TW201425450A - 感光性樹脂組成物、阻劑層合體及該等之硬化物 - Google Patents

感光性樹脂組成物、阻劑層合體及該等之硬化物 Download PDF

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Publication number: TW201425450A
Authority: TW; Taiwan
Prior art keywords: resin composition; epoxy; photosensitive resin; epoxy resin; group
Prior art date: 2012-11-22

Application number

TW102142464A

Other languages

English (en)

Chinese (zh)

Inventor

Naoko Imaizumi

Shinya Inagaki

Nao Honda

Original Assignee

Nippon Kayaku Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-11-22

Filing date

2013-11-21

Publication date

2014-07-01

2013-11-21 Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk

2014-07-01 Publication of TW201425450A publication Critical patent/TW201425450A/zh

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239000011342 resin composition Substances 0.000 title claims abstract description 101
239000003822 epoxy resin Substances 0.000 claims abstract description 115
229920000647 polyepoxide Polymers 0.000 claims abstract description 115
-1 polyol compound Chemical class 0.000 claims abstract description 73
239000004593 Epoxy Substances 0.000 claims abstract description 43
229920005862 polyol Polymers 0.000 claims abstract description 36
239000000203 mixture Substances 0.000 claims abstract description 30
239000000178 monomer Substances 0.000 claims abstract description 30
150000002989 phenols Chemical class 0.000 claims abstract description 25
125000003700 epoxy group Chemical group 0.000 claims abstract description 21
238000006243 chemical reaction Methods 0.000 claims abstract description 8
239000000758 substrate Substances 0.000 claims description 50
239000002904 solvent Substances 0.000 claims description 32
125000001931 aliphatic group Chemical group 0.000 claims description 30
238000002156 mixing Methods 0.000 claims description 24
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 22
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 21
239000003505 polymerization initiator Substances 0.000 claims description 20
RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 16
DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 15
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PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 10
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125000004432 carbon atom Chemical group C* 0.000 claims description 7
125000000217 alkyl group Chemical group 0.000 claims description 6
150000001875 compounds Chemical class 0.000 claims description 6
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238000006116 polymerization reaction Methods 0.000 claims description 4
239000003999 initiator Substances 0.000 claims description 3
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 2
238000000206 photolithography Methods 0.000 abstract description 10
238000010538 cationic polymerization reaction Methods 0.000 abstract description 2
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238000010438 heat treatment Methods 0.000 description 4
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VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
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NMAUIGWGGXRMSQ-UHFFFAOYSA-N OB(O)OC(C(F)=C(C(F)=C1F)F)=C1F.C(C=C1)=CC=C1SC1=CC=CC=C1.C(C=C1)=CC=C1SC1=CC=CC=C1 Chemical compound OB(O)OC(C(F)=C(C(F)=C1F)F)=C1F.C(C=C1)=CC=C1SC1=CC=CC=C1.C(C=C1)=CC=C1SC1=CC=CC=C1 NMAUIGWGGXRMSQ-UHFFFAOYSA-N 0.000 description 1
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NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
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239000000440 bentonite Substances 0.000 description 1
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FJYDXYVSFFWRER-UHFFFAOYSA-K bis[(2,2,2-trifluoroacetyl)oxy]alumanyl 2,2,2-trifluoroacetate Chemical compound FC(F)(F)C(=O)O[Al](OC(=O)C(F)(F)F)OC(=O)C(F)(F)F FJYDXYVSFFWRER-UHFFFAOYSA-K 0.000 description 1
229910052797 bismuth Inorganic materials 0.000 description 1
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239000004841 bisphenol A epoxy resin Substances 0.000 description 1
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WPCPXPTZTOMGRF-UHFFFAOYSA-K di(butanoyloxy)alumanyl butanoate Chemical compound [Al+3].CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O WPCPXPTZTOMGRF-UHFFFAOYSA-K 0.000 description 1
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239000007789 gas Substances 0.000 description 1
238000007429 general method Methods 0.000 description 1
239000002241 glass-ceramic Substances 0.000 description 1
238000007756 gravure coating Methods 0.000 description 1
229910052736 halogen Inorganic materials 0.000 description 1
125000005843 halogen group Chemical group 0.000 description 1
150000002367 halogens Chemical class 0.000 description 1
XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
VYBDIZDWSPIKMF-UHFFFAOYSA-N hydrazine trifluoro(methylsulfonyl)methane Chemical compound FC(S(=O)(=O)C)(F)F.NN VYBDIZDWSPIKMF-UHFFFAOYSA-N 0.000 description 1
229930195733 hydrocarbon Natural products 0.000 description 1
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230000006698 induction Effects 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
230000000977 initiatory effect Effects 0.000 description 1
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239000011810 insulating material Substances 0.000 description 1
238000009413 insulation Methods 0.000 description 1
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FRCAGVUKJQCWBD-UHFFFAOYSA-L iodine green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(\C=1C=CC(=CC=1)[N+](C)(C)C)=C/1C=C(C)C(=[N+](C)C)C=C\1 FRCAGVUKJQCWBD-UHFFFAOYSA-L 0.000 description 1
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235000014655 lactic acid Nutrition 0.000 description 1
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GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
239000001095 magnesium carbonate Substances 0.000 description 1
229910000021 magnesium carbonate Inorganic materials 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
229910052753 mercury Inorganic materials 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical class [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
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229910052759 nickel Inorganic materials 0.000 description 1
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TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical group CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
239000012766 organic filler Substances 0.000 description 1
150000002923 oximes Chemical class 0.000 description 1
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
UZRUZACOSHWLOC-UHFFFAOYSA-M phenoxyaluminum Chemical compound [Al]OC1=CC=CC=C1 UZRUZACOSHWLOC-UHFFFAOYSA-M 0.000 description 1
125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
229920001610 polycaprolactone Polymers 0.000 description 1
239000004632 polycaprolactone Substances 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
229920000570 polyether Polymers 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
229940113116 polyethylene glycol 1000 Drugs 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
239000004926 polymethyl methacrylate Substances 0.000 description 1
229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
239000004810 polytetrafluoroethylene Substances 0.000 description 1
229920001343 polytetrafluoroethylene Polymers 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
230000008569 process Effects 0.000 description 1
238000012545 processing Methods 0.000 description 1
238000003672 processing method Methods 0.000 description 1
BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
230000009257 reactivity Effects 0.000 description 1
238000007363 ring formation reaction Methods 0.000 description 1
239000005060 rubber Substances 0.000 description 1
229910052707 ruthenium Inorganic materials 0.000 description 1
238000000926 separation method Methods 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
238000003786 synthesis reaction Methods 0.000 description 1
239000000454 talc Substances 0.000 description 1
229910052623 talc Inorganic materials 0.000 description 1
MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
239000002562 thickening agent Substances 0.000 description 1
239000010409 thin film Substances 0.000 description 1
OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
238000012546 transfer Methods 0.000 description 1
MYWQGROTKMBNKN-UHFFFAOYSA-N tributoxyalumane Chemical compound [Al+3].CCCC[O-].CCCC[O-].CCCC[O-] MYWQGROTKMBNKN-UHFFFAOYSA-N 0.000 description 1
JFZKOODUSFUFIZ-UHFFFAOYSA-N trifluoro phosphate Chemical compound FOP(=O)(OF)OF JFZKOODUSFUFIZ-UHFFFAOYSA-N 0.000 description 1
UAEJRRZPRZCUBE-UHFFFAOYSA-N trimethoxyalumane Chemical compound [Al+3].[O-]C.[O-]C.[O-]C UAEJRRZPRZCUBE-UHFFFAOYSA-N 0.000 description 1
OPSWAWSNPREEFQ-UHFFFAOYSA-K triphenoxyalumane Chemical compound [Al+3].[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1 OPSWAWSNPREEFQ-UHFFFAOYSA-K 0.000 description 1
239000002966 varnish Substances 0.000 description 1
239000002023 wood Substances 0.000 description 1
239000008096 xylene Substances 0.000 description 1

