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TW200709936A - Fluid deposition cluster tool - Google Patents

Fluid deposition cluster tool

Info

Publication number
TW200709936A
TW200709936A TW095125530A TW95125530A TW200709936A TW 200709936 A TW200709936 A TW 200709936A TW 095125530 A TW095125530 A TW 095125530A TW 95125530 A TW95125530 A TW 95125530A TW 200709936 A TW200709936 A TW 200709936A
Authority
TW
Taiwan
Prior art keywords
chamber
fluid deposition
cluster tool
substrates
fluid
Prior art date
Application number
TW095125530A
Other languages
English (en)
Inventor
John A Higginson
Michael ROCCHIO
Jeffrey Birkmeyer
Stephen R Deming
Essen Kevin Von
Andreas Bibl
Deane A Gardner
Original Assignee
Dimatix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dimatix Inc filed Critical Dimatix Inc
Publication of TW200709936A publication Critical patent/TW200709936A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095125530A 2005-07-13 2006-07-12 Fluid deposition cluster tool TW200709936A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US69943705P 2005-07-13 2005-07-13
US69943605P 2005-07-13 2005-07-13

Publications (1)

Publication Number Publication Date
TW200709936A true TW200709936A (en) 2007-03-16

Family

ID=37637935

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125530A TW200709936A (en) 2005-07-13 2006-07-12 Fluid deposition cluster tool

Country Status (6)

Country Link
US (1) US20070026151A1 (zh)
EP (1) EP1902462B1 (zh)
JP (1) JP2009501083A (zh)
KR (1) KR20080026168A (zh)
TW (1) TW200709936A (zh)
WO (1) WO2007009000A2 (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5336185B2 (ja) * 2005-07-13 2013-11-06 フジフィルム ディマティックス， インコーポレイテッド 流体堆積デバイス
US8207010B2 (en) * 2007-06-05 2012-06-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing photoelectric conversion device
US8383202B2 (en) 2008-06-13 2013-02-26 Kateeva, Inc. Method and apparatus for load-locked printing
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US9604245B2 (en) * 2008-06-13 2017-03-28 Kateeva, Inc. Gas enclosure systems and methods utilizing an auxiliary enclosure
US8899171B2 (en) 2008-06-13 2014-12-02 Kateeva, Inc. Gas enclosure assembly and system
US10442226B2 (en) 2008-06-13 2019-10-15 Kateeva, Inc. Gas enclosure assembly and system
US9048344B2 (en) 2008-06-13 2015-06-02 Kateeva, Inc. Gas enclosure assembly and system
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
ITUD20080136A1 (it) * 2008-06-13 2009-12-14 Baccini S P A Impianto per la lavorazione di piastre per circuiti elettronici
KR20220162809A (ko) * 2013-03-13 2022-12-08 카티바, 인크. 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
TWI627075B (zh) * 2013-03-13 2018-06-21 凱特伊夫公司 利用一輔助包體的氣體包體系統
US10468279B2 (en) 2013-12-26 2019-11-05 Kateeva, Inc. Apparatus and techniques for thermal treatment of electronic devices
WO2015098892A1 (ja) * 2013-12-26 2015-07-02 コニカミノルタ株式会社 電子デバイスの印刷製造システム
US9343678B2 (en) * 2014-01-21 2016-05-17 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
WO2015112454A1 (en) 2014-01-21 2015-07-30 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
WO2015168036A1 (en) 2014-04-30 2015-11-05 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
EP2960059B1 (en) * 2014-06-25 2018-10-24 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
KR102068882B1 (ko) 2014-11-26 2020-01-21 카티바, 인크. 환경적으로 제어되는 코팅 시스템
KR101688398B1 (ko) * 2015-05-26 2016-12-21 주식회사 선익시스템 기판 증착 시스템
FR3042728B1 (fr) * 2015-10-22 2017-12-08 Les Laboratoires Osteal Medical Enceinte etanche de polymerisation
US20170352562A1 (en) * 2016-06-02 2017-12-07 Applied Materials, Inc. Dodecadon transfer chamber and processing system having the same
GB201715168D0 (en) 2017-09-20 2017-11-01 Extract Tech Ltd Biological processing assembly
DE102019123556A1 (de) * 2019-09-03 2021-03-04 Aixtron Se Lademodul für ein CVD-Reaktorsystem
CN120092316A (zh) * 2022-06-28 2025-06-03 英奇工厂股份有限公司 集成台式半导体工艺单元和由此类单元所形成的半导体制造生产线以及半导体工具库

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5498578A (en) * 1994-05-02 1996-03-12 Motorola, Inc. Method for selectively forming semiconductor regions
US6612317B2 (en) * 2000-04-18 2003-09-02 S.C. Fluids, Inc Supercritical fluid delivery and recovery system for semiconductor wafer processing
US6838115B2 (en) * 2000-07-12 2005-01-04 Fsi International, Inc. Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices
EP1344243A1 (de) * 2000-12-23 2003-09-17 Aixtron AG Verfahren und vorrichtung zur bearbeitung von halbleitersubstraten
US20040096586A1 (en) * 2002-11-15 2004-05-20 Schulberg Michelle T. System for deposition of mesoporous materials
JP4300863B2 (ja) * 2003-04-25 2009-07-22 澁谷工業株式会社 無菌システムとその使用方法

Also Published As

Publication number Publication date
WO2007009000A2 (en) 2007-01-18
WO2007009000A3 (en) 2007-05-18
EP1902462A2 (en) 2008-03-26
EP1902462B1 (en) 2012-06-13
US20070026151A1 (en) 2007-02-01
KR20080026168A (ko) 2008-03-24
JP2009501083A (ja) 2009-01-15

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