[go: up one dir, main page]

TW200633599A - Atmospheric processing using microwave-generated plasmas - Google Patents

Atmospheric processing using microwave-generated plasmas

Info

Publication number
TW200633599A
TW200633599A TW094138629A TW94138629A TW200633599A TW 200633599 A TW200633599 A TW 200633599A TW 094138629 A TW094138629 A TW 094138629A TW 94138629 A TW94138629 A TW 94138629A TW 200633599 A TW200633599 A TW 200633599A
Authority
TW
Taiwan
Prior art keywords
parts
microwave
processing
microwave reactor
coupled
Prior art date
Application number
TW094138629A
Other languages
English (en)
Inventor
Satyendra Kumar
Devendra Kumar
Kuruvilla Cherian
Dougherty, Sr
Original Assignee
Dana Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dana Corp filed Critical Dana Corp
Publication of TW200633599A publication Critical patent/TW200633599A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/012Soldering with the use of hot gas
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/06Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
    • C23C8/36Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
    • C23C8/38Treatment of ferrous surfaces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192Microwave generated discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
TW094138629A 2004-11-05 2005-11-03 Atmospheric processing using microwave-generated plasmas TW200633599A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62550204P 2004-11-05 2004-11-05
US62543304P 2004-11-05 2004-11-05
US62523604P 2004-11-05 2004-11-05

Publications (1)

Publication Number Publication Date
TW200633599A true TW200633599A (en) 2006-09-16

Family

ID=37452496

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138629A TW200633599A (en) 2004-11-05 2005-11-03 Atmospheric processing using microwave-generated plasmas

Country Status (4)

Country Link
US (1) US20080129208A1 (zh)
AR (1) AR051619A1 (zh)
TW (1) TW200633599A (zh)
WO (1) WO2006127037A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448427B (zh) * 2012-02-08 2014-08-11 Nat Univ Tsing Hua 利用低頻電磁波製備石墨烯之方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120196453A1 (en) * 2011-02-01 2012-08-02 Arizona Board Of Regents For And On Behalf Of Arizona State University Systems and Methods for Susceptor Assisted Microwave Annealing
US20120213948A1 (en) * 2011-02-22 2012-08-23 General Electric Company Localized microwave system and method
RU2718715C1 (ru) * 2019-08-15 2020-04-14 Федеральное государственное бюджетное научное учреждение "Всероссийский научно-исследовательский институт радиологии и агроэкологии" (ФГБНУ ВНИИРАЭ) Свч-плазмотрон
US11124867B1 (en) 2020-03-13 2021-09-21 National Taiwan University Of Science And Technology Gradient material layer and method for manufacturing the same
US11692267B2 (en) * 2020-12-31 2023-07-04 Applied Materials, Inc. Plasma induced modification of silicon carbide surface

