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TW200809227A - Board inspecting method and board inspecting device - Google Patents

Board inspecting method and board inspecting device Download PDF

Info

Publication number
TW200809227A
TW200809227A TW096121866A TW96121866A TW200809227A TW 200809227 A TW200809227 A TW 200809227A TW 096121866 A TW096121866 A TW 096121866A TW 96121866 A TW96121866 A TW 96121866A TW 200809227 A TW200809227 A TW 200809227A
Authority
TW
Taiwan
Prior art keywords
terminals
inspection
contact
terminal
substrate
Prior art date
Application number
TW096121866A
Other languages
English (en)
Chinese (zh)
Inventor
Munehiro Yamashita
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW200809227A publication Critical patent/TW200809227A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07385—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
TW096121866A 2006-06-29 2007-06-15 Board inspecting method and board inspecting device TW200809227A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006179826A JP2008008773A (ja) 2006-06-29 2006-06-29 基板検査方法及び基板検査装置

Publications (1)

Publication Number Publication Date
TW200809227A true TW200809227A (en) 2008-02-16

Family

ID=38845419

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096121866A TW200809227A (en) 2006-06-29 2007-06-15 Board inspecting method and board inspecting device

Country Status (4)

Country Link
JP (1) JP2008008773A (fr)
KR (1) KR20090031663A (fr)
TW (1) TW200809227A (fr)
WO (1) WO2008001651A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404949B (zh) * 2009-10-21 2013-08-11 Nidec Read Corp 檢查用治具之維修方法及基板檢查裝置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5260163B2 (ja) * 2008-07-02 2013-08-14 日置電機株式会社 測定装置および測定方法
JP5260164B2 (ja) * 2008-07-04 2013-08-14 日置電機株式会社 測定装置および測定方法
CN112689769B (zh) * 2018-09-14 2025-03-04 日本电产理德股份有限公司 检查指示信息产生装置与方法、基板检查系统及存储介质
TWI834728B (zh) * 2018-11-09 2024-03-11 日商日本電產理德股份有限公司 檢查指示資訊產生裝置、基板檢查系統、檢查指示資訊產生方法以及檢查指示資訊產生程式

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419574A (ja) * 1990-05-14 1992-01-23 Fujitsu Ltd プリント配線板の検査治具
JPH0666832A (ja) * 1992-08-24 1994-03-11 Hitachi Ltd プローブ及び検査装置
JP3191467B2 (ja) * 1993-01-12 2001-07-23 松下電器産業株式会社 プリント基板検査データ作成方法
JPH07191076A (ja) * 1993-12-27 1995-07-28 Fujitsu Ltd 印刷配線板試験装置
JP4544810B2 (ja) * 2002-04-23 2010-09-15 日本特殊陶業株式会社 基板製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404949B (zh) * 2009-10-21 2013-08-11 Nidec Read Corp 檢查用治具之維修方法及基板檢查裝置

Also Published As

Publication number Publication date
JP2008008773A (ja) 2008-01-17
WO2008001651A1 (fr) 2008-01-03
KR20090031663A (ko) 2009-03-27

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