamethylcyclotrioxane (set at -9.66 ppm, equivalent to setting TSM at 0 ppm)

MAS condition: 3.5kHz

Pulse width: π/6 (1.4ms)

Waiting time: 20.0sec

Cumulative number: 4096 times

Sample quantity: 180mg

<GPC measurement conditions>

Device: HTC-8220 made by Tosoh Corporation

Column: TSKgel Multipore HXL-M×3+Guardcolumn-MP(XL)

Flow rate: 1.0mL/min

Detection condition: RI (polarity +)

Concentration: 100mg + 5mL (THF)

Injection volume: 100μL

Column temperature: 40 ° C

Lysate: THF

In the present embodiment, the molar ratio of the methyl group, the methoxy group and the hydroxyl group bonded to the ruthenium atom present in the polyoxyxylene resin composition was determined by the solution ¹ H-NMR or solid ¹³ C-NMR measurement. The conditions in each measurement method are as follows.

In the present embodiment, when the measurement object (polyoxymethylene resin composition) contains a polyoxyl resin which is not dissolved in the measurement solvent, the following operation is performed, and the measurement is performed in the measurement object (polyoxymethylene resin composition). The molar ratio of methyl, methoxy and hydroxy groups.

First, a telecentric separation treatment or a filtration treatment is applied to the polyoxynoxy resin composition, and separated into a polyoxyl resin dissolved in a measurement solvent, and a polyoxymethylene resin which is not dissolved in a measurement solvent. Thereafter, by performing solution NMR measurement on the polyfluorene oxide resin dissolved in the measuring solvent, and performing solid NMR measurement on the polyfluorene oxide resin not dissolved in the measuring solvent, the methyl group and the methoxy group bonded to the ruthenium atom were respectively measured. The molar ratio of the base and the hydroxyl group. Thereafter, the molar ratio of the methyl group, the methoxy group and the hydroxyl group present in the polyoxyxylene resin composition can be determined by summing the measured values.

Further, instead of separating the polyfluorene oxide resin contained in the composition of the polyfluorene oxide resin, the polyoxynoxy resin monomer which is a raw material of the polyfluorene oxide resin composition is measured, and the methyl group, the methoxy group and the hydroxyl group bonded to the germanium atom are measured. Mohr ratio, according to the mixing ratio of the polyoxyl resin contained in the polyoxynoxy resin composition, the methyl group, the methoxy group and the hydroxyl group present in the polyoxymethylene resin composition can also be determined. Based on Moerby.

At this time, in the obtained NMR spectrum, a peak derived from a methoxy group such as a methoxy group is detected between chemical shifts of 3.0 ppm to 4.0 ppm, but a peak derived from a solvent component structure, sterol The base peaks and the like are also detected as similar chemical shifts, and there are cases where complex peaks overlap. In this case, a treatment for obtaining a spectral difference between the obtained NMR spectrum and a solvent alone NMR spectrum, a treatment for separating a peak of an alkoxy group and a decyl group by changing the measurement ambient temperature, and the like can be carried out. By carrying out such a treatment, the molar ratio of the methoxy group alone can be determined.

<Solution ¹ H-NMR measurement conditions>

Device name: 400-MR manufactured by Agilent

Observation core: ¹ H

Observation frequency: 399.78MHz

Measuring temperature: described in the examples and comparative examples

Measuring solvent: described in the examples and comparative examples

Pulse width: 6.00μ sec (45°)

Pulse repetition time: 30.0 sec

Cumulative number: 16 times

Sample concentration (sample / measurement solvent): 100mg / 0.8ml

<Solid ¹³ C-NMR measurement conditions>

Device name: AVANCE300 400-MR made by Bruker

Observational core: ¹³ C

Observation frequency: 75.4MHz

Measuring temperature: room temperature

Measurement method: DDMAS method

Reference material: adamantane (set at 29.47 ppm, equivalent to setting TMS at 0 ppm)

MAS condition: 10 kHz

Pulse width: π/6 (1.5ms)

Waiting time: 10.0sec

Cumulative number: 8192 times (measurement of reference basis) 16384 times (= 2 ¹⁴ times) (measurement of resin C)

Sample amount: 85mg

In the present embodiment, the UV transmittance of the hardened material of the cured product of the polyoxyxene resin composition and the UV transmittance of the cured product of the polyoxynoxy resin composition after the UV irradiation test were respectively measured. The conditions for UV transmittance measurement are as follows.