Family Cites Families (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US450564A (en) * 1891-04-14 John p
AU432371B2 (en) * 1967-07-13 1973-02-06 Commonwealth Scientific And Industrial Research Organization Plasma sintering
US3731047A (en) * 1971-12-06 1973-05-01 Mc Donnell Douglas Corp Plasma heating torch
US4004934A (en) * 1973-10-24 1977-01-25 General Electric Company Sintered dense silicon carbide
JPS5823349B2 (ja) * 1975-08-11 1983-05-14 新日本製鐵株式会社 タイカブツノシヨウケツホウホウ
JPS5378170A (en) * 1976-12-22 1978-07-11 Toshiba Corp Continuous processor for gas plasma etching
US4025818A (en) * 1976-04-20 1977-05-24 Hughes Aircraft Company Wire ion plasma electron gun
CA1080562A (en) * 1977-02-10 1980-07-01 Frederick D. King Method of and apparatus for manufacturing an optical fibre with plasma activated deposition in a tube
JPS55131175A (en) * 1979-03-30 1980-10-11 Toshiba Corp Surface treatment apparatus with microwave plasma
US4504007A (en) * 1982-09-14 1985-03-12 International Business Machines Corporation Solder and braze fluxes and processes for using the same
US4664937A (en) * 1982-09-24 1987-05-12 Energy Conversion Devices, Inc. Method of depositing semiconductor films by free radical generation
US4666775A (en) * 1985-04-01 1987-05-19 Kennecott Corporation Process for sintering extruded powder shapes
JPH0689456B2 (ja) * 1986-10-01 1994-11-09 キヤノン株式会社 マイクロ波プラズマcvd法による機能性堆積膜形成装置
US4919077A (en) * 1986-12-27 1990-04-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor producing apparatus
JPH0754759B2 (ja) * 1987-04-27 1995-06-07 日本電信電話株式会社 プラズマ処理方法および装置並びにプラズマ処理装置用モード変換器
FR2616614B1 (fr) * 1987-06-10 1989-10-20 Air Liquide Torche a plasma micro-onde, dispositif comportant une telle torche et procede pour la fabrication de poudre les mettant en oeuvre
EP0329338A3 (en) * 1988-02-16 1990-08-01 Alcan International Limited Process and apparatus for heating bodies at high temperature and pressure utilizing microwave energy
JP2805009B2 (ja) * 1988-05-11 1998-09-30 株式会社日立製作所 プラズマ発生装置及びプラズマ元素分析装置
DE3820237C1 (zh) * 1988-06-14 1989-09-14 Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften Ev, 3400 Goettingen, De
DE3830249A1 (de) * 1988-09-06 1990-03-15 Schott Glaswerke Plasmaverfahren zum beschichten ebener substrate
US5122431A (en) * 1988-09-14 1992-06-16 Fujitsu Limited Thin film formation apparatus
US5015349A (en) * 1988-12-23 1991-05-14 University Of Connecticut Low power density microwave discharge plasma excitation energy induced chemical reactions
US5103715A (en) * 1989-03-17 1992-04-14 Techco Corporation Power steering system
WO1990015515A1 (de) * 1989-06-07 1990-12-13 Wolfgang Moshammer Verfahren und vorrichtung zur einstrahlung von mikrowellenenergie in wasserhaltige oder mit wasser versetzte materie
US5130170A (en) * 1989-06-28 1992-07-14 Canon Kabushiki Kaisha Microwave pcvd method for continuously forming a large area functional deposited film using a curved moving substrate web with microwave energy with a directivity in one direction perpendicular to the direction of microwave propagation
DE69030140T2 (de) * 1989-06-28 1997-09-04 Canon Kk Verfahren und Anordnung zur kontinuierlichen Bildung einer durch Mikrowellen-Plasma-CVD niedergeschlagenen grossflächigen Dünnschicht
US5037666A (en) * 1989-08-03 1991-08-06 Uha Mikakuto Precision Engineering Research Institute Co., Ltd. High-speed film forming method by microwave plasma chemical vapor deposition (CVD) under high pressure
US4981488A (en) * 1989-08-16 1991-01-01 Burlington Industries, Inc. Nomex printing
US5023056A (en) * 1989-12-27 1991-06-11 The United States Of America As Represented By The Secretary Of The Navy Plasma generator utilizing dielectric member for carrying microwave energy
US5277773A (en) * 1989-12-27 1994-01-11 Exxon Research & Engineering Co. Conversion of hydrocarbons using microwave radiation
KR910016054A (ko) * 1990-02-23 1991-09-30 미다 가쓰시게 마이크로 전자 장치용 표면 처리 장치 및 그 방법
US5120567A (en) * 1990-05-17 1992-06-09 General Electric Company Low frequency plasma spray method in which a stable plasma is created by operating a spray gun at less than 1 mhz in a mixture of argon and helium gas
