TW200716657A - Novel organic silane compound - Google Patents
Novel organic silane compoundInfo
- Publication number
- TW200716657A TW200716657A TW095138680A TW95138680A TW200716657A TW 200716657 A TW200716657 A TW 200716657A TW 095138680 A TW095138680 A TW 095138680A TW 95138680 A TW95138680 A TW 95138680A TW 200716657 A TW200716657 A TW 200716657A
- Authority
- TW
- Taiwan
- Prior art keywords
- silane compound
- organic silane
- novel organic
- improving
- adhesion
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5475—Silicon-containing compounds containing nitrogen containing at least one C≡N bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Polarising Elements (AREA)
Abstract
The present invention relates to a novel organic silane compound, and more particularly, to a novel organic silane compound, useful in various applications, for the purpose of improving the affinity of an organic resin to an inorganic filler or improving the adhesion of a coating layer comprising matrix resin to a substrate. It is particularly useful for improving the adhesion of a polarizing plate adhesive for a liquid crystal display to a glass substrate, with little change over time even under hot and humid conditions.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20050099190 | 2005-10-20 | ||
| KR1020050127182A KR100822142B1 (en) | 2005-10-20 | 2005-12-21 | Novel Organic Silane Compounds |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200716657A true TW200716657A (en) | 2007-05-01 |
| TWI304405B TWI304405B (en) | 2008-12-21 |
Family
ID=38178026
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095138682A TWI324627B (en) | 2005-10-20 | 2006-10-20 | Pressure-sensitive adhesive composition |
| TW095138680A TWI304405B (en) | 2005-10-20 | 2006-10-20 | Novel organic silane compound |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095138682A TWI324627B (en) | 2005-10-20 | 2006-10-20 | Pressure-sensitive adhesive composition |
Country Status (6)
| Country | Link |
|---|---|
| JP (2) | JP4819128B2 (en) |
| KR (2) | KR100840114B1 (en) |
| CN (2) | CN101291941B (en) |
| AT (1) | ATE501228T1 (en) |
| DE (1) | DE602006020608D1 (en) |
| TW (2) | TWI324627B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI381196B (en) * | 2007-09-28 | 2013-01-01 | Nitto Denko Corp | A polarizing plate, a method for manufacturing the same, an optical film, and an image display device |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100840114B1 (en) * | 2005-10-20 | 2008-06-19 | 주식회사 엘지화학 | Pressure-sensitive adhesive composition |
| KR101042214B1 (en) * | 2009-04-09 | 2011-06-20 | 주식회사 엘지화학 | An alignment film composition, an alignment film prepared therefrom, a method for manufacturing an alignment film, an optical film comprising the same, and a display device including the optical film |
| KR101628091B1 (en) * | 2010-02-02 | 2016-06-08 | 동우 화인켐 주식회사 | Adhesive composition and polarizing plate comprising the same |
| CN103229080B (en) * | 2010-12-27 | 2015-11-25 | 三菱树脂株式会社 | Mold release film |
| KR101435252B1 (en) * | 2012-03-30 | 2014-08-28 | 주식회사 엘지화학 | Pressure sensitive adhesive tape |
| KR101466230B1 (en) * | 2013-06-14 | 2014-11-28 | 주식회사 연우 | Removable adhesive composition, method for preparing thereof, adhesive film comprising removable adhesive composition and method for manufacturing thereof |
| KR101391297B1 (en) | 2013-07-22 | 2014-05-02 | 동우 화인켐 주식회사 | Adhesive composition |
| CN106103573B (en) | 2014-02-26 | 2019-06-11 | Lg化学株式会社 | Encapsulant for photovoltaic modules, method of making the same, and photovoltaic modules comprising the encapsulant |
| JPWO2016152275A1 (en) * | 2015-03-24 | 2018-01-25 | 綜研化学株式会社 | Polarizing plate with pressure-sensitive adhesive layer and method for producing the same |
| CN105838294B (en) * | 2016-05-30 | 2018-09-11 | 成都市惠家胶粘制品有限公司 | The preparation process of high temperature resistant line paper self-adhesive tape |
| KR102335316B1 (en) * | 2017-12-27 | 2021-12-06 | 주식회사 엘지화학 | Adhesive composition and protection film using the same |
| KR102238704B1 (en) * | 2018-12-21 | 2021-04-08 | 주식회사 엘지화학 | Cross-linking agent compound, photosensitive composition comprising the same, and photosensitive material using the same |
| KR102751207B1 (en) * | 2020-01-14 | 2025-01-10 | 주식회사 엘지화학 | Adhesive resin composition for semiconductor, adhesive film for semiconductor and semiconductor package using the same |