The UV irradiation test of the cured product of the polyoxyxene resin composition is carried out by heating the cured product of the polyoxymethylene resin composition while heating. The conditions of the UV irradiation test are as follows.

Based on the measurement results of these, the UV stability of the cured product of the polyoxymethylene resin composition was evaluated.

<Transmission rate measurement>

Device name: UV-3600 manufactured by Shimadzu Corporation

Attachment: Integrating sphere ISR-3100

Measuring wavelength: 220~800nm

Background measurement: atmosphere

Measuring speed: medium speed

<UV irradiation test>

Device name: SP9-250DV manufactured by Niuwei Motor Co., Ltd.

UV irradiation wavelength: 254nm~420nm

UV irradiation intensity: 150mW/cm ²

Resin heating temperature: 50 ° C (using a heating plate)

UV irradiation time: 300 hours

(Example 1)

The first polyoxynoxy resin is a polyfluorene oxide resin 1 having an organic polyoxane structure represented by the above formula (1) (Mw=3500, in the above formula (1), R ¹ =methyl group, R ² = Methoxy or hydroxy). The existence ratio of each structural unit of the polyoxyxene resin 1 is shown in Table 1.

The polyoxynoxy resin 1 was heated from room temperature to 200 ° C at a temperature elevation rate of 5 ° C /min, and the mass reduction rate after holding in air at 200 ° C for 5 hours was 10.3%.

As the second polyoxyl resin, MSP-S110 (manufactured by Nikko Science Co., Ltd.) was used. The MSP-S110 was heated from room temperature to 200 ° C at a temperature elevation rate of 5 ° C /min, and the mass reduction rate after maintaining it in air at 200 ° C for 5 hours was 3.5%. The existence ratio of each structural unit of MSP-S110 is shown in Table 2.

35.04 g of polyoxyxylene resin 1, 23.36 g of the second polyoxyl resin MSP-S110, and 21.60 g of 2-ethoxyethyl acetate were mixed to obtain a polyoxyxylene resin composition.

The ratio of the content of A3矽 atoms to the total content of the A1矽 atom, the A2矽 atom, and the A3矽 atom in the obtained polyoxyxylene resin composition was 72%.

In the obtained polyoxyxylene resin composition, the molar ratio of the hydroxyl group (sterol group) bonded to the ruthenium atom to the methyl (alkyl) 100 bonded to the ruthenium atom is measured, and the measurement is relative to the ruthenium The molar ratio of the methyl (alkyl) 100 atom to the methoxy (alkoxy) group of the ruthenium atom.

The measurement temperature in the ¹ H-NMR measurement at this time was room temperature, and the measurement solvent was DMSO-d ₆ .

The measurement results are shown in Table 3 below.

A polyoxygen resin composition of Example 1 was obtained by adding a curing catalyst containing 15% phosphoric acid to 100 parts by mass of the obtained polyoxyxylene resin composition and sufficiently stirring and mixing. The cured material of the thickness of 1 mm was obtained by hardening the polyoxyxylene resin composition of Example 1 under the curing conditions of holding the aluminum cup at 160 ° C for 10 hours. The hardened material obtained does not have Tackiness. Moreover, cracks were not found in the obtained cured product.

The amount of the catalyst for hardening is shown in Table 3 which will be described later.

The UV transmittance of the hardened material obtained was measured. Thereafter, the obtained UV irradiation test of the cured product was carried out, and the UV transmittance of the cured product after the UV irradiation test was measured.

From the measured values of the UV transmittance before and after the UV irradiation test, the maintenance ratio of the UV transmittance was determined based on the following formula. The calculated maintenance ratio was used as an indicator of the UV stability of the cured resin of the polyoxyxene resin.

