TW201313430A - Polyarylene sulfide film for mold-release and method for preparing thermosetting resin molded body using the same - Google Patents
Polyarylene sulfide film for mold-release and method for preparing thermosetting resin molded body using the same Download PDFInfo
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- TW201313430A TW201313430A TW101128865A TW101128865A TW201313430A TW 201313430 A TW201313430 A TW 201313430A TW 101128865 A TW101128865 A TW 101128865A TW 101128865 A TW101128865 A TW 101128865A TW 201313430 A TW201313430 A TW 201313430A
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- Prior art keywords
- film
- mold
- thermosetting resin
- mold release
- particles
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 229920005989 resin Polymers 0.000 title claims description 32
- 239000011347 resin Substances 0.000 title claims description 32
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 17
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 title abstract description 14
- 229920000412 polyarylene Polymers 0.000 title abstract description 13
- -1 poly(arylene sulfide Chemical compound 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 238000000465 moulding Methods 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 238000007493 shaping process Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 60
- 239000004734 Polyphenylene sulfide Substances 0.000 description 28
- 229920000069 polyphenylene sulfide Polymers 0.000 description 28
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 20
- 229920000642 polymer Polymers 0.000 description 17
- 230000000704 physical effect Effects 0.000 description 16
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 14
- 229920006269 PPS film Polymers 0.000 description 13
- 239000000843 powder Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- 239000002002 slurry Substances 0.000 description 11
- 238000011282 treatment Methods 0.000 description 11
- 239000004744 fabric Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 229910000019 calcium carbonate Inorganic materials 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 239000002585 base Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- PBKONEOXTCPAFI-UHFFFAOYSA-N 1,2,4-trichlorobenzene Chemical compound ClC1=CC=C(Cl)C(Cl)=C1 PBKONEOXTCPAFI-UHFFFAOYSA-N 0.000 description 3
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000003733 fiber-reinforced composite Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- XWUCFAJNVTZRLE-UHFFFAOYSA-N 7-thiabicyclo[2.2.1]hepta-1,3,5-triene Chemical group C1=C(S2)C=CC2=C1 XWUCFAJNVTZRLE-UHFFFAOYSA-N 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical class C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Chemical class 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000306 polymethylpentene Polymers 0.000 description 2
- 239000011116 polymethylpentene Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- ODPYDILFQYARBK-UHFFFAOYSA-N 7-thiabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2SC2=C1 ODPYDILFQYARBK-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 1
- 239000001639 calcium acetate Substances 0.000 description 1
- 235000011092 calcium acetate Nutrition 0.000 description 1
- 229960005147 calcium acetate Drugs 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229930192474 thiophene Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000004056 waste incineration Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
- B29K2081/04—Polysulfides, e.g. PPS, i.e. polyphenylene sulfide or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
- C08J2381/04—Polysulfides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本發明關於一種脫模用聚伸芳基硫醚薄膜,其係有用於熱硬化性樹脂的成型,另外還關於一種使用其之熱硬化性樹脂成形體的製造方法。 The present invention relates to a polycondensation aryl sulfide film for mold release, which is used for molding a thermosetting resin, and a method for producing a thermosetting resin molded body using the same.
在樹脂成型的過程中,在藉由金屬模具進行熱壓延時,為了容易使熱壓延後的成形體由金屬模具脫離、防止金屬模具的污染等目的,可使用脫模薄膜。 In the process of resin molding, a mold release film can be used for the purpose of facilitating the hot rolling of the hot-rolled molded body from the metal mold and preventing the metal mold from being contaminated by a hot press.
過去以來,脫模薄膜是採用氟系薄膜、聚甲基戊烯薄膜、聚丙烯薄膜、聚對苯二甲酸乙二酯薄膜等。但是,氟系薄膜的脫模性優異,然而問題在於其為高價物品並且在使用後的廢棄焚燒處理時難以燃燒,且燃燒時產生有毒氣體。聚甲基戊烯薄膜的軟化溫度低,因此會有在成型途中薄膜容易出現皺摺的問題。聚丙烯薄膜或聚對苯二甲酸乙二酯薄膜較低價,而耐熱性差,在高溫使用的情況下脫模性不足。為了改善脫模性不良,已知有在這些薄膜的表面積層或塗布例如由熱硬化型聚矽氧系脫模劑所構成之脫模層的例子,然而會有因為聚矽氧成分轉印至成形體表面而損害製品的品質的顧慮。 In the past, a release film has been a fluorine-based film, a polymethylpentene film, a polypropylene film, a polyethylene terephthalate film, or the like. However, the fluorine-based film is excellent in mold release property, but the problem is that it is a high-priced article and is difficult to burn at the time of waste incineration treatment after use, and a toxic gas is generated at the time of combustion. Since the polymethylpentene film has a low softening temperature, there is a problem that the film is likely to wrinkle during the molding. A polypropylene film or a polyethylene terephthalate film is relatively inexpensive, and has poor heat resistance, and is insufficient in mold release property at a high temperature. In order to improve the mold release property, an example of a surface layer of these films or a release layer formed of, for example, a thermosetting polyoxymethylene type release agent is known, but there is a case where the polyfluorene component is transferred to There is a concern that the surface of the body is molded to impair the quality of the product.
另一方面,聚伸苯基硫醚薄膜(以下簡記為PPS薄膜)的耐熱性、耐藥品性優異,並且在廣溫度範圍表現出良好的脫模性,因此近年來日漸期待一種泛用的脫模薄膜能夠代替高價的氟系薄膜。例如有文獻提出一種脫模用PPS薄膜,其藉由調節粒子添加濃度,以提高表面平滑性,減少表面缺陷(參照專利文獻1、2)。 On the other hand, a polyphenylene sulfide film (hereinafter abbreviated as a PPS film) is excellent in heat resistance and chemical resistance, and exhibits good mold release property over a wide temperature range, and thus, in recent years, it has been expected to be a general-purpose release. The mold film can replace the expensive fluorine-based film. For example, there has been proposed a PPS film for mold release which adjusts the particle addition concentration to improve surface smoothness and reduce surface defects (see Patent Documents 1 and 2).
此外,近年來有許多情況是藉由將熱壓延溫度設定在180℃以上的高溫以縮短壓延時間而提升生產性,而非常需要開發出脫模性更高的脫模薄膜。在像這樣的高溫成型的情況,以往的PPS薄膜會有脫模性不足的情形,例如在將專利文獻1、2所記載的PPS薄膜在180℃以上的溫度進行壓延的情況下,薄膜會與成形體密合,在剝離時會有薄膜破裂或斷開而無法得到成形體的顧慮。 Further, in recent years, there have been many cases in which productivity is improved by setting the hot rolling temperature to a high temperature of 180 ° C or higher to shorten the rolling time, and it is highly desirable to develop a release film having a higher mold release property. In the case of high-temperature molding as described above, the conventional PPS film may have insufficient mold release property. For example, when the PPS film described in Patent Documents 1 and 2 is rolled at a temperature of 180 ° C or higher, the film may be When the molded body is in close contact, the film may be broken or broken at the time of peeling, and the molded body may not be obtained.
專利文獻1 日本特開平9-300365號公報 Patent Document 1 Japanese Patent Publication No. 9-300365
專利文獻2 日本特開2008-110549號公報 Patent Document 2 Japanese Patent Laid-Open Publication No. 2008-110549
專利文獻3 日本特開2001-154198號公報 Patent Document 3 Japanese Patent Laid-Open Publication No. 2001-154198
本發明之目的在於提供一種脫模性優異的脫模用聚伸芳基硫醚薄膜。 An object of the present invention is to provide a polycondensation aryl sulfide film for mold release which is excellent in mold release property.
為了解決上述課題,本發明之聚伸芳基硫醚薄膜主要具有下述構成。亦即: In order to solve the above problems, the polyarylene sulfide film of the present invention mainly has the following constitution. that is:
(I)一種脫模用聚伸芳基硫醚薄膜,其係由聚伸芳基硫醚樹脂所構成之薄膜,並且在薄膜的至少單面同時滿足下述(1)、(2);(1):中心面平均粗糙度(SRa)為70nm以下,(2):以奈米壓印法測得的在深度10nm的硬度為4.0GPa以上。 (I) a film of a poly(arylene sulfide) for demolding, which is a film composed of a poly(arylene thioether) resin, and satisfies the following (1), (2) at least one side of the film; 1): The center plane average roughness (SRa) is 70 nm or less, and (2): the hardness at a depth of 10 nm measured by a nanoimprint method is 4.0 GPa or more.
(II)如(I)所記載之脫模用聚伸芳基硫醚薄膜,其中薄膜的長邊方向及寬度方向的拉伸彈性率任一者皆為4.0GPa以下。 (II) The polyarylene sulfide film for mold release according to (I), wherein the film has a tensile modulus in the longitudinal direction and the width direction of 4.0 GPa or less.
