[go: up one dir, main page]

TW200701355A - Wafer cutting method and wafer cutting apparatus - Google Patents

Wafer cutting method and wafer cutting apparatus

Info

Publication number
TW200701355A
TW200701355A TW095114859A TW95114859A TW200701355A TW 200701355 A TW200701355 A TW 200701355A TW 095114859 A TW095114859 A TW 095114859A TW 95114859 A TW95114859 A TW 95114859A TW 200701355 A TW200701355 A TW 200701355A
Authority
TW
Taiwan
Prior art keywords
cutting
wafer
wafer cutting
sheet
cutting apparatus
Prior art date
Application number
TW095114859A
Other languages
Chinese (zh)
Other versions
TWI393180B (en
Inventor
Akira Nakatsu
Original Assignee
Canon Machinery Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Machinery Inc filed Critical Canon Machinery Inc
Publication of TW200701355A publication Critical patent/TW200701355A/en
Application granted granted Critical
Publication of TWI393180B publication Critical patent/TWI393180B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provided is a method for cutting a wafer into small chips with high security and a cutting apparatus suitable to this cutting method. According to the wafer cutting method and cutting apparatus for cutting the wafer 1 pasted on the sheet 3 along the planned cutting lines 2 in the lattice pattern, the top surface of the cutting apparatus 10 is slid under the bottom surface of the sheet 3, and the sheet 3 is locally vacuum suctioned through the vacuum suction inlets 13 aligned on the top surface. The vacuum suction allows bending stress to be intensively applied on one of the planned cutting lines 2 of the wafer 1 so as to cut the wafer 1 along the planned cutting line 2.
TW095114859A 2005-06-10 2006-04-26 Wafer cutting method and wafer cutting apparatus TWI393180B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005171440A JP4361516B2 (en) 2005-06-10 2005-06-10 Wafer dividing method

Publications (2)

Publication Number Publication Date
TW200701355A true TW200701355A (en) 2007-01-01
TWI393180B TWI393180B (en) 2013-04-11

Family

ID=37440160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114859A TWI393180B (en) 2005-06-10 2006-04-26 Wafer cutting method and wafer cutting apparatus

Country Status (5)

Country Link
JP (1) JP4361516B2 (en)
KR (1) KR101226578B1 (en)
DE (1) DE102006019709A1 (en)
MY (1) MY147978A (en)
TW (1) TWI393180B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109545863A (en) * 2014-05-27 2019-03-29 太阳能公司 Stacking formula solar cell module
CN109768095A (en) * 2014-05-27 2019-05-17 太阳能公司 Stacked solar cell module
US10861999B2 (en) 2015-04-21 2020-12-08 Sunpower Corporation Shingled solar cell module comprising hidden tap interconnects
US11482639B2 (en) 2014-05-27 2022-10-25 Sunpower Corporation Shingled solar cell module
US11942561B2 (en) 2014-05-27 2024-03-26 Maxeon Solar Pte. Ltd. Shingled solar cell module

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2503326A4 (en) * 2009-11-20 2015-04-15 Nat Inst Of Advanced Ind Scien DEFECT STUDY METHOD, WAFER PLATE SUBJECT TO DEFECT STUDY OR SEMICONDUCTOR ELEMENT MADE BY MEANS OF SUCH WAFER, QUALITY CONTROL METHOD FOR WAFERS OR SEMICONDUCTOR ELEMENTS AND DEVICE FOR DETECTING DEFECTS
JP5414486B2 (en) * 2009-12-01 2014-02-12 シチズン電子株式会社 Semiconductor manufacturing equipment
JP5546873B2 (en) * 2010-01-12 2014-07-09 キヤノンマシナリー株式会社 Semiconductor wafer dividing method and apparatus
CN102194652B (en) * 2010-03-11 2013-04-10 中芯国际集成电路制造(上海)有限公司 Method for preventing warping of wafers and wafers therefrom
JP5960389B2 (en) * 2010-04-19 2016-08-02 東京エレクトロン株式会社 Method for separating and transporting a semiconductor integrated circuit chip
JP6029334B2 (en) * 2012-06-07 2016-11-24 株式会社ディスコ Splitting device
US10090430B2 (en) 2014-05-27 2018-10-02 Sunpower Corporation System for manufacturing a shingled solar cell module
WO2014098771A1 (en) * 2012-12-17 2014-06-26 Agency For Science, Technology And Research Wafer dicing apparatus and wafer dicing method
JP6091335B2 (en) * 2013-05-28 2017-03-08 株式会社ディスコ Dividing method and dividing apparatus
JP6301658B2 (en) * 2014-01-15 2018-03-28 株式会社ディスコ Wafer processing method
CL2016003045A1 (en) * 2014-05-27 2017-06-09 Sunpower Corp Stepped solar cell module
CN104409386B (en) * 2014-10-20 2018-05-15 上海技美电子科技有限公司 Wafer sliver apparatus
WO2017030695A1 (en) 2015-08-18 2017-02-23 Sunpower Corporation Solar panel
JP6576735B2 (en) * 2015-08-19 2019-09-18 株式会社ディスコ Wafer division method
JP7125650B2 (en) * 2018-03-27 2022-08-25 株式会社東京精密 Wafer dividing apparatus and method
CN112701066B (en) * 2021-01-07 2021-07-20 深圳市粤海翔精密科技有限公司 Splitting knife equipment for wafer splitting and use method thereof
CN112847853B (en) * 2021-01-20 2022-12-27 中国科学院微电子研究所 Lobe of a leaf device
CN113524463B (en) * 2021-07-28 2025-07-25 广东省先进陶瓷材料科技有限公司 Stamping die and workpiece stamping method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE759715A (en) * 1969-12-12 1971-06-02 Shell Int Research BLOCK COPOLYMERS AS VISCOSITY INDEX IMPROVING AGENTS
JPH0574933A (en) * 1991-09-17 1993-03-26 Seiko Epson Corp Dicing machine
JP3276506B2 (en) * 1994-03-16 2002-04-22 株式会社日立製作所 Method for manufacturing semiconductor device
JPH0817767A (en) * 1994-06-29 1996-01-19 Hitachi Ltd Method and apparatus for breaking semiconductor wafer
JP3408805B2 (en) * 2000-09-13 2003-05-19 浜松ホトニクス株式会社 Cutting origin region forming method and workpiece cutting method
KR20040009802A (en) * 2002-07-25 2004-01-31 삼성전자주식회사 A package sawing apparatus having rubber plate for fixing frame that having bended type mount surface
TWI274406B (en) * 2003-07-16 2007-02-21 Freescale Semiconductor Inc Dual gauge leadframe
JP7254577B2 (en) * 2019-03-27 2023-04-10 積水化学工業株式会社 Piping material