Classifications

- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

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Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
General Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Materials For Photolithography (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)

TW102142464A 2012-11-22 2013-11-21 感光性樹脂組成物、阻劑層合體及該等之硬化物 TW201425450A (zh)

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US11813713B2 (en) *	2021-01-21	2023-11-14	Rohm And Haas Electronic Materials Cmp Holdings, Inc.	Chemical mechanical polishing pad and polishing method
US12064846B2 (en) *	2021-01-21	2024-08-20	Rohm And Haas Electronic Materials Cmp Holdings, Inc.	Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith
US12064845B2 (en) *	2021-01-21	2024-08-20	Rohm And Haas Electronic Materials Cmp Holdings, Inc.	Formulations for chemical mechanical polishing pads with high planarization efficiency and CMP pads made therewith
US11806830B2 (en) *	2021-01-21	2023-11-07	Rohm And Haas Electronic Materials Cmp Holdings, Inc.	Formulations for chemical mechanical polishing pads and CMP pads made therewith

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CA1243147A (en) *	1983-02-07	1988-10-11	Union Carbide Corporation	Photocopolymerizable compositions based on epoxy and hydroxyl containing organic materials and substituted cycloaliphatic monoepoxide reactive diluents
JP2761403B2 (ja) *	1989-06-15	1998-06-04	三井化学株式会社	耐熱性エポキシ樹脂組成物
JPH09255765A (ja) *	1996-03-27	1997-09-30	Dainippon Ink & Chem Inc	硬化性樹脂組成物
JP3765896B2 (ja) *	1996-12-13	2006-04-12	Ｊｓｒ株式会社	光学的立体造形用光硬化性樹脂組成物
JP2000044776A (ja) *	1998-07-29	2000-02-15	Mitsui Chemicals Inc	熱硬化性樹脂組成物
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JP4578223B2 (ja) *	2004-12-14	2010-11-10	ダイセル化学工業株式会社	光学的立体造形用光硬化性樹脂組成物
JP4789725B2 (ja) *	2006-07-14	2011-10-12	日本化薬株式会社	感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法
JP4789726B2 (ja) *	2006-07-14	2011-10-12	日本化薬株式会社	感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法
JP2008026667A (ja) *	2006-07-21	2008-02-07	Nippon Kayaku Co Ltd	永久レジスト組成物、及びレジスト積層体
JP5137673B2 (ja) *	2008-04-26	2013-02-06	日本化薬株式会社	Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
WO2009151050A1 (ja) *	2008-06-10	2009-12-17	日本化薬株式会社	中空パッケージ用感光性樹脂組成物、その硬化物及び該樹脂組成物を用いた積層体並びにマイクロデバイス
JP2010271401A (ja) *	2009-05-19	2010-12-02	Nippon Kayaku Co Ltd	レジスト組成物
JP2010276694A (ja) *	2009-05-26	2010-12-09	Nippon Kayaku Co Ltd	感光性樹脂組成物及びその積層体並びにそれらの硬化物

2012
- 2012-11-22 JP JP2012256117A patent/JP5939963B2/ja not_active Expired - Fee Related
2013
- 2013-11-21 TW TW102142464A patent/TW201425450A/zh unknown
- 2013-11-21 WO PCT/JP2013/081359 patent/WO2014080971A1/ja not_active Ceased

Also Published As

Publication number	Publication date
JP5939963B2 (ja)	2016-06-29
JP2014102464A (ja)	2014-06-05
WO2014080971A1 (ja)	2014-05-30

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