(III)一種熱硬化性樹脂成形體的製造方法,其係包含在如(I)記載之薄膜之前述同時滿足(1)、(2)的面的一面載置熱硬化性樹脂預成形體之步驟;及使用金屬模具進行熱壓延成型加工對該熱硬化性樹脂預成形體賦形之步驟。 (III) A method for producing a thermosetting resin molded body, which comprises placing a thermosetting resin preform on one surface of the film (1) and satisfying the surfaces of (1) and (2) And a step of shaping the thermosetting resin preform by hot calender molding using a metal mold.
(IV)如(III)所記載之熱硬化性樹脂成形體的製造方法,其中熱硬化性樹脂為環氧樹脂。 (IV) The method for producing a thermosetting resin molded body according to (III), wherein the thermosetting resin is an epoxy resin.
依據本發明,可大幅改善聚伸芳基硫醚薄膜的脫模性,即使使用在180℃以上的高溫進行熱壓延而賦形的情況,薄膜不會發生破裂或斷開等,可將脫模薄膜剝離,有效地得到熱硬化性樹脂成形體。 According to the present invention, the release property of the poly(arylene sulfide) film can be greatly improved, and even if the film is formed by hot rolling at a high temperature of 180 ° C or higher, the film does not crack or break, and the film can be removed. The mold film is peeled off, and a thermosetting resin molded body is efficiently obtained.
以下針對本發明作說明。 The invention is described below.
本發明所使用的聚伸芳基硫醚是指主要構成單元為-(Ar-S)-重覆單元,宜為含有該重覆單元80莫耳%以上的同元聚合物或共聚物。Ar如下述式(A)~式(L)等所表示之重覆單元等,而其中以式(A)所表示之重覆單元為特佳。 The poly-aryl aryl sulfide used in the present invention means that the main constituent unit is an -(Ar-S)-repeating unit, and it is preferred to contain a homopolymer or copolymer having more than 80% by mole of the repeating unit. Ar is a repeating unit represented by the following formula (A) to formula (L), and the like, and the repeating unit represented by the formula (A) is particularly preferable.
(但是,式中的R1、R2為氫、選自碳數1至6之烷基、碳數1至6之烷氧基、鹵素基之取代基,R1與R2可相同或相異)。 (However, R1 and R2 in the formula are hydrogen, an alkyl group selected from carbon atoms of 1 to 6, an alkoxy group having 1 to 6 carbon atoms, a substituent of a halogen group, and R1 and R2 may be the same or different).
在以此重覆單元作為主要構成單元的前提下,可含有下述式(M)~式(P)等所表示之少量的分支單元或交聯單元。這些分支單元或交聯單元的共聚合量係以相對於-(Ar-S)-單元1莫耳而言0~1莫耳%的範圍為佳。 On the premise that the repeating unit is the main constituent unit, a small number of branching units or crosslinking units represented by the following formulas (M) to (P) and the like may be contained. The amount of copolymerization of these branching units or crosslinking units is preferably in the range of 0 to 1 mol% with respect to -(Ar-S)-unit 1 molar.
另外,本發明所使用的聚伸芳基硫醚可為具有上述重覆單元的隨機共聚物、塊狀共聚物及這些混合物之任一者。 Further, the poly-aryl aryl sulfide used in the present invention may be any of a random copolymer, a bulk copolymer and a mixture thereof having the above-mentioned repeating unit.
該等聚伸芳基硫醚代表性的例子可列舉聚伸苯基硫醚、聚伸苯基硫醚碸、聚伸苯基硫醚酮、這些隨機共聚物、塊狀共聚物及這些混合物等。特別合適的聚伸芳基硫醚可列舉聚伸苯基硫醚(以下亦有簡記為PPS的情形),其含有下述式所表示的對伸苯基硫醚單元作為聚合物的主要構成單元,含量宜為80莫耳%以上,較佳為90莫耳%,更佳為95莫耳%以上。在該對伸苯基硫醚單元未滿80莫耳%的情況,會有聚合物的結晶性低或熱轉移溫度等低,損害聚伸芳基硫醚薄膜特徵的耐熱性、尺寸安定性、機械特性等的情形。 Representative examples of the poly(arylene sulfide) include polyphenylene sulfide, polyphenylene sulfide, polyphenylene sulfide, these random copolymers, bulk copolymers, and the like. . A particularly suitable poly(arylene sulfide) is a polyphenylene sulfide (hereinafter also referred to as PPS), which contains a p-phenylene sulfide unit represented by the following formula as a main constituent unit of the polymer. The content is preferably 80 mol% or more, preferably 90 mol%, more preferably 95 mol% or more. When the p-phenylene sulfide unit is less than 80 mol%, the crystallinity of the polymer is low or the heat transfer temperature is low, and the heat resistance and dimensional stability of the polyarylene sulfide film are impaired. The case of mechanical characteristics, etc.
在本發明中聚伸芳基硫醚的熔融黏度並無特別限制,而以在溫度310℃、剪切速度1,000(1/sec)時在100~2,000Pa‧s的範圍為佳,更佳為200~1,000Pa‧s的範圍。另外,聚伸芳基硫醚的分子量也沒有特別限制,可使用一般的聚伸芳基硫醚,這種聚伸芳基硫醚的重量平均分子量可例示5,000~1,000,000,7,500~500,000為佳,10,000~100,000為較佳。 The melt viscosity of the poly(arylene sulfide) in the present invention is not particularly limited, but is preferably in the range of 100 to 2,000 Pa s at a temperature of 310 ° C and a shear rate of 1,000 (1/sec), more preferably Range of 200~1,000Pa‧s. Further, the molecular weight of the poly(arylene sulfide) is not particularly limited, and a general poly(aryl) sulfide can be used. The weight average molecular weight of the poly(arylene sulfide) can be exemplified by 5,000 to 1,000,000, and 7,500 to 500,000. 10,000 to 100,000 is preferred.
聚伸芳基硫醚的製造方法不受特別限定,而可藉由例如使日本特開平5-163349號公報所代表的至少含有1個核取代鹵素的芳香族化合物或噻吩與鹼金屬單硫化物 在極性有機溶劑中並在高溫下反應的方法,宜為使硫化劑與二鹵素化芳香族化合物在有機極性溶劑中接觸而得到。 The method for producing the poly(arylene sulfide) is not particularly limited, and an aromatic compound containing at least one core-substituted halogen or thiophene and an alkali metal monosulfide represented by JP-A-5-163349, for example, can be used. The method of reacting in a polar organic solvent at a high temperature is preferably obtained by bringing a vulcanizing agent into contact with a dihalogenated aromatic compound in an organic polar solvent.
在本發明中,亦可實施將所得到的聚伸芳基硫醚在空氣中加熱來進行交聯/高分子量化;在氮氣等的惰性氣體環境下或在減壓下的熱處理;藉由有機溶劑、熱水及酸水溶液等進行洗淨;藉由酸酐、胺、異氰酸酯及官能基二硫化物等的含有官能基化合物進行活性化等各種處理之後使用。 In the present invention, the obtained polycondensation aryl sulfide may be subjected to heating in air for crosslinking/high molecular weight; heat treatment in an inert gas atmosphere such as nitrogen or under reduced pressure; The solvent, hot water, aqueous acid solution, and the like are washed, and various treatments such as activation of a functional group-containing compound such as an acid anhydride, an amine, an isocyanate, and a functional disulfide are used.
在本發明中聚伸芳基硫醚只要在不阻礙本發明之特性的範圍,亦可摻合聚伸芳基硫醚以外的樹脂(異種聚合物),另外亦可添加抗氧化劑、熱安定劑、潤滑劑、紫外線吸收劑等的添加劑。 In the present invention, the poly(arylene sulfide) may be blended with a resin other than the poly(aryl sulfide) (heteropolypolymer) as long as it does not inhibit the characteristics of the present invention, and an antioxidant or a heat stabilizer may be added. Additives such as lubricants, UV absorbers, etc.
