MX2019008513A - Material de terminal para conectores y metodo para producir el mismo. - Google Patents
Material de terminal para conectores y metodo para producir el mismo.Info
- Publication number
- MX2019008513A MX2019008513A MX2019008513A MX2019008513A MX2019008513A MX 2019008513 A MX2019008513 A MX 2019008513A MX 2019008513 A MX2019008513 A MX 2019008513A MX 2019008513 A MX2019008513 A MX 2019008513A MX 2019008513 A MX2019008513 A MX 2019008513A
- Authority
- MX
- Mexico
- Prior art keywords
- alloy layer
- nickel
- inclusive
- copper
- tin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Conductive Materials (AREA)
Abstract
Proporcionar un material de terminal para conectores que tengan excelentes propiedades de inserción-remoción, que disminuya en el coeficiente de fricción cinética hasta un mínimo de 0.3 o menos, al tiempo que exhibe excelentes características de conexión eléctrica. Un material de terminal para conectores, que se obtiene mediante laminación secuencial sobre un sustrato que está formado de cobre o una aleación de cobre, una capa de níquel o aleación de níquel, una capa de aleación de cobre-estaño y una capa de estaño en este orden, y: la capa de estaño tiene un espesor promedio de 0.2 µm a 1.2 µm (ambos inclusive); la capa de aleación de cobre-estaño es una capa de aleación compuesta que está compuesta principalmente por Cu6Sn5, con parte del cobre en el Cu6Sn5 siendo sustituido por níquel, y tiene un diámetro de grano cristalino promedio de 0.2 µm a 1.5 µm (ambos inclusive); una parte de la capa de aleación de cobre-estaño se expone desde la superficie de la capa de estaño, con una relación del área de exposición del 1% al 60% (ambos inclusive); la capa de níquel o aleación de níquel tiene un espesor promedio de 0.05 µm a 1.0 µm (ambos inclusive) y un diámetro de grano cristalino promedio de 0.01 µm a 0.5 µm (ambos inclusive), con la relación (desviación estándar)/(diámetro de grano cristalino promedio) de los diámetros de grano cristalino que sea 1.0 o menos; la rugosidad de la superficie Ra de una superficie de la capa de níquel o aleación de níquel, la superficie que está en contacto con la capa de aleación de cobre-estaño, es de 0.005 µm a 0.5 µm (ambos inclusive); y el coeficiente de fricción cinética de la superficie es 0.3 o menos.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017006184A JP6423025B2 (ja) | 2017-01-17 | 2017-01-17 | 挿抜性に優れた錫めっき付銅端子材及びその製造方法 |
| PCT/JP2018/000996 WO2018135482A1 (ja) | 2017-01-17 | 2018-01-16 | コネクタ用端子材及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2019008513A true MX2019008513A (es) | 2019-12-02 |
Family
ID=62908690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2019008513A MX2019008513A (es) | 2017-01-17 | 2018-01-16 | Material de terminal para conectores y metodo para producir el mismo. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10923245B2 (es) |
| EP (1) | EP3572558A4 (es) |
| JP (1) | JP6423025B2 (es) |
| KR (1) | KR102390232B1 (es) |
| CN (1) | CN110177904A (es) |
| MX (1) | MX2019008513A (es) |
| MY (1) | MY194439A (es) |
| TW (1) | TWI799404B (es) |
| WO (1) | WO2018135482A1 (es) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7040224B2 (ja) * | 2018-03-30 | 2022-03-23 | 三菱マテリアル株式会社 | 錫めっき付銅端子材及びその製造方法 |
| JP7293829B2 (ja) | 2019-04-11 | 2023-06-20 | 富士フイルムビジネスイノベーション株式会社 | 定着部材、定着装置、及び画像形成装置 |
