TW200923971A - Conductive films, conductive parts and manufacturing methods thereof - Google Patents
Conductive films, conductive parts and manufacturing methods thereof Download PDFInfo
- Publication number
- TW200923971A TW200923971A TW097134796A TW97134796A TW200923971A TW 200923971 A TW200923971 A TW 200923971A TW 097134796 A TW097134796 A TW 097134796A TW 97134796 A TW97134796 A TW 97134796A TW 200923971 A TW200923971 A TW 200923971A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive film
- conductive
- layer
- less
- film
- Prior art date
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- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007236948 | 2007-09-12 | ||
| JP2008076427 | 2008-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200923971A true TW200923971A (en) | 2009-06-01 |
Family
ID=40452066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097134796A TW200923971A (en) | 2007-09-12 | 2008-09-11 | Conductive films, conductive parts and manufacturing methods thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2009035059A1 (fr) |
| TW (1) | TW200923971A (fr) |
| WO (1) | WO2009035059A1 (fr) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102044309A (zh) * | 2009-10-21 | 2011-05-04 | 财团法人工业技术研究院 | 通过光能或热能成形的导电材料、导电材料的制备方法以及导电组合物 |
| CN104094365A (zh) * | 2012-02-16 | 2014-10-08 | 大仓工业株式会社 | 透明导电基材的制造方法和透明导电基材 |
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| JPWO2022210586A1 (fr) * | 2021-03-29 | 2022-10-06 | ||
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| JPH0693553B2 (ja) * | 1984-11-26 | 1994-11-16 | 日本精線株式会社 | 導電性複合体及びその製造方法 |
| JPWO2003068674A1 (ja) * | 2002-02-15 | 2005-06-02 | 独立行政法人科学技術振興機構 | 貴金属ナノワイヤー構造物とその製造方法 |
| EP1739692A4 (fr) * | 2004-04-20 | 2008-03-05 | Takiron Co | Produit moulé conducteur transparent à écran tactile et écran tactile |
| JP2006171336A (ja) * | 2004-12-15 | 2006-06-29 | Takiron Co Ltd | 画像表示用透明電極体および画像表示装置 |
| JP5546763B2 (ja) * | 2005-08-12 | 2014-07-09 | カンブリオス テクノロジーズ コーポレイション | ナノワイヤに基づく透明導電体 |
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2008
- 2008-09-11 WO PCT/JP2008/066467 patent/WO2009035059A1/fr not_active Ceased
- 2008-09-11 JP JP2009532227A patent/JPWO2009035059A1/ja active Pending
- 2008-09-11 TW TW097134796A patent/TW200923971A/zh unknown
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| US20170058418A1 (en) * | 2015-09-01 | 2017-03-02 | International Business Machines Corporation | Stabilization of Metallic Nanowire Meshes Via Encapsulation |
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| TWI677434B (zh) * | 2016-12-01 | 2019-11-21 | 日商昭和電工股份有限公司 | 透明導電基板及其製造方法 |
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| CN109923622A (zh) * | 2016-12-01 | 2019-06-21 | 昭和电工株式会社 | 透明导电基板和其制造方法 |
| US20220371310A1 (en) * | 2019-10-18 | 2022-11-24 | Showa Denko K.K. | Transparent conducting film laminate and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009035059A1 (fr) | 2009-03-19 |
| JPWO2009035059A1 (ja) | 2010-12-24 |
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