另外,在本發明中聚伸芳基硫醚可含有有機或無機粒子。這種粒子可列舉例如碳酸鈣、二氧化矽、氧化鈦、氧化鋁、高嶺土、磷酸鈣、硫酸鋇、滑石、氧化鋅、金屬等的無機粒子、或聚四氟乙烯粒子、聚矽氧粒子、如交聯聚苯乙烯粒子般至300℃還不會熔融的有機粒子。宜為碳酸鈣、二氧化矽,這些粒子由於與聚合物的親和性良好且在製膜延伸時在粒子周邊不易生成空隙,故為適合。粒子的形狀並不受特別限制,可採用球狀、直方體狀、單分散狀、凝集狀等的粒子。這些粒子可單獨使用1種,另外還可併用2種以上。粒子的添加量相對於薄膜全體而言小於5重量%,而從確保高脫模性的觀點看來為佳。在粒子含量為5重量%以上的情況,因為薄 膜表面粗糙度變大,使脫模薄膜與成形體牢固地密合,會有脫模性惡化的情形。 Further, in the present invention, the polyarylsulfide may contain organic or inorganic particles. Examples of such particles include inorganic particles such as calcium carbonate, cerium oxide, titanium oxide, aluminum oxide, kaolin, calcium phosphate, barium sulfate, talc, zinc oxide, and metal, or polytetrafluoroethylene particles and polyfluorinated particles. For example, cross-linked polystyrene particles to 300 ° C will not melt organic particles. Calcium carbonate or cerium oxide is preferred, and these particles are suitable because they have good affinity with the polymer and are less likely to form voids around the particles during film formation. The shape of the particles is not particularly limited, and particles of a spherical shape, a rectangular shape, a monodisperse form, and agglomerated shape may be used. These particles may be used alone or in combination of two or more. The amount of the particles added is less than 5% by weight based on the entire film, and is preferable from the viewpoint of ensuring high mold release property. In the case where the particle content is 5% by weight or more, because it is thin When the surface roughness of the film is increased, the release film and the molded body are firmly adhered to each other, and the mold release property may be deteriorated.
本發明之脫模用聚伸芳基硫醚薄膜的厚度並未受到特別限定,而從使用作為脫模薄膜時的作業性的層面看來,以1~500μm的範圍為佳,較佳為3~250μm的範圍,更佳為5~100μm的範圍。 The thickness of the poly(arylene sulfide) film for mold release of the present invention is not particularly limited, and is preferably in the range of 1 to 500 μm, preferably 3, from the viewpoint of workability when using the release film. The range of ~250 μm, more preferably in the range of 5 to 100 μm.
另外,本發明之脫模用聚伸芳基硫醚薄膜可為延伸膜或未延伸膜,可因應用途使用適當的延伸條件的薄膜。 Further, the polyarylene sulfide film for mold release of the present invention may be a stretched film or an unstretched film, and a film of an appropriate elongation condition may be used depending on the application.
本發明之脫模用聚伸芳基硫醚薄膜的表面的中心面平均粗糙度(SRa)為70nm以下是重要的(方便上稱為表面物性(1))。較佳為50nm以下,更佳為30nm以下。該中心面平均粗糙度超過70nm的情況,薄膜表面的凹凸與成形體的密合性會提高,在180℃以上的高溫進行熱壓延的情況,會有脫模性變得不足的情形。工業上可製膜的聚伸芳基硫醚薄膜的中心面平均粗糙度的下限值為0.5nm。為了將中心面平均粗糙度定在上述範圍,如在實施例中所列舉的具體例所述,可藉由粒子的含量、粒子的平均粒徑,製膜時的延伸倍率、熱處理溫度等適當地調整。 It is important that the surface average roughness (SRa) of the surface of the polyarylene sulfide film for mold release of the present invention is 70 nm or less (conveniently referred to as surface physical property (1)). It is preferably 50 nm or less, more preferably 30 nm or less. When the average surface roughness of the center surface exceeds 70 nm, the adhesion between the unevenness on the surface of the film and the molded body is improved, and when the film is hot rolled at a high temperature of 180 ° C or higher, the mold release property may be insufficient. The lower limit of the center plane average roughness of the industrially film-formable poly-arylene sulfide film is 0.5 nm. In order to set the center surface average roughness to the above range, as described in the specific examples exemplified in the examples, the content of the particles, the average particle diameter of the particles, the stretching ratio at the time of film formation, the heat treatment temperature, and the like may be appropriately Adjustment.
從提升脫模性的觀點看來,本發明之脫模用聚伸芳基硫醚薄膜重要的是以奈米壓印法測得在由表面算起的深度10nm的硬度為4.0GPa以上(方便上稱為表面物性(2))。較佳為4.2GPa以上,更佳為4.5GPa以上。該硬度未滿4.0GPa的情況,在180℃以上的高溫下進行熱壓延時會有脫模性不足的情形。另一方面,該硬度的上限值 不受特別限定,而實質上的上限為10GPa左右。為了達到此硬度的方法可列舉例如後述般對薄膜表面實施摩擦處理等。 From the viewpoint of improving mold release property, the polyaryl aryl sulfide film for mold release of the present invention is important in that the hardness at a depth of 10 nm from the surface is 4.0 GPa or more as measured by a nanoimprint method. It is called surface physical property (2)). It is preferably 4.2 GPa or more, more preferably 4.5 GPa or more. When the hardness is less than 4.0 GPa, the hot press delay at a high temperature of 180 ° C or higher may cause insufficient mold release property. On the other hand, the upper limit of the hardness It is not particularly limited, and the upper limit is substantially about 10 GPa. In order to achieve such a hardness, for example, a rubbing treatment or the like is applied to the surface of the film as will be described later.
在欲藉由對聚伸芳基硫醚薄膜的表面實施摩擦處理達到前述表面硬度的情況,摩擦的方法不受特別限定,而例如可使用已知的摩擦裝置(參照例如專利文獻3)。此情況下需要調整摩擦條件以使藉由奈米壓印法對經過摩擦的薄膜表面測得的硬度值在前述範圍。 In the case where the surface hardness is to be achieved by subjecting the surface of the poly(arylene sulfide) film to rubbing, the method of rubbing is not particularly limited, and for example, a known rubbing device can be used (see, for example, Patent Document 3). In this case, it is necessary to adjust the rubbing conditions so that the hardness value measured on the surface of the rubbed film by the nanoimprint method is within the aforementioned range.
此時宜為大致使下述式M所表示之摩擦密度(mm)成為300mm以上的條件進行摩擦,較佳為500mm以上,更佳為700mm以上。在摩擦密度不滿足300mm的情況,藉由奈米壓印法對經過摩擦的薄膜表面所測得的硬度值會有不在前述範圍的情形。 In this case, it is preferable to rub the friction density (mm) represented by the following formula M to a condition of 300 mm or more, preferably 500 mm or more, and more preferably 700 mm or more. In the case where the friction density does not satisfy 300 mm, the hardness value measured by the nanoimprint method on the surface of the rubbed film may be out of the above range.
M=NL(1+2 π Rn/60V) M=NL(1+2 π Rn/60V)
上述式中的N為摩擦的次數,L為與薄膜表面接觸的摩擦布的長度(mm),R為包括摩擦布厚度的摩擦輥筒的半徑(mm),n為摩擦輥筒的轉速(rprn),V為薄膜的移動速度(mm/s)。 N in the above formula is the number of rubbing times, L is the length (mm) of the rubbing cloth in contact with the surface of the film, R is the radius (mm) of the rubbing roll including the thickness of the rubbing cloth, and n is the rotating speed of the rubbing roll (rprn ), V is the moving speed (mm/s) of the film.
對薄膜表面實施摩擦處理的時間不受特別限定,而可列舉在例如雙軸延伸薄膜的情況,對延伸前的未延伸薄膜摩擦;在往一個方向延伸之後進行摩擦;在雙軸延伸之後,纏繞前進行摩擦;纏繞後進行後加工摩擦等。 The time for performing the rubbing treatment on the surface of the film is not particularly limited, and may be exemplified by, for example, a biaxially stretched film, rubbing the unstretched film before stretching; rubbing after extending in one direction; and winding after biaxial stretching Friction is performed before; after the winding, post-processing friction is performed.
本發明之脫模用聚伸芳基硫醚薄膜重要的是薄膜的至少單面同時滿足表面物性(1)及表面物性(2)。滿足這些表面物性(1)、(2)的面適合使用作為脫模面,其相反側表 面的表面物性不受特別限定。因此,依照用途在其兩面的粒子添加濃度亦可為相異,另外還可在與表面物性滿足(1)、(2)的面相反側的表面積層構成與樹脂相異的薄膜。 The polyarylene sulfide film for mold release of the present invention is important in that at least one side of the film satisfies both surface physical properties (1) and surface physical properties (2). The surface satisfying these surface physical properties (1), (2) is suitable for use as a release surface, and the opposite side table The surface physical properties of the surface are not particularly limited. Therefore, the particle addition concentration on both surfaces may be different depending on the application, and a film different from the resin may be formed on the surface layer opposite to the surface having the surface physical properties satisfying (1) and (2).
另外,本發明之脫模用聚伸芳基硫醚薄膜在薄膜的長邊方向及寬度方向的拉伸彈性率任一者皆以4.0GPa以下為佳,較佳為3.7GPa以下,更佳為3.4GPa以下。在薄膜的長邊方向或寬度方向的拉伸彈性率的任一者超過4.0GPa的情況,因為薄膜的剛性過高會有薄膜的成型性變得不足的情況。 Further, the stretched aryl sulfide film for mold release of the present invention preferably has a tensile modulus in the longitudinal direction and the width direction of the film of 4.0 GPa or less, preferably 3.7 GPa or less, more preferably 3.4GPa or less. When either of the tensile modulus in the longitudinal direction or the width direction of the film exceeds 4.0 GPa, the moldability of the film may be insufficient because the rigidity of the film is too high.