(maintenance rate of UV transmittance) = (B/A) × 100

A: UV transmittance of the cured product of the polyoxymethylene resin composition before the UV irradiation test

B: UV transmittance of the cured product of the polyoxymethylene resin composition after the UV irradiation test

The UV transmittance before and after the UV irradiation test and the maintenance ratio of the UV transmittance are shown in Table 3 which will be described later.

(Example 2)

The polyxanthoxy resin of Example 2 was obtained in the same manner as in Example 1 except that the amount of the curing catalyst for the polyoxyxylene resin composition of Example 1 was changed to the amount shown in Table 3 below. The composition was a cured product of the polyoxyxylene resin composition of Example 2.

The cured product of the obtained polyoxyxylene resin composition was subjected to measurement of the UV transmittance before and after the UV irradiation test and the maintenance ratio of the UV transmittance in the same manner as in Example 1.

The measurement results are shown in Table 3 below.

(Comparative Example 1)

The same procedure as in Example 1 was carried out except that the amount of the curing catalyst for the polyoxyxylene resin composition of Example 1 was changed to the amount shown in Table 3 below, and the polyoxynoxy resin of Comparative Example 1 was obtained. The composition was a cured product of the polyoxyxylene resin composition of Comparative Example 1.

The cured product of the obtained polyoxyxylene resin composition was subjected to measurement of UV transmittance before and after the UV irradiation test, and UV in the same manner as in Example 1. The rate of retention of penetration.

The measurement results are shown in Table 3 below.

(Comparative Example 2)

For ethyltrimethoxydecane 0.75 mole, dilute nitric acid was used as the acid catalyst to prepare a mixture of a trifunctional decane oxide: water: nitric acid having a molar ratio of 1:3:0.002. The obtained mixture was stirred at 20 ° C for 3 hours in a closed vessel, and then hydrolyzed and polymerized by allowing it to stand at 60 ° C for 24 hours. The obtained reaction liquid was separated into a lower layer containing more polycondensation reaction liquid and a higher methanol layer containing a larger amount of by-product, so that the lower side reaction liquid was taken out by a separatory funnel.

The lower side reaction liquid was dried at 60 ° C for 2 hours in the air, and then dried at 40 ° C for 2 hours under vacuum to obtain a polyoxyxylene resin composition of Comparative Example 2.

The polyanthracene resin composition of Comparative Example 2 was contained in an amount of 58.7 mol% based on the total content of the A1矽 atom, the A2矽 atom, and the A3矽 atom.

Further, the nitric acid resin composition of Comparative Example 2 had a nitric acid concentration of 128 ppm.

In the polyxanthoxy resin composition of Comparative Example 2, the molar ratio of the hydroxyl group (sterol group) bonded to the ruthenium atom to the methyl (alkyl) 100 bonded to the ruthenium atom was measured, and the measurement was relative to the combination. The molar ratio of the methoxy group (alkoxy group) bonded to the ruthenium atom to the methyl (alkyl) 100 of the ruthenium atom.

The measurement temperature in the ¹ H-NMR measurement at this time was 60 ° C, and the measurement solvent was DMSO-d ₆ .

The measurement results are shown in Table 4 which will be described later.

A cured product was obtained in the same manner as in Example 1 except that the polyoxyphthalocene resin composition of Comparative Example 2 was allowed to stand at 160 ° C for 24 hours.

The obtained cured product was subjected to the same operation as in Example 1 to measure the UV transmittance. As a result, the transmittance of UV light having a wavelength of 280 nm of the cured product obtained was 72%, which was insufficient when used as a sealing material for UV-LED. Thereafter, the obtained UV irradiation test of the cured product was carried out, and the transmittance of the cured product after the UV irradiation test was measured. As a result, the UV transmittance retention rate was 55%, which was significantly lower than that of the UV light before the UV irradiation test.

(Comparative Example 3)

354 g of the above polyfluorene oxide resin 1 was added to 190 g of isopropyl alcohol, and the polyfluorene oxide resin 1 was dissolved by heating and stirring until the internal temperature became 85 °C. Thereafter, 35 g of an oligomer having an organic polyoxane structure represented by the following formula (2) was added thereto.

(wherein R ¹ and R ² have the same meanings as described above.

p ² , q ² , r ² , a ² and b ² represent [a ² × q ² ] / [(p ² + b ² × q ² ) + a ² × q ² + (r ² + q ² )] =0~0.3 any number of 0 or more).

The existence ratio of each structural unit of the above oligomer is shown in Table 3.

Thereafter, the above polyoxyxylene resin 1 and the above oligomerization are added. The product was 3.8 g of a commercially available polyfluorene oxide compound, and the mixture was stirred for 1 hour or more to be dissolved. The commercially available polyoxymethane compound is a total content of A1矽 atoms, A2矽 atoms, and A3矽 atoms, and the ratio of the content of A3矽 atoms is 0% or more and less than 30%, and the weight average molecular weight exceeds 8000 and 15000 or less. Polyoxyl resin.

Thereafter, 123 g of 2-butoxyacetate acetate and 0.1 g of 3-glycidoxypropyltrimethoxydecane (decane coupling agent) were added to the obtained mixture. The polyfluorene oxide resin 1 and the above oligomer were obtained by distilling off isopropyl alcohol from the obtained mixture until the isopropyl alcohol concentration became 1% by mass or less under the conditions of a temperature of 70 ° C and a pressure of 4 kPa A. The polyoxonium resin composition having a mixing ratio of the above commercially available polyoxyxides is 90:9:1.

As a result of measuring the ²⁹ Si-NMR of the obtained polyoxyxylene resin composition, the signal area derived from the A3 germanium atom was 65% among the total signals derived from the germanium atom.

In the obtained polyoxyxylene resin composition, the molar ratio of the hydroxyl group (sterol group) bonded to the ruthenium atom to the methyl (alkyl) 100 bonded to the ruthenium atom is measured, and the measurement is relative to the ruthenium atom The methyl (alkyl) 100 is bonded to the molar ratio of the methoxy (alkoxy) of the ruthenium atom. As a result, the molar ratio of hydroxyl groups was 23.1, and the molar ratio of methoxy groups was 16.1.

The measurement temperature in the ¹ H-NMR measurement at this time was 60 ° C, and the measurement solvent was DMSO-d ₆ .

By the quality of the obtained polyoxyl resin composition 100 In a portion, 2 parts by mass of a curing catalyst containing 15% phosphoric acid was added and sufficiently stirred to obtain a polyanthracene resin composition of Comparative Example 3. The phosphoric acid concentration in the polyoxyxylene resin composition of Comparative Example 3 was 2870 ppm. About 5 g of the polyoxyxylene resin composition of Comparative Example 3 was placed in an aluminum cup, heated from room temperature to 160 ° C at a rate of 5 ° C /min in an oven, and allowed to stand at 160 ° C for 3 hours, thereby obtaining a thickness. 1mm hardened material. The hardened material obtained does not have Tackiness. Also, cracks were not found in the cured product.

The obtained polyoxymethylene resin cured product was subjected to the same operation as in Example 1 to measure the UV transmittance before and after the UV irradiation test, and the UV transmittance retention rate. As a result, the UV transmittance before the UV irradiation test was 80%, and the UV transmittance was maintained at 45%.

In Table 4 below, the "UV transmittance of the cured resin of the polyoxygenated resin before the UV irradiation test" is indicated as "initial UV transmittance". Regarding the initial UV transmittance, 75% or more was judged as pass, and "○" was indicated in the judgment column. Further, it was judged that the initial UV transmittance was less than 75%, and it was judged as "X" in the judgment column.

In addition, in the following Table 4, the "UV transmittance retention rate" was determined to be 90% or more, and it was judged as "○" in the judgment column. Moreover, it is judged that the "UV transmittance retention rate" is less than 90%, and it is judged as "X" in the judgment column.

From the above results, it is understood that the polyoxyxylene resin composition of the present invention is useful.

