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TW201142516A - Resist underlayer film forming composition containing fullerene derivative - Google Patents

Resist underlayer film forming composition containing fullerene derivative Download PDF

Info

Publication number
TW201142516A
TW201142516A TW100106406A TW100106406A TW201142516A TW 201142516 A TW201142516 A TW 201142516A TW 100106406 A TW100106406 A TW 100106406A TW 100106406 A TW100106406 A TW 100106406A TW 201142516 A TW201142516 A TW 201142516A
Authority
TW
Taiwan
Prior art keywords
underlayer film
resist underlayer
resist
forming composition
film forming
Prior art date
Application number
TW100106406A
Other languages
English (en)
Chinese (zh)
Inventor
Tetsuya Shinjo
Keisuke Hashimoto
Hiroaki Okuyama
Yasushi Sakaida
Masakazu Kato
Original Assignee
Nissan Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Ind Ltd filed Critical Nissan Chemical Ind Ltd
Publication of TW201142516A publication Critical patent/TW201142516A/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
TW100106406A 2010-03-01 2011-02-25 Resist underlayer film forming composition containing fullerene derivative TW201142516A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010044100 2010-03-01

Publications (1)

Publication Number Publication Date
TW201142516A true TW201142516A (en) 2011-12-01

Family

ID=44542027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100106406A TW201142516A (en) 2010-03-01 2011-02-25 Resist underlayer film forming composition containing fullerene derivative

Country Status (3)

Country Link
JP (1) JP5757286B2 (fr)
TW (1) TW201142516A (fr)
WO (1) WO2011108365A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107407883A (zh) * 2015-03-11 2017-11-28 日产化学工业株式会社 抗蚀剂下层膜的形成方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107207259A (zh) * 2014-10-08 2017-09-26 亚历克斯·菲利普·格雷厄姆·罗宾逊 旋涂硬掩膜材料
KR102273332B1 (ko) 2015-03-31 2021-07-06 닛산 가가쿠 가부시키가이샤 양이온 중합성 레지스트 하층막 형성 조성물
KR102675775B1 (ko) 2016-12-27 2024-06-18 삼성전자주식회사 하드마스크 조성물, 이를 이용한 패턴의 형성방법 및 상기 하드마스크 조성물을 이용하여 형성된 하드마스크
US11674051B2 (en) 2017-09-13 2023-06-13 Nissan Chemical Corporation Stepped substrate coating composition containing compound having curable functional group
US20200379347A1 (en) * 2019-05-31 2020-12-03 Rohm And Haas Electronic Materials Llc Resist underlayer compositions and pattern formation methods using such compositions
JP7589693B2 (ja) 2019-09-17 2024-11-26 Jsr株式会社 組成物、レジスト下層膜、レジスト下層膜の形成方法、パターニングされた基板の製造方法及び化合物
JP7702974B2 (ja) 2020-12-28 2025-07-04 Jsr株式会社 半導体基板の製造方法及び組成物
JPWO2022191037A1 (fr) 2021-03-11 2022-09-15
KR20230157942A (ko) 2021-03-12 2023-11-17 제이에스알 가부시끼가이샤 반도체 기판의 제조 방법, 조성물, 중합체 및 중합체의제조 방법
US20240302747A1 (en) * 2021-03-16 2024-09-12 Nissan Chemical Corporation Naphthalene unit-containing resist underlayer film-forming composition
KR20240025531A (ko) 2021-06-24 2024-02-27 제이에스알 가부시끼가이샤 반도체 기판의 제조 방법 및 조성물
KR20250091207A (ko) 2022-10-18 2025-06-20 제이에스알 가부시키가이샤 반도체 기판의 제조 방법 및 조성물
KR20250129655A (ko) 2022-12-26 2025-08-29 제이에스알 가부시키가이샤 반도체 기판의 제조 방법, 조성물 및 중합체

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4134759B2 (ja) * 2003-03-04 2008-08-20 Jsr株式会社 反射防止膜形成組成物および反射防止膜
JP2005266798A (ja) * 2004-02-19 2005-09-29 Tokyo Ohka Kogyo Co Ltd フォトレジスト組成物およびレジストパターン形成方法
GB0420702D0 (en) * 2004-09-17 2004-10-20 Univ Birmingham Use of methanofullerene derivatives as resist materials and method for forming a resist layer
JP4496432B2 (ja) * 2005-02-18 2010-07-07 信越化学工業株式会社 フォトレジスト下層膜形成材料及びパターン形成方法
JP4434984B2 (ja) * 2005-02-18 2010-03-17 信越化学工業株式会社 パターン形成方法及びパターン形成材料
US8361694B2 (en) * 2007-04-06 2013-01-29 Nissan Chemical Industries, Ltd. Resist underlayer film forming composition
JP5068828B2 (ja) * 2010-01-19 2012-11-07 信越化学工業株式会社 レジスト下層膜形成用組成物、レジスト下層膜形成方法、及びパターン形成方法
JP5068831B2 (ja) * 2010-02-05 2012-11-07 信越化学工業株式会社 レジスト下層膜材料、レジスト下層膜形成方法、パターン形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107407883A (zh) * 2015-03-11 2017-11-28 日产化学工业株式会社 抗蚀剂下层膜的形成方法

Also Published As

Publication number Publication date
JPWO2011108365A1 (ja) 2013-06-24
JP5757286B2 (ja) 2015-07-29
WO2011108365A1 (fr) 2011-09-09

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