本發明之脫模用聚伸芳基硫醚薄膜可適合使用作為在使用金屬模具進行熱壓延成型時的脫模薄膜。例如在製造印刷電路板、IC晶片(晶圓鑄模)、陶瓷電子零件、熱硬化性樹脂製品、化妝板等時,在成型步驟時夾進該金屬板彼此之間或樹脂彼此之間以使金屬板彼此或樹脂彼此不會接著,特別是在製造積層板時,製造可撓印刷電路板時,使半導體密封用環氧樹脂組成物成型時,製造纖維強化複合材料時,製造運動休閒用品時所適合使用的薄膜。製造積層板時所使用的脫模薄膜,具體而言是指例如在製造多層印刷電路板時的壓延成型之中,為了防止印刷電路板與分離板或其他印刷電路板與之間的接著而存在於其間的薄膜。另外,在製造可撓印刷電路板時所使用的脫模薄膜,具體而言是指例如在製造安裝電氣製品中的可動部分且可變形的可撓印刷電路板時,在對基底薄膜蝕刻等而藉此形成電路,為了保護此電路 使用包覆樹脂,在對其熱壓延時,為了使此包覆樹脂與電路的凹凸部密合而覆蓋包覆樹脂所使用的薄膜。半導體密封用環氧樹脂組成物的成型時所使用的脫模薄膜,具體而言是指例如在藉由轉移鑄型、壓縮鑄型等已知的成型方法使環氧樹脂材料的粉體或錠硬化成型時,為了防止金屬模具與環氧樹脂的密合而存在於其之間的薄膜。纖維強化複合材料製造時所使用的脫模薄膜,具體而言是指例如使基材樹脂採用環氧樹脂的碳纖維預浸體硬化成型而製造出各種製品時,為了防止金屬模具與環氧樹脂的密合所使用的薄膜。製造運動休閒用品時所使用的脫模薄膜,具體而言是指例如在製造釣竿、高爾夫球桿的桿、風浪板的桿等的過程中,在高壓釜中使卷成圓筒狀的碳纖維預浸體硬化時,為了防止與模具的密合所使用的薄膜。 The polyarylene sulfide film for mold release of the present invention can be suitably used as a release film at the time of hot calender molding using a metal mold. For example, when manufacturing a printed circuit board, an IC wafer (wafer mold), a ceramic electronic component, a thermosetting resin product, a cosmetic board, or the like, the metal plates are sandwiched between the metal plates or between the resins at the molding step to make the metal When the board is made of a resin board, when manufacturing a flexible printed circuit board, when making a flexible printed circuit board, when manufacturing a fiber-reinforced composite material, when manufacturing a fiber-reinforced composite material, when manufacturing a sports and leisure product A film suitable for use. The release film used in the production of the laminate is specifically referred to, for example, in the calender molding at the time of manufacturing a multilayer printed circuit board, in order to prevent the subsequent connection between the printed circuit board and the separator or other printed circuit board. The film in between. In addition, the release film used in the manufacture of the flexible printed circuit board specifically refers to, for example, etching of the base film when manufacturing a movable portion and a deformable flexible printed circuit board in an electrical product. Thereby forming a circuit in order to protect the circuit The coating resin is used to cover the film used for coating the resin in order to cause the coating resin to adhere to the uneven portion of the circuit. The release film used for molding the epoxy resin composition for semiconductor encapsulation is specifically, for example, a powder or an ingot of an epoxy resin material by a known molding method such as a transfer mold or a compression mold. In the case of hardening molding, a film is present between the metal mold and the epoxy resin to prevent adhesion therebetween. The release film used in the production of the fiber-reinforced composite material is specifically, for example, a method in which a base material resin is molded by using a carbon fiber prepreg of an epoxy resin to produce various products, in order to prevent the metal mold and the epoxy resin. The film used for the adhesion. The release film used in the manufacture of sports and leisure articles is, for example, a carbon fiber pre-rolled in a cylindrical shape in an autoclave, for example, in the manufacture of a fishing rod, a golf club rod, a windsurfing rod, or the like. When the dip is hardened, the film used to prevent adhesion to the mold is used.
本發明特別適合使用於在使基材樹脂浸滲至強化纖維基材而成的預浸體以壓延成型金屬模具成型時,防止金屬模具與預浸體的接著。就適合使用的預浸體的構成而言,強化纖維可列舉碳纖維、玻璃布、芳綸纖維等的高強度纖維,浸滲的基材樹脂可列舉環氧樹脂、不飽和聚酯樹脂、烯丙基樹脂、酚樹脂、三聚氰胺樹脂、聚醯胺樹脂等的熱硬化性樹脂,其中環氧樹脂為佳。 The present invention is particularly suitable for use in preventing the adhesion of a metal mold and a prepreg when a prepreg obtained by impregnating a base resin with a reinforcing fiber base is formed by a calender molding die. Examples of the structure of the prepreg to be used include high-strength fibers such as carbon fibers, glass cloths, and aramid fibers, and examples of the base resin impregnated include an epoxy resin, an unsaturated polyester resin, and an acryl. A thermosetting resin such as a base resin, a phenol resin, a melamine resin, or a polyamide resin, and an epoxy resin is preferred.
接下來針對製造本發明之脫模用聚伸芳基硫醚薄膜的方法,聚伸芳基硫醚採用聚伸苯基硫醚的雙軸配向聚伸苯基硫醚薄膜的製造方法舉例說明,而本發明的解釋並不受此限定。 Next, for the method for producing the polyarylene sulfide film for demolding of the present invention, a method for producing a biaxially oriented polyphenylene sulfide film of polyphenylene sulfide by using polyphenylene sulfide is exemplified. However, the explanation of the present invention is not limited thereto.
使硫化鈉與對二氯苯在N-甲基-2-吡咯烷酮(NMP)等的醯胺系極性溶劑中並在高溫高壓下反應。亦可因應必要包含三鹵化苯等的共聚合成分。可添加氫氧化鉀或羧酸鹼金屬鹽等以作為聚合度調整劑,並使其在230~280℃聚合反應。 Sodium sulfide and p-dichlorobenzene are reacted in a guanamine-based polar solvent such as N-methyl-2-pyrrolidone (NMP) under high temperature and high pressure. It is also possible to include a copolymerization component such as trihalogenated benzene as necessary. Potassium hydroxide or an alkali metal carboxylate or the like may be added as a polymerization degree adjuster, and it may be polymerized at 230 to 280 °C.
在聚合後將聚合物冷卻,以水將聚合物製成泥漿,並過濾器過濾後,得到粒狀聚合物。將其在醋酸鹽等的水溶液中並在30~100℃攪拌處理10~60分鐘,在30~80℃下以離子交換水洗淨數次並使其乾燥,而得到PPS粉末。將此粉末聚合物在氧氣分壓10torr以下,宜為5torr以下以NMP洗淨後,以30~80℃的離子交換水洗淨數次,在5torr以下的減壓下乾燥。以這些所得到的粉末聚合物實質上為線型PPS聚合物,因此可安定地延伸製膜。 After the polymerization, the polymer was cooled, the polymer was slurried with water, and filtered through a filter to obtain a particulate polymer. This is stirred in an aqueous solution of acetate or the like at 30 to 100 ° C for 10 to 60 minutes, washed with ion-exchanged water at 30 to 80 ° C several times, and dried to obtain a PPS powder. The powder polymer is washed with NMP at a partial pressure of oxygen of 10 torr or less, preferably 5 torr or less, and then washed with ion-exchanged water at 30 to 80 ° C for several times, and dried under reduced pressure of 5 torr or less. The powder polymer obtained by these is substantially a linear PPS polymer, and thus the film can be stably stretched.
將如上述方式所得到的聚伸苯基硫醚粉末與使粒子分散於液體中而成的泥漿混合,將該混合物供給至通氣擠出機,熔融混練,同時除去該液體,在聚伸苯基硫醚中分散有粒子。合適的分散方法是先使粒子在沸點為90~290℃的液體中微分散而製成泥漿(以下會有稱為粒子泥漿的情形)。此處宜因應必要藉由過濾或傾析器除去粗大粒子或微小粒子。該粒子的平均粒徑係以在粒子泥漿中0.5~3.0μm的範圍為佳,且從防止2次凝集的觀點看來,泥漿中的粒子濃度係以相對於粒子泥漿全體的重 量而言的80重量%以下為佳。該液體可列舉例如水、乙二醇、三乙二醇、NMP、二苯醚等,而以在該液體的沸點以上不會使聚伸苯基硫醚溶解的水、乙二醇、三乙二醇為佳。 The polyphenylene sulfide powder obtained as described above is mixed with a slurry obtained by dispersing particles in a liquid, and the mixture is supplied to a ventilating extruder, melt-kneaded, and the liquid is removed, and the phenyl group is dispersed. Particles are dispersed in the thioether. A suitable dispersion method is to first make the particles finely dispersed in a liquid having a boiling point of 90 to 290 ° C to form a slurry (hereinafter referred to as a particle slurry). It is desirable here to remove coarse or fine particles by filtration or decanter. The average particle diameter of the particles is preferably in the range of 0.5 to 3.0 μm in the particle slurry, and from the viewpoint of preventing secondary aggregation, the particle concentration in the slurry is based on the weight of the entire particle slurry. It is preferably 80% by weight or less in terms of the amount. The liquid may, for example, be water, ethylene glycol, triethylene glycol, NMP, diphenyl ether or the like, and water, ethylene glycol or triethyl glycol which does not dissolve the polyphenylene sulfide at a boiling point or higher of the liquid. A diol is preferred.
