[go: up one dir, main page]

TW200701355A - Wafer cutting method and wafer cutting apparatus - Google Patents

Wafer cutting method and wafer cutting apparatus

Info

Publication number
TW200701355A
TW200701355A TW095114859A TW95114859A TW200701355A TW 200701355 A TW200701355 A TW 200701355A TW 095114859 A TW095114859 A TW 095114859A TW 95114859 A TW95114859 A TW 95114859A TW 200701355 A TW200701355 A TW 200701355A
Authority
TW
Taiwan
Prior art keywords
cutting
wafer
wafer cutting
sheet
cutting apparatus
Prior art date
Application number
TW095114859A
Other languages
English (en)
Other versions
TWI393180B (zh
Inventor
Akira Nakatsu
Original Assignee
Canon Machinery Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Machinery Inc filed Critical Canon Machinery Inc
Publication of TW200701355A publication Critical patent/TW200701355A/zh
Application granted granted Critical
Publication of TWI393180B publication Critical patent/TWI393180B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095114859A 2005-06-10 2006-04-26 晶圓切割方法以及晶圓切割裝置 TWI393180B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005171440A JP4361516B2 (ja) 2005-06-10 2005-06-10 ウェーハ分割方法

Publications (2)

Publication Number Publication Date
TW200701355A true TW200701355A (en) 2007-01-01
TWI393180B TWI393180B (zh) 2013-04-11

Family

ID=37440160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114859A TWI393180B (zh) 2005-06-10 2006-04-26 晶圓切割方法以及晶圓切割裝置

Country Status (5)

Country Link
JP (1) JP4361516B2 (zh)
KR (1) KR101226578B1 (zh)
DE (1) DE102006019709A1 (zh)
MY (1) MY147978A (zh)
TW (1) TWI393180B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109545863A (zh) * 2014-05-27 2019-03-29 太阳能公司 叠盖式太阳能电池模块
CN109768095A (zh) * 2014-05-27 2019-05-17 太阳能公司 叠盖式太阳能电池模块
US10861999B2 (en) 2015-04-21 2020-12-08 Sunpower Corporation Shingled solar cell module comprising hidden tap interconnects
US11482639B2 (en) 2014-05-27 2022-10-25 Sunpower Corporation Shingled solar cell module
US11942561B2 (en) 2014-05-27 2024-03-26 Maxeon Solar Pte. Ltd. Shingled solar cell module

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2503326A4 (en) * 2009-11-20 2015-04-15 Nat Inst Of Advanced Ind Scien METHOD FOR EXAMINING DEFECTS, DEFECTIVE STUDY OF WAFER OR SEMICONDUCTOR ELEMENTS MANUFACTURED WITH THE WAFER, QUALITY CONTROL PROCEDURE FOR WAFER OR SEMICONDUCTOR ELEMENT AND DIRECT DEVICE DEVICE
JP5414486B2 (ja) * 2009-12-01 2014-02-12 シチズン電子株式会社 半導体製造装置
JP5546873B2 (ja) * 2010-01-12 2014-07-09 キヤノンマシナリー株式会社 半導体ウェハの分割方法及び装置
CN102194652B (zh) * 2010-03-11 2013-04-10 中芯国际集成电路制造(上海)有限公司 防止晶圆翘曲的方法以及由该方法得到的晶圆
JP5960389B2 (ja) * 2010-04-19 2016-08-02 東京エレクトロン株式会社 半導体集積回路チップを分離および搬送する方法
JP6029334B2 (ja) * 2012-06-07 2016-11-24 株式会社ディスコ 分割装置
US10090430B2 (en) 2014-05-27 2018-10-02 Sunpower Corporation System for manufacturing a shingled solar cell module
WO2014098771A1 (en) * 2012-12-17 2014-06-26 Agency For Science, Technology And Research Wafer dicing apparatus and wafer dicing method
JP6091335B2 (ja) * 2013-05-28 2017-03-08 株式会社ディスコ 分割方法及び分割装置
JP6301658B2 (ja) * 2014-01-15 2018-03-28 株式会社ディスコ ウェーハの加工方法
CL2016003045A1 (es) * 2014-05-27 2017-06-09 Sunpower Corp Modulo escalonado de celda solar
CN104409386B (zh) * 2014-10-20 2018-05-15 上海技美电子科技有限公司 晶圆裂片装置
WO2017030695A1 (en) 2015-08-18 2017-02-23 Sunpower Corporation Solar panel
JP6576735B2 (ja) * 2015-08-19 2019-09-18 株式会社ディスコ ウエーハの分割方法
JP7125650B2 (ja) * 2018-03-27 2022-08-25 株式会社東京精密 ウェーハ分割装置及び方法
CN112701066B (zh) * 2021-01-07 2021-07-20 深圳市粤海翔精密科技有限公司 一种晶圆裂片用劈裂刀设备及其使用方法
CN112847853B (zh) * 2021-01-20 2022-12-27 中国科学院微电子研究所 一种裂片装置
CN113524463B (zh) * 2021-07-28 2025-07-25 广东省先进陶瓷材料科技有限公司 一种冲压模具及工件冲压加工方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE759715A (nl) * 1969-12-12 1971-06-02 Shell Int Research Blokcopolymeren als viscositeitsindexverbeterende middelen
JPH0574933A (ja) * 1991-09-17 1993-03-26 Seiko Epson Corp ダイシング装置
JP3276506B2 (ja) * 1994-03-16 2002-04-22 株式会社日立製作所 半導体装置の製造方法
JPH0817767A (ja) * 1994-06-29 1996-01-19 Hitachi Ltd 半導体ウエハのブレーキング方法および装置
JP3408805B2 (ja) * 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
KR20040009802A (ko) * 2002-07-25 2004-01-31 삼성전자주식회사 굴곡형 장착 면을 갖는 프레임 고정 고무판을 구비하는패키지 절단 장치
TWI274406B (en) * 2003-07-16 2007-02-21 Freescale Semiconductor Inc Dual gauge leadframe
JP7254577B2 (ja) * 2019-03-27 2023-04-10 積水化学工業株式会社 配管材

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109545863A (zh) * 2014-05-27 2019-03-29 太阳能公司 叠盖式太阳能电池模块
CN109768095A (zh) * 2014-05-27 2019-05-17 太阳能公司 叠盖式太阳能电池模块
CN109545863B (zh) * 2014-05-27 2021-09-14 迈可晟太阳能有限公司 叠盖式太阳能电池模块
CN114582986A (zh) * 2014-05-27 2022-06-03 迈可晟太阳能有限公司 叠盖式太阳能电池模块
US11482639B2 (en) 2014-05-27 2022-10-25 Sunpower Corporation Shingled solar cell module
CN109768095B (zh) * 2014-05-27 2023-04-04 迈可晟太阳能有限公司 叠盖式太阳能电池模块
US11942561B2 (en) 2014-05-27 2024-03-26 Maxeon Solar Pte. Ltd. Shingled solar cell module
US11949026B2 (en) 2014-05-27 2024-04-02 Maxeon Solar Pte. Ltd. Shingled solar cell module
US10861999B2 (en) 2015-04-21 2020-12-08 Sunpower Corporation Shingled solar cell module comprising hidden tap interconnects

Also Published As

Publication number Publication date
TWI393180B (zh) 2013-04-11
JP2006344910A (ja) 2006-12-21
KR101226578B1 (ko) 2013-01-28
KR20060128641A (ko) 2006-12-14
DE102006019709A1 (de) 2006-12-14
JP4361516B2 (ja) 2009-11-11
MY147978A (en) 2013-02-28

Similar Documents

Publication Publication Date Title
TW200701355A (en) Wafer cutting method and wafer cutting apparatus
TWI625313B (zh) Scribing method
ATE459450T1 (de) Schneide- oder ätzvorrichtung mit werkzeug mit antrieb zur staubabsaugung
TW200624396A (en) Method and apparatus for scribing brittle material board and system for breaking brittle material board
TW200505805A (en) Brittle board dividing system and brittle board dividing method
WO2009059128A3 (en) Crystalline-thin-film photovoltaic structures and methods for forming the same
EP1983575A3 (en) Method for manufacturing bonded substrate
ATE517849T1 (de) Verfahren und vorrichtung zum brechen geritzter glastafeln
MY147081A (en) Method and device for dividing a plane-parallel plate made of a brittle material into a plurality of individual plates by means of a laser
TW200716274A (en) Cryofluid assisted forming method
EP1437202A3 (de) Vorrichtung und Verfahren zur Nutzentrennung in einer Maschine zur Herstellung von aus einer Materialbahn ausgeschnittenen Flachmaterialstücken
MY141428A (en) Substrate meniscus interface and methods for operation
EP2036856A3 (en) Clean bench and method of producing raw material for single crystal silicon
TW200618068A (en) Strained semiconductor devices and method for forming at least a portion thereof
WO2007117697A3 (en) Jig apparatus
TW200632995A (en) Single wafer dryer and drying methods
USD609990S1 (en) Device to secure container to reciprocating power tool
TW200834127A (en) Method for cutting a prism sheet
WO2006086160A8 (en) Apparatus and method for moving envelopes
TW200802675A (en) Sheet cutting device and cutting method
ATE370821T1 (de) Vorrichtung zum handhaben eines stapels
WO2004074931A3 (en) Method and apparatus for megasonic cleaning of patterned substrates
WO2006127383A3 (en) Sheet handling
TW200610629A (en) Ceramic blade and fabrication method thereof
TW200721243A (en) Sheet application device and application method