| JP7354719B2 (ja) | 2019-09-24 | 2023-10-03 | 富士フイルムビジネスイノベーション株式会社 | 定着部材、定着装置、及び画像形成装置 |
| JP7272224B2 (ja) * | 2019-09-30 | 2023-05-12 | 三菱マテリアル株式会社 | コネクタ用端子材 |
| CN110592515B (zh) * | 2019-09-30 | 2022-06-17 | 凯美龙精密铜板带（河南）有限公司 | 一种热浸镀锡铜材及其制造方法 |
| CN111009759B (zh) * | 2019-12-23 | 2021-08-20 | 苏州威贝斯特电子科技有限公司 | 一种端子组合物及其插座连接器用制品 |
| JP2023061782A (ja) * | 2021-10-20 | 2023-05-02 | Ｊｘ金属株式会社 | めっき材及び電子部品 |
| DE102021130188A1 (de) * | 2021-11-18 | 2023-05-25 | Te Connectivity Germany Gmbh | Verfahren zur oberflächenbehandlung eines elektrischen kontaktlements und kontaktelement |
| JP7670224B1 (ja) * | 2024-01-24 | 2025-04-30 | 三菱マテリアル株式会社 | コネクタ用端子材及びその製造方法、並びにコネクタ |
| JP7579476B1 (ja) | 2024-02-21 | 2024-11-07 | 有限会社 ナプラ | 端子 |
| JP2025145843A (ja) * | 2024-03-22 | 2025-10-03 | 三菱マテリアル株式会社 | めっき皮膜付銅端子材及びその製造方法 |
| JP7736142B1 (ja) * | 2024-10-23 | 2025-09-09 | 三菱マテリアル株式会社 | コネクタ用端子材及びその製造方法 |
| JP7732566B1 (ja) * | 2024-10-23 | 2025-09-02 | 三菱マテリアル株式会社 | コネクタ用端子材及びその製造方法 |
| CN119320922B (zh) * | 2024-12-13 | 2025-10-28 | 河南凯美龙新材料科技股份有限公司 | 一种降低铜带表面摩擦系数的热浸镀锡铜板带及其制造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100870334B1 (ko) * | 2004-09-10 | 2008-11-25 | 가부시키가이샤 고베 세이코쇼 | 접속 부품용 도전 재료 및 그의 제조방법 |
| JP4503620B2 (ja) | 2007-01-25 | 2010-07-14 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
| JP5319101B2 (ja) * | 2007-10-31 | 2013-10-16 | Ｊｘ日鉱日石金属株式会社 | 電子部品用Ｓｎめっき材 |
| US8698002B2 (en) * | 2009-01-20 | 2014-04-15 | Mitsubishi Shindoh Co., Ltd. | Conductive member and method for producing the same |
| JP5278630B1 (ja) * | 2012-01-26 | 2013-09-04 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材及びその製造方法 |
| TW201413068A (zh) * | 2012-07-02 | 2014-04-01 | Mitsubishi Materials Corp | 插拔性優良之鍍錫銅合金端子材料及其製造方法 |
| JP5522300B1 (ja) | 2012-07-02 | 2014-06-18 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材及びその製造方法 |
| JP2015063750A (ja) | 2013-08-26 | 2015-04-09 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
| JP6160582B2 (ja) * | 2014-09-11 | 2017-07-12 | 三菱マテリアル株式会社 | 錫めっき銅合金端子材及びその製造方法 |
| JP5984980B2 (ja) * | 2015-02-24 | 2016-09-06 | Ｊｘ金属株式会社 | 電子部品用Ｓｎめっき材 |
| JP6558971B2 (ja) | 2015-06-17 | 2019-08-14 | 株式会社日立ハイテクノロジーズ | 採血装置 |
-
2017
- 2017-01-17 JP JP2017006184A patent/JP6423025B2/ja active Active
-
2018
- 2018-01-16 KR KR1020197023283A patent/KR102390232B1/ko active Active
- 2018-01-16 WO PCT/JP2018/000996 patent/WO2018135482A1/ja not_active Ceased
- 2018-01-16 EP EP18742148.2A patent/EP3572558A4/en active Pending
- 2018-01-16 CN CN201880005730.7A patent/CN110177904A/zh active Pending
- 2018-01-16 MY MYPI2019004079A patent/MY194439A/en unknown
- 2018-01-16 MX MX2019008513A patent/MX2019008513A/es unknown
- 2018-01-16 US US16/478,256 patent/US10923245B2/en active Active
- 2018-01-17 TW TW107101682A patent/TWI799404B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110177904A (zh) | 2019-08-27 |
| TW201832643A (zh) | 2018-09-01 |
| JP6423025B2 (ja) | 2018-11-14 |
| MY194439A (en) | 2022-11-30 |
| JP2018115361A (ja) | 2018-07-26 |
| TWI799404B (zh) | 2023-04-21 |
| WO2018135482A1 (ja) | 2018-07-26 |
| US20190362865A1 (en) | 2019-11-28 |
| US10923245B2 (en) | 2021-02-16 |
| EP3572558A1 (en) | 2019-11-27 |
| KR20190101465A (ko) | 2019-08-30 |
| KR102390232B1 (ko) | 2022-04-22 |
| EP3572558A4 (en) | 2020-10-28 |
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