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109545863A (en) * 2014-05-27 2019-03-29 太阳能公司 Stacking formula solar cell module
CN109768095A (en) * 2014-05-27 2019-05-17 太阳能公司 Stacked solar cell module
CN109545863B (en) * 2014-05-27 2021-09-14 迈可晟太阳能有限公司 Overlapping type solar cell module
CN114582986A (en) * 2014-05-27 2022-06-03 迈可晟太阳能有限公司 Overlapping type solar cell module
US11482639B2 (en) 2014-05-27 2022-10-25 Sunpower Corporation Shingled solar cell module
CN109768095B (en) * 2014-05-27 2023-04-04 迈可晟太阳能有限公司 Overlapping type solar cell module
US11942561B2 (en) 2014-05-27 2024-03-26 Maxeon Solar Pte. Ltd. Shingled solar cell module
US11949026B2 (en) 2014-05-27 2024-04-02 Maxeon Solar Pte. Ltd. Shingled solar cell module
US10861999B2 (en) 2015-04-21 2020-12-08 Sunpower Corporation Shingled solar cell module comprising hidden tap interconnects

Also Published As

Publication number Publication date
TWI393180B (en) 2013-04-11
JP2006344910A (en) 2006-12-21
KR101226578B1 (en) 2013-01-28
KR20060128641A (en) 2006-12-14
DE102006019709A1 (en) 2006-12-14
JP4361516B2 (en) 2009-11-11
MY147978A (en) 2013-02-28

Similar Documents

Publication Publication Date Title
TW200701355A (en) Wafer cutting method and wafer cutting apparatus
TWI625313B (en) Scribing method
ATE459450T1 (en) CUTTING OR ETCHING DEVICE WITH DRIVEN TOOL FOR DUST EXTRACTION
TW200624396A (en) Method and apparatus for scribing brittle material board and system for breaking brittle material board
TW200505805A (en) Brittle board dividing system and brittle board dividing method
WO2009059128A3 (en) Crystalline-thin-film photovoltaic structures and methods for forming the same
EP1983575A3 (en) Method for manufacturing bonded substrate
ATE517849T1 (en) METHOD AND DEVICE FOR BREAKING SCRATCHED GLASS PANELS
MY147081A (en) Method and device for dividing a plane-parallel plate made of a brittle material into a plurality of individual plates by means of a laser
TW200716274A (en) Cryofluid assisted forming method
EP1437202A3 (en) Device and Method for separating blanks in a machine for the production of planar elements cut from a web
MY141428A (en) Substrate meniscus interface and methods for operation
EP2036856A3 (en) Clean bench and method of producing raw material for single crystal silicon
TW200618068A (en) Strained semiconductor devices and method for forming at least a portion thereof
WO2007117697A3 (en) Jig apparatus
TW200632995A (en) Single wafer dryer and drying methods
USD609990S1 (en) Device to secure container to reciprocating power tool
TW200834127A (en) Method for cutting a prism sheet
WO2006086160A8 (en) Apparatus and method for moving envelopes
TW200802675A (en) Sheet cutting device and cutting method
ATE370821T1 (en) DEVICE FOR HANDLING A STACK
WO2004074931A3 (en) Method and apparatus for megasonic cleaning of patterned substrates
WO2006127383A3 (en) Sheet handling
TW200610629A (en) Ceramic blade and fabrication method thereof
TW200721243A (en) Sheet application device and application method