[Industrial availability]

According to the present invention, a polyoxyxylene resin composition useful for producing a cured product of a high UV-stabilizing polyoxyxene resin composition can be provided. Further, according to the present invention, a cured product of the polyoxyxene resin composition can be provided. Moreover, according to the present invention, a sealing material for a semiconductor light-emitting element comprising a cured product of the polyoxynoxy resin composition can be provided.

Claims (5)

A polyoxyxylene resin composition comprising at least one polyfluorene oxide resin composition and satisfying the following requirements (i) to (iii): (i) the germanium atom system contained therein is substantially A ratio of at least one ruthenium atom selected from the group consisting of an A1 ruthenium atom and an A2 ruthenium atom to an A3 ruthenium atom, and a total amount of A3 ruthenium atoms relative to the total content of the A1 矽 atom, the A2 矽 atom, and the A3 矽 atom 50 mol% or more and 99 mol% or less; (ii) an alkyl group having a carbon number of 1 to 3, an alkoxy group having 1 or 2 carbon atoms, or a hydroxyl group bonded to the side chain of the above-mentioned germanium atom, and an alkoxy group The molar ratio is less than 5 with respect to the alkyl group 100, and the molar ratio of the hydroxyl group is 10 or more with respect to the alkyl group 100; (iii) substantially does not contain a metal catalyst, and contains a hardening touch that does not contain a metal. The medium (the curing catalyst is an acid catalyst or an alkali catalyst), and the concentration of the curing catalyst in the polyoxynoxy resin composition is 600 ppm (mass parts per million) or less; [here, the A1 矽 atomic system In the structural unit represented by the following formula (A1), one oxygen atom (the oxygen atom is bonded to a germanium atom in another structural unit), one R ¹ and Two R ² bonded ruthenium atoms, or in a structural unit represented by the following formula (A1'), with one bond (the bond is bonded to the ruthenium atom in other structural units) Atom is bonded to each other, and one R ¹ and two R ^{2 are} bonded to a ruthenium atom; and the A 2 矽 atom is a structural unit represented by the following formula (A2), and one oxygen atom (the oxygen atom system and other structures) a unit of a helium atom is bonded to a bond, a bond is bonded to an oxygen atom bonded to a helium atom in another structural unit, and a R ¹ and a R ^{2 are} bonded to a helium atom. ; A3 矽 atomic system means a structural unit represented by the following formula (A3), with two oxygen atoms (the oxygen atom system is bonded to a ruthenium atom in other structural units), and a bonding point (the bonding point) It is a combination of an oxygen atom bonded to a ruthenium atom in another structural unit) and a ruthenium atom to which R ^{1 is} bonded; R ¹ represents an alkyl group having 1 to 3 carbon atoms, and R ² represents an alkyl group having 1 or 2 carbon atoms; Oxyl or hydroxy] The polyoxyxylene resin composition of claim 1, which comprises the first polyfluorene oxide resin as the polyfluorene oxide resin; and the first polyfluorinated oxygen resin: the germanium atomic system contained therein is substantially selected from the group consisting of At least one of the above-mentioned A1矽 atom and the aforementioned A2矽 atom and at least one of the above-mentioned A3矽 The ratio of the content of the A3矽 atom to the total content of the A1矽 atom, the A2矽 atom, and the A3矽 atom is 60 mol% or more and 90 mol% or less, and the weight average molecular weight is Polyoxyethylene resin of 1500 or more and 8000 or less. The polyoxyxylene resin composition according to claim 1 or 2, which comprises the second polyfluorene oxide resin described below as the polyfluorene oxide resin; and the second polyoxynoxy resin: from the chamber at a temperature elevation rate of 5 ° C /min The temperature was raised to 200 ° C, and the mass reduction rate after maintaining in air at 200 ° C for 5 hours was less than 5% of the polyoxynoxy resin. A cured product of the polyoxyxylene resin composition according to any one of claims 1 to 3. A sealing material for a semiconductor light-emitting device, which is composed of a cured product of the polyoxyethylene resin composition according to any one of claims 1 to 3.