接下來,藉由將上述粒子泥漿混合至聚伸苯基硫醚粉末後,供給至具有通氣孔的擠出機之方法、或將聚伸苯基硫醚粉末供給至具有通氣孔的擠出機,在該聚合物熔融前或/及熔融中強制注入該粒子泥漿之方法等,混練粒子泥漿為熔融狀態的聚伸苯基硫醚,同時由通氣孔除去該液體成分,而藉此使粒子分散於聚伸苯基硫醚中。此處從分散性、液體成分的除去效率這點看來,該液體成分的比例係以相對於聚伸苯基硫醚粉末而言的30重量%以下為佳,20重量%以下為更佳。由擠出機吐出的腸線狀聚合物係藉由常法,在水浴等之中冷卻後切斷,而成為在聚合物中分散有粒子的顆粒(以下會有稱為粒子顆粒的情形)。 Next, by mixing the above-mentioned particle slurry to the polyphenylene sulfide powder, supplying it to an extruder having a vent hole, or supplying the polyphenylene sulfide powder to an extruder having a vent hole a method of forcibly injecting the particle slurry before or during melting of the polymer, and kneading the particle slurry into a polyphenylene sulfide in a molten state while removing the liquid component by a vent hole, thereby dispersing the particles In the polyphenylene sulfide. Here, from the viewpoint of dispersibility and removal efficiency of the liquid component, the ratio of the liquid component is preferably 30% by weight or less based on the polyphenylene sulfide powder, and more preferably 20% by weight or less. The gut-like polymer discharged from the extruder is cooled by a water bath or the like by a usual method, and is cut into particles in which particles are dispersed in the polymer (hereinafter referred to as particle particles).
另外,僅將(1)所得到的聚伸苯基硫醚粉末顆粒化(以下會有將此顆粒稱為無粒子顆粒的情形)製造薄膜時可與上述粒子顆粒混合使用。 Further, only the phenylene sulfide powder obtained in (1) is granulated (hereinafter, this granule is referred to as a non-particle granule). When a film is produced, it can be used in combination with the above particles.
使如上述方式所得到的粒子顆粒及/或無粒子顆粒在減壓下乾燥之後,將其投入擠出機的熔融部加熱至300~350℃的溫度,宜為310~340℃的擠出機。然後使經過擠出機的熔融聚合物通過過濾器,使用T模具的金屬嘴將此熔融聚合物吐出成為薄膜狀。此過濾器部分或金 屬嘴的設定溫度係以設定在高於擠出機熔融部的溫度3~20℃的溫度為佳,較佳為高出5~15℃度。使此薄膜狀物密合於表面溫度20~70℃的冷卻鼓上,並冷卻固化,而得到實質上為無配向狀態的未延伸薄膜。 After the particle particles and/or the non-particle particles obtained as described above are dried under reduced pressure, they are introduced into a melting portion of the extruder and heated to a temperature of 300 to 350 ° C, preferably an extruder of 310 to 340 ° C. . Then, the molten polymer passing through the extruder was passed through a filter, and the molten polymer was discharged into a film shape using a metal nozzle of a T die. This filter part or gold The set temperature of the nozzle is preferably set to a temperature of 3 to 20 ° C higher than the temperature of the melting portion of the extruder, preferably 5 to 15 ° C. The film was adhered to a cooling drum having a surface temperature of 20 to 70 ° C, and solidified by cooling to obtain an unstretched film having substantially no alignment.
接下來,對此未延伸薄膜實施雙軸延伸使其雙軸配向。延伸方法可採用逐次雙軸延伸法(將往長邊方向延伸之後,往寬度方向進行延伸的方法等的逐次往單一方向延伸加以組合的延伸法);同時雙軸延伸法(同時往長邊方向與寬度方向延伸的方法)、或可採用將該等加以組合的方法。此處以使用最初往長邊方向延伸,接下來往寬度方向延伸的逐次雙軸延伸法為例作說明。 Next, the unstretched film is biaxially stretched to have a biaxial alignment. The extension method may be a sequential biaxial stretching method (an extension method in which a method of extending in the longitudinal direction and extending in the width direction is sequentially extended in a single direction); and a biaxial stretching method (simultaneously toward the long side) A method of extending in the width direction) or a method of combining the same. Here, a sequential biaxial stretching method in which the first longitudinal direction is extended and then the width direction is extended will be described as an example.
將未延伸聚伸苯基硫醚薄膜以加熱輥筒組加熱之後,往長邊方向(MD方向)以2.5~4.5倍,宜為3.0~4.0倍,更佳為3.1~3.4倍並以1階段或2階段以上進行的多階段延伸(MD延伸)。在延伸倍率未滿2.5倍的情況下,在後續熱處理的過程會有薄膜的平面性顯著惡化的情形。延伸溫度係以70~130℃為佳,較佳為80~110℃。然後以20~50℃的冷卻輥筒組冷卻。 After the unstretched polyphenylene sulfide film is heated by the heating roller group, it is 2.5 to 4.5 times, preferably 3.0 to 4.0 times, more preferably 3.1 to 3.4 times, and 1 stage in the longitudinal direction (MD direction). Or multi-stage extension (MD extension) performed in 2 or more stages. In the case where the stretching ratio is less than 2.5 times, there is a case where the planarity of the film is remarkably deteriorated in the course of the subsequent heat treatment. The elongation temperature is preferably from 70 to 130 ° C, preferably from 80 to 110 ° C. It is then cooled by a cooling roller set of 20 to 50 °C.
在MD延伸之後,寬度方向(TD方向)的延伸方法一般而言為使用例如拉幅機的方法。以夾具將此薄膜的兩端部夾持住,並導引至拉幅機,進行寬度方向的延伸(TD延伸)。延伸溫度係以70~130℃為佳,較佳為80~110℃。延伸倍率為2.5~4.5倍,宜為3.0~4.0倍,更佳為3.1~3.4倍的範圍。 After the MD extension, the extension method in the width direction (TD direction) is generally a method using, for example, a tenter. The two ends of the film were clamped by a jig and guided to a tenter to extend in the width direction (TD extension). The elongation temperature is preferably from 70 to 130 ° C, preferably from 80 to 110 ° C. The stretching ratio is 2.5 to 4.5 times, preferably 3.0 to 4.0 times, and more preferably 3.1 to 3.4 times.
接下來,使此雙軸延伸薄膜在緊繃之下進行熱處理。熱處理溫度宜為160~280℃的範圍,且宜以1階段或2階段以上的多階段來進行。此時從熱的尺寸安定性這點看來,宜為在該熱處理溫度往薄膜寬度方向實施0~10%的範圍的弛緩處理。在進行第2階段熱處理的情況,將第1階段熱處理溫度設定在160~220℃的範圍,將第2階段熱處理溫度設定在230~280℃的範圍且高於第1階段的溫度,由於可提升薄膜的平面性或安定地製膜,故為適合。在熱處理後將薄膜冷卻至室溫。 Next, the biaxially stretched film is subjected to heat treatment under tension. The heat treatment temperature is preferably in the range of 160 to 280 ° C, and is preferably carried out in a plurality of stages of one stage or two stages or more. At this time, from the viewpoint of the dimensional stability of the heat, it is preferable to carry out the relaxation treatment in the range of 0 to 10% in the film width direction at the heat treatment temperature. In the case of the second-stage heat treatment, the first-stage heat treatment temperature is set in the range of 160 to 220 ° C, and the second-stage heat treatment temperature is set in the range of 230 to 280 ° C and higher than the temperature in the first stage. The film is suitable for film formation or stable film formation. The film was cooled to room temperature after heat treatment.
