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TW200907001A - Adhesive composition, adhesive sheet, adhesive sheet for optics and adhesive sheet for electromagnetic shielding - Google Patents

Adhesive composition, adhesive sheet, adhesive sheet for optics and adhesive sheet for electromagnetic shielding Download PDF

Info

Publication number
TW200907001A
TW200907001A TW097112755A TW97112755A TW200907001A TW 200907001 A TW200907001 A TW 200907001A TW 097112755 A TW097112755 A TW 097112755A TW 97112755 A TW97112755 A TW 97112755A TW 200907001 A TW200907001 A TW 200907001A
Authority
TW
Taiwan
Prior art keywords
group
adhesive
formula
less
substituent
Prior art date
Application number
TW097112755A
Other languages
English (en)
Chinese (zh)
Inventor
Chiharu Machiya
Masaru Takahashi
Hironobu Moriyama
Chihiro Kurokawa
Yoshio Omori
Original Assignee
Sony Chemical & Inf Device
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Inf Device filed Critical Sony Chemical & Inf Device
Publication of TW200907001A publication Critical patent/TW200907001A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/04Polymers provided for in subclasses C08C or C08F
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW097112755A 2007-04-09 2008-04-09 Adhesive composition, adhesive sheet, adhesive sheet for optics and adhesive sheet for electromagnetic shielding TW200907001A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007102256 2007-04-09
JP2007103383 2007-04-11

Publications (1)

Publication Number Publication Date
TW200907001A true TW200907001A (en) 2009-02-16

Family

ID=39863946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112755A TW200907001A (en) 2007-04-09 2008-04-09 Adhesive composition, adhesive sheet, adhesive sheet for optics and adhesive sheet for electromagnetic shielding

Country Status (2)

Country Link
TW (1) TW200907001A (ja)
WO (1) WO2008126849A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI632215B (zh) * 2013-09-19 2018-08-11 東亞合成股份有限公司 Active energy ray-curing adhesive composition

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5770413B2 (ja) * 2008-12-25 2015-08-26 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物およびこれを用いた光学部材
KR101946695B1 (ko) * 2013-11-22 2019-02-11 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 광학 필름용 점착제 조성물, 점착형 광학 필름 및 적층체
CN105295759B (zh) * 2015-10-14 2018-05-08 东莞市纳利光学材料有限公司 一种具有抗电磁波效果的oca光学胶膜及其制备方法
CN105404039B (zh) * 2015-12-23 2018-10-26 东莞市纳利光学材料有限公司 一种具有抗电磁波oca光学胶膜的液晶显示屏及其制备方法
JP7496272B2 (ja) * 2020-09-23 2024-06-06 綜研化学株式会社 加飾フィルム用粘着剤組成物およびその用途
JP7669719B2 (ja) * 2021-02-26 2025-04-30 王子ホールディングス株式会社 粘着シート、積層体並びに光学デバイス及び画像表示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06108026A (ja) * 1992-09-28 1994-04-19 Nippon Synthetic Chem Ind Co Ltd:The 偏光板用粘着剤
JP3557429B2 (ja) * 1995-02-06 2004-08-25 綜研化学株式会社 液晶素子用感圧接着剤および液晶素子
JP3931266B2 (ja) * 1998-07-31 2007-06-13 東亞合成株式会社 水性樹脂エマルションの製造方法
JP2002338926A (ja) * 2001-05-11 2002-11-27 Sekisui Chem Co Ltd アクリル系粘着剤組成物の製造方法、アクリル系粘着剤組成物及びアクリル系粘着シート
JP2003195776A (ja) * 2001-12-28 2003-07-09 Nitto Denko Corp 表示装置用電磁波シールドフィルタ、プラズマディスプレイパネル用フィルタおよびプラズマディスプレイパネル表示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI632215B (zh) * 2013-09-19 2018-08-11 東亞合成股份有限公司 Active energy ray-curing adhesive composition

Also Published As

Publication number Publication date
WO2008126849A1 (ja) 2008-10-23

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