TW200907001A - Adhesive composition, adhesive sheet, adhesive sheet for optics and adhesive sheet for electromagnetic shielding - Google Patents
Adhesive composition, adhesive sheet, adhesive sheet for optics and adhesive sheet for electromagnetic shielding Download PDFInfo
- Publication number
- TW200907001A TW200907001A TW097112755A TW97112755A TW200907001A TW 200907001 A TW200907001 A TW 200907001A TW 097112755 A TW097112755 A TW 097112755A TW 97112755 A TW97112755 A TW 97112755A TW 200907001 A TW200907001 A TW 200907001A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- adhesive
- formula
- less
- substituent
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007102256 | 2007-04-09 | ||
| JP2007103383 | 2007-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200907001A true TW200907001A (en) | 2009-02-16 |
Family
ID=39863946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097112755A TW200907001A (en) | 2007-04-09 | 2008-04-09 | Adhesive composition, adhesive sheet, adhesive sheet for optics and adhesive sheet for electromagnetic shielding |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW200907001A (ja) |
| WO (1) | WO2008126849A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI632215B (zh) * | 2013-09-19 | 2018-08-11 | 東亞合成股份有限公司 | Active energy ray-curing adhesive composition |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5770413B2 (ja) * | 2008-12-25 | 2015-08-26 | チェイル インダストリーズ インコーポレイテッド | 粘着剤組成物およびこれを用いた光学部材 |
| KR101946695B1 (ko) * | 2013-11-22 | 2019-02-11 | 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 | 광학 필름용 점착제 조성물, 점착형 광학 필름 및 적층체 |
| CN105295759B (zh) * | 2015-10-14 | 2018-05-08 | 东莞市纳利光学材料有限公司 | 一种具有抗电磁波效果的oca光学胶膜及其制备方法 |
| CN105404039B (zh) * | 2015-12-23 | 2018-10-26 | 东莞市纳利光学材料有限公司 | 一种具有抗电磁波oca光学胶膜的液晶显示屏及其制备方法 |
| JP7496272B2 (ja) * | 2020-09-23 | 2024-06-06 | 綜研化学株式会社 | 加飾フィルム用粘着剤組成物およびその用途 |
| JP7669719B2 (ja) * | 2021-02-26 | 2025-04-30 | 王子ホールディングス株式会社 | 粘着シート、積層体並びに光学デバイス及び画像表示装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06108026A (ja) * | 1992-09-28 | 1994-04-19 | Nippon Synthetic Chem Ind Co Ltd:The | 偏光板用粘着剤 |
| JP3557429B2 (ja) * | 1995-02-06 | 2004-08-25 | 綜研化学株式会社 | 液晶素子用感圧接着剤および液晶素子 |
| JP3931266B2 (ja) * | 1998-07-31 | 2007-06-13 | 東亞合成株式会社 | 水性樹脂エマルションの製造方法 |
| JP2002338926A (ja) * | 2001-05-11 | 2002-11-27 | Sekisui Chem Co Ltd | アクリル系粘着剤組成物の製造方法、アクリル系粘着剤組成物及びアクリル系粘着シート |
| JP2003195776A (ja) * | 2001-12-28 | 2003-07-09 | Nitto Denko Corp | 表示装置用電磁波シールドフィルタ、プラズマディスプレイパネル用フィルタおよびプラズマディスプレイパネル表示装置 |
-
2008
- 2008-04-09 WO PCT/JP2008/056975 patent/WO2008126849A1/ja not_active Ceased
- 2008-04-09 TW TW097112755A patent/TW200907001A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI632215B (zh) * | 2013-09-19 | 2018-08-11 | 東亞合成股份有限公司 | Active energy ray-curing adhesive composition |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008126849A1 (ja) | 2008-10-23 |
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