使用摩擦裝置對如上述方式所得到的雙軸配向聚伸苯基硫醚薄膜進行摩擦處理。摩擦裝置亦可使用周知者。其概要係藉由將纏繞了摩擦布的輥筒按壓在前述薄膜,並使輥筒旋轉,同時使其相對移動而進行摩擦。輥筒的旋轉方向係以順著所纏繞的摩擦布的植毛方向為佳,並且以往與薄膜移動方向相反方向旋轉為佳。此外,輥筒軸與前述薄膜的移動方向亦可以某個角度θ相接。摩擦的強度可依照轉速比、壓入量等適當地變更。轉速比是指將輥筒相對線速度除以薄膜相對移動速度而得之值,壓入量一般而言是指將摩擦布(輥筒)由薄膜表面與摩擦布表面相接的位置按壓進薄膜表面的長度。摩擦布的材料適合採用醋酸纖維素、綿、嫘縈、聚醯胺、丙烯酸、芳綸等。摩擦布的形態係以不織布、織布、絨織為佳。從提升生產性的觀點看來,摩擦方向宜為使摩擦輥筒的旋轉方向與薄膜的長邊方向(MD方向)平行。另外, 從防止塵埃等附著在薄膜的觀點看來,宜在摩擦後進行除靜電。如以上所述般,所得到的聚伸苯基硫醚薄膜適合使用作為脫模用薄膜。 The biaxially oriented polyphenylene sulfide film obtained as described above was subjected to a rubbing treatment using a rubbing device. The friction device can also be used by a well-known person. The outline is obtained by pressing a roller wound with a rubbing cloth against the film, and rotating the roller while relatively moving it to rub. The direction of rotation of the roller is preferably along the direction in which the rubbing cloth is wound, and it is preferable to rotate in the opposite direction to the moving direction of the film. Further, the direction of movement of the roller shaft and the film may be at a certain angle θ. The strength of the friction can be appropriately changed in accordance with the rotation speed ratio, the amount of pressing, and the like. The rotational speed ratio refers to the value obtained by dividing the relative linear velocity of the roller by the relative moving speed of the film. The pressing amount generally refers to pressing the rubbing cloth (roller) into the film from the position where the surface of the film meets the surface of the rubbing cloth. The length of the surface. The material of the rubbing cloth is suitable for cellulose acetate, cotton, ray, polyamide, acrylic, aramid and the like. The form of the rubbing cloth is preferably a non-woven fabric, a woven fabric, or a woven fabric. From the viewpoint of improving productivity, the rubbing direction is preferably such that the direction of rotation of the rubbing roller is parallel to the longitudinal direction (MD direction) of the film. In addition, From the viewpoint of preventing dust or the like from adhering to the film, it is preferable to perform static elimination after rubbing. As described above, the obtained polyphenylene sulfide film is suitably used as a film for mold release.
物性值的測定方法以及效果的評估方法如以下所述。 The method for measuring the physical property value and the method for evaluating the effect are as follows.
使用小坂研究所製SURF CORDER ET 4000A,依照下述條件求得表面中心面平均粗糙度(SRa)。 Using the SURF CORDER ET 4000A manufactured by Otaru Research Institute, the surface center plane average roughness (SRa) was obtained in accordance with the following conditions.
觸針曲率半徑:2μm Contact lens radius of curvature: 2μm
截止點:0.25mm Cut-off point: 0.25mm
測定長:0.5mm Measuring length: 0.5mm
測定間隔:5μm Measurement interval: 5μm
測定次數:80次。 Number of measurements: 80 times.
使用MTS Systems公司製的超微小硬度計「Nano Indenter DCM」,藉由奈米壓印法進行測定。使用鑽石製正三角錐壓頭進行壓入負荷/除荷測試,求得荷重-壓入深度線圖。此時,在最大荷重Pmax下的硬度H係藉由下述式計算。 The measurement was carried out by a nanoimprint method using a nanometer hardness tester "Nano Indenter DCM" manufactured by MTS Systems. The load-bearing/de-loading test was carried out using a diamond-shaped triangular pyramid indenter to obtain a load-pressing depth map. At this time, the hardness H at the maximum load Pmax is calculated by the following formula.
H=Pmax/A H=Pmax/A
上述式中的A為壓痕投影面積,是使用由荷重-壓入深度曲線圖計算出的有效接觸深度所算出之值。依照下述條件進行測定10次,求得壓入深度10nm時的硬度的平均值。 A in the above formula is the indentation projected area, which is a value calculated using the effective contact depth calculated from the load-press depth map. The measurement was carried out 10 times in accordance with the following conditions, and the average value of the hardness at a press-in depth of 10 nm was obtained.
測定裝置:MTS Systems公司製超微小硬度計Nano Indenter DCM Measuring device: Nano Indenter DCM made by MTS Systems
測定方法:奈米壓印法(連續剛性測定法) Determination method: nanoimprint method (continuous rigidity measurement method)
使用壓頭:鑽石製正三角錐壓頭 Using the indenter: a diamond-shaped triangular pyramid indenter
最大壓入深度:約3μm Maximum indentation depth: about 3μm
測定環境:25℃‧大氣中。 Measurement environment: 25 ° C ‧ atmosphere.
依照ASTM-D882所規定的方法,使用英斯特(Instron)型拉伸測試機,並依照下述條件測得。更換樣品並分別對薄膜的長邊方向及寬度方向進行測定10次,求得其平均值。 An Instron type tensile tester was used in accordance with the method specified in ASTM-D882 and measured according to the following conditions. The sample was changed and the longitudinal direction and the width direction of the film were measured 10 times, and the average value was obtained.
測定裝置:ORIENTEC股份有限公司製薄膜強伸度自動測定裝置“Tensilon AMF/RTA-100" Measuring device: "Tensilon AMF/RTA-100" automatic measuring device for film elongation of ORIENTEC Co., Ltd.
試樣尺寸:寬度10mm×測試長度100mm Sample size: width 10mm × test length 100mm
拉伸速度:300mm/分鐘 Stretching speed: 300mm/min
測定環境:25℃、65%RH。 Measurement environment: 25 ° C, 65% RH.
使用Dial Gauge厚度計(Mitutoyo公司製),10點測定,求得平均值。 The average value was determined by a 10-point measurement using a Dial Gauge thickness meter (manufactured by Mitutoyo Co., Ltd.).
將由碳纖維與環氧樹脂所構成並且切成29cm×29cm尺寸的預浸體(東麗製,產品型號:3252S-15)以兩枚切成30cm×30cm尺寸的試樣薄膜包夾住。此時進行積層以使經過摩擦處理的面與預浸體相接。藉由將金屬模具溫 度調整在200℃的壓延成型機(平板金屬模具)施加2MPa的壓力5分鐘,然後取出積層體,在室溫中充分冷卻之後,以手撕開預浸體與試樣薄膜。藉由以下基準判斷剝離時的脫模性。C為不合格。 A prepreg (made by Toray Industries, product model: 3252S-15) composed of carbon fiber and epoxy resin and cut into a size of 29 cm × 29 cm was sandwiched between two sample film sheets cut into a size of 30 cm × 30 cm. At this time, lamination is performed so that the rubbed surface is in contact with the prepreg. By warming the metal mold The calendering machine (plate metal mold) at 200 ° C was applied to apply a pressure of 2 MPa for 5 minutes, and then the laminate was taken out, and after sufficiently cooling at room temperature, the prepreg and the sample film were torn by hand. The release property at the time of peeling was judged by the following criteria. C is unqualified.
A:薄膜並未破裂,輕易由預浸體剝離 A: The film is not broken and is easily peeled off from the prepreg.
B:薄膜一部分破裂,而由預浸體剝離 B: Part of the film is broken and peeled off by the prepreg
C:牢固地密合,並未由預浸體剝離。 C: Firmly adhered and not peeled off from the prepreg.
製作出在中央部具有直徑5cm、高度7mm的正圓柱形的突起部,在沿著此突起部底部的圓周以等間隔在6處開有真空吸引用的排氣孔(孔徑1mm)的公型金屬模具(尺寸為15×25cm),並安裝於成光產業股份有限公司製的真空成型機(裝置名:Formech 300型)。將試樣薄膜切成A4尺寸並安裝於裝置,使用加熱至350℃的裝置所附屬的陶瓷加熱器將試樣薄膜預熱10秒鐘,然後將並未加熱的前述金屬模具按壓在試樣薄膜,在按壓之後透過排氣孔進行真空吸引30秒鐘而使薄膜成型。此時,因為試樣薄膜無法充分順從著金屬模具的突起形狀,因此以突起上端部為起始點傾斜地吸在金屬模具。關於此傾斜部的起點與終點(薄膜與突起部的接觸點,且為突起部底圓側的接觸點),在由突起部頂部的圓投影而成的平面上的兩點之間的直線距離(觀察到起點與終點大致為同心圓)以游標尺測定10點(由整個圓周均勻地取10點),將其平均值定為裾寬。藉由以下基準判斷成型時的成型性。C為不合格。 A projection having a right-cylindrical shape having a diameter of 5 cm and a height of 7 mm at the center portion was formed, and a vent hole for a vacuum suction (a hole diameter of 1 mm) was opened at six intervals along the circumference of the bottom portion of the projection portion. A metal mold (having a size of 15 × 25 cm) was attached to a vacuum forming machine (device name: Forchem 300 type) manufactured by Chengguang Industry Co., Ltd. The sample film was cut into an A4 size and mounted on a device, and the sample film was preheated for 10 seconds using a ceramic heater attached to a device heated to 350 ° C, and then the unheated metal mold was pressed against the sample film. After pressing, vacuum suction was performed through the vent hole for 30 seconds to form a film. At this time, since the sample film could not sufficiently conform to the protrusion shape of the metal mold, the metal mold was attracted obliquely with the upper end portion of the protrusion as a starting point. The linear distance between the two points on the plane projected by the circle at the top of the protrusion on the start point and the end point of the inclined portion (the contact point between the film and the protrusion and the contact point on the bottom side of the protrusion) (It is observed that the starting point and the ending point are approximately concentric circles.) 10 points are measured by a vernier scale (10 points are uniformly taken from the entire circumference), and the average value is defined as the width of the 裾. The moldability at the time of molding was judged by the following criteria. C is unqualified.
