TW200905785A - Precision positioning apparatus - Google Patents
Precision positioning apparatus Download PDFInfo
- Publication number
- TW200905785A TW200905785A TW97107493A TW97107493A TW200905785A TW 200905785 A TW200905785 A TW 200905785A TW 97107493 A TW97107493 A TW 97107493A TW 97107493 A TW97107493 A TW 97107493A TW 200905785 A TW200905785 A TW 200905785A
- Authority
- TW
- Taiwan
- Prior art keywords
- mobile station
- actuators
- precision positioning
- positioning device
- actuator
- Prior art date
Links
- 238000001816 cooling Methods 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 230000005484 gravity Effects 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Machine Tool Units (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007055505 | 2007-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200905785A true TW200905785A (en) | 2009-02-01 |
Family
ID=39738045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97107493A TW200905785A (en) | 2007-03-06 | 2008-03-04 | Precision positioning apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5170077B2 (fr) |
| TW (1) | TW200905785A (fr) |
| WO (1) | WO2008108148A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110554575A (zh) * | 2018-05-30 | 2019-12-10 | 佳能株式会社 | 基板保持装置、曝光装置以及物品的制造方法 |
| TWI699608B (zh) * | 2019-03-15 | 2020-07-21 | 日月光半導體製造股份有限公司 | 用於組裝光學裝置之設備 |
| CN113917797A (zh) * | 2021-09-22 | 2022-01-11 | 哈尔滨工业大学 | 一种基于六自由度控制的运动台及其控制方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101060865B1 (ko) | 2009-09-21 | 2011-08-31 | 주식회사 포스코 | 하이드로 포밍 장치 |
| JP5714480B2 (ja) * | 2011-12-27 | 2015-05-07 | 住友重機械工業株式会社 | 位置決め装置 |
| CN103376667B (zh) * | 2012-04-20 | 2015-08-26 | 上海微电子装备有限公司 | 一种用于曝光装置的掩模台 |
| NL2010679A (en) * | 2012-05-23 | 2013-11-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| CN110962064B (zh) * | 2019-12-09 | 2024-08-27 | 格力电器(郑州)有限公司 | 一种阻挡定位装置 |
| CN113752707A (zh) * | 2020-06-01 | 2021-12-07 | 追极智能(北京)科技有限公司 | 一种打印装置及贩卖机 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0413533A (ja) * | 1990-05-02 | 1992-01-17 | Toshiba Corp | テーブル装置 |
| JPH05149968A (ja) * | 1991-11-27 | 1993-06-15 | Mitsubishi Electric Corp | 半導体センサ |
| JP3679509B2 (ja) * | 1996-06-18 | 2005-08-03 | キヤノン株式会社 | 移動ステージ装置およびこれを用いた露光装置 |
| JP2002203766A (ja) * | 2000-12-27 | 2002-07-19 | Nikon Corp | 照明光学装置及びそれを備える露光装置 |
| JP2004342987A (ja) * | 2003-05-19 | 2004-12-02 | Canon Inc | ステージ装置 |
| JP2005101136A (ja) * | 2003-09-24 | 2005-04-14 | Nikon Corp | ステージ装置及び露光装置 |
| JP4948763B2 (ja) * | 2003-12-24 | 2012-06-06 | 株式会社サイレンス | ダンピングコイルばね及び振動減衰装置 |
| JP4868113B2 (ja) * | 2005-06-27 | 2012-02-01 | 株式会社ニコン | 支持装置、ステージ装置及び露光装置 |
| JP2007010529A (ja) * | 2005-06-30 | 2007-01-18 | Nikon Corp | 計測方法、計測装置、干渉計システム及び露光装置 |
| JP2007019225A (ja) * | 2005-07-07 | 2007-01-25 | Nikon Corp | 位置計測装置の反射部材構造及びステージ装置並びに露光装置 |
-
2008
- 2008-02-15 WO PCT/JP2008/052491 patent/WO2008108148A1/fr not_active Ceased
- 2008-02-15 JP JP2009502494A patent/JP5170077B2/ja not_active Expired - Fee Related
- 2008-03-04 TW TW97107493A patent/TW200905785A/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110554575A (zh) * | 2018-05-30 | 2019-12-10 | 佳能株式会社 | 基板保持装置、曝光装置以及物品的制造方法 |
| CN110554575B (zh) * | 2018-05-30 | 2022-09-20 | 佳能株式会社 | 基板保持装置、曝光装置以及物品的制造方法 |
| TWI699608B (zh) * | 2019-03-15 | 2020-07-21 | 日月光半導體製造股份有限公司 | 用於組裝光學裝置之設備 |
| CN113917797A (zh) * | 2021-09-22 | 2022-01-11 | 哈尔滨工业大学 | 一种基于六自由度控制的运动台及其控制方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008108148A1 (fr) | 2008-09-12 |
| JP5170077B2 (ja) | 2013-03-27 |
| JPWO2008108148A1 (ja) | 2010-06-10 |
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