US5307892A (en) * 1990-08-03 1994-05-03 Techco Corporation Electronically controlled power steering system
JPH0779102B2 (ja) * 1990-08-23 1995-08-23 富士通株式会社 半導体装置の製造方法
US5085885A (en) * 1990-09-10 1992-02-04 University Of Delaware Plasma-induced, in-situ generation, transport and use or collection of reactive precursors
DE4029270C1 (zh) * 1990-09-14 1992-04-09 Balzers Ag, Balzers, Li
JP2958086B2 (ja) * 1990-09-18 1999-10-06 奈良精機株式会社 注射針の熔融処理装置
US5087272A (en) * 1990-10-17 1992-02-11 Nixdorf Richard D Filter and means for regeneration thereof
JP2824808B2 (ja) * 1990-11-16 1998-11-18 キヤノン株式会社 マイクロ波プラズマcvd法による大面積の機能性堆積膜を連続的に形成する装置
AU649770B2 (en) * 1991-01-25 1994-06-02 Societe Prolabo Apparatus for simultaneous treatment, in a moist medium, on a plurality of samples, and utilisation of the said apparatus
US5202541A (en) * 1991-01-28 1993-04-13 Alcan International Limited Microwave heating of workpieces
EP0502269A1 (en) * 1991-03-06 1992-09-09 Hitachi, Ltd. Method of and system for microwave plasma treatments
US5223308A (en) * 1991-10-18 1993-06-29 Energy Conversion Devices, Inc. Low temperature plasma enhanced CVD process within tubular members
US5521360A (en) * 1994-09-14 1996-05-28 Martin Marietta Energy Systems, Inc. Apparatus and method for microwave processing of materials
US5311906A (en) * 1992-02-04 1994-05-17 Techco Corporation Preload mechanism for power steering apparatus
US5316043A (en) * 1992-02-04 1994-05-31 Techco Corporation Preload mechanism for power steering apparatus
US5330800A (en) * 1992-11-04 1994-07-19 Hughes Aircraft Company High impedance plasma ion implantation method and apparatus
JP3365511B2 (ja) * 1993-04-05 2003-01-14 セイコーエプソン株式会社 ろう材による接合方法及び装置
JP2803017B2 (ja) * 1993-06-07 1998-09-24 工業技術院長 抗血栓性医用材料及び医療用具並びにこれらの製造方法、製造装置及びプラズマ処理装置
US5505275A (en) * 1993-09-09 1996-04-09 Techo Corporation Power steering system
US5755097A (en) * 1993-07-29 1998-05-26 Techco Corporation Bootstrap power steering systems
US6342195B1 (en) * 1993-10-01 2002-01-29 The Penn State Research Foundation Method for synthesizing solids such as diamond and products produced thereby
US5611864A (en) * 1994-03-24 1997-03-18 Matsushita Electric Industrial Co., Ltd. Microwave plasma processing apparatus and processing method using the same
GB9414561D0 (en) * 1994-07-19 1994-09-07 Ea Tech Ltd Method of and apparatus for microwave-plasma production
JPH0891951A (ja) * 1994-09-22 1996-04-09 Sumitomo Electric Ind Ltd アルミニウムと窒化ケイ素の接合体およびその製造方法
US5641423A (en) * 1995-03-23 1997-06-24 Stericycle, Inc. Radio frequency heating apparatus for rendering medical materials
US5712000A (en) * 1995-10-12 1998-01-27 Hughes Aircraft Company Large-scale, low pressure plasma-ion deposition of diamondlike carbon films
US5859404A (en) * 1995-10-12 1999-01-12 Hughes Electronics Corporation Method and apparatus for plasma processing a workpiece in an enveloping plasma
US5847355A (en) * 1996-01-05 1998-12-08 California Institute Of Technology Plasma-assisted microwave processing of materials
WO1997029156A1 (en) * 1996-02-06 1997-08-14 E.I. Du Pont De Nemours And Company Treatment of deagglomerated particles with plasma-activated species
JP3895000B2 (ja) * 1996-06-06 2007-03-22 Dowaホールディングス株式会社 浸炭焼入焼戻方法及び装置
JPH1081971A (ja) * 1996-07-10 1998-03-31 Suzuki Motor Corp 高分子基材へのプラズマCVDによるSiC薄膜形成方法及び装置
US6011248A (en) * 1996-07-26 2000-01-04 Dennis; Mahlon Denton Method and apparatus for fabrication and sintering composite inserts
US6038854A (en) * 1996-08-19 2000-03-21 The Regents Of The University Of California Plasma regenerated particulate trap and NOx reduction system
US5734501A (en) * 1996-11-01 1998-03-31 Minnesota Mining And Manufacturing Company Highly canted retroreflective cube corner article
US5715677A (en) * 1996-11-13 1998-02-10 The Regents Of The University Of California Diesel NOx reduction by plasma-regenerated absorbend beds
AU5960698A (en) * 1997-01-17 1998-08-07 California Institute Of Technology Microwave technique for brazing materials
US6189482B1 (en) * 1997-02-12 2001-02-20 Applied Materials, Inc. High temperature, high flow rate chemical vapor deposition apparatus and related methods