| CN120005563A (en) * | 2024-12-31 | 2025-05-16 | 广东施奈仕实业有限公司 | A kind of anti-precipitation thermal conductive potting glue and preparation method thereof |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2019669A1 (en) | 1989-11-21 | 1991-05-21 | John Woods | Anionically polymerizable monomers, polymers thereof, and use of such polymers in photoresists |
| EP0459617A1 (en) | 1990-04-27 | 1991-12-04 | Three Bond Co., Ltd. | Novel silicon containing alpha-cyanoacrylates |
| JP2652093B2 (en) * | 1991-09-12 | 1997-09-10 | 富士写真フイルム株式会社 | Photosensitive composition |
| US5232982A (en) * | 1992-04-07 | 1993-08-03 | General Electric Company | One component room temperature vulcanizing silicone elastomer with improved primerless adhesion to polycarbonate |
| JPH0980230A (en) * | 1995-09-13 | 1997-03-28 | Sekisui Chem Co Ltd | Polarizing plate fixing structure |
| JPH1046125A (en) | 1996-08-01 | 1998-02-17 | Nippon Synthetic Chem Ind Co Ltd:The | Adhesive composition |
| JPH10130612A (en) * | 1996-10-30 | 1998-05-19 | Nippon Synthetic Chem Ind Co Ltd:The | Adhesive composition |
| JPH11131033A (en) | 1997-08-28 | 1999-05-18 | Lintec Corp | Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet using the same |
| JP2001181358A (en) * | 1999-12-28 | 2001-07-03 | Hitachi Chem Co Ltd | Resin paste composition and semiconductor device using the same |
| DE60210058T2 (en) * | 2001-03-02 | 2006-11-09 | F. Hoffmann-La Roche Ag | ALKOXYCARBONYLAMINO-HETEROARYL CARBOXYLENE DERIVATIVES AS IP ANTAGONISTS |
| JP2003337202A (en) * | 2002-05-21 | 2003-11-28 | Konica Minolta Holdings Inc | Antireflection film and method of manufacturing display device and optical film having the same |
| JP5058428B2 (en) * | 2003-01-15 | 2012-10-24 | 日立化成工業株式会社 | Adhesive sheet, semiconductor device and manufacturing method thereof |
| JP2004323543A (en) * | 2003-04-21 | 2004-11-18 | Nitto Denko Corp | Pressure-sensitive adhesive composition for optical members, pressure-sensitive adhesive layer for optical members, pressure-sensitive optical member, and image display device |
| JP2005213341A (en) | 2004-01-29 | 2005-08-11 | Lintec Corp | Pressure sensitive adhesive composition and pressure sensitive adhesive optical member |
| JP4345927B2 (en) * | 2004-02-25 | 2009-10-14 | 日東電工株式会社 | Optical member with adhesive, method for producing the same, and image display device |
| JP2005281460A (en) * | 2004-03-29 | 2005-10-13 | Panac Co Ltd | Adhesive and adhesive film with excellent reworkability |
| KR100840114B1 (en) * | 2005-10-20 | 2008-06-19 | 주식회사 엘지화학 | Pressure-sensitive adhesive composition |
-
2005
- 2005-12-21 KR KR1020050127183A patent/KR100840114B1/en not_active Expired - Fee Related
- 2005-12-21 KR KR1020050127182A patent/KR100822142B1/en not_active Expired - Fee Related
-
2006
- 2006-10-19 CN CN200680039148XA patent/CN101291941B/en not_active Expired - Fee Related
- 2006-10-19 AT AT06799339T patent/ATE501228T1/en not_active IP Right Cessation
- 2006-10-19 DE DE602006020608T patent/DE602006020608D1/en active Active
- 2006-10-19 CN CN2006800391901A patent/CN101292007B/en not_active Expired - Fee Related
- 2006-10-19 JP JP2008536498A patent/JP4819128B2/en not_active Expired - Fee Related
- 2006-10-19 JP JP2008536497A patent/JP4927856B2/en not_active Expired - Fee Related
- 2006-10-20 TW TW095138682A patent/TWI324627B/en not_active IP Right Cessation
- 2006-10-20 TW TW095138680A patent/TWI304405B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI381196B (en) * | 2007-09-28 | 2013-01-01 | Nitto Denko Corp | A polarizing plate, a method for manufacturing the same, an optical film, and an image display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101291941B (en) | 2011-08-17 |
| KR100822142B1 (en) | 2008-04-14 |
| JP2009512753A (en) | 2009-03-26 |
| DE602006020608D1 (en) | 2011-04-21 |
| KR100840114B1 (en) | 2008-06-19 |
| CN101291941A (en) | 2008-10-22 |
| TWI304405B (en) | 2008-12-21 |
| CN101292007A (en) | 2008-10-22 |
| CN101292007B (en) | 2012-07-25 |
| ATE501228T1 (en) | 2011-03-15 |
| JP4927856B2 (en) | 2012-05-09 |
| JP4819128B2 (en) | 2011-11-24 |
| TWI324627B (en) | 2010-05-11 |
| JP2009512683A (en) | 2009-03-26 |
| KR20070043557A (en) | 2007-04-25 |
| KR20070043558A (en) | 2007-04-25 |
| TW200716718A (en) | 2007-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |