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TW200702501A - Electronic component and the process for depositing the same - Google Patents

Electronic component and the process for depositing the same

Info

Publication number
TW200702501A
TW200702501A TW094122962A TW94122962A TW200702501A TW 200702501 A TW200702501 A TW 200702501A TW 094122962 A TW094122962 A TW 094122962A TW 94122962 A TW94122962 A TW 94122962A TW 200702501 A TW200702501 A TW 200702501A
Authority
TW
Taiwan
Prior art keywords
electronic component
deposit layer
rich
electric connection
rich deposit
Prior art date
Application number
TW094122962A
Other languages
English (en)
Inventor
Cheng-Fu Yu
Chia-Chun Chen
Pascal Oberndorff
Ker-Chang Hsieh
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200702501A publication Critical patent/TW200702501A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW094122962A 2004-07-07 2005-07-06 Electronic component and the process for depositing the same TW200702501A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200410063715.8A CN1718867A (zh) 2004-07-07 2004-07-07 电子元件及其电镀方法

Publications (1)

Publication Number Publication Date
TW200702501A true TW200702501A (en) 2007-01-16

Family

ID=34972812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094122962A TW200702501A (en) 2004-07-07 2005-07-06 Electronic component and the process for depositing the same

Country Status (6)

Country Link
US (1) US8603643B2 (zh)
EP (1) EP1774065A1 (zh)
JP (1) JP2008506038A (zh)
CN (2) CN1718867A (zh)
TW (1) TW200702501A (zh)
WO (1) WO2006006114A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI487000B (zh) * 2007-08-10 2015-06-01 Quantum Global Tech Llc 電子裝置製程構件之非即時調節的方法與設備

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019468A (ja) * 2006-07-12 2008-01-31 C Uyemura & Co Ltd 錫めっき皮膜
US8211752B2 (en) * 2007-11-26 2012-07-03 Infineon Technologies Ag Device and method including a soldering process
JP4484962B2 (ja) * 2008-05-30 2010-06-16 日鉱金属株式会社 Ｓｎ又はＳｎ合金めっき被膜、それを有する複合材料、及び複合材料の製造方法
DE102012204241B4 (de) * 2012-03-16 2015-11-12 Bühler Motor GmbH Leiterplattenanordnung
CN102773576A (zh) * 2012-06-30 2012-11-14 惠州市奥罗拉科技有限公司 一种端子类镀锡品锡须消减工艺
DE102013212069A1 (de) * 2013-06-25 2015-01-08 Robert Bosch Gmbh Zinnbeschichtung, zugehöriges Kontaktelement und Verfahren zum Aufbringen einer Zinnbeschichtung
CN103526238A (zh) * 2013-09-29 2014-01-22 东台市东环电工机械有限公司 提高接线头c型连接器电连接性能的方法
KR102355341B1 (ko) * 2016-05-10 2022-01-24 미쓰비시 마테리알 가부시키가이샤 주석 도금 형성 구리 단자재 및 단자 그리고 전선 단말부 구조
CN112342584A (zh) * 2020-09-29 2021-02-09 扬州市景杨表面工程有限公司 一种心脏起搏器电容器件无磁化铜锡电镀工艺
CN112317972B (zh) * 2020-09-30 2021-07-20 厦门大学 一种单向性耐高温焊接接头的低温快速制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9026747D0 (en) * 1990-12-08 1991-01-30 Yorkshire Chemicals Plc Electrolyte compositions
CA2086939C (en) * 1991-05-08 1996-10-22 Vladimir Alexandrovich Peremyschev Method of drying a protective polymer coating applied onto a surface of an article from a solution, and device for effecting thereof
JP4897187B2 (ja) 2002-03-05 2012-03-14 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． スズメッキ方法
US6860981B2 (en) * 2002-04-30 2005-03-01 Technic, Inc. Minimizing whisker growth in tin electrodeposits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI487000B (zh) * 2007-08-10 2015-06-01 Quantum Global Tech Llc 電子裝置製程構件之非即時調節的方法與設備

Also Published As

Publication number Publication date
US8603643B2 (en) 2013-12-10
WO2006006114A1 (en) 2006-01-19
CN1997775A (zh) 2007-07-11
EP1774065A1 (en) 2007-04-18
CN1718867A (zh) 2006-01-11
US20080038574A1 (en) 2008-02-14
JP2008506038A (ja) 2008-02-28

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