A:裾寬1cm以下 A: 裾 width is less than 1cm
B:裾寬為1cm以上2cm以下 B: 裾 width is 1cm or more and 2cm or less
C:裾寬為2cm以上。 C: The width of the crucible is 2 cm or more.
在高壓釜中裝入47%硫氫化鈉9.44kg(80莫耳)、96%氫氧化鈉3.43kg(82.4莫耳)、N-甲基-2-吡咯烷酮(NMP)13.0kg(131莫耳)、醋酸鈉2.86kg(34.9莫耳)、及離子交換水12kg,在常壓下使氮氣通過,同時花費約3小時徐緩加熱至235℃,將水17.0kg及NMP0.3kg(3.23莫耳)餾出之後,使反應容器冷卻至160℃。接下來,添加對二氯苯(p-DCB)11.5kg(78.4莫耳)、1,2,4-三氯苯0.007kg(0.04莫耳)、NMP22.2kg(223莫耳),在氮氣下將反應容器密封,以400rpm攪拌,同時以0.6℃/分鐘的速度由200℃升溫至270℃。在270℃下經過30分鐘後,花費10分鐘將水1.11kg(61.6莫耳)注入系統內,在270℃下再繼續反應100分鐘。然後,再度在系統內注入水1.60kg(88.8莫耳),冷卻至240℃之後,以0.4℃/分鐘的速度冷卻,冷卻至210℃,然後急冷至室溫附近。將內容物取出,以32升的NMP稀釋後,以篩網(80mesh)將溶劑與固體物過濾。再度將所得到的粒子以38升的NMP在85℃下洗淨。然後以67升的溫水洗淨5次並且過濾,以0.05重量%醋酸鈣水溶液70,000g洗淨5次並且過濾,而得到PPS聚合物粒子。使其在60℃下熱風乾燥,在120℃下減壓乾燥20小時,藉此得到白色聚伸苯基硫醚粉末。 The autoclave was charged with 47% sodium hydrogen sulfide (9.44 kg (80 mol), 96% sodium hydroxide 3.43 kg (82.4 mol), N-methyl-2-pyrrolidone (NMP) 13.0 kg (131 m). Sodium acetate 2.86kg (34.9 mol) and ion-exchanged water 12kg, nitrogen gas is passed under normal pressure, and it takes about 3 hours to slowly heat to 235 ° C, and water 17.0 kg and NMP 0.3 kg (3.23 mol) After the reaction, the reaction vessel was cooled to 160 °C. Next, add 11.5 kg (78.4 mol) of p-dichlorobenzene (p-DCB), 0.007 kg (0.04 mol) of 1,2,4-trichlorobenzene, and 22.2 kg (223 mol) of NMP under nitrogen. The reaction vessel was sealed and stirred at 400 rpm while raising the temperature from 200 ° C to 270 ° C at a rate of 0.6 ° C / minute. After 30 minutes at 270 ° C, 1.11 kg (61.6 mol) of water was injected into the system over 10 minutes, and the reaction was continued at 270 ° C for another 100 minutes. Then, 1.60 kg (88.8 mol) of water was again injected into the system, and after cooling to 240 ° C, it was cooled at a rate of 0.4 ° C / min, cooled to 210 ° C, and then quenched to near room temperature. The contents were taken out, diluted with 32 liters of NMP, and the solvent and solid were filtered through a sieve (80 mesh). The obtained particles were again washed with 38 liters of NMP at 85 °C. Then, it was washed 5 times with 67 liters of warm water and filtered, washed 5 times with 70,000 g of 0.05% by weight aqueous calcium acetate solution and filtered to obtain PPS polymer particles. It was dried by hot air at 60 ° C, and dried under reduced pressure at 120 ° C for 20 hours, whereby a white polyphenylene sulfide powder was obtained.
將(1)所得到的聚伸苯基硫醚粉末供給至具有30mm口徑的雙軸螺桿的通氣擠出機,並使其在溫度320℃下熔融。使此熔融物通過由金屬纖維所構成的95%截止且孔徑10μm的過濾器過濾之後,由孔徑2mm的模具擠出,而得到腸線狀樹脂組成物。進一步將該組成物裁成約3mm長,而得到聚伸苯基硫醚的無粒子顆粒。 The polyphenylene sulfide powder obtained in (1) was supplied to a ventilating extruder having a biaxial screw having a diameter of 30 mm, and was melted at a temperature of 320 °C. This melt was filtered through a 95% cut-off filter made of metal fibers and having a pore size of 10 μm, and then extruded through a die having a pore diameter of 2 mm to obtain a gut-like resin composition. Further, the composition was cut into a length of about 3 mm to obtain a particle-free particle of polyphenylene sulfide.
使平均粒徑1.2μm的碳酸鈣粒子分散於乙二醇50重量%而調製成泥漿。以過濾器將此泥漿過濾之後,使用亨舍爾(Henschle)混合機,混合至(1)所得到的聚合物。此時進行混合以使碳酸鈣的重量相對於(1)所得到的聚合物的重量成為20重量%。將所得到的混合物供給至具有30mm口徑的雙軸螺桿的通氣擠出機,在溫度320℃下熔融。使此熔融物通過由金屬纖維所構成,95%截止孔徑10μm的過濾器進行過濾之後,由孔徑2mm的模具擠出,而得到腸線狀樹脂組成物。進一步將該組成物裁成約3mm長,而得到粒子含量20重量%的粒子顆粒。 Calcium carbonate particles having an average particle diameter of 1.2 μm were dispersed in 50% by weight of ethylene glycol to prepare a slurry. After filtering the slurry with a filter, it was mixed with the obtained polymer (1) using a Henschle mixer. At this time, mixing was carried out so that the weight of calcium carbonate became 20 weight% with respect to the weight of the polymer obtained by (1). The obtained mixture was supplied to a ventilating extruder having a biaxial screw having a diameter of 30 mm, and melted at a temperature of 320 °C. This melt was filtered through a filter made of metal fibers and having a 95% cut-off pore diameter of 10 μm, and then extruded through a die having a pore diameter of 2 mm to obtain a gut-like resin composition. Further, the composition was cut into a length of about 3 mm to obtain particle particles having a particle content of 20% by weight.
將上述所得到的無粒子顆粒與粒子顆粒混合使碳酸鈣的含量成為相對於聚伸苯樹脂的重量而言0.5重量%之後,使用旋轉式真空乾燥機,使其在3mmHg的減壓並在溫度180℃下乾燥4小時。將所得到的乾燥晶片供給至熔融部加熱至310℃的全螺纹單軸擠出機,以溫度設定在320℃的過濾器過濾之後,由溫度設定在310℃的T 模具的金屬嘴熔融擠出,對表面溫度25℃的澆鑄鼓施加靜電荷,同時密合冷卻固化,而製作出未延伸薄膜。 The particle-free particles obtained above were mixed with the particle particles so that the content of calcium carbonate became 0.5% by weight based on the weight of the polyphenylene resin, and then the pressure was reduced at 3 mmHg and at a temperature using a rotary vacuum dryer. Dry at 180 ° C for 4 hours. The obtained dried wafer was supplied to a full-thread single-axis extruder heated to 310 ° C in the melting section, and filtered at a temperature of 320 ° C after the filter was set, and the temperature was set at 310 ° C. The metal nozzle of the mold was melt-extruded, and an electrostatic charge was applied to the casting drum having a surface temperature of 25 ° C while being tightly cooled and solidified to produce an unstretched film.