US6039834A (en) * 1997-03-05 2000-03-21 Applied Materials, Inc. Apparatus and methods for upgraded substrate processing system with microwave plasma source
AU6964098A (en) * 1997-04-10 1998-10-30 Nucon Systems, Inc. Process and apparatus for microwave joining thick-walled ceramic parts
FR2762748B1 (fr) * 1997-04-25 1999-06-11 Air Liquide Dispositif d'excitation d'un gaz par plasma d'onde de surface
JPH1154773A (ja) * 1997-08-01 1999-02-26 Canon Inc 光起電力素子及びその製造方法
JP3894635B2 (ja) * 1997-08-11 2007-03-22 株式会社小松製作所 浸炭部材とその製造方法並びに浸炭処理システム
US6183689B1 (en) * 1997-11-25 2001-02-06 Penn State Research Foundation Process for sintering powder metal components
US6028393A (en) * 1998-01-22 2000-02-22 Energy Conversion Devices, Inc. E-beam/microwave gas jet PECVD method and apparatus for depositing and/or surface modification of thin film materials
US20020034461A1 (en) * 1998-01-29 2002-03-21 Segal David Leslie Plasma assisted processing of gas
DE19814812C2 (de) * 1998-04-02 2000-05-11 Mut Mikrowellen Umwelt Technol Plasmabrenner mit einem Mikrowellensender
US6228773B1 (en) * 1998-04-14 2001-05-08 Matrix Integrated Systems, Inc. Synchronous multiplexed near zero overhead architecture for vacuum processes
JP4037956B2 (ja) * 1998-04-28 2008-01-23 東海カーボン株式会社 チャンバー内壁保護部材
JP4014300B2 (ja) * 1998-06-19 2007-11-28 東京エレクトロン株式会社 プラズマ処理装置
JP2000021871A (ja) * 1998-06-30 2000-01-21 Tokyo Electron Ltd プラズマ処理方法
CA2338230A1 (en) * 1998-07-21 2000-02-03 Edward H. Phillips Feedback and servo control for electric power steering systems
JP2991192B1 (ja) * 1998-07-23 1999-12-20 日本電気株式会社 プラズマ処理方法及びプラズマ処理装置
US6362449B1 (en) * 1998-08-12 2002-03-26 Massachusetts Institute Of Technology Very high power microwave-induced plasma
JP3293564B2 (ja) * 1998-08-20 2002-06-17 株式会社村田製作所 電子デバイスの作製方法
US6204606B1 (en) * 1998-10-01 2001-03-20 The University Of Tennessee Research Corporation Slotted waveguide structure for generating plasma discharges
US6186090B1 (en) * 1999-03-04 2001-02-13 Energy Conversion Devices, Inc. Apparatus for the simultaneous deposition by physical vapor deposition and chemical vapor deposition and method therefor
SE516722C2 (sv) * 1999-04-28 2002-02-19 Hana Barankova Förfarande och apparat för plasmabehandling av gas
AU8027800A (en) * 1999-10-18 2001-04-30 Penn State Research Foundation, The Microwave processing in pure h fields and pure e fields
JP3595233B2 (ja) * 2000-02-16 2004-12-02 株式会社ノリタケカンパニーリミテド 電子放出源及びその製造方法
US6367412B1 (en) * 2000-02-17 2002-04-09 Applied Materials, Inc. Porous ceramic liner for a plasma source
JP2001237397A (ja) * 2000-02-23 2001-08-31 Nec Corp 半導体装置の製造方法
DE10009569C2 (de) * 2000-02-29 2003-03-27 Schott Glas Verfahren und Vorrichtung zum Zerkleinern von Glaskörpern mittels Mikrowellenerwärmung
US6345497B1 (en) * 2000-03-02 2002-02-12 The Regents Of The University Of California NOx reduction by electron beam-produced nitrogen atom injection
KR100341407B1 (ko) * 2000-05-01 2002-06-22 윤덕용 플라즈마 처리에 의한 리튬전이금속 산화물 박막의 결정화방법
JP4523118B2 (ja) * 2000-06-14 2010-08-11 東京エレクトロン株式会社 プラズマ処理装置
US6812441B2 (en) * 2000-08-04 2004-11-02 The Penn State Research Foundation Method and apparatus for the preparation of transparent alumina ceramics by microwave sintering
JP3865289B2 (ja) * 2000-11-22 2007-01-10 独立行政法人科学技術振興機構 マイクロ波によるプラズマ発生装置
AU2002237870A1 (en) * 2001-01-17 2002-07-30 The Penn State Research Foundation Microwave processing using highly microwave absorbing powdered material layers
JP2002280196A (ja) * 2001-03-15 2002-09-27 Micro Denshi Kk マイクロ波を利用したプラズマ発生装置
JP2003075077A (ja) * 2001-09-05 2003-03-12 Natl Inst For Fusion Science マイクロ波焼成炉およびマイクロ波焼成方法
AU2003230264A1 (en) * 2002-05-08 2003-11-11 Dana Corporation Plasma assisted dry processing
US7097782B2 (en) * 2002-11-12 2006-08-29 Micron Technology, Inc. Method of exposing a substrate to a surface microwave plasma, etching method, deposition method, surface microwave plasma generating apparatus, semiconductor substrate etching apparatus, semiconductor substrate deposition apparatus, and microwave plasma generating antenna assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448427B (zh) * 2012-02-08 2014-08-11 Nat Univ Tsing Hua 利用低頻電磁波製備石墨烯之方法

