[go: up one dir, main page]

TW200845442A - Semiconductor apparatus and method for manufacturing the same and magnetic memory device - Google Patents

Semiconductor apparatus and method for manufacturing the same and magnetic memory device Download PDF

Info

Publication number
TW200845442A
TW200845442A TW097107012A TW97107012A TW200845442A TW 200845442 A TW200845442 A TW 200845442A TW 097107012 A TW097107012 A TW 097107012A TW 97107012 A TW97107012 A TW 97107012A TW 200845442 A TW200845442 A TW 200845442A
Authority
TW
Taiwan
Prior art keywords
magnetic
layer
memory element
magnetic memory
semiconductor device
Prior art date
Application number
TW097107012A
Other languages
English (en)
Chinese (zh)
Inventor
Tsuyoshi Koga
Shuichi Ueno
Hideto Hidaka
Tomoya Kawagoe
Original Assignee
Renesas Tech Corp
Grandis Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp, Grandis Inc filed Critical Renesas Tech Corp
Publication of TW200845442A publication Critical patent/TW200845442A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1659Cell access
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1675Writing or programming circuits or methods
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/10Magnetoresistive devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Semiconductor Memories (AREA)
TW097107012A 2007-03-02 2008-02-29 Semiconductor apparatus and method for manufacturing the same and magnetic memory device TW200845442A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007052952A JP2008218649A (ja) 2007-03-02 2007-03-02 半導体装置およびその製造方法ならびに磁気メモリ素子

Publications (1)

Publication Number Publication Date
TW200845442A true TW200845442A (en) 2008-11-16

Family

ID=39738147

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097107012A TW200845442A (en) 2007-03-02 2008-02-29 Semiconductor apparatus and method for manufacturing the same and magnetic memory device

Country Status (3)

Country Link
JP (1) JP2008218649A (ja)
TW (1) TW200845442A (ja)
WO (1) WO2008108264A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5488833B2 (ja) * 2008-03-07 2014-05-14 日本電気株式会社 Mram混載システム
US8719610B2 (en) 2008-09-23 2014-05-06 Qualcomm Incorporated Low power electronic system architecture using non-volatile magnetic memory
US7876603B2 (en) * 2008-09-30 2011-01-25 Micron Technology, Inc. Spin current generator for STT-MRAM or other spintronics applications
JP5703041B2 (ja) 2011-01-27 2015-04-15 ルネサスエレクトロニクス株式会社 半導体装置
JP2014112691A (ja) * 2013-12-26 2014-06-19 Renesas Electronics Corp 半導体装置の製造方法
JP6829172B2 (ja) 2017-09-20 2021-02-10 キオクシア株式会社 半導体記憶装置
US12207477B2 (en) * 2021-03-18 2025-01-21 International Business Machines Corporation Same level MRAM stacks having different configurations

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004023062A (ja) * 2002-06-20 2004-01-22 Nec Electronics Corp 半導体装置とその製造方法
JP4341355B2 (ja) * 2003-09-24 2009-10-07 ソニー株式会社 磁気記憶装置、磁気記憶装置の書き込み方法および磁気記憶装置の製造方法
JP2005277147A (ja) * 2004-03-25 2005-10-06 Tohoku Univ 磁気記録素子の記録方法及び磁気記録素子アレイ
JP4095597B2 (ja) * 2004-09-09 2008-06-04 株式会社東芝 磁気ランダムアクセスメモリ

Also Published As

Publication number Publication date
WO2008108264A1 (ja) 2008-09-12
JP2008218649A (ja) 2008-09-18

Similar Documents

Publication Publication Date Title
CN110957420B (zh) 磁性随机存取记忆体辅助的非挥发性装置和其制造方法
US10068946B2 (en) Magnetic memory
CN111261771B (zh) 包括自旋轨道转矩线的半导体器件
KR102283330B1 (ko) 반도체 소자
US9660183B2 (en) Integration of spintronic devices with memory device
KR102499931B1 (ko) 반도체 mram 디바이스 및 방법
JP5575745B2 (ja) 磁気抵抗ランダムアクセスメモリ(MagnetoresistiveRandomAccessMemory:MRAM)ビットセルのアレイ・ストラクチャル・デザイン(arraystructuraldesign)
US9373782B2 (en) MTJ structure and integration scheme
EP2392029B1 (en) Magnetic tunnel junction comprising a tunnel barrier, pinned layer and top electrode formed in a damascene-type process
US8508979B2 (en) Magnetic recording element and nonvolatile memory device
TW202203221A (zh) 磁記憶體裝置及其製造方法
EP2332145B1 (en) Symmetric stt-mram bit cell design
TW200845442A (en) Semiconductor apparatus and method for manufacturing the same and magnetic memory device
CN107924992B (zh) 应变垂直磁隧道结器件
US8198102B2 (en) Methods of fabricating magnetic memory devices with thin conductive bridges
TW201438301A (zh) 電場加強之自旋轉移力矩記憶體裝置
CN109004086A (zh) 半导体封装
CN1713299A (zh) 磁性存储单元以及制造磁性存储单元的方法
TW202147650A (zh) 磁性記憶體裝置
US12315541B2 (en) Magnetoresistive memory device and manufacturing method thereof
US10388852B2 (en) Magnetic tunnel junction element
CN110323247A (zh) Mram器件及其制造方法及包括mram的电子设备
JP2012009535A (ja) 磁壁移動素子及びその製造方法
KR100481876B1 (ko) 자기 터널 접합을 구비하는 자기 메모리 및 그 제조 방법
US9035402B2 (en) Semiconductor memory device