將此未延伸薄膜使用由加熱後的複數個輥筒組所構成的縱延伸機進行預熱後,利用輥筒的轉速差,在薄膜溫度101℃以3.5倍的倍率往薄膜的縱方向延伸。然後以夾具將此薄膜的兩端部夾持住,並導引至拉幅機,在延伸溫度101℃以延伸倍率3.7倍往薄膜的寬度方向進行延伸,接下來在溫度260℃下進行熱處理10秒鐘。熱處理之間,往薄膜寬度方向實施5%的弛緩處理。將薄膜冷卻至室溫之後,除去薄膜邊緣,而製作出厚度25μm的雙軸配向PPS薄膜。 This unstretched film was preheated by a longitudinal stretching machine composed of a plurality of heated roller groups, and then stretched in the longitudinal direction of the film at a film temperature of 101 ° C at a magnification of 3.5 times by the difference in rotation speed of the rolls. Then, the two ends of the film were clamped by a jig, and guided to a tenter, and extended at a stretching temperature of 101 ° C at a stretching ratio of 3.7 times in the width direction of the film, followed by heat treatment at a temperature of 260 ° C. Seconds. Between the heat treatments, a 5% relaxation treatment was performed in the film width direction. After the film was cooled to room temperature, the edge of the film was removed to prepare a biaxially oriented PPS film having a thickness of 25 μm.
將所製作出的薄膜的單面使用Newtom公司製的摩擦裝置均勻地摩擦。摩擦布採用嫘縈製的織布,以摩擦密度成為1000mm的條件進行摩擦。若測定摩擦面的中心面平均粗糙度及奈米壓印硬度,則如表1所述。使用此薄膜進行脫模性評估的結果,如表1所示般,表現出優異的脫模性。 One side of the produced film was uniformly rubbed using a friction device manufactured by Newtom. The rubbing cloth was made of a tanned woven fabric and rubbed under conditions of a friction density of 1000 mm. The center surface average roughness and the nanoimprint hardness of the friction surface were measured as described in Table 1. As a result of evaluation of mold release property using this film, as shown in Table 1, excellent mold release property was exhibited.
除了在實施例1中,將無粒子顆粒與粒子顆粒混合使碳酸鈣的含量成為相對於聚伸苯樹脂的重量而言的2.0重量%以外,以與實施例1同樣的方式製作出脫模用PPS薄膜。薄膜物性與脫模性如表1所述,雖然發生薄膜破裂,然而、密合的抵抗小,脫模性沒有問題。 In the same manner as in Example 1, except that the particle-free particles were mixed with the particles in the first embodiment, and the content of the calcium carbonate was 2.0% by weight based on the weight of the polyphenylene resin. PPS film. The physical properties and mold release properties of the film were as described in Table 1. Although film breakage occurred, the adhesion resistance was small, and the mold release property was not problematic.
除了在實施例1中,調節熔融擠出的擠出量及澆鑄鼓的速度,將未延伸薄膜的厚度定為25μm,然後,不對薄膜實施延伸,對其表面實施摩擦處理以外,以與實施例1同樣的方式製作出脫模用PPS薄膜。薄膜物性與脫模性如表1所述,表現出優異的脫模性。 Except that in Example 1, the amount of extrusion of the melt extrusion and the speed of the casting drum were adjusted, and the thickness of the unstretched film was set to 25 μm, and then, the film was not subjected to stretching, and the surface was subjected to rubbing treatment, in addition to the examples. 1 A PPS film for mold release was produced in the same manner. The physical properties and mold release properties of the film were as described in Table 1, and exhibited excellent mold release properties.
除了在實施例1中將縱延伸的延伸倍率定為3.2倍,將寬度方向的延伸倍率定為3.1倍,以第1階段190℃(5秒鐘),第2階段260℃(5秒鐘)的2階段來進行熱固定以外,以與實施例1同樣的方式製作出脫模用PPS薄膜。薄膜物性與脫模性如表1所述,表現出優異的脫模性。 Except that in Example 1, the stretching ratio of the longitudinal stretching was set to 3.2 times, the stretching ratio in the width direction was set to 3.1 times, the first stage was 190 ° C (5 seconds), and the second stage was 260 ° C (5 seconds). A PPS film for mold release was produced in the same manner as in Example 1 except that the heat setting was carried out in two stages. The physical properties and mold release properties of the film were as described in Table 1, and exhibited excellent mold release properties.
除了在實施例1中將縱延伸的延伸倍率定為4.1倍,將寬度方向延伸倍率定為4.0倍以外,以與實施例1同樣的方式製作出脫模用PPS薄膜。薄膜物性與脫模性如表1所述,表現出優異的脫模性。 A PPS film for mold release was produced in the same manner as in Example 1 except that the stretching ratio of the longitudinal stretching was 4.1 times and the stretching ratio in the width direction was 4.0 times. The physical properties and mold release properties of the film were as described in Table 1, and exhibited excellent mold release properties.
除了在實施例1中並未對薄膜實施摩擦處理以外,以與實施例1同樣的方式製作出脫模用PPS薄膜。薄膜物性與脫模性如表1所述,薄膜牢固地密合而無法剝離。 A PPS film for mold release was produced in the same manner as in Example 1 except that the film was not subjected to rubbing treatment in Example 1. The physical properties and mold release properties of the film were as described in Table 1, and the film was firmly adhered and could not be peeled off.
除了在實施例1中將摩擦時的壓入量定為0.1mm以外,以與實施例1同樣的方式製作出脫模用PPS薄膜。 薄膜物性與脫模性如表1所述,薄膜牢固地密合而無法剝離。 A PPS film for mold release was produced in the same manner as in Example 1 except that the amount of pressing at the time of rubbing was set to 0.1 mm in Example 1. The physical properties and mold release properties of the film were as described in Table 1, and the film was firmly adhered and could not be peeled off.
除了在實施例2中並未對薄膜實施摩擦處理以外,以與實施例2同樣的方式製作出脫模用PPS薄膜。薄膜物性與脫模性如表1所述,薄膜牢固地密合而無法剝離。 A PPS film for mold release was produced in the same manner as in Example 2 except that the film was not subjected to rubbing treatment in Example 2. The physical properties and mold release properties of the film were as described in Table 1, and the film was firmly adhered and could not be peeled off.
除了在實施例1中,將無粒子顆粒與粒子顆粒混合使碳酸鈣的含量成為5.0重量%以外,以與實施例1同樣的方式製作出脫模用PPS薄膜。薄膜物性與脫模性如表1所述,薄膜牢固地密合而無法剝離。 A PPS film for mold release was produced in the same manner as in Example 1 except that the non-particle particles and the particles were mixed to have a calcium carbonate content of 5.0% by weight. The physical properties and mold release properties of the film were as described in Table 1, and the film was firmly adhered and could not be peeled off.
本發明之脫模用聚伸芳基硫醚薄膜可使用作為一種脫模薄膜,其係用於在碳纖維-環氧樹脂預浸體的成型等的成型加工步驟之中,由金屬模具脫模順利進行。 The polyarylene sulfide film for mold release of the present invention can be used as a release film which is used for mold release from a metal mold in a molding process such as molding of a carbon fiber-epoxy prepreg. get on.
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| TW101128865A TW201313430A (en) | 2011-08-11 | 2012-08-10 | Polyarylene sulfide film for mold-release and method for preparing thermosetting resin molded body using the same |
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| JP (1) | JP6127514B2 (en) |
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| TWI644735B (en) * | 2015-11-30 | 2018-12-21 | 日商Towa股份有限公司 | Resin molding device, resin molding method, discharge mechanism, and discharge device |
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| KR102267680B1 (en) * | 2013-11-29 | 2021-06-22 | 에베 그룹 에. 탈너 게엠베하 | Mould with a mould pattern, and method for producing same |
| JP2017205902A (en) * | 2016-05-16 | 2017-11-24 | 三井化学東セロ株式会社 | Release film suitable for manufacture of multilayer printed wiring board |
| JPWO2020100916A1 (en) * | 2018-11-14 | 2021-09-30 | 株式会社ブリヂストン | Manufacturing method of reinforcing fiber composite resin |
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| JP2000034356A (en) * | 1998-07-17 | 2000-02-02 | Toray Ind Inc | Biaxially oriented polyphenylene sulfide film for releasing and production thereof |
| JP4946022B2 (en) * | 2005-12-06 | 2012-06-06 | 東レ株式会社 | Polyphenylene sulfide composite film |
| JP2008110549A (en) * | 2006-10-31 | 2008-05-15 | Toray Ind Inc | Polyphenylene sulfide composite film |
| CN102046349B (en) * | 2008-05-28 | 2013-09-18 | 株式会社吴羽 | Release film comprising polyphenylene sulfide resin and laminate |
| JP5526886B2 (en) * | 2009-03-16 | 2014-06-18 | 東レ株式会社 | Biaxially oriented polyarylene sulfide film for mold release |
-
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| TWI644735B (en) * | 2015-11-30 | 2018-12-21 | 日商Towa股份有限公司 | Resin molding device, resin molding method, discharge mechanism, and discharge device |
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| WO2013021816A1 (en) | 2013-02-14 |
| JPWO2013021816A1 (en) | 2015-03-05 |
| JP6127514B2 (en) | 2017-05-17 |
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