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TW200704940A - Pusher, pusher unit and semiconductor testing device - Google Patents

Pusher, pusher unit and semiconductor testing device

Info

Publication number
TW200704940A
TW200704940A TW095126485A TW95126485A TW200704940A TW 200704940 A TW200704940 A TW 200704940A TW 095126485 A TW095126485 A TW 095126485A TW 95126485 A TW95126485 A TW 95126485A TW 200704940 A TW200704940 A TW 200704940A
Authority
TW
Taiwan
Prior art keywords
pusher
semiconductor element
tested semiconductor
testing device
body section
Prior art date
Application number
TW095126485A
Other languages
English (en)
Inventor
Akihiko Ito
Tsuyoshi Yamashita
Tomoyuki Kanaumi
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200704940A publication Critical patent/TW200704940A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095126485A 2005-07-21 2006-07-20 Pusher, pusher unit and semiconductor testing device TW200704940A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/013409 WO2007010610A1 (ja) 2005-07-21 2005-07-21 プッシャ、プッシャユニットおよび半導体試験装置

Publications (1)

Publication Number Publication Date
TW200704940A true TW200704940A (en) 2007-02-01

Family

ID=37668499

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126485A TW200704940A (en) 2005-07-21 2006-07-20 Pusher, pusher unit and semiconductor testing device

Country Status (6)

Country Link
US (1) US7804316B2 (zh)
JP (1) JPWO2007010610A1 (zh)
KR (1) KR20100017958A (zh)
MY (1) MY148619A (zh)
TW (1) TW200704940A (zh)
WO (1) WO2007010610A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404939B (zh) * 2009-09-25 2013-08-11 Semes Co Ltd 用以連接半導體裝置至測試裝置之連接單元以及具有此連接單元之測試機

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008102581A1 (ja) * 2007-02-23 2008-08-28 Advantest Corporation 電子部品押圧装置および電子部品試験装置
JP5282930B2 (ja) * 2007-10-09 2013-09-04 住友電気工業株式会社 光素子温度特性検査装置
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
WO2009101706A1 (ja) * 2008-02-15 2009-08-20 Advantest Corporation マッチプレートベース部および本体部、電子部品ハンドリング装置、ならびにマッチプレート本体部およびテスト部ユニットの交換治具および交換方法
US20100066395A1 (en) * 2008-03-13 2010-03-18 Johnson Morgan T Wafer Prober Integrated With Full-Wafer Contacter
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
JPWO2011007419A1 (ja) * 2009-07-14 2012-12-20 株式会社アドバンテスト 電子部品押圧装置、電子部品試験装置及びインタフェース装置
JP5910303B2 (ja) * 2012-05-21 2016-04-27 三菱電機株式会社 半導体検査治具
KR101936348B1 (ko) * 2012-09-17 2019-01-08 삼성전자주식회사 급속 온도 변환이 가능한 테스트 핸들러 및 그를 이용한 반도체 소자의 테스트 방법
KR101532391B1 (ko) * 2014-04-10 2015-06-30 주식회사 아이에스시 푸셔 장치
JP6445340B2 (ja) * 2015-02-06 2018-12-26 株式会社エンプラス 電気部品用ソケット
US9921265B2 (en) * 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
KR102842851B1 (ko) 2016-01-08 2025-08-05 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
JP6790768B2 (ja) * 2016-11-30 2020-11-25 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2018081021A (ja) * 2016-11-17 2018-05-24 三菱電機株式会社 押さえ治具
EP4653878A2 (en) * 2017-03-03 2025-11-26 AEHR Test Systems Electronics tester
KR102295094B1 (ko) * 2017-10-01 2021-08-31 (주)아테코 전자부품소자 테스트 온도 조절 장치와 방법, 테스트 챔버의 푸싱 장치, 및 전자부품 테스트 장치
KR20200012211A (ko) 2018-07-26 2020-02-05 삼성전자주식회사 반도체 소자 테스트 시스템, 반도체 소자 테스트 방법, 및 반도체 소자 제조 방법
JP7270348B2 (ja) * 2018-09-10 2023-05-10 三菱電機株式会社 電気特性検査治具
KR102185035B1 (ko) * 2019-07-02 2020-12-01 세메스 주식회사 반도체 패키지 테스트 장치
TWI734238B (zh) * 2019-10-29 2021-07-21 鴻勁精密股份有限公司 分類設備及其溫控裝置
KR102281297B1 (ko) * 2019-11-13 2021-07-23 주식회사 아이에스시 전기적 검사를 위한 푸셔장치
KR102329619B1 (ko) * 2020-01-20 2021-11-22 주식회사 제너릭스 반도체 소자 테스트 장비용 푸셔 장치
WO2022029207A1 (en) * 2020-08-04 2022-02-10 Advantest Corporation Automated test equipments, handlers and methods for testing a device under test using an additional signaling
CN120254561A (zh) 2020-10-07 2025-07-04 雅赫测试系统公司 电子测试器
TWI744205B (zh) * 2021-03-16 2021-10-21 力成科技股份有限公司 測試分類機的共用型匹配板
TWI874043B (zh) * 2023-12-14 2025-02-21 長裕欣業股份有限公司 電子元件溫度測試裝置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3099254B2 (ja) * 1994-02-28 2000-10-16 安藤電気株式会社 浮動機構つき吸着ハンドおよび搬送接触機構
JPH0933606A (ja) * 1995-07-20 1997-02-07 Shin Etsu Polymer Co Ltd 半導体素子検査用治具
JPH09175647A (ja) 1995-10-27 1997-07-08 Advantest Corp 半導体デバイス搬送処理装置
US5640303A (en) * 1995-10-30 1997-06-17 Precision Connector Designs, Inc. Interconnection apparatus for semiconductor/integrated circuit devices
JPH1058367A (ja) 1996-08-23 1998-03-03 Advantest Corp Ｉｃ搬送装置
JP3951436B2 (ja) * 1998-04-01 2007-08-01 株式会社アドバンテスト Ｉｃ試験装置
JPH11329646A (ja) * 1998-05-15 1999-11-30 Jsr Corp 検査装置
JPH11344527A (ja) * 1998-06-02 1999-12-14 Ando Electric Co Ltd 高温ハンドラの測定機構
JP4100790B2 (ja) 1998-12-08 2008-06-11 株式会社アドバンテスト 電子部品吸着装置および電子部品試験装置
US6301097B1 (en) * 1999-07-27 2001-10-09 International Business Machines Corporation Inflatable sealing system for low temperature electronic module
JP4327335B2 (ja) * 2000-06-23 2009-09-09 株式会社アドバンテスト コンタクトアームおよびこれを用いた電子部品試験装置
JP2002160187A (ja) * 2000-11-24 2002-06-04 Seiko Epson Corp 保持装置、搬送装置、ｉｃ検査装置、保持方法、搬送方法及びｉｃ検査方法
JP2002174658A (ja) 2000-12-05 2002-06-21 Advantest Corp ハンドラおよび電子部品試験装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404939B (zh) * 2009-09-25 2013-08-11 Semes Co Ltd 用以連接半導體裝置至測試裝置之連接單元以及具有此連接單元之測試機

Also Published As

Publication number Publication date
US7804316B2 (en) 2010-09-28
KR20100017958A (ko) 2010-02-16
MY148619A (en) 2013-05-15
JPWO2007010610A1 (ja) 2009-01-29
US20090102497A1 (en) 2009-04-23
WO2007010610A1 (ja) 2007-01-25

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