Also Published As

Publication number Publication date
WO2006127037A3 (en) 2009-04-09
AR051619A1 (es) 2007-01-24
US20080129208A1 (en) 2008-06-05
WO2006127037A2 (en) 2006-11-30

Similar Documents

Publication Publication Date Title
TW200509247A (en) Surface wave plasma treatment apparatus using multi-slot antenna
TW200629337A (en) Reactor for performing a plasma-assisted treatment on a substrate
TW200644117A (en) Plasma processing apparatus and plasma processing method
WO2000058995A3 (en) Apparatus for improving plasma distribution and performance in an inductively coupled plasma
WO2010080420A3 (en) Methods and apparatus for dual confinement and ultra-high pressure in an adjustable gap plasma chamber
TW200620455A (en) Yttria insulator ring for use inside a plasma chamber
TWI267137B (en) Plasma treatment system
GB0521961D0 (en) Method of treating a gas stream
TW376547B (en) Method and apparatus for plasma processing
AU2003234474A1 (en) Plasma-assisted multi-part processing
TW200616498A (en) Ultra high speed uniform plasma processing system
WO2001093315A3 (en) Methods and apparatus for plasma processing
WO2004030015A3 (en) Method and apparatus for an improved baffle plate in a plasma processing system
WO2004030013A8 (en) Baffle plate in a plasma processing system
WO2006034130A3 (en) Apparatus and process for surface treatment of substrate using an activated reactive gas
TW200739722A (en) Methods and apparatus for selective pre-coating of a plasma processing chamber
MY187052A (en) Toroidal plasma processing apparatus
EP1988565A3 (en) Methods to eliminate m-shape etch rate profile in inductively coupled plasma reactor
EP1220281A3 (en) Method of treatment with a microwave plasma
TW200802597A (en) Plasma processing apparatus and plasma processing method
TW200730039A (en) Work processing system and plasma generator apparatus
TW200629375A (en) Magnetic-field concentration in inductively coupled plasma reactors
ATE271717T1 (de) Vorrichtung zur erzeugung von leistungsfähigen mikrowellenplasmen
WO2008149741A1 (ja) プラズマ処理装置のドライクリーニング方法
TW200633599A (en) Atmospheric processing using microwave-generated plasmas